83B 2PA1774xMB series SO T8 40 V, 100 mA PNP general-purpose transistors Rev. 1 — 23 March 2012 Product data sheet 1. Product profile 1.1 General description PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number Package NPN complement NXP JEITA JEDEC 2PA1774QMB SOT883B - - 2PC4617QMB 2PA1774RMB SOT883B - - 2PC4617RMB 2PA1774SMB SOT883B - - - 1.2 Features and benefits Leadless ultra small SMD plastic package Low package height of 0.37 mm Power dissipation comparable to SOT23 AEC-Q101 qualified 1.3 Applications General-purpose switching and amplification Mobile applications 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 40 V IC collector current - - 100 mA hFE DC current gain 2PA1774QMB 120 - 270 2PA1774RMB 180 - 390 2PA1774SMB 270 - 560 VCE = 6 V; IC = 1 mA 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 2. Pinning information Table 3. Pinning Pin Description Simplified outline 1 base 2 emitter 1 3 collector 2 Graphic symbol 3 3 1 Transparent top view 2 sym013 3. Ordering information Table 4. Ordering information Type number Package 2PA1774xMB series Name Description Version DFN1006B-3 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.37 mm SOT883B 4. Marking Table 5. Marking codes Type number Marking code[1] 2PA1774QMB 0100 0000 2PA1774RMB 0000 1101 2PA1774SMB 0000 1110 [1] For DFN1006B-3 (SOT883B) binary marking code description see Figure 1. 4.1 Binary marking code description PIN 1 INDICATION READING DIRECTION READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. 2PA1774XMB_SER Product data sheet DFN1006B-3 (SOT883B) binary marking code description All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 2 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). 2PA1774XMB_SER Product data sheet Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 40 V VEBO emitter-base voltage open collector - 5 V IC collector current - 100 mA ICM peak collector current single pulse; tp 1 ms - 200 mA IBM peak base current single pulse; tp 1 ms - 100 mA Ptot total power dissipation Tamb 25 C [1][2] - 250 mW [3][2] - 590 mW Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, mounting pad for collector 1 cm2. All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 3 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient Rth(j-a) in free air Min Typ Max Unit [1][2] - - 500 K/W [3][2] - - 212 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, mounting pad for collector 1 cm2. 006aab603 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 0.02 10 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 2PA1774XMB_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 4 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter ICBO Conditions Min Typ Max Unit VCB = 30 V; IE = 0 A - - 100 nA VCB = 30 V; IE = 0 A; Tj = 150 C - - 5 A - - 100 nA 2PA1774QMB 120 - 270 2PA1774RMB 180 - 390 270 - 560 - - 200 mV 100 - - MHz - - 2.2 pF collector-base cut-off current IEBO emitter-base cut-off current VEB = 4 V; IC = 0 A hFE DC current gain VCE = 6 V; IC = 1 mA 2PA1774SMB VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA fT transition frequency VCE = 12 V; IC = 2 mA; f = 100 MHz Cc collector capacitance VCB = 12 V; IE = ie = 0 A; f = 1 MHz [1] 2PA1774XMB_SER Product data sheet [1] Pulse test: tp 300 s; 0.02. All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 5 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors mdb664 −1200 mdb665 −103 VBE (mV) −1000 VCEsat (mV) (1) −800 −102 (2) −600 (1) (2) (3) −400 (3) −200 −10−1 −1 −10 −102 −103 IC (mA) −10 −10−1 VCE = 6 V −1 −102 −103 IC (mA) IC/IB = 10 (1) Tamb = 55 C (1) Tamb = 150 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 150 C (3) Tamb = 55 C Fig 3. −10 Base-emitter voltage as a function of collector current; typical values Fig 4. mdb666 −1200 VBEsat (mV) Collector-emitter saturation voltage as a function of collector current; typical values mdb668 103 RCEsat (Ω) -1000 102 (1) −800 (2) −600 (1) 10 (3) (2) −400 (3) −200 −10−1 −1 −10 1 −10−1 2 IC (mA) −10 −1 IC/IB = 10 IC/IB = 10 (1) Tamb = 55 C (1) Tamb = 150 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 150 C (3) Tamb = 55 C Fig 5. Base-emitter saturation voltage as a function of collector current; typical values 2PA1774XMB_SER Product data sheet Fig 6. −10 −102 −103 IC (mA) Collector-emitter equivalent on-resistance as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 6 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 0.65 0.55 0.40 0.34 0.35 0.20 0.12 1 0.04 max 2 0.30 0.22 1.05 0.65 0.95 0.30 0.22 3 0.55 0.47 Dimensions in mm Fig 7. 11-11-02 Package outline DFN1006B-3 (SOT883B) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 2PA1774xMB series [1] 2PA1774XMB_SER Product data sheet DFN1006B-3 2 mm pitch, 8 mm tape and reel (SOT883B) -315 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 7 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 11. Soldering Footprint information for reflow soldering SOT883B 1.3 0.7 R0.05 (8x) 0.9 0.6 0.7 0.25 (2x) 0.3 (2x) 0.3 0.4 (2x) 0.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm sot883b_fr Reflow soldering is the only recommended soldering method. Fig 8. Reflow soldering footprint DFN1006B-3 (SOT883B) 2PA1774XMB_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 8 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes 2PA1774XMB_SER v.1 20120323 Product data sheet - - 2PA1774XMB_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 9 of 12 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 23 March 2012 Document identifier: 2PA1774XMB_SER 2PA1774xMB series NXP Semiconductors 40 V, 100 mA PNP general-purpose transistors Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 2PA1774XMB_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 23 March 2012 © NXP B.V. 2012. All rights reserved. 11 of 12 NXP Semiconductors 2PA1774xMB series 40 V, 100 mA PNP general-purpose transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Binary marking code description. . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 23 March 2012 Document identifier: 2PA1774XMB_SER