TJA1042 High-speed CAN transceiver with Standby mode Rev. 7 — 8 May 2012 Product data sheet 1. General description The TJA1042 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive industry, providing the differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJA1042 belongs to the third generation of high-speed CAN transceivers from NXP Semiconductors, offering significant improvements over first- and second-generation devices such as the TJA1040. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features: • Ideal passive behavior to the CAN bus when the supply voltage is off • A very low-current Standby mode with bus wake-up capability • TJA1042T/3 and TJA1042TK/3 can be interfaced directly to microcontrollers with supply voltages from 3 V to 5 V These features make the TJA1042 an excellent choice for all types of HS-CAN networks, in nodes that require a low-power mode with wake-up capability via the CAN bus. 2. Features and benefits 2.1 General Fully ISO 11898-2 and ISO 11898-5 compliant Suitable for 12 V and 24 V systems Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) VIO input on TJA1042T/3 and TJA1042TK/3 allows for direct interfacing with 3 V to 5 V microcontrollers (available in SO8 and very small HVSON8 packages respectively) SPLIT voltage output on TJA1042T for stabilizing the recessive bus level (available in SO8 package only) Available in SO8 and HVSON8 packages Leadless HVSON8 package (3.0 mm 3.0 mm) with improved Automated Optical Inspection (AOI) capability Dark green product (halogen free and Restriction of Hazardous Substances (RoHS) compliant) 2.2 Low-power management Very low-current Standby mode with host and bus wake-up capability Functional behavior predictable under all supply conditions TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Transceiver disengages from the bus when not powered up (zero load) 2.3 Protections High ESD handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Bus-dominant time-out function in Standby mode Undervoltage detection on pins VCC and VIO Thermally protected 3. Quick reference data Table 1. Quick reference data Symbol Parameter VCC Conditions Min Typ Max Unit supply voltage 4.5 - 5.5 V Vuvd(VCC) undervoltage detection voltage on pin VCC 3.5 - 4.5 V ICC supply current Standby mode - 10 15 A Normal mode; bus recessive 2.5 5 10 mA Normal mode; bus dominant 20 45 70 mA VESD electrostatic discharge voltage IEC 61000-4-2 at pins CANH and CANL 8 - +8 kV VCANH voltage on pin CANH no time limit; DC limiting value 58 - +58 V VCANL voltage on pin CANL no time limit; DC limiting value 58 - +58 V Tvj virtual junction temperature 40 - +150 C 4. Ordering information Table 2. Ordering information Type number[1] TJA1042T Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TJA1042T/3 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TJA1042TK/3 HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 3 0.85 mm SOT782-1 [1] TJA1042T with SPLIT pin; TJA1042T/3 and TJA1042TK/3 with VIO pin. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 2 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 5. Block diagram VIO VCC 5 3 VCC TJA1042 TEMPERATURE PROTECTION VIO(1) TXD 1 7 TIME-OUT SLOPE CONTROL AND DRIVER MODE CONTROL SPLIT 6 CANH CANL VIO(1) STB RXD 8 5 SPLIT(1) 4 MUX AND DRIVER WAKE-UP FILTER 2 GND 015aaa017 (1) In a transceiver with a SPLIT pin, the VIO input is internally connected to VCC. Fig 1. TJA1042 Product data sheet Block diagram All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 3 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 6. Pinning information 6.1 Pinning terminal 1 index area TXD 1 8 STB TXD 1 8 STB GND 2 7 CANH GND 2 7 CANH VCC 3 6 CANL VCC 3 6 CANL RXD 4 5 SPLIT RXD 4 5 VIO TXD 1 GND 2 TJA1042T/3 015aaa019 015aaa018 a. TJA1042T: SO8 Fig 2. b. TJA1042T/3: SO8 STB 7 CANH 3 6 CANL 4 5 VIO TJA1042TK/3 VCC TJA1042T 8 RXD 015aaa239 Transparent top view c. TJA1042TK/3: HVSON8 Pin configuration diagrams 6.2 Pin description Table 3. Pin Description TXD 1 transmit data input GND 2[1] ground supply VCC 3 supply voltage RXD 4 receive data output; reads out data from the bus lines SPLIT 5 common-mode stabilization output; in TJA1042T version only VIO 5 supply voltage for I/O level adapter; in TJA1042T/3 and TJA1042TK/3 versions only CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line STB 8 Standby mode control input [1] TJA1042 Product data sheet Pin description Symbol For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should be soldered to board ground (and not to any other voltage level). All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 4 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 7. Functional description The TJA1042 is a HS-CAN stand-alone transceiver with Standby mode. It combines the functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved EMC and ESD handling capability and quiescent current performance. Improved slope control and high DC handling capability on the bus pins provide additional application flexibility. The TJA1042 is available in two versions, distinguished only by the function of pin 5: • The TJA1042T is 100 % backwards compatible with the TJA1040, and also covers existing PCA82C250 and PCA82C251 applications • The TJA1042T/3 and TJA1042TK/3 allow for direct interfacing to microcontrollers with supply voltages down to 3 V 7.1 Operating modes The TJA1042 supports two operating modes, Normal and Standby, which are selected via pin STB. See Table 4 for a description of the operating modes under normal supply conditions. Table 4. Operating modes Mode Pin STB Pin RXD LOW HIGH Normal LOW bus dominant bus recessive Standby HIGH wake-up request detected no wake-up request detected 7.1.1 Normal mode A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible EME. 7.1.2 Standby mode A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not able to transmit or correctly receive data via the bus lines. The transmitter and Normal-mode receiver blocks are switched off to reduce supply current, and only a low-power differential receiver monitors the bus lines for activity. The wake-up filter on the output of the low-power receiver does not latch bus dominant states, but ensures that only bus dominant and bus recessive states that persist longer than tfltr(wake)bus are reflected on pin RXD. In Standby mode, the bus lines are biased to ground to minimize the system supply current. The low-power receiver is supplied by VIO, and is capable of detecting CAN bus activity even if VIO is the only supply voltage available. When pin RXD goes LOW to signal a wake-up request, a transition to Normal mode will not be triggered until STB is forced LOW. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 5 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 7.2 Fail-safe features 7.2.1 TXD dominant time-out function A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set to HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s. 7.2.2 Bus dominant time-out function In Standby mode a 'bus dominant time-out' timer is started when the CAN bus changes from recessive to dominant state. If the dominant state on the bus persists for longer than tto(dom)bus, the RXD pin is reset to HIGH. This function prevents a clamped dominant bus (due to a bus short-circuit or a failure in one of the other nodes on the network) from generating a permanent wake-up request. The bus dominant time-out timer is reset when the CAN bus changes from dominant to recessive state. 7.2.3 Internal biasing of TXD and STB input pins Pins TXD and STB have internal pull-ups to VIO to ensure a safe, defined state in case one or both of these pins are left floating. Pull-up currents flow in these pins in all states; both pins should be held HIGH in Standby mode to minimize standby current. 7.2.4 Undervoltage detection on pins VCC and VIO Should VCC drop below the VCC undervoltage detection level, Vuvd(VCC), the transceiver will switch to Standby mode. The logic state of pin STB will be ignored until VCC has recovered. Should VIO drop below the VIO undervoltage detection level, Vuvd(VIO), the transceiver will switch off and disengage from the bus (zero load) until VIO has recovered. 7.2.5 Overtemperature protection The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillation due to temperature drift is avoided. 7.3 SPLIT output pin and VIO supply pin Two versions of the TJA1042 are available, only differing in the function of a single pin. Pin 5 is either a SPLIT output pin or a VIO supply pin. 7.3.1 SPLIT pin Using the SPLIT pin on the TJA1042T in conjunction with a split termination network (see Figure 3 and Figure 6) can help to stabilize the recessive voltage level on the bus. This will reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with poor bus leakage performance). In Normal mode, pin SPLIT delivers a DC output voltage of 0.5VCC. In Standby mode or when VCC is off, pin SPLIT is floating. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 6 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode VCC TJA1042T CANH 60 Ω R VSPLIT = 0.5 VCC in normal mode; otherwise floating SPLIT 60 Ω R CANL GND Fig 3. 015aaa020 Stabilization circuitry and application for version with SPLIT pin 7.3.2 VIO supply pin Pin VIO on the TTJA1042T/3 and TJA1042TK/3 should be connected to the microcontroller supply voltage (see Figure 7). This will adjust the signal levels of pins TXD, RXD and STB to the I/O levels of the microcontroller. Pin VIO also provides the internal supply voltage for the low-power differential receiver of the transceiver. For applications running in low-power mode, this allows the bus lines to be monitored for activity even if there is no supply voltage on pin VCC. For versions of the TJA1042 without a VIO pin, the VIO input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and STB to levels compatible with 5 V microcontrollers. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Vx voltage on pin x Conditions on any other pin transient voltage TJA1042 Product data sheet Max Unit 58 +58 V no time limit; DC value on pins CANH, CANL and SPLIT Vtrt Min on pins CANH and CANL All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 [1] 0.3 +7 V 150 +100 V © NXP B.V. 2012. All rights reserved. 7 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter VESD Conditions electrostatic discharge voltage IEC 61000-4-2 [3] at pins CANH and CANL at pins CANH and CANL at any other pin at any pin at corner pins at any pin storage temperature 8 +8 kV 8 +8 kV 4 +4 kV 300 +300 V 750 +750 V 500 +500 V [6] CDM virtual junction temperature Unit [5] MM Tvj Max [4] HBM Tstg Min [2] [7] 40 +150 C 55 +150 C [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. [2] IEC 61000-4-2 (150 pF, 330 . [3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 ) has been be verified by an external test house. The result is equal to or better than 8 kV (unaided). [4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k). [5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ). [6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (>1000 V). [7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 9. Thermal characteristics Table 6. Thermal characteristics According to IEC 60747-1. Symbol Parameter Conditions Value Unit Rth(vj-a) thermal resistance from virtual junction to ambient SO8 package; in free air 145 K/W HVSON8 package; in free air 50 K/W 10. Static characteristics Table 7. Static characteristics Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit 4.5 - 5.5 V Supply; pin VCC VCC supply voltage TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 8 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Table 7. Static characteristics …continued Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit ICC supply current Standby mode TJA1042T; includes IIO; VTXD = VIO - 10 15 A TJA1042T/3 or TJA1042TK/3 - - 5 A recessive; VTXD = VIO 2.5 5 10 mA dominant; VTXD = 0 V 20 45 70 mA 3.5 - 4.5 V 2.8 - 5.5 V 5 - 14 A recessive; VTXD = VIO 15 80 200 A dominant; VTXD = 0 V - 350 1000 A 1.3 2.0 2.7 V 0.7VIO - VIO + 0.3 V 0.3 - 0.3VIO V Normal mode Vuvd(VCC) undervoltage detection voltage on pin VCC I/O level adapter supply; pin VIO[1] VIO supply voltage on pin VIO IIO supply current on pin VIO Standby mode; VTXD = VIO Normal mode Vuvd(VIO) undervoltage detection voltage on pin VIO Standby mode control input; pin STB [3] VIH HIGH-level input voltage VIL LOW-level input voltage IIH HIGH-level input current VSTB = VIO 1 - +1 A IIL LOW-level input current VSTB = 0 V 15 - 1 A 0.7VIO - VIO + 0.3 V 0.3 - 0.3VIO V 5 - +5 A 260 150 30 A - 5 10 pF CAN transmit data input; pin TXD [3] VIH HIGH-level input voltage VIL LOW-level input voltage IIH HIGH-level input current VTXD = VIO IIL LOW-level input current VTXD = 0 V Ci [4] input capacitance CAN receive data output; pin RXD IOH HIGH-level output current VRXD = VIO 0.4 V; VIO = VCC 8 3 1 mA IOL LOW-level output current VRXD = 0.4 V; bus dominant 2 5 12 mA pin CANH 2.75 3.5 4.5 V pin CANL 0.5 1.5 2.25 V 400 - +400 mV Bus lines; pins CANH and CANL VO(dom) dominant output voltage Vdom(TX)sym transmitter dominant voltage symmetry TJA1042 Product data sheet VTXD = 0 V; t < tto(dom)TXD Vdom(TX)sym = VCC VCANH VCANL All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 9 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Table 7. Static characteristics …continued Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit VO(dif)bus bus differential output voltage VTXD = 0 V; t < tto(dom)TXD VCC = 4.75 V to 5.25 V RL = 45 to 65 1.5 - 3 V VTXD = VIO; recessive; no load 50 - +50 mV 2 0.5VCC 3 V 0.1 - +0.1 V 0.5 0.7 0.9 V 0.4 0.7 1.15 V 50 120 200 mV pin CANH; VCANH = 0 V 100 70 40 mA pin CANL; VCANL = 5 V / 40 V VO(rec) recessive output voltage Normal mode; VTXD = VIO; no load Vth(RX)dif differential receiver threshold voltage Vcm(CAN) = 30 V to +30 V Standby mode; no load [5] Normal mode Standby mode Vhys(RX)dif differential receiver hysteresis Vcm(CAN) = 30 V to +30 V voltage Normal mode IO(dom) dominant output current [6] VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V 40 70 100 mA IO(rec) recessive output current Normal mode; VTXD = VIO VCANH = VCANL = 27 V to +32 V 5 - +5 mA IL leakage current VCC = VIO = 0 V; VCANH = VCANL = 5 V 5 - +5 A Ri input resistance 9 15 28 k Ri input resistance deviation between VCANH and VCANL 1 - +1 % Ri(dif) differential input resistance 19 30 52 k - - 20 pF - - 10 pF Normal mode ISPLIT = 500 A to +500 A 0.3VCC 0.5VCC 0.7VCC Normal mode; RL = 1 M 0.45VCC 0.5VCC 0.55VCC V Standby mode VSPLIT = 58 V to +58 V 5 - +5 A - 190 - C Ci(cm) common-mode input capacitance [4] Ci(dif) differential input capacitance [4] Common mode stabilization output; pin SPLIT; only for TJA1042T output voltage VO leakage current IL V Temperature detection Tj(sd) [4] shutdown junction temperature [1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. [3] Maximum value assumes VCC < VIO; if VCC > VIO, the maximum value will be VCC + 0.3 V. [4] Not tested in production; guaranteed by design. [5] Vcm(CAN) is the common mode voltage of CANH and CANL. [6] For TJA1042T/3 and TJA1042TK/3: values valid when VIO = 4.5 V to 5.5 V; when VIO = 2.8 V to 4.5 V, values valid when Vcm(CAN) = 12 V to +12 V. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 10 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 11. Dynamic characteristics Table 8. Dynamic characteristics Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5 td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns td(busdom-RXD) delay time from bus dominant to RXD Normal mode - 60 - ns td(busrec-RXD) delay time from bus recessive to RXD Normal mode - 65 - ns tPD(TXD-RXD) propagation delay from TXD to RXD version with SPLIT pin Normal mode 60 - 220 ns versions with VIO pin Normal mode 60 - 250 ns tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode 0.3 2 5 ms tto(dom)bus bus dominant time-out time Standby mode 0.3 2 5 ms tfltr(wake)bus bus wake-up filter time version with SPLIT pin Standby mode 0.5 1 3 s versions with VIO pin Standby mode 0.5 1.5 5 s 7 25 47 s td(stb-norm) standby to normal mode delay time [1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. +5 V 47 μF 100 nF VIO(1) VCC TXD CANH TJA1042 SPLIT RXD GND RL 100 pF CANL STB 15 pF 015aaa024 (1) For versions with a VIO pin (TJA1042T/3 and TJA1042TK/3), the VIO pin is connected to pin VCC. Fig 4. TJA1042 Product data sheet Timing test circuit for CAN transceiver All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 11 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode HIGH TXD LOW CANH CANL dominant 0.9 V VO(dif)(bus) 0.5 V recessive HIGH 0.7VIO RXD 0.3VIO LOW td(TXD-busrec) td(TXD-busdom) td(busrec-RXD) td(busdom-RXD) tPD(TXD-RXD) Fig 5. tPD(TXD-RXD) 015aaa025 CAN transceiver timing diagram 12. Application information BAT 5V VCC CANH CANH SPLIT CANL STB TJA1042T CANL Pyy TXD RXD VDD Pxx TX0 MICROCONTROLLER RX0 GND Fig 6. TJA1042 Product data sheet GND 015aaa022 Typical application with TJA1042T and a 5 V microcontroller. All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 12 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode BAT 3V INH 5V VCC VIO STB CANH CANH Pxx TJA1042T/3 TJA1042TK/3 CANL CANL TXD RXD TX0 RX0 GND VDD MICROCONTROLLER GND 015aaa021 Switching off the 5 V supply in Standby mode (dotted line) is optional. Fig 7. Typical application with TJA1042T/3 or TJA1042TK/3 and a 3 V microcontroller. 13. Test information 13.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 13 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 14. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT96-1 (SO8) TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 14 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K Eh 8 5 Dh 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c 0.2 D Dh E Eh e e1 K L 3.10 2.45 3.10 1.65 0.35 0.45 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 2.90 2.35 2.90 1.55 0.25 0.35 v 0.1 w y 0.05 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. Fig 9. References Outline version IEC JEDEC JEITA SOT782-1 --- MO-229 --- sot782-1_po European projection Issue date 09-08-25 09-08-28 Package outline SOT782-1 (HVSON8) TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 15 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 16 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 10) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 10. TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 17 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 contains a brief introduction to the techniques most commonly used to solder Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • AN10365 ‘Surface mount reflow soldering description” • AN10366 “HVQFN application information” TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 18 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 18. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1042 v.7 20120508 Product data sheet - TJA1042 v.6 Modifications • Table 3: Table note 1 added TJA1042 v.6 20110323 Product data sheet - TJA1042 v.5 TJA1042 v.5 20110118 Product data sheet - TJA1042 v.4 TJA1042 v.4 20091006 Product data sheet - TJA1042 v.3 TJA1042 v.3 20090825 Product data sheet - TJA1042 v.2 TJA1042 v.2 20090708 Product data sheet - TJA1042 v.1 TJA1042 v.1 20090309 Product data sheet - - TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 19 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TJA1042 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 20 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TJA1042 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 8 May 2012 © NXP B.V. 2012. All rights reserved. 21 of 22 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 21. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.3 7.3.1 7.3.2 8 9 10 11 12 13 13.1 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6 TXD dominant time-out function . . . . . . . . . . . . 6 Bus dominant time-out function . . . . . . . . . . . . 6 Internal biasing of TXD and STB input pins . . . 6 Undervoltage detection on pins VCC and VIO . . 6 Overtemperature protection . . . . . . . . . . . . . . . 6 SPLIT output pin and VIO supply pin . . . . . . . . 6 SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Application information. . . . . . . . . . . . . . . . . . 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Quality information . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Handling information. . . . . . . . . . . . . . . . . . . . 16 Soldering of SMD packages . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Soldering of HVSON packages. . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 19.4 20 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information . . . . . . . . . . . . . . . . . . . . 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 May 2012 Document identifier: TJA1042