74HC373; 74HCT373 Octal D-type transparent latch; 3-state Rev. 5 — 13 December 2011 Product data sheet 1. General description The 74HC373; 74HCT373 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL. It is specified in compliance with JEDEC standard no. 7A. The 74HC373; 74HCT373 is an octal D-type transparent latch featuring separate D-type inputs for each latch and 3-state outputs for bus oriented applications. A latch enable (LE) input and an output enable (OE) input are common to all latches. The 74HC373; 74HCT373 consists of eight D-type transparent latches with 3-state true outputs. When LE is HIGH, data at the Dn inputs enters the latches. In this condition the latches are transparent, i.e. a latch output will change state each time its corresponding D input changes. When LE is LOW the latches store the information that was present at the D inputs a set-up time preceding the HIGH-to-LOW transition of LE. When OE is LOW, the contents of the 8 latches are available at the outputs. When OE is HIGH, the outputs go to the highimpedance OFF-state. Operation of the OE input does not affect the state of the latches. The 74HC373; 74HCT373 is functionally identical to: • 74HC563; 74HCT563: but inverted outputs and different pin arrangement • 74HC573; 74HCT573: but different pin arrangement 2. Features and benefits 3-state non-inverting outputs for bus oriented applications Common 3-state output enable input Functionally identical to the 74HC563; 74HCT563 and 74HC573; 74HCT573 ESD protection: HBM JESD22-A114F exceeds 2 000 V MM JESD22-A115-A exceeds 200 V Specified from 40 C to +85 C and from 40 C to +125 C 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 3. Ordering information Table 1. Ordering information Type number Package 74HC373N Temperature range Name Description Version 40 C to +125 C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 40 C to +125 C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 40 C to +125 C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 40 C to +125 C DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm SOT764-1 74HCT373N 74HC373D 74HCT373D 74HC373DB 74HCT373DB 74HC373PW 74HCT373PW 74HC373BQ 74HCT373BQ 4. Functional diagram 3 4 7 8 13 14 17 18 11 1 D0 D1 D2 D3 D4 D5 D6 D7 LATCH 1 TO 8 3-STATE OUTPUTS Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 2 5 6 9 12 15 16 19 LE OE 001aae050 Fig 1. Functional diagram 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 2 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 1 OE LE EN 11 C1 11 3 4 7 D0 Q0 D1 Q1 D2 8 13 14 17 18 2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 5 D1 6 D2 9 D4 15 D5 16 D6 19 Q7 D7 1 2 1D Q0 4 5 7 6 8 9 13 12 14 15 17 16 18 19 D3 12 OE Fig 2. 3 D0 LE Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aae049 001aae048 Logic symbol Fig 3. IEC logic symbol LE LE LE D Q LE Fig 4. 001aae051 Logic diagram (one latch) D0 D1 D Q D2 D Q D3 D Q D4 D Q D5 D Q D6 D Q D7 D Q D Q LATCH 1 LATCH 2 LATCH 3 LATCH 4 LATCH 5 LATCH 6 LATCH 7 LATCH 8 LE LE LE LE LE LE LE LE LE LE LE LE LE LE LE LE LE OE Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aae052 Fig 5. Logic diagram 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 3 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 5. Pinning information 5.1 Pinning 74HC373 74HCT373 20 VCC Q0 2 19 Q7 D0 3 18 D7 D1 4 Q1 terminal 1 index area OE 1 1 OE 20 VCC 74HC373 74HCT373 Q0 2 19 Q7 D0 3 18 D7 17 D6 D1 4 17 D6 5 16 Q6 Q1 5 16 Q6 Q2 6 15 Q5 Q2 6 15 Q5 D2 7 14 D5 D2 7 D3 8 Q3 9 13 D4 Q3 9 12 Q4 GND 10 11 LE 13 D4 12 Q4 LE 11 8 GND 10 D3 14 D5 GND(1) 001aae047 Transparent top view 001aae046 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input. Fig 6. Pin configuration DIP20, SO20, SSOP20 and TSSOP20 Fig 7. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description OE 1 3-state output enable input (active LOW) Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7 2, 5, 6, 9, 12, 15, 16, 19 3-state latch output D0, D1, D2, D3, D4, D5, D6, D7 3, 4, 7, 8, 13, 14, 17, 18 data input GND 10 ground (0 V) LE 11 latch enable input (active HIGH) VCC 20 supply voltage 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 4 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 6. Functional description 6.1 Function table Table 3. Function table[1] Operating mode Control Input Internal latches Output OE LE Dn Enable and read register (transparent mode) L H L L L H H H Latch and read register L l L L h H H X X Z Latch register and disable outputs [1] H L X Qn H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition; L = LOW voltage level; I = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current VO = 0.5 V to (VCC + 0.5 V) - 35 mA ICC supply current - +70 mA IGND ground current - 70 mA Tstg storage temperature 65 +150 C Ptot total power dissipation 750 mW DIP20 package [1] - SO20 package [2] - 500 mW SSOP20 package [3] 500 mW TSSOP20 package [3] 500 mW DHVQFN20 package [4] 500 mW [1] For DIP20 package: Ptot derates linearly with 12 mW/K above 70 C. [2] For SO20: Ptot derates linearly with 8 mW/K above 70 C. [3] For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 C. [4] For DHVQFN20 package: Ptot derates linearly with 4.5 mW/K above 60 C. 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 - © NXP B.V. 2011. All rights reserved. 5 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC373 Min Typ 74HCT373 Max Min Typ Unit Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V Conditions Min Typ Max Unit VCC = 2.0 V 1.5 1.2 - V VCC = 4.5 V 3.15 2.4 - V VCC = 6.0 V 4.2 3.2 - V 9. Static characteristics Table 6. Static characteristics 74HC373 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VCC = 2.0 V - 0.8 0.5 V VCC = 4.5 V - 2.1 1.35 V VCC = 6.0 V - 2.8 1.8 V VI = VIH or VIL - - - IO = 20 A; VCC = 2.0 V 1.9 2.0 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - V IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - V IO = 7.8 mA; VCC = 6.0 V 5.48 5.81 - V IO = 20 A; VCC = 2.0 V - 0 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 V VI = VIH or VIL II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 A IOZ OFF-state output current VI = VIH or VIL; VCC = 6.0 V; VO = VCC or GND - - 0.5 A ICC supply current VCC = 6.0 V; IO = 0 A; VI = VCC or GND - - 8.0 A CI input capacitance - 3.5 - pF 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 6 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 6. Static characteristics 74HC373 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VCC = 2.0 V 1.5 - - V VCC = 4.5 V 3.15 - - V VCC = 6.0 V 4.2 - - V VCC = 2.0 V - - 0.5 V VCC = 4.5 V - - 1.35 V VCC = 6.0 V - - 1.8 V IO = 20 A; VCC = 2.0 V 1.9 - - V IO = 20 A; VCC = 4.5 V 4.4 - - V IO = 20 A; VCC = 6.0 V 5.9 - - V IO = 6.0 mA; VCC = 4.5 V 3.84 - - V IO = 7.8 mA; VCC = 6.0 V 5.34 - - V Tamb = 40 C to +85 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL IO = 20 A; VCC = 2.0 V - - 0.1 V IO = 20 A; VCC = 4.5 V - - 0.1 V IO = 20 A; VCC = 6.0 V - - 0.1 V IO = 6.0 mA; VCC = 4.5 V - - 0.33 V IO = 7.8 mA; VCC = 6.0 V - - 0.33 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 1.0 A IOZ OFF-state output current VI = VIH or VIL; VCC = 6.0 V; VO = VCC or GND - - 5.0 A ICC supply current VCC = 6.0 V; IO = 0 A; VI = VCC or GND - 80 A - - V Tamb = 40 C to +125 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 74HC_HCT373 Product data sheet VCC = 2.0 V 1.5 VCC = 4.5 V 3.15 - - V VCC = 6.0 V 4.2 - - V VCC = 2.0 V - - 0.5 V VCC = 4.5 V - - 1.35 V VCC = 6.0 V - - 1.8 V IO = 20 A; VCC = 2.0 V 1.9 - - V IO = 20 A; VCC = 4.5 V 4.4 - - V IO = 20 A; VCC = 6.0 V 5.9 - - V IO = 6.0 mA; VCC = 4.5 V 3.7 - - V IO = 7.8 mA; VCC = 6.0 V 5.2 - - V VI = VIH or VIL All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 7 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 6. Static characteristics 74HC373 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - - 0.1 V IO = 20 A; VCC = 4.5 V - - 0.1 V IO = 20 A; VCC = 6.0 V - - 0.1 V IO = 6.0 mA; VCC = 4.5 V - - 0.4 V IO = 7.8 mA; VCC = 6.0 V - - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 1.0 A IOZ OFF-state output current VI = VIH or VIL; VCC = 6.0 V; VO = VCC or GND - - 10.0 A ICC supply current VCC = 6.0 V; IO = 0 A; VI = VCC or GND - - 160 A Conditions Min Typ Max Unit Table 7. Static characteristics 74HCT373 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 C VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 V VOH HIGH-level output voltage VI = VIH or VIL VOL LOW-level output voltage IO = 20 A; VCC = 4.5 V 4.4 4.5 - V IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - V - 0.0 0.1 V VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 6.0 mA; VCC = 4.5 V - 0.16 0.26 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 A IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A - - 0.5 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 A ICC additional supply current VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A Dn - 30 108 A LE - 150 540 A OE CI input capacitance - 100 360 A - 3.5 - pF Tamb = 40 C to +85 C VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 8 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 7. Static characteristics 74HCT373 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VOH HIGH-level output voltage VI = VIH or VIL VOL LOW-level output voltage Min Typ Max Unit IO = 20 A; VCC = 4.5 V 4.4 - - V IO = 6.0 A; VCC = 4.5 V 3.84 - - V IO = 20 A; VCC = 4.5 V - - 0.1 V IO = 6.0 mA; VCC = 4.5 V - - 0.33 V VI = VIH or VIL II input leakage current VI = VCC or GND; VCC = 5.5 V - - 1.0 A IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A - - 5.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 80 A ICC additional supply current VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A Dn - - 135 A LE - - 675 A OE - - 450 A Tamb = 40 C to +125 C VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 4.5 V 4.4 - - V IO = 6.0 mA; VCC = 4.5 V 3.7 - - V IO = 20 A; VCC = 4.5 V - - 0.1 V VOL LOW-level output voltage VI = VIH or VIL IO = 6.0 mA; VCC = 4.5 V - - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 1.0 A IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A - - 10 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 160 A ICC additional supply current VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A Dn - - 147 A LE - - 735 A OE - - 490 A 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 9 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 10. Dynamic characteristics Table 8. Dynamic characteristics 74HC373 Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions Min Typ Max Unit VCC = 2.0 V - 41 150 ns VCC = 4.5 V - 15 30 ns VCC = 5 V; CL = 15 pF - 12 - ns VCC = 6.0 V - 12 26 ns VCC = 2.0 V - 50 175 ns VCC = 4.5 V - 18 35 ns Tamb = 25 C tpd propagation delay Dn to Qn; see Figure 8 [1] LE to Qn; see Figure 9 ten tdis tt tW tsu th CPD enable time disable time transition time pulse width set-up time hold time power dissipation capacitance 74HC_HCT373 Product data sheet VCC = 5 V; CL = 15 pF - 15 - ns VCC = 6.0 V - 14 30 ns VCC = 2.0 V - 44 150 ns VCC = 4.5 V - 16 30 ns VCC = 6.0 V - 13 26 ns VCC = 2.0 V - 47 150 ns VCC = 4.5 V - 17 30 ns VCC = 6.0 V - 14 26 ns VCC = 2.0 V - 14 60 ns VCC = 4.5 V - 5 12 ns VCC = 6.0 V - 4 10 ns VCC = 2.0 V 80 17 - ns VCC = 4.5 V 16 6 - ns VCC = 6.0 V 14 5 - ns VCC = 2.0 V 50 14 - ns VCC = 4.5 V 10 5 - ns VCC = 6.0 V 9 4 - ns VCC = 2.0 V +5 8 - ns VCC = 4.5 V +5 3 - ns VCC = 6.0 V +5 2 - ns - 45 - pF OE to Qn; see Figure 10 OE to Qn; see Figure 10 Qn; see Figure 8 and Figure 9 [2] [3] [4] LE HIGH; see Figure 9 Dn to LE; see Figure 11 Dn to LE; see Figure 11 per latch; VI = GND to VCC All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 [5] © NXP B.V. 2011. All rights reserved. 10 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 8. Dynamic characteristics 74HC373 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions Min Typ Max Unit Tamb = 40 C to +85 C tpd propagation delay Dn to Qn; see Figure 8 [1] VCC = 2.0 V - - 190 ns VCC = 4.5 V - - 38 ns VCC = 6.0 V - - 33 ns VCC = 2.0 V - - 220 ns VCC = 4.5 V - - 44 ns - - 37 ns VCC = 2.0 V - - 190 ns VCC = 4.5 V - - 38 ns - - 33 ns VCC = 2.0 V - - 190 ns VCC = 4.5 V - - 38 ns - - 33 ns LE to Qn; see Figure 9 VCC = 6.0 V ten enable time OE to Qn; see Figure 10 [2] VCC = 6.0 V tdis disable time OE to Qn; see Figure 10 [3] VCC = 6.0 V tt tW tsu th transition time pulse width set-up time hold time 74HC_HCT373 Product data sheet Qn; see Figure 8 and Figure 9 [4] VCC = 2.0 V - - 75 ns VCC = 4.5 V - - 15 ns VCC = 6.0 V - - 13 ns LE HIGH; see Figure 9 VCC = 2.0 V 100 - - ns VCC = 4.5 V 20 - - ns VCC = 6.0 V 17 - - ns Dn to LE; see Figure 11 VCC = 2.0 V 65 - - ns VCC = 4.5 V 13 - - ns VCC = 6.0 V 11 - - ns Dn to LE; see Figure 11 VCC = 2.0 V 5 - - ns VCC = 4.5 V 5 - - ns VCC = 6.0 V 5 - - ns All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 11 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 8. Dynamic characteristics 74HC373 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions Min Typ Max Unit Tamb = 40 C to +125 C tpd propagation delay Dn to Qn; see Figure 8 [1] VCC = 2.0 V - - 225 ns VCC = 4.5 V - - 45 ns VCC = 6.0 V - - 38 ns VCC = 2.0 V - - 265 ns VCC = 4.5 V - - 53 ns - - 45 ns VCC = 2.0 V - - 225 ns VCC = 4.5 V - - 45 ns - - 38 ns VCC = 2.0 V - - 225 ns VCC = 4.5 V - - 45 ns - - 38 ns LE to Qn; see Figure 9 VCC = 6.0 V ten enable time OE to Qn; see Figure 10 [2] VCC = 6.0 V tdis disable time OE to Qn; see Figure 10 [3] VCC = 6.0 V tt tW tsu transition time pulse width set-up time 74HC_HCT373 Product data sheet Qn; see Figure 8 and Figure 9 [4] VCC = 2.0 V - - 90 ns VCC = 4.5 V - - 18 ns VCC = 6.0 V - - 15 ns LE HIGH; see Figure 9 VCC = 2.0 V 120 - - ns VCC = 4.5 V 24 - - ns VCC = 6.0 V 20 - - ns Dn to LE; see Figure 11 VCC = 2.0 V 75 - - ns VCC = 4.5 V 15 - - ns VCC = 6.0 V 13 - - ns All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 12 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 8. Dynamic characteristics 74HC373 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions th Dn to LE; see Figure 11 [1] hold time Min Typ Max Unit VCC = 2.0 V 5 - - ns VCC = 4.5 V 5 - - ns VCC = 6.0 V 5 - - ns tpd is the same as tPLH and tPHL. [2] ten is the same as tPZH and tPZL. [3] tdis is the same as tPLZ and tPHZ. [4] tt is the same as tTHL and tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. Table 9. Dynamic characteristics 74HCT373 Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions Min Typ Max Unit VCC = 4.5 V - 17 30 ns VCC = 5 V; CL = 15 pF - 14 - ns Tamb = 25 C tpd propagation delay Dn to Qn; see Figure 8 [1] LE to Qn; see Figure 9 ten enable time VCC = 4.5 V - 16 32 ns VCC = 5 V; CL = 15 pF - 13 - ns - 19 32 ns - 18 30 ns - 5 12 ns 16 4 - ns 12 6 - ns 4 1 - ns - 41 - pF OE to Qn; see Figure 10 [2] VCC = 4.5 V tdis disable time OE to Qn; see Figure 10 [3] VCC = 4.5 V tt transition time Qn; see Figure 8 and Figure 9 [4] VCC = 4.5 V tW pulse width LE HIGH; see Figure 9 VCC = 4.5 V tsu set-up time Dn to LE; see Figure 11 VCC = 4.5 V th hold time Dn to LE; see Figure 11 VCC = 4.5 V CPD power dissipation capacitance 74HC_HCT373 Product data sheet per latch; VI = GND to (VCC 1.5 V) All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 [5] © NXP B.V. 2011. All rights reserved. 13 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 9. Dynamic characteristics 74HCT373 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions Min Typ Max Unit - - 38 ns - - 40 ns - - 40 ns - - 38 ns - - 15 ns 20 - - ns 15 - - ns 4 - - ns - - 45 ns - - 48 ns - - 48 ns - - 45 ns - - 18 ns 24 - - ns 18 - - ns Tamb = 40 C to +85 C tpd propagation delay Dn to Qn; see Figure 8 [1] VCC = 4.5 V LE to Qn; see Figure 9 VCC = 4.5 V ten enable time OE to Qn; see Figure 10 tdis disable time OE to Qn; see Figure 10 [2] VCC = 4.5 V [3] VCC = 4.5 V tt transition time Qn; see Figure 8 and Figure 9 tW pulse width LE HIGH; see Figure 9 [4] VCC = 4.5 V VCC = 4.5 V tsu set-up time Dn to LE; see Figure 11 th hold time Dn to LE; see Figure 11 VCC = 4.5 V VCC = 4.5 V Tamb = 40 C to +125 C tpd propagation delay Dn to Qn; see Figure 8 [1] VCC = 4.5 V LE to Qn; see Figure 9 VCC = 4.5 V ten enable time OE to Qn; see Figure 10 [2] VCC = 4.5 V tdis disable time OE to Qn; see Figure 10 [3] VCC = 4.5 V tt transition time Qn; see Figure 8 and Figure 9 VCC = 4.5 V tW pulse width LE HIGH; see Figure 9 VCC = 4.5 V tsu set-up time Dn to LE Dn to LE; see Figure 11 VCC = 4.5 V 74HC_HCT373 Product data sheet [4] All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 14 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Table 9. Dynamic characteristics 74HCT373 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12. Symbol Parameter Conditions th Dn to LE; see Figure 11 hold time Dn to LE VCC = 4.5 V [1] tpd is the same as tPLH and tPHL. [2] ten is the same as tPZH and tPZL. [3] tdis is the same as tPLZ and tPHZ. [4] tt is the same as tTHL and tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in W). Min Typ Max Unit 4 - - ns PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 11. Waveforms VM Dn input t PLH t PHL 90 % VM Qn output 10 % t TLH t THL 001aae082 Measurement points are given in Table 10. Fig 8. Propagation delay input (Dn) to output (Qn) and transition time output (Qn) VM LE input tW t PHL t PLH 90 % VM Qn output 10 % t THL t TLH 001aae083 Measurement points are given in Table 10. Fig 9. Pulse width latch enable input (LE), propagation delay (LE) to output (Qn) and transition time output (Qn) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 15 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state VI OE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM 10% VOL tPHZ tPZH VOH 90% output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs disabled outputs enabled 001aae307 Measurement points are given in Table 10. Fig 10. 3-state enable and disable time VM LE input t su t su th th VM Dn input 001aae084 Measurement points are given in Table 10. Fig 11. Set-up and hold time data input (Dn) to latch enable input (LE) Table 10. Measurement points Type Input Output VM VM 74HC373 0.5VCC 0.5VCC 74HCT373 1.3 V 1.3 V 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 16 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 11. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch Fig 12. Test circuit for measuring switching times Table 11. Test data Type Input VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC373 VCC 6 ns 15 pF, 50 pF 1 k open GND VCC 74HCT373 3V 6 ns 15 pF, 50 pF 1 k open GND VCC 74HC_HCT373 Product data sheet Load S1 position All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 17 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2 0.25 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC JEITA MS-001 SC-603 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 13. Package outline SOT146-1 (DIP20) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 18 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 14. Package outline SOT163-1 (SO20) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 19 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 15. Package outline SOT339-1 (SSOP20) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 20 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 16. Package outline SOT360-1 (TSSOP20) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 21 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 17. Package outline SOT764-1 (DHVQFN20) 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 22 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 13. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT373 v.5 20111213 Product data sheet - 74HC_HCT373 v.4 Modifications: • Legal pages updated. 74HC_HCT373 v.4 20100903 Product data sheet - 74HC_HCT373 v.3 74HC_HCT373 v.3 20060120 Product data sheet - 74HC_HCT373_CNV v.2 74HC_HCT373_CNV v.2 19970827 Product specification - - 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 23 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 24 of 26 74HC373; 74HCT373 NXP Semiconductors Octal D-type transparent latch; 3-state Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT373 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 December 2011 © NXP B.V. 2011. All rights reserved. 25 of 26 NXP Semiconductors 74HC373; 74HCT373 Octal D-type transparent latch; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 December 2011 Document identifier: 74HC_HCT373