PHILIPS 74AHC1G08GW-G

74AHC1G08; 74AHCT1G08
2-input AND gate
Product data sheet
1. General description
74AHC1G08 and 74AHCT1G08 are high-speed Si-gate CMOS devices. They provide a
2-input AND function.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
n
n
n
n
n
n
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
SOT353-1 and SOT753 package options
ESD protection:
u HBM JESD22-A114E: exceeds 2000 V
u MM JESD22-A115-A: exceeds 200 V
u CDM JESD22-C101C: exceeds 1000 V
n Specified from −40 °C to +125 °C
3. Ordering information
Table 1.
Ordering information
Type number
74AHC1G08GW
Package
Temperature range
Name
Description
Version
−40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
−40 °C to +125 °C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74AHCT1G08GW
74AHC1G08GV
74AHCT1G08GV
74AHC1G08; 74AHCT1G08
NXP Semiconductors
2-input AND gate
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level
Inputs
Output
A
B
Y
L
L
L
L
H
L
H
L
L
H
H
H
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VCC
supply voltage
Conditions
−0.5
+7.0
V
VI
input voltage
−0.5
+7.0
V
IIK
input clamping current
VI < −0.5 V
−20
-
mA
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
IO
output current
−0.5 V < VO < VCC + 0.5 V
-
±20
mA
-
±25
mA
ICC
supply current
-
75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
-
250
mW
[1]
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VCC
supply voltage
VI
input voltage
VO
output voltage
Tamb
ambient temperature
∆t/∆V
input transition rise
and fall rate
74AHC_AHCT1G08_6
Product data sheet
Conditions
74AHC1G08
74AHCT1G08
Unit
Min
Typ
Max
Min
Typ
Max
2.0
5.0
5.5
4.5
5.0
5.5
V
0
-
5.5
0
-
5.5
V
0
-
VCC
0
-
VCC
V
−40
+25
+125
−40
+25
+125
°C
VCC = 3.3 V ± 0.3 V
-
-
100
-
-
-
ns/V
VCC = 5.0 V ± 0.5 V
-
-
20
-
-
20
ns/V
© NXP B.V. 2007. All rights reserved.
3 of 11
74AHC1G08; 74AHCT1G08
NXP Semiconductors
2-input AND gate
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
For type 74AHC1G08
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
3.8
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
µA
II
input leakage
current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
µA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
For type 74AHCT1G08
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = −50 µA
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
µA
IO = −8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
II
input leakage
current
74AHC_AHCT1G08_6
Product data sheet
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
© NXP B.V. 2007. All rights reserved.
4 of 11
74AHC1G08; 74AHCT1G08
NXP Semiconductors
2-input AND gate
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
µA
∆ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; tr = tf = ≤ 3.0 ns. For test circuit see Figure 6.
Symbol
Parameter
25 °C
Conditions
Min
Typ
CL = 15 pF
-
CL = 50 pF
-
−40 °C to +85 °C −40 °C to +125 °C Unit
Max
Min
Max
Min
Max
4.6
8.8
1.0
10.5
1.0
12.0
ns
6.5
12.3
1.0
14.0
1.0
16.0
ns
-
3.2
5.9
1.0
7.0
1.0
8.0
ns
For type 74AHC1G08
tpd
propagation
delay
A and B to Y;
see Figure 5
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
[1]
[2]
[3]
CL = 15 pF
CL = 50 pF
CPD
power
dissipation
capacitance
-
4.6
7.9
1.0
9.0
1.0
10.5
ns
-
17
-
-
-
-
-
pF
CL = 15 pF
-
3.6
6.2
1.0
7.1
1.0
8.0
ns
CL = 50 pF
-
5.1
7.9
1.0
9.0
1.0
10.5
ns
-
19
-
-
-
-
-
pF
per buffer;
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[4]
A and B to Y;
see Figure 5
[1]
For type 74AHCT1G08
tpd
propagation
delay
VCC = 4.5 V to 5.5 V
CPD
[1]
power
dissipation
capacitance
per buffer;
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
[3]
[4]
tpd is the same as tPLH and tPHL.
[2]
Typical values are measured at VCC = 3.3 V.
[3]
Typical values are measured at VCC = 5.0 V.
[4]
CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz; fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts
74AHC_AHCT1G08_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
5 of 11
74AHC1G08; 74AHCT1G08
NXP Semiconductors
2-input AND gate
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
Fig 7. Package outline SOT353-1 (TSSOP5)
74AHC_AHCT1G08_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
7 of 11
74AHC1G08; 74AHCT1G08
NXP Semiconductors
2-input AND gate
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT753
JEITA
EUROPEAN
PROJECTION
SC-74A
Fig 8. Package outline SOT753 (SC-74A)
74AHC_AHCT1G08_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
8 of 11