74HC244; 74HCT244 Octal buffer/line driver; 3-state Rev. 4 — 24 September 2012 Product data sheet 1. General description The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The device features two output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC. 2. Features and benefits Input levels: For 74HC244: CMOS level For 74HCT244: TTL level Octal bus interface Non-inverting 3-state outputs Complies with JEDEC standard no. 7 A ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number 74HC244N Package Temperature range Name Description Version 40 C to +125 C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 40 C to +125 C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 40 C to +125 C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 40 C to +125 C DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm 74HCT244N 74HC244D 74HCT244D 74HC244DB 74HCT244DB 74HC244PW 74HCT244PW 74HC244BQ 74HCT244BQ 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 4. Functional diagram 2 4 6 8 1 17 15 13 11 19 1A0 1Y0 1A1 1Y1 1A2 1Y2 1A3 1Y3 18 16 14 12 1OE 2A0 2Y0 2A1 2Y1 2A2 2Y2 2A3 2Y3 3 5 7 9 2OE mna875 Fig 1. Functional diagram 1 1A0 1A1 1A2 2 18 4 16 6 14 8 12 1Y0 1Y1 1Y2 2A0 2A1 2A2 17 3 15 5 13 7 11 9 2Y0 2Y1 2 18 4 16 6 14 8 12 2Y2 19 1A3 1OE 1 1Y3 2A3 2OE EN EN 2Y3 19 mna874 11 9 13 7 15 5 17 3 mna873 Fig 2. Logic symbol 74HC_HCT244 Product data sheet Fig 3. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 2 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 5. Pinning information 5.1 Pinning 1OE terminal 1 index area 20 VCC 74HC244 74HCT244 74HC244 74HCT244 1 1A0 2 20 VCC 19 2OE 2Y0 3 18 1Y0 1A0 2 19 2OE 1A1 4 17 2A0 2Y0 3 18 1Y0 2Y1 5 16 1Y1 1A1 4 17 2A0 1A2 6 15 2A1 2Y1 5 16 1Y1 2Y2 7 14 1Y2 1A2 6 15 2A1 1 1OE 8 13 2A2 2Y3 9 12 1Y3 2Y2 7 GND 10 11 2A3 1A3 8 2Y3 9 13 2A2 12 1Y3 GND 10 001aae011 14 1Y2 GND (1) 2A3 11 1A3 001aae012 Transparent top view (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration DIP20, SO20, (T)SSOP20 Fig 5. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE, 2OE 1, 19 output enable input (active LOW) 1A0, 1A1, 1A2, 1A3 2, 4, 6, 8 data input 2Y0, 2Y1, 2Y2, 2Y3 3, 5, 7, 9 bus output GND 10 ground (0 V) 2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 data input 1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14, 12 bus output VCC 20 supply voltage 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 3 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 6. Functional description Table 3. Function table[1] Input Output nOE nAn nYn L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current 0.5 V < VO < VCC + 0.5 V - 35 mA ICC supply current - 70 mA IGND ground current 70 - mA Tstg storage temperature 65 +150 C DIP20 package [1] - 750 mW SO20, SSOP20, TSSOP20 and DHVQFN20 packages [2] - 500 mW total power dissipation Ptot [1] For DIP20 package: Ptot derates linearly with 12 mW/K above 70 C. [2] For SO20 packages: Ptot derates linearly with 8 mW/K above 70 C. For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN20 packages: above 60 C, Ptot derates linearly with 4.5 mW/K. 8. Recommended operating conditions Table 5. Symbol Recommended operating conditions Parameter Conditions Min Typ Max Unit 74HC244 VCC supply voltage 2.0 5.0 6.0 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V t/V input transition rise and fall rate VCC = 2.0 V - - 625 ns/V Tamb VCC = 4.5 V - 1.67 139 ns/V VCC = 6.0 V - - 83 ns/V 40 - +125 C ambient temperature 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 4 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state Table 5. Recommended operating conditions …continued Symbol Parameter Conditions Min Typ Max Unit 74HCT244 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V t/V input transition rise and fall rate VCC = 4.5 V - 1.67 139 ns/V Tamb ambient temperature 40 - +125 C 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V HIGH-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V 74HC244 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage LOW-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1.0 - 1.0 A IOZ OFF-state output current per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 6.0 V; IO = 0 A - - 0.5 - 5.0 - 10 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 A CI input capacitance - 3.5 - - - - - pF 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 5 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HCT244 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V 3.98 4.32 - 3.84 - 3.7 - V IO = 6 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 A - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1.0 - 1.0 A IOZ OFF-state output current per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 5.5 V; IO = 0 A - - 0.5 - 5.0 - 10 A ICC supply current VI = VCC or GND; VCC = 5.5 V; IO = 0 A - - 8.0 - 80 - 160 A ICC additional per input pin; supply current VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A - 70 252 - 315 - 343 A CI input capacitance - 3.5 - - - - - pF 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for load circuit see Figure 8. Symbol Parameter 25 C Conditions 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) 74HC244 tpd [1] propagation delay nAn to nYn; see Figure 6 74HC_HCT244 Product data sheet VCC = 2.0 V - 30 110 145 165 ns VCC = 4.5 V - 11 22 28 33 ns VCC = 5.0 V; CL = 15 pF - 9 - - - ns VCC = 6.0 V - 9 19 24 28 ns All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 6 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state Table 7. Dynamic characteristics …continued GND = 0 V; for load circuit see Figure 8. Symbol Parameter ten enable time 25 C Conditions Min Typ Max Max (85 C) Max (125 C) VCC = 2.0 V - 36 150 190 225 ns VCC = 4.5 V - 13 30 38 45 ns - 10 26 33 38 ns VCC = 2.0 V - 39 150 190 225 ns VCC = 4.5 V - 14 30 38 45 ns - 11 26 33 38 ns VCC = 2.0 V - 14 60 75 90 ns VCC = 4.5 V - 5 12 15 18 ns - 4 10 13 15 ns - 35 - - - pF - 13 22 28 33 ns nOE to nYn; see Figure 7 [2] VCC = 6.0 V disable time tdis nOE to nYn or see Figure 7 [3] VCC = 6.0 V transition time tt [4] see Figure 6 VCC = 6.0 V power dissipation capacitance CPD 40 C to +125 C Unit per buffer; VI = GND to VCC [5] 74HCT244 [1] propagation delay nAn to nYn; tpd see Figure 6 VCC = 4.5 V VCC = 5.0 V; CL = 15 pF - 11 - - - ns - 15 30 38 45 ns 15 25 31 38 ns ten enable time nOE to nYn; VCC = 4.5 V; see Figure 7 [2] tdis disable time nOE to nYn; VCC = 4.5 V; see Figure 7 [3] - tt transition time VCC = 4.5 V; see Figure 6 [4] - 5 12 15 18 ns CPD power dissipation capacitance per buffer; VI = GND to VCC 1.5 V [5] - 35 - - - pF [1] tpd is the same as tPHL and tPLH. [2] ten is the same as tPZH and tPZL. [3] tdis is the same as tPHZ and tPLZ. [4] tt is the same as tTHL and tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 7 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 11. Waveforms VI VM nAn input VM GND t PHL VOH t PLH 90 % VM VM nYn output 10 % VOL t THL t TLH 001aae013 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Input (nAn) to output (nYn) propagation delays and output transition times VI nOE input VM GND t PLZ t PZL VCC nYn output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY nYn output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled 001aae014 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. 3-state enable and disable times Table 8. Measurement points Type Input Output VM VM VX VY 74HC244 0.5 VCC 0.5 VCC 0.1 VCC 0.9 VCC 74HCT244 1.3 V 1.3 V 0.1 VCC 0.9 VCC 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 8 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 8. Test circuit for measuring switching times Table 9. Test data Type Input VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC244 VCC 6 ns 15 pF, 50 pF 1 k open GND VCC 74HCT244 3V 6 ns 15 pF, 50 pF 1 k open GND VCC 74HC_HCT244 Product data sheet Load S1 position All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 9 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2 0.25 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 Fig 9. REFERENCES IEC JEDEC JEITA MS-001 SC-603 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Package outline SOT146-1 (DIP20) 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 10 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 10. Package outline SOT163-1 (SO20) 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 11 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT339-1 (SSOP20) 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 12 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 12. Package outline SOT360-1 (TSSOP20) 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 13 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT764-1 (DHVQFN20) 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 14 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT244 v.4 20120924 Product data sheet - 74HC_HCT244 v.3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74HC_HCT244 v.3 20051222 Product data sheet - 74HC_HCT244_CNV v.2 74HC_HCT244_CNV v.2 19901201 Product specification - - 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 15 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. 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This document supersedes and replaces all information supplied prior to the publication hereof. 74HC_HCT244 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 16 of 18 74HC244; 74HCT244 NXP Semiconductors Octal buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 24 September 2012 © NXP B.V. 2012. All rights reserved. 17 of 18 NXP Semiconductors 74HC244; 74HCT244 Octal buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 24 September 2012 Document identifier: 74HC_HCT244