EMC EM78P459AK

EM78P458/459
OTP ROM
EM78P458/459
8-BIT MICRO-CONTROLLER
Version 1.4
EM78P458/459
OTP ROM
Specification Revision History
Version
Content
1.0
Initial version
1.1
Modify ERC frequency
03/06/2003
1.2
Add AD & OP spec
05/07/2003
1.3
Change Power on reset content
07/01/2003
1.4
Add the Device Characteristic at section 6.5
06/25/2004
Application Note
AN-001 A/D Pre-amplifier
AN-002 Calibration Offset on A/D
AN-003 Example of Microcomputer Digital Thermometer
AN-004 Tips on how to apply EM78P458
AN-005 Tips on how to apply A/D Converter
AN-006 AD & R4
AN-007 Enhancing Noise Immunity
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
1. GENERAL DESCRIPTION
EM78P458 and EM78P459 are 8-bit microprocessors designed and developed with low-power and
high-speed CMOS technology. It is equipped with a 4K*13-bit Electrical One Time Programmable Read
Only Memory (OTP-ROM).
With its OTP-ROM feature, it is able to offer a convenient way of developing and verifying user’s programs.
Moreover, user can take advantage of EMC Writer to easily program his development code.
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
2. FEATURES
• Operating voltage range: 2.3V~5.5V
• Operating temperature range: 0°C~70°C
• Operating frequency range(base on 2 clocks):
* Crystal mode: DC ~ 20MHz/2clks,5V; DC ~ 8MHz/2clks,3V
* RC mode: DC ~ 4MHz/2clks,5V; DC ~ 4MHz/2clks,3V
• Low power consumption:
* Less than 1.5 mA at 5V/4MHz
* Typically 15 µA, at 3V/32KHz
* Typically 1 µA, during sleep mode
• 4K × 13 bits on chip ROM
• 84 × 8 bits on chip registers (SRAM)
• 2 bi-directional I/O ports
• 8 level stacks for subroutine nesting
• 8-bit real time clock/counter (TCC) with selective signal sources, trigger edges, and overflow interrupt
• 8-bit multichannel Analog-to-Digital Converter with 8-bit resolution
• Dual Pulse Width Modulation (PWM ) with 10-bit resolution
• One pair of comparators
• Power-down (SLEEP) mode
• Six available interruptions
* TCC overflow interrupt
* Input-port status changed interrupt (wake up from the sleep mode)
* External interrupt
* ADC completion interrupt
* PWM period match completion
* Comparator high interrupt
• Programmable free running watchdog timer
• 8 Programmable pull-down I/O pins
• 7 programmable pull-high I/O pins
• 8 programmable open-drain I/O pins
• Two clocks per instruction cycle
• Package types:
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
* 20 pin DIP 300mil
: EM78P458AP
* 20 pin SOP 300mil
: EM78P458AM
* 24 pin skinny DIP 300mil : EM78P459AK
* 24 pin SOP 300mil
: EM78P459AM
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
3. PIN ASSIGNMENT
P56/CIN+
1
24
P55/CIN-
P57/CO
2
23
P54/TCC
20
P55/CIN-
P60/ADC1
3
22
OSCI
P57/CO
2
19
P54/TCC
P61/ADC2
4
21
OSCO
P60/ADC1
3
18
OSCI
ENTCC
5
20
RESET
P61/ADC2
4
17
OSCO
Vss
6
19
VDD
Vss
5
16
VDD
Vss
7
18
VDD
P62/ADC3
6
15
P53/VREF
P62/ADC3
8
17
P53/VREF
P63/ADC4
7
14
P52/PWM2
P63/ADC4
9
16
P52/PWM2
P64/ADC5
8
13
P51/PWM1
P64/ADC5
10
15
P51/PWM1
P65/ADC6
9
12
P50/INT
P65/ADC6
11
14
P50/INT
P66/ADC7
10
11
P67/ADC8
P66/ADC7
12
13
P67/ADC8
EM78P459
1
EM78P458
P56/CIN+
Fig. 1 Pin Assignment
Table 1 EM78P458 Pin Description
Symbol
VDD
Pin No.
16
OSCI
18
OSCO
17
P50
12
P51 ~ P57
P60 ~ P67
INT
ADC1~ADC8
PWM1,
PWM2
VREF
13~15
19, 20,
1, 2
3, 4,
6~11
12
3, 4,
6 ~ 11
Type
Function
Power supply.
* XTAL type: Crystal input terminal or external clock input pin.
I
* RC type: RC oscillator input pin.
*XTAL type: Output terminal for crystal oscillator or external clock input
pin.
O
*RC type: Clock output with a period of one instruction cycle time, the
prescaler is determined by the CONT register.
* External clock signal input.
* General-purpose Input only.
I
* Default value while power-on reset.
I/O
I/O
I
I
13, 14
O
15
I
* General-purpose I/O pin.
* Default value while power-on reset.
* General-purpose I/O pin.
* Default value while power-on reset.
* External interrupt pin triggered by falling edge.
* Analog to Digital Converter.
* Defined by AD-CMPCON (IOCA0)<2:4>.
* Pulse width modulation outputs.
* Defined by PWMCON (IOC51)<6, 7>
* External reference voltage for ADC
* Defined by AD-CMPCON (IOCA0)<7>.
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
20, 1,2
I
O
TCC
19
I
VSS
5
-
CIN-, CIN+,
CO
* “-“ -> the input pin of Vin- of the comparator.
* “+”-> the input pin of Vin+ of the comparator.
* Pin CO is the output of the comparator.
* Defined by AD-CMPCON (IOCA0) <5, 6>
* Real time clock/counter with Schmitt trigger input pin; it must be tied to
VDD or VSS if it is not in use.
Ground.
Table 2 EM78P459 Pin Description
Symbol
VDD
Pin No.
19, 18
OSCI
22
OSCO
21
P50
14
Type
Function
Power supply.
* XTAL type: Crystal input terminal or external clock input pin.
I
* RC type: RC oscillator input pin.
* XTAL type: Output terminal for crystal oscillator or external clock input
pin.
O * RC type: Clock output with a period of one instruction cycle time, the
prescaler is determined by the CONT register.
* External clock signal input.
* General-purpose Input only.
I
* Default value while power-on reset.
15~17
23, 24
1, 2
3, 4,
8~13
14
3, 4,
8~13
I/O
15, 16
O
17
I
24, 1, 2
I
/RESET
20
I
TCC
23
I
ENTCC
VSS
5
6, 7
I
-
P51 ~ P57
P60 ~ P67
INT
ADC1~ADC8
PWM1,
PWM2
VREF
CIN-, CIN+,
CO
I/O
I
I
* General-purpose I/O pin.
* Default value while power-on reset.
* General-purpose I/O pin.
* Default value while power-on reset.
* External interrupt pin triggered by falling edge.
* Analog to Digital Converter.
* Defined by AD-CMPCON (IOCA0)<2:4>.
* Pulse width modulation outputs.
* Defined by PWMCON (IOC51)<6, 7>
* External reference voltage for ADC
* Defined by AD-CMPCON (IOCA0)<7>.
* ‘-’ -> the Vin- input pins of the comparators.
* ‘+’ -> the Vin+ input pins of the comparators.
* Pin CO is the output of the comparator.
* Defined by AD-CMPCON (IOCA0) <5, 6>
* If it remains at logic low, the device will be reset.
* Wake up from sleep mode when pins status changes.
* Voltage on /RESET/Vpp must not be over Vdd during normal mode.
* Pull-high is on if /RESET is asserted.
* Real time clock/counter with Schmitt trigger input pin; it must be tied to
VDD or VSS if it is not in use.
1: Enable TCC; 0: Disable TCC.
Ground.
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
4. FUNCTION DESCRIPTION
WDT Timer
WDT
Time-out
STACK 0
PC
STACK 1
Prescaler
STACK 2
Oscillator/
Timming
Control
STACK 3
ROM
/INT
STACK 4
STACK 5
Instruction
Register
Interrupt
Control
ENTCC
R1(TCC)
STACK 6
STACK 7
Sleep
&
Wake Up
Control
ALU
Instruction
Decoder
RAM
R3
R4
ACC
DATA & CONTROL BUS
Comparators
IOC5
R5
2 PWMs
P P P P PP P P
5555 55 55
0123 45 67
8 ADC
IOC6
R6
P PPPPPP P
66666666
01234567
Fig. 2 The Functional Block Diagram of EM78P458/459
4.1 Operational Registers
1. R0 (Indirect Addressing Register)
R0 is not a physically implemented register. Its major function is to perform as an indirect addressing
pointer. Any instruction using R0 as a pointer, actually accesses data pointed by the RAM Select
Register (R4).
2. R1 (Time Clock /Counter)
• Increased by an external signal edge through the TCC pin, or by the instruction cycle clock.
• The signals to increase the counter are decided by Bit 4 and Bit 5 of the CONT register.
• Writable and readable as any other registers.
3. R2 (Program Counter) & Stack
• R2 and hardware stacks are 12-bit wide. The structure is depicted in Fig. 4.
• Generates 4K×13 bits on-chip ROM addresses to the relative programming instruction codes. One
program page is 1024 words long.
• The contents of R2 are set to all "0"s upon a RESET condition.
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
• "JMP" instruction allows the direct loading of the lower 10 program counter bits. Thus, "JMP" allows
PC to jump to any location within a page.
• "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into the stack. Thus,
the subroutine entry address can be located anywhere within a page.
• "RET" ("RETL k", "RETI") instruction loads the program counter with the contents of the top of stack.
• "ADD R2, A" allows a relative address to be added to the current PC, and the ninth and tenth bits of
the PC are cleared.
• "MOV R2, A" allows to load an address from the "A" register to the lower 8 bits of the PC, and the
ninth and tenth bits of the PC are cleared.
• Any instruction that is written to R2 (e.g. "ADD R2, A", "MOV R2, A", "BC R2, 6",⋅⋅⋅⋅⋅) will cause the
ninth bit and the tenth bit (A8~A9) of the PC to be cleared. Thus, the computed jump is limited to the
first 256 locations of a page.
• In the case of EM78P458/459, the most two significant bits (A11 and A10) will be loaded with the
content of PS1 and PS0 in the status register (R3) upon the execution of a "JMP", "CALL", or any
other instructions set which write to R2.
• All instructions are single instruction cycle (fclk/2 or fclk/4) except for the instructions which write to
R2, need one more instruction cycle.
000H
008H
Reset Vector
Interrupt Vector
000
PC A11, A10
00
Page 0
User Memory
Space
3FF
400
Page 1
7FF
800
Page 2
BFF
C00
Page 3
FFFH
A9 ~ A0
01
10
11
FFF
Stack Level 0
Stack Level 1
Stack Level 2
Stack Level 3
Stack Level 4
Stack Level 5
Stack Level 6
Stack Level 7
On-chip Program Memory
Fig. 3 Program Counter Organization
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Address
PAGE registers
IOC PAGE registers
IOC PAGE registers
00
R0 (IAR)
Reserve
Reserve
01
R1 (TCC)
Reserve
Reserve
02
R2 (PC)
Reserve
Reserve
03
R3 (Status)
Reserve
Reserve
04
R4 RSR)
Reserve
Reserve
05
R5 (Port5)
IOC50 (I/O Port Control Register)
IOC51 (PWMCON)
06
R6 (Port6)
IOC60 (I/O Port Control Register)
IOC61 (DT1L)
07
R7
General Registers
Reserve
IOC71 (DT1H)
08
R8
General Registers
Reserve
IOC81 (PRD1)
09
R9
(ADCON)
IOC90 (GCON)
IOC91 (DT2L)
0A
RA
(ADDATA)
IOCA0 (AD-CMPCON)
IOCA1 (DT2H)
0B
RB General Registers
IOCB0 (Pull-down Control Register) IOCB1 (PRD2)
0C
RC General Registers
(Only two bits)
IOCC0 (Open-drain Control Register) IOCC1 (DL1L)
0D
RD General Registers
IOCD0 (Pull-high Control Register)
IOCD1 (DL1H)
0E
RE General Registers
(Only two bits)
IOCE0 (WDT Control Register)
IOCE1 (DL2L)
0F
RF (Interrupt status)
IOCF0 (Interrupt Mask Register)
IOCF1 (DL2H)
10
︰
1F
20
︰
General Registers
Bank 0
Bank 1
3F
Fig. 4 Data Memory Configuration
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
4. R3 (Status Register)
7
CMPOUT
6
PS1
5
PS0
4
T
3
P
2
Z
1
DC
0
C
• Bit 7 (CMPOUT) the result of the comparator output.
• Bit 6 (PS1) ~ 5 (PS0) Page select bits. PS0~PS1 are used to select a program memory page. When
executing a "JMP", "CALL", or other instructions which cause the program counter to be changed
(e.g. MOV R2, A), PS0~PS1 are loaded into the 11th and 12th bits of the program counter where it
selects one of the available program memory pages. Note that RET (RETL, RETI) instruction does
not change the PS0~PS1 bits. That is, the return will always be to the page from the place where the
subroutine was called, regardless of the current setting of PS0~PS1 bits.
PS1
0
0
1
1
PS0
0
1
0
1
Program memory page [Address]
Page 0 [000-3FF]
Page 1 [400-7FF]
Page 2 [800-BFF]
Page 3 [C00-FFF]
• Bit 4 (T) Time-out bit. Set to 1 by the "SLEP" and "WDTC" commands, or during Power on and reset
to 0 by WDT time-out.
• Bit 3 (P) Power-down bit. Set to 1 during power-on or by a "WDTC" command and reset to 0 by a
"SLEP" command.
• Bit 2 (Z) Zero flag. Set to "1" if the result of an arithmetic or logic operation is zero.
• Bit 1 (DC) Auxiliary carry flag
• Bit 0 (C) Carry flag
5. R4 (RAM Select Register)
• Bit 7 is a general-purpose read/write bit.
• Bit 6 is used to select bank 0 or bank 1.
• Bits 0~5 are used to select registers (address: 00~3F) in the indirect address mode.
6. R5 ~ R6 (Port 5 ~ Port 6)
• R5 and R6 are I/O registers.
7. R7 ~ R8
• All of these are 8-bit general-purpose registers.
8. R9 (ADCON: Analog to Digital Control)
7
-
6
-
5
IOCS
4
ADRUN
3
ADPD
2
ADIS2
1
ADIS1
0
ADIS0
• Bit 7:Bit 6 Unemployed, read as ‘0’;
• Bit 5(IOCS): Select the Segment of IO control register.
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
1 = Segment 1 ( IOC51~IOCF1 ) selected;
0 = Segment 0 ( IOC50~IOCF0 ) selected;
• Bit 4 (ADRUN): ADC starts to RUN.
1 = an A/D conversion is started. This bit can be set by software;
0 = reset on completion of the conversion. This bit can not be reset though software;
• Bit 3 (ADPD): ADC Power-down mode.
1 = ADC is operating;
0 = switch off the resistor reference to save power even while the CPU is operating.
• Bit2:Bit0 (ADIS2:ADIS0): Analog Input Select.
000 = AN0;
001 = AN1;
010 = AN2;
011 = AN3;
100 = AN4;
101 = AN5;
110 = AN6;
111 = AN7;
They can only be changed when the ADIF bit and the ADRUN bit are both LOW.
9. RA (ADDATA: the converted value of ADC)
When the A/D conversion is complete, the result is loaded into the ADDATA. The START//END bit is
cleared, and the ADIF is set.
10. RB
An 8-bit general-purpose register.
11. RC
A 2-bit, Bit 0and Bit 1 register.
12. RD
An 8-bit general-purpose register.
13. RE
A 2-bit, Bit 0 and Bit 1 register.
14. RF (Interrupt Status Register)
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
EM78P458/459
OTP ROM
7
-
6
CMPIF
5
PWM2IF
4
PWM1IF
3
ADIF
2
EXIF
1
ICIF
0
TCIF
“1” means interrupt request, and “0” means no interrupt occurs.
• Bit 7 Unemployed, read as ‘0’;
• Bit 6 (CMPIF) High-compared interrupt flag. Set when a change occurs in the output of Comparator,
reset by software.
• Bit 5 (PWM2IF) PWM2 (Pulse Width Modulation) interrupt flag. Set when a selected period is
reached, reset by software.
• Bit 4 (PWM1IF) PWM1 (Pulse Width Modulation) interrupt flag. Set when a selected period is
reached, reset by software.
• Bit 3 (ADIF) Interrupt flag for analog to digital conversion. Set when AD conversion is completed,
reset by software.
• Bit 2 (EXIF) External interrupt flag. Set by falling edge on /INT pin, reset by software.
• Bit 1 (ICIF) Port 6 input status change interrupt flag. Set when Port 6 input changes, reset by
software.
• Bit 0 (TCIF) TCC overflow interrupt flag. Set when TCC overflows, reset by software.
• RF can be cleared by instruction but cannot be set.
• IOCF0 is the interrupt mask register.
• Note that to read RF will result to "logic AND" of RF and IOCF0.
15. R10 ~ R3F
• All of these are 8-bit general-purpose registers.
4.2 Special Purpose Registers
1. A (Accumulator)
• Internal data transfer, or instruction operand holding
• It can not be addressed.
2. CONT (Control Register)
7
INTE
6
INT
5
TS
4
TE
3
PAB
2
PSR2
1
PSR1
0
PSR0
• Bit 7 (INTE) INT signal edge
0: interrupt occurs at the rising edge on the INT pin
1: interrupt occurs at the falling edge on the INT pin
• Bit 6 (INT) Interrupt enable flag
0: masked by DISI or hardware interrupt
1: enabled by the ENI/RETI instructions
This specification is subject to change without prior notice.
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EM78P458/459
OTP ROM
• Bit 5 (TS) TCC signal source
0: internal instruction cycle clock. If P54 is used as I/O pin, TS must be 0.
1: transition on the TCC pin
• Bit 4 (TE) TCC signal edge
0: increment if the transition from low to high takes place on the TCC pin;
1: increment if the transition from high to low takes place on the TCC pin.
• Bit 3 (PAB) Prescaler assignment bit.
0: TCC;
1: WDT.
• Bit 2 (PSR2) ~ Bit 0 (PSR0) TCC/WDT prescaler bits.
PSR2
0
0
0
0
1
1
1
1
PSR1
0
0
1
1
0
0
1
1
PSR0
0
1
0
1
0
1
0
1
TCC Rate
1:2
1:4
1:8
1:16
1:32
1:64
1:128
1:256
WDT Rate
1:1
1:2
1:4
1:8
1:16
1:32
1:64
1:128
• CONT register is both readable and writable.
3. IOC50 ~ IOC60 (I/O Port Control Register)
• "1" puts the relative I/O pin into high impedance, while "0" defines the relative I/O pin as output.
• IOC50 and IOC60 registers are both readable and writable.
4. IOC90 (GCON: I/O Configuration & Control of ADC )
7
OP2E
6
OP1E
5
G22
4
G21
3
G20
2
G12
1
G11
0
G10
• Bit 7 ( OP2E ) Enable the gain amplifier which input is connected to P64 and output is connected to
the 8-1 analog switch.
0 = OP2 is off ( default value ), and bypasses the input signal to the ADC;
1 = OP2 is on.
• Bit 6 ( OP1E ) Enable the gain amplifier whose input is connected to P60 and output is connected to
the 8-1 analog switch.
0 = OP1 is off (default value), and bypasses the input signal to the ADC;
1 = OP1 is on.
• Bit 5:Bit 3 (G22 and G20): Select the gain of OP2.
000 = IS x 1 (default value);
This specification is subject to change without prior notice.
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EM78P458/459
OTP ROM
001 = IS x 2;
010 = IS x 4;
011 = IS x 8;
100 = IS x 16;
101 = IS x 32;
Legend: IS = the input signal
• Bit 2:Bit 0 (G12 and G10 ): Select the gain of OP1.
000 = IS x 1 (default value);
001 = IS x 2;
010 = IS x 4;
011 = IS x 8;
100 = IS x 16;
101 = IS x 32;
Legend: S = the input signal
5. IOCA0 ( AD-CMPCON ):
7
VREFS
6
CE
5
COE
4
IMS2
3
IMS1
2
IMS0
1
CKR1
0
CKR0
• Bit 7: The input source of the Vref of the ADC.
0 = The Vref of the ADC is connected to Vdd (default value), and the P53/VREF pin carries out the
function of P53;
1 = The Vref of the ADC is connected to P53/VREF.
• Bit 6 (CE): Comparator enable bit
0 = Comparator is off (default value);
1 = Comparator is on.
• Bit 5 ( COE ): Set P57 as the output of the comparator
0 = the comparator acts as an OP if CE=1.
1 = act as a comparator if CE=1.
• Bit4:Bit2 (IMS2:IMS0):
Input Mode Select. ADC configuration definition bit. The following Table describes how to define the
characteristic of each pin of R6.
Table 3 Description of AD Configuration Control Bits
IMS2:IMS0
000
001
010
P60
A
A
A
P61
D
A
A
P62
D
D
A
This specification is subject to change without prior notice.
P63
D
D
D
P64
D
D
D
15
P65
D
D
D
P66
D
D
D
P67
D
D
D
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
011
100
101
110
111
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
D
A
A
A
A
D
D
A
A
A
D
D
D
A
A
D
D
D
D
A
• Bit 1: Bit 0 (CKR1: CKR0): The prescaler of oscillator clock rate of ADC
00 = 1: 4 (default value);
01 = 1: 16;
10 = 1: 64;
11 = The oscillator clock source of ADC is from WDT ring oscillator frequency.
( frequency=256/18ms≒14.2Khz)
6. IOCB0 (Pull-down Control Register)
7
/PD7
6
/PD6
5
/PD5
4
/PD4
3
/PD3
2
/PD2
1
/PD1
0
/PD0
1
/OD1
0
/OD0
• Bit 7 (/PD7) Control bit is used to enable the pull-down of the P67 pin.
0: Enable internal pull-down;
1: Disable internal pull-down.
• Bit 6 (/PD6) Control bit is used to enable the pull-down of the P66 pin.
• Bit 5 (/PD5) Control bit is used to enable the pull-down of the P65 pin.
• Bit 4 (/PD4) Control bit is used to enable the pull-down of the P64 pin.
• Bit 3 (/PD3) Control bit is used to enable the pull-down of the P63 pin.
• Bit 2 (/PD2) Control bit is used to enable the pull-down of the P62 pin.
• Bit 1 (/PD1) Control bit is used to enable the pull-down of the P61 pin.
• Bit 0 (/PD0) Control bit is used to enable the pull-down of the P60 pin.
• IOCB0 register is both readable and writable.
7. IOCC0 (Open-Drain Control Register)
7
/OD7
6
/OD6
5
/OD5
4
/OD4
3
/OD3
2
/OD2
• Bit 7 (OD7) Control bit used to enable the open-drain of the P57 pin.
0: Enable open-drain output
1: Disable open-drain output
• Bit 6 (OD6) Control bit is used to enable the open-drain of the P54 pin.
• Bit 5 (OD5) Control bit is used to enable the open-drain of the P52 pin.
• Bit 4 (OD4) Control bit is used to enable the open-drain of the P51 pin.
• Bit 3 (OD3) Control bit is used to enable the open-drain of the P67 pin.
• Bit 2 (OD2) Control bit is used to enable the open-drain of the P66 pin.
This specification is subject to change without prior notice.
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OTP ROM
• Bit 1 (OD1) Control bit is used to enable the open-drain of the P65 pin.
• Bit 0 (OD0) Control bit is used to enable the open-drain of the P64 pin.
• IOCC0 register is both readable and writable.
8. IOCD0 (Pull-high Control Register)
7
/PH7
6
/PH6
5
/PH5
4
-
3
/PH3
2
/PH2
1
/PH1
0
/PH0
1
-
0
-
• Bit 7 (/PH7) Control bit is used to enable the pull-high of the P56 pin.
0: Enable internal pull-high;
1: Disable internal pull-high.
• Bit 6 (/PH6) Control bit is used to enable the pull-high of the P55 pin.
• Bit 5 (/PH5) Control bit is used to enable the pull-high of the P53 pin.
• Bit 4 Not used.
• Bit 3 (/PH3) Control bit is used to enable the pull-high of the P63 pin.
• Bit 2 (/PH2) Control bit is used to enable the pull-high of the P62 pin.
• Bit 1 (/PH1) Control bit is used to enable the pull-high of the P61 pin.
• Bit 0 (/PH0) Control bit is used to enable the pull-high of the P60 pin.
• IOCD0 register is both readable and writable.
9. IOCE0 (WDT Control Register)
7
WDTE
6
EIS
5
-
4
-
3
-
2
-
• Bit 7 (WDTE) Control bit is used to enable Watchdog Timer.
0: Disable WDT;
1: Enable WDT.
WDTE is both readable and writable
• Bit 6 (EIS) Control bit is used to define the function of the P50 (/INT) pin.
0: P50, input pin only;
1: /INT, external interrupt pin. In this case, the I/O control bit of P50 (bit 0 of IOC50) must be set to
"1".
When EIS is "0", the path of /INT is masked. When EIS is "1", the status of /INT pin can also be read
by way of reading Port 5 (R5). Refer to Fig. 7.
EIS is both readable and writable.
• Bits 5~0 Not used.
This specification is subject to change without prior notice.
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10. IOCF0 (Interrupt Mask Register)
7
-
6
CMPIE
5
PWM2IE
4
PWM1IE
3
ADIE
2
EXIE
1
ICIE
0
TCIE
• Bit 7: Unimplemented, read as ‘0’.
Individual interrupt is enabled by setting its associated control bit in the IOCF0 to "1".
Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Fig.
11.
• Bit 6 (CMPIE) CMPIF interrupt enable bit.
0: disable CMPIF interrupt
1: enable CMPIF interrupt
• Bit 5 (PWM2IE) PWM2IF interrupt enable bit.
0: disable PWM2 interrupt
1: enable PWM2 interrupt
• Bit 4 (PWM1IE) PWM1IF interrupt enable bit.
0: disable PWM1 interrupt
1: enable PWM1 interrupt
• Bit 3 (ADIE) ADIF interrupt enable bit.
0: disable ADIF interrupt
1: enable ADIF interrupt
• Bit 2 (EXIE) EXIF interrupt enable bit.
0: disable EXIF interrupt
1: enable EXIF interrupt
• Bit 1 (ICIE) ICIF interrupt enable bit.
0: disable ICIF interrupt
1: enable ICIF interrupt
• Bit 0 (TCIE) TCIF interrupt enable bit.
0: disable TCIF interrupt
1: enable TCIF interrupt
IOCF0 register is both readable and writable.
11. IOC51 ( PWMCON ):
7
PWM2E
6
PWM1E
5
T2EN
4
T1EN
3
T2P1
2
T2P0
1
T1P1
0
T1P0
• Bit 7 (PWM2E): PWM2 enable bit
0 = PWM2 is off (default value), and its related pin carries out the P52 function.
1 = PWM2 is on, and its related pin will be set to output automatically.
This specification is subject to change without prior notice.
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OTP ROM
• Bit 6 (PWM1E): PWM1 enable bit
0 = PWM1 is off (default value), and its related pin carries out the P51 function;
1 = PWM1 is on, and its related pin will be set to output automatically.
• Bit 5 (T2EN): TMR2 enable bit
0 = TMR2 is off (default value).
1 = TMR2 is on.
• Bit 4 (T1EN): TMR1 enable bit
0 = TMR1 is off (default value).
1 = TMR1 is on.
• Bit 3: Bit 2 ( T2P1:T2P0 ): TMR2 clock prescale option bits.
T2P1
0
0
1
1
T2P0
0
1
0
1
Prescale
1:2(Default)
1:8
1:32
1:64
• Bit 1 : Bit 0 ( T1P1:T1P0 ): TMR1 clock prescale option bits.
T1P1
0
0
1
1
T1P0
0
1
0
1
Prescale
1:2(Default)
1:8
1:32
1:64
12. IOC61 ( DT1L: the Least Significant Byte ( Bit 7 ~ Bit 0) of Duty Cycle of
PWM1 )
A specified value keeps the output of PWM1 to stay at high until the value matches with TMR1.
13. IOC71 ( DT1H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle of
PWM1 )
7
CALI1
6
SIGN1
5
VOF1[2]
4
VOF1[1]
3
VOF1[0]
2
-
1
PWM1[9]
0
PWM1[8]
• Bit 7 (CALI1): Calibration enable bit
0 = Calibration disable;
1 = Calibration enable.
• Bit 6 (SIGN1): Polarity bit of offset voltage
0 = Negative voltage;
1 = Positive voltage.
• Bit 5:Bit 3 (VOF1[2]:VOF1[0]): Offset voltage bits.
• Bit 1:Bit 0 (PWM1[9]:PWM1[8]): The Most Significant Byte of PWM1 Duty Cycle
A specified value keeps the PWM1 output to stay at high until the value matches with TMR1.
This specification is subject to change without prior notice.
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OTP ROM
14. IOC81 ( PRD1: Period of PWM1 ):
The content of IOC81 is a period (time base) of PWM1. The frequency of PWM1 is the reverse of the
period.
15. IOC91 ( DT2L: the Least Significant Byte ( Bit 7 ~ Bit 0 ) of Duty Cycle of
PWM2 )
A specified value keeps the of PWM1 output to stay at high until the value matches with TMR2.
16. IOCA1 ( DT2H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle of
PWM2 )
7
CALI2
6
SIGN2
5
VOF2[2]
4
VOF2[1]
3
VOF2[0]
2
-
1
PWM2[9]
0
PWM2[8]
• Bit 7 (CALI2): Calibration enable bit
0 = Calibration disable;
1 = Calibration enable.
• Bit 6 (SIGN2): Polarity bit of offset voltage
0 = Negative voltage;
1 = Positive voltage.
• Bit 5:Bit 3 (VOF2[2]:VOF2[0]): Offset voltage bits
• Bit 1:Bit 0 (PWM2[9]:PWM2[8]): The Most Significant Byte of PWM1 Duty Cycle
A specified value keeps the PWM2 output to stay at high until the value matches with TMR2.
17. IOCB1 ( PRD2: Period of PWM2 )
The content of IOCB1 is a period (time base) of PWM2. The frequency of PWM2 is the reverse of the
period.
18. IOCC1 ( DL1L: the Least Significant Byte ( Bit 7 ~ Bit 0 ) of Duty Cycle Latch of
PWM1 )
The content of IOCC1 is read-only.
19. IOCD1 ( DL1H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle Latch of
PWM1 )
The content of IOCD1 is read-only.
20. IOCE1 ( DL2L: the Least Significant Byte ( Bit 7 ~ Bit 0) of Duty Cycle Latch of
PWM2 )
This specification is subject to change without prior notice.
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OTP ROM
The content of IOCE1 is read-only.
21. IOCF1 ( DL2H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle Latch of
PWM2 )
The content of IOCF1 is read-only.
This specification is subject to change without prior notice.
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OTP ROM
4.3 TCC/WDT & Prescaler
An 8-bit counter is available as prescaler for the TCC or WDT. The prescaler is available for either the
TCC or WDT only at any given time, and the PAB bit of CONT register is used to determine the
prescaler assignment. The PSR0~PSR2 bits determine the prescale ratio. The prescaler is cleared
each time the instruction is written to TCC under TCC mode. The WDT and prescaler, when assigned to
WDT mode, are cleared by the WDTC or SLEP instructions. Fig. 5 depicts the circuit diagram of
TCC/WDT.
• R1(TCC) is an 8-bit timer/counter. The TCC clock source can be internal or external clock input (edge
selectable from TCC pin). If TCC signal source is from internal clock, TCC will increase by 1 at every
instruction cycle (without prescaler). Referring to Fig. 5, selection of CLK=Fosc/2 or CLK=Fosc/4
depends on the CODE Option bit CLKS. CLK=Fosc/2 if CLKS bit is "0", and CLK=Fosc/4 if CLKS bit is
"1".
• If TCC signal source is from external clock input, TCC will increase by 1 at every falling edge or rising
edge of TCC pin.
• The watchdog timer is a free running on-chip RC oscillator. The WDT will keep on running even after
the oscillator driver has been turned off (i.e. in sleep mode). During normal operation or sleep mode, a
WDT time-out (if enabled) will cause the device to reset. The WDT can be enabled or disabled at any
time during the normal mode by software programming. Refer to WDTE bit of IOCE0 register. Without
presacler, the WDT time-out period is approximately 18 ms1.
1
NOTE: VDD=5V,Setup time period = 18ms ± 30%.
VDD=3V,Setup time period = 22ms ± 30%.
This specification is subject to change without prior notice.
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OTP ROM
CLK (Fosc/2 or Fosc/4)
DATA BUS
0
TCC
Pin
1
TE
1
M
U
X
M
U
X
0
TS
1
TCC (R1)
TCC overflow
interrupt
PAB
0
WDT
SYNC
2 cycles
M
U
X
8-bit Counter
PAB
8-to-1 MUX
PSR0 ~ PSR2
1
0
WDTE
(in IOCE)
MUX
PAB
WDT timeout
Fig. 5 Block Diagram of TCC and WDT
4.4 I/O Ports
Port 5, Port 6, and the I/O registers are bi-directional tri-state I/O ports. The function of Pull-high,
Pull-down, and Open-drain can be set internally by IOCB0, IOCC0, and IOCD0, respectively. Port 6
features an input status changed interrupt (or wake-up) function. Each I/O pin can be defined as
"input" or "output" pin by the I/O control register (IOC50 ~ IOC60). The I/O registers and I/O control
registers are both readable and writable. The I/O interface circuits for Port 5 and Port 6 are shown in
the following Fig. 6, Fig. 7, and Fig. 8 respectively.
This specification is subject to change without prior notice.
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EM78P458/459
OTP ROM
PCRD
Q
PORT
D
_
CLK
Q
C
L
Q
P
R
IOD
D
CLK
_
PCWR
PDWR
C
L
Q
PDRD
M
U
X
0
1
NOTE: Pull-down is not shown in the figure.
Fig. 6 The Ccircuit of I/O Port and I/O Control Register for Port 5
PCRD
Q
P
R
D
_
CLK
Q
C
L
PCWR
P50, /INT
Q
PORT
P
R
D
_
CLK
Q
C
L
IOD
PDWR
Bit 6 of IOCE0
D
P
R
CLK
C
L
0
Q
1
_
M
U
X
Q
PDRD
TI 0
D
P
R
CLK
C
L
Q
_
Q
INT
NOTE: Pull-high (down) and Open-drain are not shown in the figure.
Fig. 7 The Circuit of I/O Port and I/O Control Register for P50(/INT)
This specification is subject to change without prior notice.
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OTP ROM
PCRD
Q
P
R
D
_
CLK
Q
C
L
PCWR
P60 ~ P67
Q
PORT
0
P
R
IOD
D
_
CLK
Q
C
L
PDWR
M
U
X
1
PDRD
TI n
D
P
R
CLK
C
L
Q
_
Q
NOTE: Pull-high (down) and Open-drain are not shown in the figure.
Fig. 8 The Circuit of I/O Port and I/O Control Register for P60~P67
IOCE.1
D
P
R
Q
Interrupt
CLK
_
C Q
L
RE.1
ENI Instruction
P
D R Q
T10
T11
CLK
_
C
L Q
P
Q R
D
CLK
_
Q C
L
T17
DISI Instruction
Interrupt
(Wake-up from SLEEP)
/SLEP
Next Instruction
(Wake-up from SLEEP)
Fig. 9 Block Diagram of Port 6 with Input Changed Interrupt/Wake-up
This specification is subject to change without prior notice.
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OTP ROM
Table 4 Usage of Port 6 Input Changed Wake-up/Interrupt Function
Usage of Port 6 Input Status Changed Wake-up/Interrupt
(I) Wake-up from Port 6 Input Status Change
(II) Port 6 Input Status Change Interrupt
(a) Before SLEEP
1. Read I/O Port 6 (MOV R6,R6)
1. Disable WDT
2. Execute "ENI"
2. Read I/O Port 6 (MOV R6,R6)
3. Enable interrupt (Set IOCF0.1)
3. Execute "ENI" or "DISI"
4. IF Port 6 changed (interrupt)
4. Enable interrupt (Set IOCF0.1)
→ Interrupt vector (008H)
5. Execute "SLEP" instruction
(b) After wake-up
1. IF "ENI" → Interrupt vector (008H)
2. IF "DISI" → Next instruction
4.5 RESET and Wake-up
1. The function of RESET and Wake-up
A RESET is initiated by one of the following events(1) Power-on reset
(2) /RESET pin input "low", or
(3) WDT time-out (if enabled).
The device is kept in a RESET condition for a period of approximately 18ms (one oscillator start-up
timer period) after the reset is detected. Once the RESET occurs, the following functions are
performed.
• The oscillator is running, or will be started.
• The Program Counter (R2) is set to all "0".
• All I/O port pins are configured as input mode (high-impedance state).
• The Watchdog Timer and prescaler are cleared.
• When power is switched on, the upper 3 bits of R3 are cleared.
• The bits of the CONT register are set to all "1" except for the Bit 6 (INT flag).
• The bits of the IOCB0 register are set to all "1".
• The IOCC0 register is cleared.
• The bits of the IOCD0 register are set to all "1".
• Bit 7 of the IOCE0 register is set to "1", and Bit 6 is cleared.
• Bits 0~6 of RF register and bits 0~6 of IOCF0 register are cleared.
Executing the “SLEP” instruction will assert the sleep (power down) mode. While entering sleep mode,
the WDT (if enabled) is cleared but keeps on running. The controller can be awakened by(1) External reset input on /RESET pin.
This specification is subject to change without prior notice.
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OTP ROM
(2) WDT time-out (if enabled).
(3) Port 6 input status change (if enabled).
(4) Comparator high.
(5) ADC complete.
The first two cases will cause the EM78P458/459 to reset. The T and P flags of R3 can be used to
determine the source of the reset (wake-up). Case 3 is considered the continuation of program
execution and the global interrupt ("ENI" or "DISI" being executed) decides whether or not the
controller branches to the interrupt vector following wake-up. If ENI is executed before SLEP, the
instruction will begin to execute from the address 0x8 after wake-up. If DISI is executed before SLEP,
the execution will restart from the instruction right next to SLEP after wake-up.
Only one of the Cases 2, to 4 can be enabled before entering into sleep mode. That is,
[a] if Port 6 Input Status Change Interrupt is enabled before SLEP , WDT must be disabled by
software. However, the WDT bit in the option register remains enabled. Hence, the
EM78P458/459 can be awakened only by Case 1 or 3.
[b] if WDT is enabled before SLEP, Port 6 Input Status Changed Interrupt must be disabled. Hence,
the EM78P458/459 can be awakened only by Case 1 or 2. Refer to the section on Interrupt for
further details.
[c] if Comparator High Interrupt is enabled before SLEP, WDT must be disabled by software.
However, the WDT bit in the option register remains enabled. Hence, the EM78P458/459 can
be awakened only by Case 1 or 4.
If Port 6 Input Status Change Interrupt is used to wake up the EM78P458/459 (as in Case [a] above),
the following instructions must be executed before SLEP:
MOV A, @0Bxx000110
; Select internal TCC clock
CONTW
CLR R1
; Clear TCC and prescaler
MOV A, @0Bxxxx1110
; Select WDT prescaler
CONTW
WDTC
; Clear WDT and prescaler
MOV A, @0B0xxxxxxx
; Disable WDT
IOW RE
MOV R6, R6
; Read Port 6
MOV A, @0B00000x1x
; Enable Port 6 input change interrupt
IOW RF
This specification is subject to change without prior notice.
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06.25.2004 (V1.4)
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OTP ROM
ENI (or DISI)
; Enable (or disable) global interrupt
SLEP
; Sleep
NOP
Similarly, if the Comparator High Interrupt is used to wake up the EM78P458/459 (as in Case [c]
above), the following instructions must be executed before SLEP:
MOV A, @0Bxx000110
; Select internal TCC clock
CONTW
CLR R1
; Clear TCC and prescaler
MOV A, @0Bxxxx1110
; Select WDT prescaler
CONTW
WDTC
; Clear WDT and prescaler
MOV A, @0B0xxxxxxx
; Disable WDT
IOW RE
MOV A, @0B01xxxxxx
; Enable comparator high interrupt
IOW RF
ENI (or DISI)
; Enable (or disable) global interrupt
SLEP
; Sleep
NOP
One problem user must be aware of, is that after waking up from the sleep mode, the WDT function
will enable automatically. The WDT operation (being enabled or disabled) should be handled
appropriately by software after waking up from the sleep mode.
2. The Status of T, and P of STATUS Register
A RESET condition is initiated by one of the following events:
(1) A power-on condition,
(2) A high-low-high pulse on /RESET pin, or
(3) Watchdog Timer time-out.
The values of T and P, as listed in Table 5 below, are used to check how the processor wakes up.
Table 6 shows the events, which may affect the status of T and P.
This specification is subject to change without prior notice.
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OTP ROM
Table 5 The Values of RST, T, and P after RESET
Reset Type
Power-on
/RESET during Operating mode
/RESET wake-up during SLEEP mode
WDT during Operating mode
WDT wake-up during SLEEP mode
Wake-up on pin change during SLEEP mode
T
P
1
*P
1
0
0
1
1
*P
0
*P
0
0
*P: Previous status before reset
Table 6 The Status of RST, T and P being Affected by Events
Event
Power-on
WDTC instruction
WDT time-out
SLEP instruction
Wake-up on pin changed during SLEEP mode
T
P
1
1
0
1
1
1
1
*P
0
0
*P: Previous value before reset
VDD
D
Oscillator
Q
CLK
CLK
CLR
Power-On Reset
Voltage Detector
W
WDT Timeout
WDT
Setup time
Reset
/RESET
Fig. 10 Block Diagram of Reset of Controller
This specification is subject to change without prior notice.
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OTP ROM
4.6 Interrupt
The EM78P458/459 has six interrupts as listed below:
(1) TCC overflow interrupt
(2) Port 6 Input Status Change Interrupt
(3) External interrupt [(P50, /INT) pin].
(4) Analog to Digital conversion completed.
(5) When TMR1/TMR2 matches with PRD1/PRD2 respectively in PWM.
(6) When the comparators output change.
Before the Port 6 Input Status Change Interrupt is enabled, reading Port 6 (e.g. "MOV R6,R6") is
necessary. Each Port 6 pin will have this feature if its status changes. Any pin configured as output or
P50 pin configured as /INT, is excluded from this function. Port 6 Input Status Change Interrupt will
wake up the EM78P458/459 from the sleep mode if it is enabled prior to going into the sleep mode by
executing SLEP. When the controller is wake-up, it will continue to execute the succeeding program if
the global interrupt is disabled, or branches out to the interrupt vector 008H if the global interrupt is
enabled.
RF, the interrupt status register that records the interrupt requests in the relative flags/bits. IOCF0 is
an interrupt mask register. The global interrupt is enabled by the ENI instruction and is disabled by the
DISI instruction. When one of the interrupts (when enabled) occurs, the next instruction will be
fetched from address 008H. Once in the interrupt service routine, the source of an interrupt can be
determined by polling the flag bits in RF. The interrupt flag bit must be cleared by instructions before
leaving the interrupt service routine to avoid recursive interrupts.
The flag (except ICIF bit) in the Interrupt Status Register (RF) is set regardless of the status of its
mask bit or the execution of ENI. Note that the outcome of RF will be the logic AND of RF and IOCF0
(refer to Fig. 11). The RETI instruction ends the interrupt routine and enables the global interrupt (the
execution of ENI).
When an interrupt is generated by the INT instruction (when enabled), the next instruction will be
fetched from address 001H.
This specification is subject to change without prior notice.
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OTP ROM
Fig. 11 Interrupt Input Circuit
4.7 Analog-To-Digital Converter (ADC)
The analog-to-digital circuitry consists of an 8-bit analog multiplexer, three control registers
(ADCON/R9, AD-CMP-CON/IOCA0, GCON/IOC90), one data register (ADDATA/RA) and an ADC
with 8-bit resolution. The functional block diagram of the ADC is shown in Fig. 12. The analog
reference voltage (Vref) and analog ground are connected via separate input pins.
The ADC module utilizes successive approximation to convert the unknown analog signal into a
digital value. The result is fed to the ADDATA. Input channels are selected by the analog input
multiplexer via the ADCON register Bits ADIS0, ADIS1, and ADIS2.
ADC8
Vref
ADC7
8-1 Analog Switch
ADC6
+
OP2
-
ADC5
ADC4
Power-Down
ADC
( successive approximation )
Start to Convert
ADC3
Fsco
ADC2
4-1
MUX
+
OP1
-
ADC1
Internal
RC
4
3
2
5
4
3
2
AD-CMPCON
1
0
2
1
0
1
ADCON AD-CMPCON
0
3
RF
7
6
5
ADDATA
4
3
2
1
0
4
3
ADCON
GCON
DATA BUS
Fig. 12 The Functional Block Diagram of Analog-to-Digital Conversion
This specification is subject to change without prior notice.
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OTP ROM
1. ADC Control Register (ADCON/R9, AD-CMP-CON/IOCA0, GCON/IOC90)
1.1 ADCON/R9
The ADCON register controls the operation of the A/D conversion and decides which pin should
be currently active.
BIT
SYMBOL
*Init_Value
7
0
6
0
5
IOCS
0
4
ADRUN
0
3
ADPD
0
2
ADIS2
0
1
ADIS1
0
0
ADIS0
0
*Init_Value: Initial value at power on reset
• ADRUN (bit 4): ADC starts to RUN.
1 = an A/D conversion is started. This bit can be set by software.
0 = reset on completion of the conversion. This bit can not be reset in software.
• ADPD (bit 3): ADC Power-down Mode.
1 = ADC is operating;
0 = switch off the resistor reference to save power even when the CPU is operating.
• ADIS2~ADIS0 (bit 2~0): Analog Input Select.
000 = AN0;
001 = AN1;
010 = AN2;
011 = AN3;
100 = AN4;
101 = AN5;
110 = AN6;
111 = AN7;
Change occurs only when the ADIF bit and the ADRUN bit are both LOW.
1.2 AD-CMP-CON/IOCA0
The AD-CMP-CON register defines the pins of Port 6 as analog inputs or as digital I/O,
individually.
BIT
SYMBOL
*Init_Value
7
VREFS
0
6
CE
0
5
COE
0
4
IMS2
0
3
IMS1
0
2
IMS0
0
1
CKR1
0
0
CKR0
0
*Init_Value: Initial value at power on reset
• VREFS (Bit 7): The input source of the Vref of the ADC.
0 = The Vref of the ADC is connected to Vdd (default value), and the P53/VREF pin carries out
the function of P53;
This specification is subject to change without prior notice.
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OTP ROM
1 = The Vref of the ADC is connected to P53/VREF.
• CE (Bit 6): Control bit used to enable comparator.
0 = Disable comparator
1 = Enable comparator
• COE (Bit 5): Set P57 as the output of the comparator
0 = the comparator acts as an OP if CE=1.
1 = act as a comparator if CE=1.
• IMS2~IMS0 (Bit 4 ~ Bit 2): ADC configuration definition bit.
• CKR1 and CKR0 (Bit 1 and Bit 0): The conversion time select.
00 = Fosc/4;
01 = Fosc/16;
10 = Fsco/64;
11 = The oscillator clock source of ADC is from WDT ring oscillator frequency.
( frequency=256/18ms≒14.2Khz)
1.3 GCON/IOC90
As shown in Fig. 12, OP1 and OP2, the gain amplifiers, are located in the middle of the analog
input pins (ADC1 and ADC5) and the 8-1analog switch. The GCON register controls the gains.
Table 7 Table 7 Shows the Gains and the Operating Range of ADC.
BIT
SYMBOL
*Init_Value
7
OP2E
0
6
OP1E
0
5
G22
0
4
G21
0
3
G20
0
2
G12
0
1
G11
0
0
G10
0
Table 8 The Gains and the Operating Range of ADC
G10:G12/G20:G22
000
001
010
011
100
101
Gain
1
2
4
8
16
32
Range of Operating Voltage
0 ~ Vref
0 ~ (1/2)Vref
0 ~ (1/4)Vref
0 ~ (1/8)Vref
0 ~ (1/16)Vref
0 ~ (1/32)Vref
<Note> Vref can not be less than 3 volts.
2. ADC Data Register (ADDATA/RA)
When the A/D conversion is complete, the result is loaded to the ADDATA. The START/END bit is
clear, and the ADIF is set.
This specification is subject to change without prior notice.
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3. A/D Sampling Time
The accuracy, linearity, and speed of the successive approximation A/D converter are dependent on
the properties of the ADC and the comparator. The source impedance and the internal sampling
impedance directly affect the time required to charge the sample holding capacitor. The application
program controls the length of the sample time to meet the specified accuracy. Generally speaking,
the program should wait for 1 μs for each KΩ of the analog source impedance and at least 1 μs for
the low-impedance source. After the analog input channel is selected, this acquisition time must be
done before the conversion can be started.
4. A/D Conversion Time
CKR0 and CKR1 select the conversion time (Tct), in terms of instruction cycles. This allows the MCU
to run at the maximum frequency without sacrificing the accuracy of A/D conversion. For the
EM78P458/459, the conversion time per bit is about 4μs. Table 8 shows the relationship between
Tct and the maximum operating frequencies.
Table 9 Tct vs. the Maximum Operation Frequency
CKR0:CKR1
00
01
10
11
Operation Mode
Fsco/4
Fsco/16
Fsco/64
Internal RC
Max. operation frequency
1 MHz
4 MHz
16MHz
-
5. A/D Operation During Sleep Mode
In order to reduce power consumption, the A/D conversion remains operational during sleep mode,
and is obligated to implement the internal RC clock source mode. As the SLEP instruction is executed,
all the operations of the MCU will stop except for the A/D conversion. The RUN bit will be cleared and
the result will be fed to the ADDATA when the conversion is completed. If the ADIE is enabled, the
device will wake up. Otherwise, the A/D conversion will be shut off, no matter what the status of
ADPD bit is.
6. Programming Steps/Considerations
1. Programming steps
Follow these steps to obtain data from the ADC:
(1) Write to the three bits (IMS2:IMS0) on the AD-CMP-CON1 register to define the characteristics
of R6: Digital I/O, analog channels, and voltage reference pin;
(2) Write to the ADCON register to configure AD module:
This specification is subject to change without prior notice.
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OTP ROM
(a) Select A/D input channel ( ADAS2:ADAS0 );
(b) Select the proper gains by writing to the GCON register ( optional );
(c) Define A/D conversion clock rate ( CKR1:CKR0 );
(d) Set the ADPD bit to 1 to begin sampling.
(3) Put “ENI” instruction, if the interrupt function is employed.
(4) Set the ADRUN bit to 1.
(5) Wait for either the interrupt flag to be set or the ADC interrupt to occur.
(6) Read ADDATA, the conversion data register.
(7) Clear the interrupt flag bit (ADIF).
(8) For next conversion, go to Step 1 or Step 2 as required. At least 2 Tct is required before next
acquisition starts.
<Note>: To obtain an accurate value, it is necessary to avoid any data transition on I/O pins during
AD conversion.
2. The Demonstration Programs
; To define the general registers
R_0 == 0
; Indirect addressing register
PSW == 3
; Status register
PORT5 == 5
PORT6 == 6
R_F== 0XF
; Interrupt status register
; To define the control register
IOC50 == 0X5
; Control Register of Port 5
IOC60 == 0X6
; Control Register of Port 6
C_INT== 0XF
; Interrupt Control Register
;ADC Control Registers
ADDATA == 0xA
; The contents are the results of ADC
ADCON R== 0x9
; 7
This specification is subject to change without prior notice.
6
5
35
4
3
2
1
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EM78P458/459
OTP ROM
; ADCONC== 0xA
GCON == 0x9
-
IOCS ADRUN ADPD ADIS2 ADIS1 ADIS0
; 7
6
5
; VREFS
X
X
; 7
; OPE2
6
4
3
IMS2 IMS1
5
OPE1 G22
4
G21
2
1
0
IMS0 CKR1 CKR0
3
2
G20
G12
1
G11
0
G10
;To define bits
;In ADCONR
ADRUN == 0x4
; ADC is executed as the bit is set
ADPD == 0x3
; Power Mode of ADC
ORG 0
; Initial address
JMP INITIAL
;
ORG 0x08
; Interrupt vector
(User program)
CLR R_F
; To clear the ADCIF bit
BS ADCONR, ADRUN
; To start to execute the next AD conversion if necessary
RETI
INITIAL:
MOV A, @0BXXXX1XXX
; Enable the interrupt function of ADC, “X” by application
IOW C_INT
MOV A, @0xXX
; Interrupt disabled:<6>
CONTW
MOV A, @0B00000000
; To employ Vdd as the reference voltage, to define P60 as
IOW ADCONC
; an analog input and set clock rate at fosc/4
En_ADC:
This specification is subject to change without prior notice.
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OTP ROM
MOV A, @0BXXXXXXX1
; To define P60 as an input pin, and the others are dependent
IOW PORT6
; on applications
MOV A, @0B01000101
; To enable the OP1, and set the gain as 32
IOW GCON
BS ADCONR, ADPD
; To disable the power-down mode of ADC
ENI
; Enable the interrupt function
BS ADCONR, ADRUN
; Start to run the ADC
; If the interrupt function is employed, the following three lines may be ignored
POLLING:
JBC ADCONR, ADRUN
; To check the ADRUN bit continuously;
JMP POLLING
; ADRUN bit will be reset as the AD conversion is completed
(User program)
:
:
:
4.8 Dual Sets of PWM ( Pulse Width Modulation )
1. Overview
In PWM mode, both PWM1 and PWM2 pins produce up to a 10-bit resolution PWM output (see. Fig.
13 for the functional block diagram). A PWM output has a period and a duty cycle, and it keeps the
output in high. The baud rate of the PWM is the inverse of the period. Fig. 14 depicts the relationships
between a period and a duty cycle.
This specification is subject to change without prior notice.
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OTP ROM
DL1H + DL1L
latch
To PW M 1IF
DT1H
+
DT1L
Fosc
1:2
1:8
1:32
1:64
Duty Cycle
M atch
Com parator
PW M 1
M UX
R
Q
TM R1H + TM R1L
reset
S
IOC51
Com parator
T1P0 T1P1 T1EN
Period
M atch
PRD1
Data Bus
Data Bus
DL2H + DL2L
DT2H
+
DT2L
T2P0 T2P1 T2EN
latch
Com parator
To PW M 2IF
Duty Cycle
M atch
PW M 2
Fosc
1:2
1:8
1:32
1:64
R
TM R2H + TM R2L
reset
Q
S
M UX
IOC51
Com parator
Period
M atch
PRD2
Fig. 13 The Functional Block Diagram of the Dual PWMs
Period
Duty Cycle
PRD1 = TMR1
DT1 = TMR1
Fig. 14 The Output Timing of the PWM
2. Increment Timer Counter ( TMRX: TMR1H/TWR1L or TMR2H/TWR2L )
TMRX are ten-bit clock counters with programmable prescalers. They are designed for the PWM
module as baud rate clock generators. TMRX can be read, written, and cleared at any reset
conditions. If employed, they can be turned down for power saving by setting T1EN bit
[PWMCON<4>] or T2EN bit [PWMCON<5>] to 0.
3. PWM Period ( PRDX : PRD1 or PRD2 )
The PWM period is defined by writing to the PRDX register. When TMRX is equal to PRDX, the
This specification is subject to change without prior notice.
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OTP ROM
following events occur on the next increment cycle:
• TMRX is cleared.
• The PWMX pin is set to 1.
• The PWM duty cycle is latched from DT1/DT2 to DTL1/DTL2.
< Note > The PWM output will not be set, if the duty cycle is 0;
• The PWMXIF pin is set to 1.
The following formula describes how to calculate the PWM period:
PERIOD = (PRDX + 1) * 4 * (1/Fosc) * (TMRX prescale value )
4. PWM Duty Cycle ( DTX: DT1H/ DT1L and DT2H/ DT2L; DTL: DL1H/DL1L and
DL2H/DL2L )
The PWM duty cycle is defined by writing to the DTX register, and is latched from DTX to DLX while
TMRX is cleared. When DLX is equal to TMRX, the PWMX pin is cleared. DTX can be loaded at any
time. However, it cannot be latched into DTL until the current value of DLX is equal to TMRX.
The following formula describes how to calculate the PWM duty cycle:
Duty Cycle = (DTX) * (1/Fosc) * (TMRX prescale value )
5. Comparator X
To change the output status while the match occurs, the TMRXIF flag will be set at the same time.
6. PWM Programming Procedures/Steps
(1) Load PRDX with the PWM period..
(2) Load DTX with the PWM Duty Cycle.
(3) Enable interrupt function by writing IOCF0, if required.
(4) Set PWMX pin to be output by writing a desired value to IOC51.
(5) Load a desired value to IOC51 with TMRX prescaler value and enable both PWMX and TMRX.
This specification is subject to change without prior notice.
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OTP ROM
4.9 Timer
1. Overview
Timer1 (TMR1) and Timer2 (TMR2) (TMRX) are 10-bit clock counters with programmable prescalers,
respectively. They are designed for the PWM module as baud rate clock generators. TMRX can be
read, written, and cleared at any reset conditions.
2. Function description
Fig. 15 shows TMRX block diagram. Each signal and block are described as follows:
Fosc
1:2
1:8
1:32
1:64
To PWM1IF
MUX
TMR1X
reset
Period
Match
Comparator
T1P0
T1P1 T1EN
PRD1
Data Bus
Data Bus
PRD2
T2P0 T2P1 T2EN
Fosc
1:2
1:8
1:32
1:64
Comparator
TMR2X
Period
Match
reset
MUX
To PWM2IF
*TMR1X = TMR1H + TMR1L;
*TMR2X = TMR2H +TMR2L
Fig. 15 TMRX Block Diagram
Fosc: Input clock.
Prescaler ( T1P0 and T1P1/T2P1 and T2P0 ): Options of 1:2, 1:8, 1:32, and 1:64 are defined by
TMRX. It is cleared when any type of reset occurs.
TMR1X and TMR2X (TMR1H/TWR1L and TMR2H/TMR2L ):
Timer
X
register;
TMRX
is
increased until it matches with PRDX, and then is reset to 0. TMRX cannot be read.
PRDX ( PRD1 and PRD2 ): PWM period register.
ComparatorX ( Comparator 1 and Comparator 2 ): To reset TMRX while a match occurs and the
TMRXIF flag is set at the same time.
This specification is subject to change without prior notice.
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OTP ROM
3. Programming the Related Registers
When defining TMRX, refer to the related registers of its operation as shown in Table 9.It must be
noted that the PWMX bits must be disabled if their related TMRXs are employed. That is, bit 7 and bit
6 of the PWMCON register must be set to ‘0’.
Table 10 Related Control Registers of TMR1 and TMR2
Address
Name
IOC51 PWMCON/IOC51
Bit 7
PWM2E
Bit 6
PWM1E
Bit 5
T2EN
Bit 4
T1EN
Bit 3
T2P1
Bit 2
T2P0
Bit 1 Bit 0
T1P1 T1P0
4. Timer programming procedures/steps
(1) Load PRDX with the TIMER period.
(2) Enable interrupt function by writing IOCF0, if required
(3) Load a desired value to PWMCON with the TMRX prescaler value and enable both TMRX and
disable PWMX.
4.10 Comparator
EM78P458/459 has one comparator, which has two analog inputs and one output. The comparator
can be employed to wake up from the sleep mode. Fig. 16 shows the circuit of the comparator.
Cin-
-
Cin+
CMP
+
CO
Fig. 16 Comparator Operating Mode
1. External Reference Signal
The analog signal that is presented at Cin- compares to the signal at Cin+, and the digital output (CO)
of the comparator is adjusted accordingly.
• The reference signal must be between Vss and Vdd.
• The reference voltage can be applied to either pi of comparator.
• Threshold detector applications may be of the same reference.
• The comparator can operate from the same or different reference source.
2. Comparator Outputs
• The compared result is stored in the CMPOUT of R3.
• The comparator outputs is output to P57 by programming bit5<COE> of the AD-CMPCON register
to 1.
This specification is subject to change without prior notice.
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OTP ROM
• P57 must be defined as an output if implemented as the comparator output.
• Fig. 17 shows the comparator output block diagram.
To C0
From OP I/O
CMRD
EN
Q
EN
D
Q
D
To CMPOUT
RESET
To CPIF
CMRD
From other
comparator
Fig. 17 The Output Configuration of a Comparator
3. Using as An Operation Amplifier
The comparator can be used as an operation amplifier if a feedback resistor is connected from the
input to the output externally. In this case, the Schmitt trigger can be disabled for power saving by
setting CE to 1 and COE to 0.
4. Interrupt
• CMPIE (IOCF0.6) must be enabled.
• Interrupt occurs at the rising edge of the comparator output pin.
• The actual change on the pin can be determined by reading the Bit CMPOUT, R3<7>.
• CMPIF (RF.6), the comparator interrupt flag, can only be cleared by software.
5. Wake-up from SLEEP Mode
• If enabled, the comparator remains active and the interrupt remains functional, even under SLEEP
mode.
• If a mismatch occurs, the interrupt will wake up the device from SLEEP mode.
• The power consumption should be taken into consideration for the benefit of energy conservation.
• If the function is unemployed during SLEEP mode, turn off comparator before entering into sleep
mode.
This specification is subject to change without prior notice.
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OTP ROM
4.11 The Initialized Values after Reset
Table 11 The Summary of the Initialized Values for Registers
Address
Name
N/A
IOC50
N/A
IOC60
N/A
IOCB0
N/A
IOCC0
N/A
IOCD0
N/A
IOCE0
N/A
IOCF0
N/A
IOC90
(GCON)
N/A
IOCA0
(AD-CMP
CON)
N/A
IOC51
(PWMCON)
N/A
IOC61
(DT1L)
N/A
IOC71
(DT1H)
N/A
IOC81
(PRD1)
N/A
IOC91
(DT2L)
N/A
IOCA1
Reset Type
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Bit 7
C57
1
1
P
C67
1
1
P
/PD7
1
1
P
OD7
1
1
P
/PH7
1
1
P
WDTE
1
1
P
X
0
0
0
OP2E
0
0
P
VREFS
0
0
P
PWM2E
0
0
P
Bit7
0
0
P
CALI1
0
0
P
0
0
P
Bit7
0
0
P
CALI2
This specification is subject to change without prior notice.
Bit 6
C56
1
1
P
C66
1
1
P
/PD6
1
1
P
OD6
1
1
P
/PH6
1
1
P
EIS
0
0
P
CMPIE
0
0
P
OP1E
0
0
P
CE
0
0
P
PWM2E
0
0
P
Bit6
0
0
P
SIGN1
1
1
P
0
0
P
Bit6
0
0
P
SIGN2
43
Bit 5
C55
1
1
P
C65
1
1
P
*/PD5
1
1
P
OD5
1
1
P
/PH5
1
1
P
X
1
1
1
PMW2IE
0
0
P
G22
0
0
P
COE
0
0
P
T2EN
0
0
P
Bit5
0
0
P
VOF1[2]
1
1
P
0
0
P
Bit5
0
0
P
VOF2[2]
Bit 4
C54
1
1
P
C64
1
1
P
*/PD4
1
1
P
OD4
1
1
P
/PH4
1
1
P
X
1
1
1
PWM1IE
0
0
P
G21
0
0
P
IMS2
0
0
P
T1EN
0
0
P
Bit4
0
0
P
VOF1[1]
0
0
P
0
0
P
Bit4
0
0
P
VOF2[1]
Bit 3
C53
1
1
P
C63
1
1
P
/PD3
1
1
P
OD3
1
1
P
/PH3
1
1
P
X
1
1
1
ADIE
0
0
P
G20
0
0
P
IMS1
0
0
P
T2P1
0
0
P
Bit3
0
0
P
VOF1[0]
0
0
P
0
0
P
Bit3
0
0
P
VOF2[0]
Bit 2
C52
1
1
P
C62
1
1
P
/PD2
1
1
P
OD2
1
1
P
/PH2
1
1
P
X
1
1
1
EXIE
0
0
P
G12
0
0
P
IMS0
0
0
P
T2P0
0
0
P
Bit2
0
0
P
X
0
0
0
0
0
P
Bit2
0
0
P
X
Bit 1
C51
1
1
P
C61
1
1
P
/PD1
1
1
P
OD1
1
1
P
/PH1
1
1
P
X
1
1
1
ICIE
0
0
P
G11
0
0
P
CKR1
0
0
P
T1P1
0
0
P
Bit1
0
0
P
Bit1
0
0
P
0
0
P
Bit1
0
0
P
Bit1
Bit 0
C50
1
1
P
C60
1
1
P
/PD0
1
1
P
OD0
1
1
P
/PH0
1
1
P
X
1
1
1
TCIE
0
0
P
G10
0
0
P
CKR0
0
0
P
T1P0
0
0
P
Bit0
0
0
P
Bit0
0
0
P
0
0
P
Bit0
0
0
P
Bit0
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Address
Name
(DT2H)
N/A
IOCB1
(PRD2)
N/A
IOCC1
(DL1L)
N/A
IOCD1
(DL1H)
N/A
IOCE1
(DL2L)
N/A
IOCF1
(DL2H)
N/A
CONT
0x00
R0(IAR)
0x01
R1(TCC)
0x02
R2(PC)
0x03
R3(SR)
0x04
R4(RSR)
0x05
P5
0x06
P6
0x7~0x8
R7~R8
0x9
R9
(ADCON)
Reset Type
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
This specification is subject to change without prior notice.
Bit 7
0
0
P
0
0
P
Bit7
0
0
P
X
0
0
0
Bit7
0
0
P
X
0
0
0
INTE
1
1
P
U
P
P
0
0
P
0
0
GP2
0
0
P
BS7
0
0
P
P57
1
1
P
P67
1
1
P
U
P
P
X
0
0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
1
1
0
0
0
0
1
1
0
0
0
0
P
P
P
P
0
P
0
0
0
0
0
0
0
0
0
0
0
0
P
P
P
P
P
P
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
0
0
0
0
0
0
0
0
0
0
0
0
P
P
P
P
P
P
X
X
X
X
X
Bit1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
P
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
0
0
0
0
0
0
0
0
0
0
0
0
P
P
P
P
P
P
X
X
X
X
X
Bit1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
P
INT
TS
TE
PAB
PSR2
PSR1
0
1
1
1
1
1
0
1
1
1
1
1
P
P
P
P
P
P
U
U
U
U
U
U
P
P
P
P
P
P
P
P
P
P
P
P
0
0
0
0
0
0
0
0
0
0
0
0
P
P
P
P
P
P
0
0
0
0
0
0
0
0
0
0
0
0
Jump to address 0x08 or continue to execute next instruction
PS1
PS0
T
P
Z
DC
0
0
1
1
U
U
0
0
t
t
P
P
P
P
t
t
P
P
BS6
0
U
U
U
U
U
0
P
P
P
P
P
P
P
P
P
P
P
P56
P55
P54
P53
P52
P51
1
1
1
1
1
1
1
1
1
1
1
1
P
P
P
P
P
P
P66
P65
P64
P63
P62
P61
1
1
1
1
1
1
1
1
1
1
1
1
P
P
P
P
P
P
U
U
U
U
U
U
P
P
P
P
P
P
P
P
P
P
P
P
X
IOCS
ADRUN
ADPD
ADAS2
ADAS1
0
0
0
0
0
0
0
0
0
0
0
0
44
Bit 0
0
0
P
0
0
P
Bit0
0
0
P
Bit0
0
0
P
Bit0
0
0
P
Bit0
0
0
P
PSR0
1
1
P
U
P
P
0
0
P
0
0
C
U
P
P
U
P
P
P50
1
1
P
P60
1
1
P
U
P
P
ADAS0
0
0
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Address
Name
0xA
RA
(ADDDATA)
0xB
RB
(TMR1L)
0xC
RC
(TMR1H)
0xD
RD
(TMR2L)
0xE
RE
(TMR2H)
0xF
RF
(ISR)
0x10~0x3F
R10~R3F
Reset Type
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit Name
Power-on
/RESET and WDT
Wake-up from Pin Changed
Bit 7
P
0
0
P
Bit7
0
0
P
X
0
0
0
Bit7
0
0
P
X
0
0
0
X
0
0
0
U
P
P
Bit 6
P
0
0
P
Bit6
0
0
P
X
0
0
0
Bit6
0
0
P
X
0
0
0
CMPIF
0
0
P
U
P
P
X: not used. U: unknown or don’t care.
Bit 5
P
0
0
P
Bit5
0
0
P
X
0
0
0
Bit5
0
0
P
X
0
0
0
PWM2IF
0
0
P
U
P
P
Bit 4
P
0
0
P
Bit4
0
0
P
X
0
0
0
Bit4
0
0
P
X
0
0
0
PWM1IF
0
0
P
U
P
P
Bit 3
P
0
0
P
Bit3
0
0
P
X
0
0
0
Bit3
0
0
P
X
0
0
0
ADIF
0
0
P
U
P
P
Bit 2
P
0
0
P
Bit2
0
0
P
X
0
0
0
Bit2
0
0
P
X
0
0
0
EXIF
0
0
P
U
P
P
Bit 1
P
0
0
P
Bit1
0
0
P
Bit1
0
0
P
Bit1
0
0
P
Bit1
0
0
P
ICIF
0
0
P
U
P
P
Bit 0
P
0
0
P
Bit0
0
0
P
Bit0
0
0
P
Bit0
0
0
P
Bit0
0
0
P
TCIF
0
0
P
U
P
P
P: previous value before reset.
t: check Table 5
4.12 Oscillator
1. Oscillator Modes
The EM78P458 and EM78P459 can be operated in four different oscillator modes, such as High
XTAL oscillator mode (HXT), Low XTAL oscillator mode (LXT), External RC oscillator mode (ERC),
and RC oscillator mode with Internal capacitor (IC). Users can select one of them by programming the
MASK Option. The up-limited operation frequency of crystal/resonator on the different VDDs is listed
in Table 11.
Table 12 The Summary of Maximum Operating Speeds
Conditions
Two clocks
VDD
2.3
3.0
5.0
Fxt max.(MHz)
4
8
20
2. Crystal Oscillator/Ceramic Resonators (XTAL)
EM78P458/459 can be driven by an external clock signal through the OSCI pin as shown in Fig. 18
This specification is subject to change without prior notice.
45
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
below.
Ext.
Clock
OSCI
EM78P458
EM78P459
OSCO
Fig. 18 Circuit for External Clock Input
In the most applications, pin OSCI and pin OSCO can be connected with a crystal or ceramic
resonator to generate oscillation. Fig. 19 depicts such circuit. The same applies to the HXT mode and
the LXT mode. Table 12 provided the recommended values of C1 and C2. Since each resonator has
its own attribute, user should refer to their specifications for appropriate values of C1 and C2. RS, a
serial resistor, may be necessary for AT strip cut crystal or low frequency mode.
C1
OSCI
EM78P458
EM78P459
XTAL
OSCO
RS
C2
Fig. 19 Circuit for Crystal/Resonator
Table 13 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonators
Oscillator Type
Frequency Mode
Ceramic
Resonators
HXT
LXT
Crystal Oscillator
HXT
Frequency
455 kHz
2.0 MHz
4.0 MHz
32.768kHz
100KHz
200KHz
455KHz
1.0MHz
2.0MHz
4.0MHz
C1(pF)
100~150
20~40
10~30
25
25
25
20~40
15~30
15
15
C2(pF)
100~150
20~40
10~30
15
25
25
20~150
15~30
15
15
3. External RC Oscillator Mode
For some applications that do not require precise timing calculation, the RC oscillator (Fig. 20) could
This specification is subject to change without prior notice.
46
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
offer users with an effective cost savings. Nevertheless, it should be noted that the frequency of the
RC oscillator is influenced by the supply voltage, the values of the resistor (Rext), the capacitor(Cext),
and even by the operation temperature. Moreover, the frequency also changes slightly from one chip
to another due to the manufacturing process variation.
In order to maintain a stable system frequency, the values of the Cext should not be less than 20pF,
and that the value of Rext should not be greater than 1M ohm. If they cannot be kept in this range, the
frequency can be affected easily by noise, humidity, and leakage.
The smaller the Rext in the RC oscillator, the faster its frequency will be. On the contrary, for very low
Rext values, for instance, 1 KΩ, the oscillator becomes unstable because the NMOS cannot
discharge the current of the capacitance correctly.
Based on the above reasons, it must be kept in mind that all supply voltage, the operation
temperature, the components of the RC oscillator, the package types, and the way the PCB is layout,
have certain effect on the system frequency.
Vcc
Rext
OSCI
Cext
EM78P458
EM78P459
Fig. 20 Circuit for External RC Oscillator Mode
Table 14 RC Oscillator Frequencies
Cext
Rext
Average Fosc 5V,25°C
Average Fosc 3V,25°C
20 pF
3.3k
5.1k
10k
100k
3.57 MHz
2.63MHz
1.30 MHz
150 KHz
2.94 MHz
1.92 MHz
1.22 MHz
153 KHz
100 pF
3.3k
5.1k
10k
100k
1.43 MHz
980 KHz
520 KHz
57 KHz
1.35 MHz
877 KHz
465 KHz
54 KHz
This specification is subject to change without prior notice.
47
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
300 pF
<Note>
3.3k
5.1k
10k
100k
510 KHz
340 KHz
175 KHz
19 KHz
470 KHz
320 KHz
170 KHz
19 KHz
1. Measured on DIP packages.
2. Design reference only
4. RC Oscillator Mode with Internal Capacitor
If both precision and cost are taken into consideration, EM78P257A/B also offers a special oscillation
mode. It is equipped with an internal capacitor and an external resistor (connected to Vcc). The
internal capacitor functions as temperature compensator. In order to obtain more accurate frequency,
a precise resistor is recommended.
Vcc
Rext
OSCI
EM78P458
EM78P459
Fig. 21 Circuit for Internal C Oscillator Mode
Table 15 R Oscillator Frequencies
Rext
Average Fosc 5V,25°C
Average Fosc 3V,25°C
51k
100k
300k
2.22 MHz
1.15 MHz
375 KHz
2.17 MHz
1.14 MHz
370 KHz
<Note>
1. Measured on DIP packages.
2. Design reference only
4.13 Power-on Considerations
Any microcontroller is not warranted to start proper operation before the power supply stabilizes in
steady state.
EM78P458/459 POR voltage range is 1.2V~1.8V. Under customer application, when power is OFF,
Vdd must drop to below 1.2V and remains OFF for 10us before power can be switched ON again.
This way, the EM78P458/459 will reset and work normally. The extra external reset circuit will work
well if Vdd can rise at very fast speed (50 ms or less). However, under most cases where critical
This specification is subject to change without prior notice.
48
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
applications are involved, extra devices are required to assist in solving the power-up problems.
1. External Power on Reset Circuit
The circuit shown in Fig. 22 implements an external RC to produce a reset pulse. The pulse width
(time constant) should be kept long enough to allow Vdd to reach minimum operation voltage. This
circuit is used when the power supply has a slow rise time. Because the current leakage from the
/RESET pin is about ±5µA, it is recommended that R should not be great than 40 K. In this way, the
voltage at Pin /RESET is held below 0.2V. The diode (D) acts as a short circuit at power-down. The
capacitor, C, is discharged rapidly and fully. Rin, the current-limited resistor, prevents high current
discharge or ESD (electrostatic discharge) from flowing into Pin /RESET.
VDD
/RESET
R
EM78P458
EM78P459
Rin
D
C
Fig. 22 External Power on Reset Circuit
2. Residue-Voltage Protection
When battery is replaced, device power (Vdd) is taken off but residue-voltage remains. The
residue-voltage may trips below Vdd minimum, but not to zero. This condition may cause a poor
power on reset. Fig. 23 and Fig. 24 show how to build a residue-voltage protection circuit
VDD
VDD
EM78P458
EM78P459
33K
Q1
10K
/RESET
100K
Fig. 23
1N4684
Circuit 1 for the Residue Voltage Protection
This specification is subject to change without prior notice.
49
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
VDD
VDD
EM78P458
EM78P459
R1
Q1
/RESET
R2
R3
Fig.24 Circuit 2 for the Residue Voltage Protection
4.14 CODE OPTION
EM78P458/459 has one CODE option word and one Customer ID word that are not a part of the
normal program memory.
Word 0
Bit12~Bit0
Code option12~0
Word 1
Bit12~Bit0
Code option12~0
1. Code Option Register (Word 0)
Bit12
MS
Bit11
/ENWDT
Bit10
CLKS
Bit9
/PTB
Bit8
HLF
Bit7
RCT
Bit6
HLP
Bit5~Bit0
ID
• Bit 12 (MS): Oscillator type selection.
0: RC type
1: XTAL type
• Bit 11 (/ENWTD): Watchdog timer enable bit.
0: Enable
1: Disable
• Bit 10 (CLKS): Clocks of each instruction cycle.
0: Two clocks
1: Four clocks
Refer to the section of Instruction Set.
• Bit 9 (/PTB): Protect bit.
0: Enable
1: Disable
• Bit 8 (HLF): XTAL frequency selection.
0: Low frequency
This specification is subject to change without prior notice.
50
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
1: High frequency
• Bit 7 (RCT): Resistor Capacitor
0: Inter C, External R
1: External RC
• Bit 6 (HLP): Power consumption selection.
0: Low power.
1: High power.
• Bit 5 ~ Bit 0 (ID[5]~ID[0]): Customer’s ID.
2. Code Option Register (Word 1)
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4~Bit0
SIGN2
VOF2[2]
VOF2[1]
VOF2[0]
SIGN1
VOF1[2]
VOF1[1]
VOF1[0]
-
• Bit 12 (SIGN2): Polarity bit of offset voltage.
0: Negative voltage
1: Positive voltage
• Bit 11 ~ Bit 9 (VOF2[2]~VOF2[0]): Offset voltage bits
• Bit 8 (SIGN1): Polarity bit of offset voltage.
0: Negative voltage
1: Positive voltage
• Bit 7 ~ Bit 5 (VOF1[2]~VOF210)): Offset voltage bits
• Bit 4 ~ Bit 0 : Not used.
4.15 Instruction Set
Each instruction in the instruction set is a 13-bit word divided into an OP code and one or more
operands. Normally, all instructions are executed within one single instruction cycle (one instruction
consists of 2 oscillator periods), unless the program counter is changed by instruction "MOV R2,A",
"ADD R2,A", or by instructions of arithmetic or logic operation on R2 (e.g. "SUB R2,A", "BS(C) R2,6",
"CLR R2", ⋅⋅⋅⋅). In this case, the execution takes two instruction cycles.
In addition, the instruction set has the following features:
(1) Every bit of any register can be set, cleared, or tested directly.
(2) The I/O registers can be regarded as general registers. That is, the same instruction can operate
on I/O registers.
The symbol "R" represents a register designator that specifies which one of the registers (including
operational registers and general-purpose registers) is to be utilized by the instruction. The symbol
"b" represents a bit field designator that selects the value for the bit located in the register "R" that is
This specification is subject to change without prior notice.
51
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
affected by the operation. The symbol "k" represents an 8 or 10-bit constant or literal value.
Table 16 The list of the instruction set of EM78P458/459
INSTRUCTION BINARY
0 0000 0000 0000
0 0000 0000 0001
0 0000 0000 0010
0 0000 0000 0011
0 0000 0000 0100
0 0000 0000 rrrr
0 0000 0001 0000
0 0000 0001 0001
0 0000 0001 0010
0 0000 0001 0011
0 0000 0001 0100
0 0000 0001 rrrr
0 0000 01rr rrrr
0 0000 1000 0000
0 0000 11rr rrrr
0 0001 00rr rrrr
0 0001 01rr rrrr
0 0001 10rr rrrr
0 0001 11rr rrrr
0 0010 00rr rrrr
0 0010 01rr rrrr
0 0010 10rr rrrr
0 0010 11rr rrrr
0 0011 00rr rrrr
0 0011 01rr rrrr
0 0011 10rr rrrr
0 0011 11rr rrrr
0 0100 00rr rrrr
0 0100 01rr rrrr
0 0100 10rr rrrr
0 0100 11rr rrrr
0 0101 00rr rrrr
0 0101 01rr rrrr
0 0101 10rr rrrr
0 0101 11rr rrrr
HEX MNEMONIC
0000
NOP
0001
DAA
0002
CONTW
0003
SLEP
0004
WDTC
000r
IOW R
0010
ENI
0011
DISI
0012
RET
0013
RETI
0014
CONTR
001r
IOR R
00rr
MOV R,A
0080
CLRA
00rr
CLR R
01rr
SUB A,R
01rr
SUB R,A
01rr
DECA R
01rr
DEC R
02rr
OR A,R
02rr
OR R,A
02rr
AND A,R
02rr
AND R,A
03rr
XOR A,R
03rr
XOR R,A
03rr
ADD A,R
03rr
ADD R,A
04rr
MOV A,R
04rr
MOV R,R
04rr
COMA R
04rr
COM R
05rr
INCA R
05rr
INC R
05rr
DJZA R
05rr
DJZ R
0 0110 00rr rrrr
06rr
RRCA R
0 0110 01rr rrrr
06rr
RRC R
0 0110 10rr rrrr
06rr
RLCA R
0 0110 11rr rrrr
06rr
RLC R
0 0111 00rr rrrr
07rr
SWAPA R
0
0
0
0
07rr
07rr
07rr
0xxx
SWAP R
JZA R
JZ R
BC R,b
0111
0111
0111
100b
01rr
10rr
11rr
bbrr
rrrr
rrrr
rrrr
rrrr
This specification is subject to change without prior notice.
OPERATION
No Operation
Decimal Adjust A
A → CONT
0 → WDT, Stop oscillator
0 → WDT
A → IOCR
Enable Interrupt
Disable Interrupt
[Top of Stack] → PC
[Top of Stack] → PC, Enable Interrupt
CONT → A
IOCR → A
A→R
0→A
0→R
R-A → A
R-A → R
R-1 → A
R-1 → R
A ∨ VR → A
A ∨ VR → R
A&R→A
A&R→R
A⊕R→A
A⊕R→R
A+R→A
A+R→R
R→A
R→R
/R → A
/R → R
R+1 → A
R+1 → R
R-1 → A, skip if zero
R-1 → R, skip if zero
R(n) → A(n-1),
R(0) → C, C → A(7)
R(n) → R(n-1),
R(0) → C, C → R(7)
R(n) → A(n+1),
R(7) → C, C → A(0)
R(n) → R(n+1),
R(7) → C, C → R(0)
R(0-3) → A(4-7),
R(4-7) → A(0-3)
R(0-3) ↔ R(4-7)
R+1 → A, skip if zero
R+1 → R, skip if zero
0 → R(b)
52
STATUS AFFECTED
None
C
None
T,P
T,P
None <Note1>
None
None
None
None
None
None <Note1>
None
Z
Z
Z,C,DC
Z,C,DC
Z
Z
Z
Z
Z
Z
Z
Z
Z,C,DC
Z,C,DC
Z
Z
Z
Z
Z
Z
None
None
C
C
C
C
None
None
None
None
None <Note2>
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
INSTRUCTION BINARY
0 101b bbrr rrrr
0 110b bbrr rrrr
0 111b bbrr rrrr
HEX
0xxx
0xxx
0xxx
MNEMONIC
BS R,b
JBC R,b
JBS R,b
1 00kk kkkk kkkk
1kkk
CALL k
1
1
1
1
1
kkkk
kkkk
kkkk
kkkk
kkkk
1kkk
18kk
19kk
1Akk
1Bkk
JMP k
MOV A,k
OR A,k
AND A,k
XOR A,k
1 1100 kkkk kkkk
1Ckk
RETL k
1 1101 kkkk kkkk
1Dkk
SUB A,k
1 1110 0000 0001
1E01
INT
1 1111 kkkk kkkk
1Fkk
ADD A,k
0 0000 0010 0000
0020
TBL
01kk
1000
1001
1010
1011
kkkk
kkkk
kkkk
kkkk
kkkk
OPERATION
1 → R(b)
if R(b)=0, skip
if R(b)=1, skip
PC+1 → [SP],
(Page, k) → PC
(Page, k) → PC
k→A
A∨k→A
A&k→A
A⊕k→A
k → A,
[Top of Stack] → PC
k-A → A
PC+1 → [SP],
001H → PC
k+A → A
R2+A → R2
Bits 8~9 of R2 unchanged
STATUS AFFECTED
None <Note3>
None
None
None
None
None
Z
Z
Z
None
Z,C,DC
None
Z,C,DC
Z,C,DC
<Note 1> This instruction is applicable to IOC50~IOC60, IOC90~IOCF0, IOC51~IOCF1 only.
<Note 2> This instruction is not recommended for RF operation.
<Note 3> This instruction cannot operate under RF.
This specification is subject to change without prior notice.
53
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
4.16 Timing Diagrams
AC Test Input/Output W aveform
2.4
2.0
0.8
TEST POINTS
2.0
0.8
0.4
AC Testing : Input is driven at 2.4V for logic "1",and 0.4V for logic "0".Timing measurements are
made at 2.0V for logic "1",and 0.8V for logic "0".
RESET Timing (CLK="0")
NOP
Instruction 1
Executed
CLK
/RESET
Tdrh
TCC Input Timing (CLKS="0")
Tins
CLK
TCC
Ttcc
This specification is subject to change without prior notice.
54
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
5. ABSOLUTE MAXIMUM RATINGS
Items
Temperature under bias
Storage temperature
Input voltage
Output voltage
Rating
to
to
to
to
0°C
-65°C
-0.3V
-0.3V
This specification is subject to change without prior notice.
55
70°C
150°C
+6.0V
+6.0V
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
6. ELECTRICAL CHARACTERISTICS
6.1 DC Electrical Characteristic(Ta=0°C ~ 70 °C, VDD=5.0V±5%, VSS=0V)
Symbol
VOL2
Parameter
XTAL: VDD to 3V
XTAL: VDD to 5V
RC: VDD to 5V
Input Leakage Current for input pins
Input High Voltage,VDD=5V
Input Low Voltage,VDD=5V
Input High Threshold Voltage,VDD=5V
Input Low Threshold Voltage,VDD=5V
Clock Input High Voltage,VDD=5V
Clock Input Low Voltage,VDD=5V
Input High Voltage,VDD=3V
Input Low Voltage,VDD=3V
Input High Threshold Voltage,VDD=3V
Input Low Threshold Voltage,VDD=3V
Clock Input High Voltage,VDD=3V
Clock Input Low Voltage,VDD=3V
Output High Voltage
(Ports 5, 6)
Output Low Voltage (P51~P57, P60~P63,
P66~P67)
Output Low Voltage (P64,P65)
IPH
Pull-high current
IPD
Pull-down current
ISB
Power down current
ISB
Power down current
ICC1
Operating supply current (VDD=3V) at two
clocks
ICC2
Operating supply current (VDD=3V) at two
clocks
ICC3
Operating supply current (VDD=5.0V) at
two clocks
ICC4
Operating supply current (VDD=5.0V) at
two clocks
Fxt
IIL
VIH1
VIL1
VIHT1
VILT1
VIHX1
VILX1
VIH2
VIL2
VIHT2
VILT2
VIHX2
VILX2
VOH1
VOL1
This specification is subject to change without prior notice.
Condition
Two cycle with two clocks
R: 5.1KΩ, C: 100pF
VIN = VDD, VSS
Ports 5, 6
Ports 5, 6
/RESET, TCC
/RESET, TCC
OSCI
OSCI
Ports 5, 6
Ports 5, 6
/RESET, TCC
/RESET, TCC
OSCI
OSCI
IOH = -12.0 mA
Min
DC
DC
F±30%
Typ
760
Max
8
20
F±30%
±1
2.0
0.8
2.0
0.8
2.5
1.0
1.5
0.4
1.5
0.4
1.5
0.6
2.4
Unit
MHz
MHz
KHz
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
IOL = 12.0 mA
0.4
V
IOL = 16.0 mA
Pull-high active, input pin at
VSS
Pull-down active, input pin at
VDD
All input and I/O pins at VDD,
output pin floating, WDT
enabled
All input and I/O pins at VDD,
output pin floating, WDT
disabled
/RESET='High',Fosc=32KHz
(Crystal type, two clocks),
output pin floating, WDT
disabled
/RESET=‘High',Fosc=32KHz
(Crystal type, two clocks),
output pin floating, WDT
enabled
/RESET='High', Fosc=2MHz
(Crystal type, two clocks),
output pin floating
/RESET='High', Fosc=4MHz
(Crystal type, two clocks),
output pin floating
0.4
V
56
-50
-100
-240
µA
25
50
120
µA
10
µA
1
µA
15
30
µA
19
35
µA
2
mA
4.0
mA
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
6.2 AC Electrical Characteristic(Ta=0°C ~ 70 °C, VDD=5V±5%, VSS=0V)
Symbol
Dclk
Tins
Ttcc
Tdrh
Trst
Twdt
Tset
Thold
Tdelay
Parameter
Input CLK duty cycle
Instruction cycle time
(CLKS="0")
TCC input period
Device reset hold time
/RESET pulse width
Watchdog timer period
Input pin setup time
Input pin hold time
Output pin delay time
Conditions
Crystal type
RC type
Ta = 25°C
Ta = 25°C
Ta = 25°C
Min
45
100
500
(Tins+20)/N*
9
2000
9
Typ
50
Max
55
DC
DC
18
30
18
0
20
50
30
Cload=20pF
Unit
%
ns
ns
ns
ms
ns
ms
ms
ms
ms
*N= selected prescaler ratio.
6.3 A/D Converter Characteristic(Vdd=3.0V to 5.5V,Vss=0V,Ta=0 to 70℃)
Symbol
VAREF
VASS
VAI
IAI
RN
LN
DNL
FSE
OE
Parameter
Condition
Analog reference voltage
VAREF - VASS≧2.5V
TAD
TCN
ADIV
Analog input voltage
Analog supply current
Resolution
Linearity error
Differential nonlinear error
Full scale error
Offset error
Recommended impedance of
analog voltage source
A/D clock period
A/D conversion time
A/D OP input voltage range
ADOV
A/D OP output voltage swing
ADSR
PSR
A/D OP slew rate
Power Supply Rejection
ZAI
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS =0.0V
Vdd = 2.5 to 5.5V Ta=25℃
Vdd = 2.5 to 5.5V Ta=25℃
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=VAREF=5.0V, VASS
=0.0V,RL=10KΩ
Vdd=VAREF=5.0V, VASS =0.0V
Vdd=5.0V±0.5V
Min.
3.0
Typ.
VASS
500
6
0
0
±0
±0
700
7
±2
±0.5
±2
±1
Max.
Vdd
Vss
VAREF
1000
8
±4
±0.9
±4
±2
0
8
10
KΩ
3
10
0
0
4.7
0.1
±0
3.5
4
10
5
0.3
5
us
TAD
V
0.2
4.8
0.3
±2
Unit
V
V
V
uA
Bits
LSB
LSB
LSB
LSB
V
V/us
LSB
Note: 1.These parameters are characterized but not tested.
2.These parameters are for design guidance only and are not tested.
3.It will not consume any current other than minor leakage current, when A/D is off.
4.The A/D conversion result never decrease with an increase in the input voltage, and has no
missing code.
5.Specifications subject to change without notice.
This specification is subject to change without prior notice.
57
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
6.4 Comparator(OP) Characteristic(Vdd = 5.0V,Vss=0V,Ta=0 to 70℃)
Symbol
SR
IVR
Parameter
Slew rate
Input voltage range
OVS
Output voltage swing
Iop
Supply current of OP
Power-supply Rejection Ration
for OP
Offset voltage
Operating range
PSRR
Vos
Vs
Condition
Vdd =5.0V, VSS =0.0V
Vd =5.0V, VSS =0.0V,RL=10KΩ
Vdd= 5.0V, VSS =0.0V
Min.
0.1
0
0
4.7
250
Typ.
0.2
0.2
4.8
350
5
0.3
5
500
50
60
70
dB
±10
±20
5.5
mV
V
Vdd= 5.0V, VSS =0.0V
2.5
Max.
Unit
V/us
V
V
uA
Note: 1.These parameters are characterized but not tested.
2.These parameters are for design guidance only and are not tested.
3.Specifications subject to change without notice.
6.5 Device characteristic
The graphic provided in the following pages were derived based on a limited number of samples and
are shown here for reference only. The device characteristic illustrated herein are not guaranteed for
it accuracy. In some graphic, the data maybe out of the specified warranted operating range.
This specification is subject to change without prior notice.
58
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Vih/Vil (Input pins with schmitt inverter)
2.5
Vih max(0℃ to 70℃ )
Vih typ 25℃
Vih Vil(Volt)
2
Vih min(0℃ to 70℃)
1.5
1
Vil max(0℃ to 70℃ )
0.5
Vil typ 25℃
Vil min(0℃ to 70℃)
0
2.5
3
3.5
4
Vdd(Volt)
4.5
5
5.5
Fig. 25 Vih, Vil of P50 Vs VDD
Vih/Vil (Input pins with schmitt inverter)
2.5
Vih max(0℃ to 70℃ )
Vih typ 25℃
2
Vih Vil(Volt)
Vih min(0℃ to 70℃)
1.5
1
Vil max(0℃ to 70℃ )
0.5
Vil typ 25℃
Vil min(0℃ to 70℃)
0
2.5
3
3.5
4
Vdd(Volt)
4.5
5
5.5
Fig. 26 Vih, Vil of P51,P52,P54 Vs VDD
This specification is subject to change without prior notice.
59
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Vih/Vil (Input pins with schmitt inverter)
2.5
Vih max(0℃ to 70℃ )
Vih typ 25℃
Vih Vil(Volt)
2
Vih min(0℃ to 70℃)
1.5
1
Vil max(0℃ to 70℃ )
0.5
Vil typ 25℃
Vil min(0℃ to 70℃)
0
2.5
3
3.5
4
4.5
5
5.5
Vdd(Volt)
Fig. 27 Vih, Vil of P53,P55~P57,P60~P67 Vs VDD
Voh/Ioh (VDD=3V)
0
0
-5
-2
-10
-4
Ioh(mA)
Ioh(mA)
Voh/Ioh (VDD=5V)
Min 70 ℃
-15
Typ 25 ℃
-20
Min 70 ℃
-6
Typ 25 ℃
-8
Max 0 ℃
Max 0 ℃
-25
-10
-30
-12
0
1
2
3
4
5
0
Voh(Volt)
This specification is subject to change without prior notice.
0.5
1
1.5
2
2.5
3
Voh(Volt)
60
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Fig.28 Port5, Port6, Voh vs. Ioh, VDD=5V
Fig.29 Port5, Port6, Voh vs. Ioh, VDD=3V
Vol/Iol (VDD=5V)
Vol/Iol (VDD=3V)
80
Max 0 ℃
35
70
Typ 25 ℃
30
Min 70 ℃
25
60
Max 0 ℃
Typ 25 ℃
Min 70 ℃
Iol(mA)
Iol(mA)
50
40
20
15
30
20
10
10
5
0
0
0
1
2
3
4
5
0
Vol(Volt)
1
1.5
2
2.5
3
Vol(Volt)
Fig. 30 Port5, and P60~P63,P66,P67 Vol, VDD=5V
This specification is subject to change without prior notice.
0.5
Fig. 31 Port5, and P60~P63,P66,P67 Vol , VDD=3V
61
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Vol/Iol (3V)
Vol/Iol (3V)
50
50
Max 0 ℃
45
40
40
Typ 25 ℃
30
Min 70 ℃
25
Typ 25 ℃
35
Iol(mA)
35
Iol(mA)
Max 0 ℃
45
30
Min 70 ℃
25
20
20
15
15
10
10
5
5
0
0
0
0.5
1
1.5
2
2.5
0
3
0.5
1
1.5
2
2.5
3
Vol(Volt)
Vol(Volt)
Fig. 32 P64,P65 Vol vs. Iol, VDD=5V
Fig. 33 P64,P65 Vol vs. Iol, VDD=3V
This specification is subject to change without prior notice.
62
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
WDT Time_ o u t
35
30
Max 70 ℃
WDT period (mS)
25
Typ 25 ℃
20
Min 0 ℃
15
10
5
0
2
3
4
5
6
VDD (Volt)
Fig. 34 WDT Time Out Period vs. VDD, Prescaler Set to 1 : 1
This specification is subject to change without prior notice.
63
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Cex t=1 0 0 p F, Ty p i cal RC OSC Freq u en cy
1.4
R = 3.3 k
1.2
Frequency(M Hz)
1
R = 5.1 k
0.8
0.6
R = 10 k
0.4
0.2
R = 100 k
0
2.5
3
3.5
4
4.5
VDD(Volt)
5
5.5
Fig. 35 Typical RC OSC Frequency vs. VDD （Cext=100pF, Temperature at 25 ℃）
This specification is subject to change without prior notice.
64
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Four conditions exist with the operating current ICC1 to ICC4. these conditions are as follows：
ICC1：VDD=3V, Fosc=32 kHz, 2clock, WDT disable.
ICC2：VDD=3V, Fosc=32 kHz, 2clock, WDT enable.
ICC3：VDD=5V, Fosc=2 MHz, 2clock, WDT enable.
ICC4：VDD=5V, Fosc=4 MHz, 2clock, WDT enable.
Current (uA)
Typical ICC1 and ICC2 vs. Temperature
21
Typ ICC2
18
Typ ICC1
15
12
9
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 36 Typical Operating Current（ICC1 and ICC2） vs. Temperature
Maximum ICC1 and ICC2 vs. Temperature
30
Max ICC2
Current (uA)
27
24
Max ICC1
21
18
15
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 37 Maximum Operating Current（ICC1 and ICC2） vs. Temperature
This specification is subject to change without prior notice.
65
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Typical ICC3 and ICC4 vs. Temperature
1.9
Current (mA)
1.7
Typ ICC4
1.5
1.3
Typ ICC3
1.1
0.9
0.7
0.5
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 38 Typical Operating Current（ICC3 and ICC4） vs. Temperature
Maximum ICC3 and ICC4 vs. Temperature
2.2
Max ICC4
Current (mA)
2
1.8
1.6
Max ICC3
1.4
1.2
1
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 39 Maximum Operating Current（ICC3 and ICC4） vs. Temperature
Two conditions exist with the standby current ISB1 and ISB2. these conditions are as follow：
ISB1：VDD=5V, WDT disable
ISB2：VDD=5V, WDT enable
This specification is subject to change without prior notice.
66
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Typical ISB1 and ISB2 vs. Temperature
12
Current (uA)
9
Typ ISB2
6
3
Typ ISB1
0
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 40 Typical Standby Current（ISB1 and ISB2） vs. Temperature
Maximum ISB1 and ISB2 vs. Temperature
Current (uA)
12
9
Max ISB2
6
3
Max ISB1
0
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 41 Maximum Standby Current（ISB1 and ISB2） vs. Temperature
This specification is subject to change without prior notice.
67
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Operating voltage (0℃~70℃)
Frequency(M Hz)
25
20
15
10
5
0
2
2.5
3
3.5
4
4.5
5
5.5
6
VDD(Volt)
Fig. 42 Operating Voltage In Temperature Range from 0 ℃ to 70 ℃
This specification is subject to change without prior notice.
68
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
EM78P458/459 HXT I-V
2.5
2
1.5
1
0.5
0
2
2.5
3
3.5
4
4.5
5
5.5
6
Fig. 43 EM78P458/459 I-V Curve Operating at 4 MHz
EM78P458/459 HXT I-V
2.5
2
1.5
1
0.5
0
2
3
4
5
6
Fig. 44 EM78P458_G/459-G I-V Curve Operating at 4 MHz
This specification is subject to change without prior notice.
69
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
EM78P458/459 LXT I-V
200
150
100
50
0
2
3
4
5
6
Fig. 45 EM78P458/459 I-V Curve Operating at 32.768 kHz
EM78P458/459 LXT I-V
140
120
100
80
60
40
20
0
2
3
4
5
6
Fig. 46 EM78P458_G/459_G I-V Curve Operating at 32.768 kHz
This specification is subject to change without prior notice.
70
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
APPENDIX
Package Types:
OTP MCU
EM78P458AP
EM78P458AM
EM78P459AK
EM78P459AM
Package Type
DIP
SOP
Skinny DIP
SOP
This specification is subject to change without prior notice.
Pin Count
20 pin
20 pin
24 pin
24 pin
71
Package Size
300mil
300mil
300mil
300mil
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
Package Information
20-Lead Plastic Dual in line (PDIP) — 300 mil
This specification is subject to change without prior notice.
72
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
20-Lead Plastic Small Outline (SOP) — 300 mil
This specification is subject to change without prior notice.
73
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
24-Lead Plastic Dual in line (PDIP) — 300 mil
This specification is subject to change without prior notice.
74
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
24-Lead Plastic Small Outline (SOP) — 300 mil
This specification is subject to change without prior notice.
75
06.25.2004 (V1.4)
EM78P458/459
OTP ROM
ELAN (HEADQUARTER) MICROELECTRONICS CORP., LTD.
Address : No. 12, Innovation 1st. Rd. Science-Based Industrial Park, Hsinchu City, Taiwan.
Telephone: 886-3-5639977
Facsimile : 886-3-5639966
ELAN (H.K.) MICROELECTRONICS CORP., LTD.
Address : Rm. 1005B, 10/F, Empire Centre, 68 Mody Road, Tsimshatsui, Kowloon, Hong Kong.
Telephone: 852-27233376
Facsimile : 852-27237780
E-mail : [email protected]
ELAN MICROELECTRONICS SHENZHEN, LTD.
Address : SSMEC Bldg. 3F , Gaoxin S. Ave. 1st , South Area , Shenzhen High-tech Industrial Park., Shenzhen
Telephone: 86-755-26010565
Facsimile : 86-755-26010500
ELAN MICROELECTRONICS SHANGHAI, LTD.
Address : #23 Building No.115 Lane 572 BiBo Road. Zhangjiang, Hi-tech Park, Shanghai
Telephone: 86-21-50803866
Facsimile : 86-21-50804600
Elan Information Technology Group.
Address: 1821 Saratoga Avenue, suite 250, Saratoga, CA 95070, USA
Telephone: 1-408-366-8225
Facsimile : 1-408-366-8220
Elan Microelectronics Corp. (Europe)
Address: Dubendorfstrasse 4, 8051 Zurich, Switzerland
Telephone: 41-43-2994060
Facsimile : 41-43-2994079
Email : [email protected]
Web-Site : www.elan-europe.com
Copyright © 2004 ELAN Microelectronics Corp. All rights reserved.
ELAN owns the intellectual property rights, concepts, ideas, inventions, know-how (whether patentable
or not) related to the Information and Technology (herein after referred as " Information and
Technology") mentioned above, and all its related industrial property rights throughout the world, as now
may exist or to be created in the future. ELAN represents no warranty for the use of the specifications
described, either expressed or implied, including, but not limited, to the implied warranties of
merchantability and fitness for particular purposes. The entire risk as to the quality and performance of
the application is with the user. In no even shall ELAN be liable for any loss or damage to revenues,
profits or goodwill or other special, incidental, indirect and consequential damages of any kind, resulting
from the performance or failure to perform, including without limitation any interruption of business,
whatever resulting from breach of contract or breach of warranty, even if ELAN has been advised of the
possibility of such damages.
The specifications of the Product and its applied technology will be updated or changed time by time. All
the information and explanations of the Products in this website is only for your reference. The actual
specifications and applied technology will be based on each confirmed order.
ELAN reserves the right to modify the information without prior notification. The most up-to-day
information is available on the website http://www.emc.com.tw.
This specification is subject to change without prior notice.
76
06.25.2004 (V1.4)