PR OD UCT BR I EF B l u e t o o t hTM Multi Chip Module Description The Bluetooth MCM Solution ROK104001 from Infineon Technologies is a complete solution for fast implementation, and cuts your time-to-market. It is a short-range, compact and cost effective radiobaseband module that supports both voice and data transmission and can be implemented in any electronic device. The module includes a baseband processor with 4 Mbit Flash memory, a radio solution, antenna interfaces and application supporting circuitry. The ROK 104 001 comes with either the Embedded Communication Platform (ECP) firmware, providing the full Bluetooth software stack, including profiles for serial communication, or with the basic Bluetooth firmware for signaling at the HCI (Host Controller Inter- Bluetooth face) level. Since this solution is also FCC and ETSI type approved on delivery, cost and time for qualification -Firmware in two versions: and type approval is greatly minimized. -a) Serial Communication (GAP/SPP/DUN/LAN) -b) HCI : Standard Bluetooth Interface ■ Key Features ■ A small and cost effective Bluetooth system ■ Output power class 2 ■ Complete Bluetooth function including: ■ ■ ■ - Hardware: Radio, Baseband, Crystal & Memory, ■ Voltage regulator and RC filters ■ Point- to -Multipoint, 7 slaves with the HCI firmware or 3 slaves with embedded stack Power management: PARK, SNIFF & HOLD as well as system power saving Pre-qualified for Bluetooth spec. 1.1 FCC & ETSI type approved Multiple interfaces UART, PCM, Bidirectional serial interface/GPIO, GPIO Voltage regulator included on module highly reduces the input voltage requirements Note: The Bluetooth trademarks are owned by Bluetoth SIG, Inc. and used by Infineon Technologies under license. www.infineon.com/bluetooth ROK 104 001 Multi Chip Module N e v e r s t o p t h i n k i n g . PR Configuration Host Application ECI Driver ECI Driver Serial Media - UART ECI GAP SDAP LAN ROK 104 001 SPP Memory Serial Media - UART ECI GAP PCM Networking Host Application Radio AMBA BusSystem UART2 Host Bluetooth Core ARM7TDMITM 8-bit GPIO DUN Base Band Chip Flash Serial Communication TM UART1 I EF ECP - Firmware ROK 104 001 Debug Interface BR OD UCT RFCOMMSDP L2CAP PAN SDAP BNEP SDP L2CAP LM LM UART1 (921 kbit/s) UART2 (921 kbit/s) Antenna Interface 50 Ohm Bluetooth ISM band antenna (2.4 – 2.5 GHz). Traditional host stack Traditional host stack Module Size The dimensions of the Bluetooth module are: 15.5 x 10.5 x 2.0 mm. SDAP SDAP LAN LAN Bidirectional Serial Interface/GPIO ■ For example PCM codecs or EEPROM. DUN DUN PCM ■ The PCM interface provides full support for one PCM channel to facilitate voice communication. SPP SPP Host Host GAP GAP UART’s ■ UART1 supports band rates up to 921 kbit/s with maximum throughput. ■ UART2 supports baud rates up to 921 kbit/s with reduced throughput. Host application Host application API API RFCOMM SDP RFCOMM SDP L2CAP L2CAP HCI HCI Serial Media - UART Serial Media - UART HCI HCI LM LM ROK ROK 104 001 104 001 GPIO ■ An 8 bit programmable General Purpose IO interface . Ordering Information ROK 104 001/21 : With standard HCI firmware ROK 104 001/22 : With ECP firmware (Serial) How to reach us: Attention please! Warnings http://www.infineon.com The information herein is given to describe certain components and shall not be considered as warranted characteristics. Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81541 München Terms of delivery and rights to technical change reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. © Infineon Technologies AG 2002. All Rights Reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Published by Infineon Technologies AG Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Ordering No. B134-H8137-X-X-7600 Printed in Germany PS 02023. NB