TJA1051 High-speed CAN transceiver Rev. 04 — 20 October 2009 Product data sheet 1. General description The TJA1051 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive industry, providing differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJA1051 is a up from the TJA1050 high-speed CAN transceiver. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features: • Ideal passive behavior to the CAN bus when the supply voltage is off • TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with supply voltages from 3 V to 5 V These features make the TJA1051 an excellent choice for all types of HS-CAN networks, in nodes that do not require a standby mode with wake-up capability via the bus. 2. Features 2.1 General n n n n Fully ISO 11898-2 compliant Suitable for 12 V and 24 V systems Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V microcontrollers (available in SO8 and very small HVSON8 packages respectively) 2.2 Low-power management n Functional behavior predictable under all supply conditions n Transceiver disengages from the bus when not powered up (zero load) 2.3 Protection n n n n n High ElectroStatic Discharge (ESD) handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Undervoltage detection on pins VCC and VIO Thermally protected TJA1051 NXP Semiconductors High-speed CAN transceiver 3. Ordering information Table 1. Ordering information Type number Package Name Description Version TJA1051T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TJA1051T/3[1] SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TJA1051TK/3[1] HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 [1] TJA1051T/3 and TJA1051TK/3 with VIO pin. 4. Block diagram VIO(1) VCC 5 3 VCC TJA1051 TEMPERATURE PROTECTION VIO TXD S RXD (1) 7 1 TIME-OUT 8 MODE CONTROL 4 SLOPE CONTROL AND DRIVER 6 CANH CANL DRIVER 2 GND 015aaa036 (1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC. Fig 1. Block diagram TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 2 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 5. Pinning information 5.1 Pinning TJA1051T/3 TJA1051T TJA1051TK/3 TXD 1 8 S TXD 1 8 S GND 2 7 CANH GND 2 7 CANH VCC 3 6 CANL VCC 3 6 CANL RXD 4 5 n.c. RXD 4 5 VIO 015aaa037 Fig 2. 015aaa038 Pin configuration diagrams 5.2 Pin description Table 2. Pin description Symbol Pin Description TXD 1 transmit data input GND 2 ground supply VCC 3 supply voltage RXD 4 receive data output; reads out data from the bus lines n.c. 5 not connected; in TJA1051T version only VIO 5 supply voltage for I/O level adapter; in TJA1051T/3 and TJA1051TK/3 versions only CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line S 8 Silent mode control input TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 3 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 6. Functional description The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines the functionality of the TJA1050 transceiver with improved EMC and ESD handling capability. Improved slope control and high DC handling capability on the bus pins provides additional application flexibility. The TJA1051 is available in two versions, distinguished only by the function of pin 5: • The TJA1051T is 100 % backwards compatible with the TJA1050 • The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with supply voltages down to 3 V 6.1 Operating modes The TJA1051 supports two operating modes, Normal and Silent, which are selectable via pin S. See Table 3 for a description of the operating modes under normal supply conditions. Table 3. Operating modes Mode Normal Silent Inputs Outputs Pin S Pin TXD CAN driver Pin RXD LOW LOW dominant active[1] LOW HIGH recessive active[1] HIGH X[2] recessive active[1] [1] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive. [2] X = don't care 6.1.1 Normal mode A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible ElectroMagnetic Emission (EME). 6.1.2 Silent mode A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled, releasing the bus pins to recessive state. All other IC functions, including the receiver, continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN controller from disrupting all network communications. 6.2 Fail-safe features 6.2.1 TXD dominant time-out function A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 4 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s. 6.2.2 Internal biasing of TXD and S input pins Pin TXD has an internal pull-up to VIO and pin S has an internal pull-down to GND. This ensures a safe, defined state in case one or both of these pins are left floating. 6.2.3 Undervoltage detection on pins VCC and VIO Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus (zero load) until VCC and VIO have recovered. 6.2.4 Over-temperature protection The output drivers are protected against over-temperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillations due to temperature drift are avoided. 6.3 VIO supply pin Two versions of the TJA1051 are available, only differing in the function of a single pin. Pin 5 is either not connected or is a VIO supply pin. Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller supply voltage (see Figure 3). This will adjust the signal levels of pins TXD, RXD and S to the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to levels compatible with 5 V microcontrollers. TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 5 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 7. Application design-in information BAT 3V 5V VIO VCC VDD CANH CANH S TJA1051T/3 TJA1051TK/3 CANL CANL TXD RXD Pyy TX0 MICROCONTROLLER RX0 GND GND Fig 3. 015aaa039 Typical application of the TJA1051T/3 or TJA1051TK/3. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter voltage on pin x Vx transient voltage Vtrt VESD electrostatic discharge voltage Conditions Min Max Unit on pins CANH and CANL −58 +58 V on any other pin −0.3 +7 V −150 +100 V −8 +8 kV −8 +8 kV −4 +4 kV −300 +300 V −750 +750 V no time limit; DC value on pins CANH and CANL [1] IEC 61000-4-2 [2] at pins CANH and CANL HBM [3] [4] at pins CANH and CANL at any other pin MM [5] at any pin CDM [6] at corner pins −500 +500 V −40 +150 °C storage temperature −55 +150 °C ambient temperature −40 +125 °C at any pin Tvj virtual junction temperature Tstg Tamb [7] [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. [2] IEC 61000-4-2 (150 pF, 330 Ω). TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 6 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver [3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be verified by an external test house. The result is equal to or better than ±8 kV (unaided). [4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ). [5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 µH, 10 Ω). [6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (> 1000 V). [7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 9. Thermal characteristics Table 5. Thermal characteristics According to IEC 60747-1. Symbol Parameter Conditions Rth(vj-a) thermal resistance from virtual junction to ambient Value Unit SO8 package; in free air 155 K/W HVSON8 package; in free air 55 K/W 10. Static characteristics Table 6. Static characteristics Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC[2]. Symbol Parameter Conditions Min Typ Max Unit 4.5 - 5.5 V 0.1 1 2.5 mA recessive; VTXD =VIO 2.5 5 10 mA dominant; VTXD = 0 V 20 50 70 mA 3.5 - 4.5 V 2.8 - 5.5 V recessive; VTXD = VIO 10 80 250 µA dominant; VTXD = 0 V 50 350 500 µA 1.3 - 2.7 V Supply; pin VCC VCC supply voltage ICC supply current Silent mode Normal mode Vuvd(VCC) undervoltage detection voltage on pin VCC I/O level adapter supply; pin VIO[1] VIO supply voltage on pin VIO IIO supply current on pin VIO Vuvd(VIO) Normal and Silent modes undervoltage detection voltage on pin VIO Mode control input; pin S VIH HIGH-level input voltage 0.7VIO - VIO + 0.3 V VIL LOW-level input voltage −0.3 - 0.3VIO V IIH HIGH-level input current VS = VIO 1 4 10 µA IIL LOW-level input current VS = 0 V −1 0 +1 µA CAN transmit data input; pin TXD VIH HIGH-level input voltage 0.7VIO - VIO + 0.3 V VIL LOW-level input voltage −0.3 - 0.3VIO TJA1051_4 Product data sheet V © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 7 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver Table 6. Static characteristics …continued Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC[2]. Symbol Parameter Conditions Min Typ Max Unit IIH HIGH-level input current VTXD = VIO −5 0 +5 µA IIL LOW-level input current Normal mode; VTXD = 0 V −260 −150 −30 µA Ci input capacitance - 5 10 pF [3] CAN receive data output; pin RXD IOH HIGH-level output current VRXD = VIO − 0.4 V; VIO = VCC −8 −3 −1 mA IOL LOW-level output current VRXD = 0.4 V; bus dominant 2 5 12 mA pin CANH 2.75 3.5 4.5 V pin CANL 0.5 1.5 2.25 V −400 0 +400 mV 1.5 - 3 V VTXD = VIO; recessive; no load −50 - +50 mV Bus lines; pins CANH and CANL VO(dom) dominant output voltage Vdom(TX)sym transmitter dominant voltage symmetry VO(dif)bus VTXD = 0 V; t < tto(dom)TXD Vdom(TX)sym = VCC − VCANH − VCANL bus differential output voltage VTXD = 0 V; t < tto(dom)TXD RL = 45 Ω to 65 Ω VO(rec) recessive output voltage Normal and Silent modes; VTXD = VIO; no load 2 0.5VCC 3 V Vth(RX)dif differential receiver threshold voltage Normal and Silent modes Vcm(CAN)[4] = −30 V to +30 V 0.5 0.7 0.9 V Vhys(RX)dif differential receiver hysteresis Normal and Silent modes voltage Vcm(CAN) = −30 V to +30 V 50 120 200 mV IO(dom) dominant output current pin CANH; VCANH = 0 V −100 −70 −40 mA pin CANL; VCANL = 5 V / 40 V 40 70 100 mA VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V IO(rec) recessive output current Normal and Silent modes; VTXD = VIO VCANH = VCANL = −27 V to +32 V −5 - +5 mA IL leakage current VCC = VIO = 0 V; VCANH = VCANL = 5 V −5 0 +5 µA Ri input resistance 9 15 28 kΩ ∆Ri input resistance deviation −1 0 +1 % Ri(dif) differential input resistance 19 30 52 kΩ - - 20 pF between VCANH and VCANL Ci(cm) common-mode input capacitance [3] Ci(dif) differential input capacitance [3] - - 10 pF [3] - 190 - °C Temperature protection Tj(sd) shutdown junction temperature [1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. [3] Not tested in production. TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 8 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver [4] Vcm(CAN) is the common mode voltage of CANH and CANL. 11. Dynamic characteristics Table 7. Dynamic characteristics Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5 td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns td(busdom-RXD) delay time from bus dominant to RXD Normal and Silent modes - 60 - ns td(busrec-RXD) delay time from bus recessive to RXD Normal and Silent modes - 65 - ns tPD(TXD-RXD) propagation delay from TXD to RXD versions with pin 5 n.c. Normal mode 40 - 220 ns versions with VIO pin Normal mode 40 - 250 ns VTXD = 0 V; Normal mode 0.3 1 12 ms tto(dom)TXD TXD dominant time-out time [1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. +5 V 47 µF 100 nF VIO(1) VCC CANH TXD TJA1051 RXD GND RL 100 pF CANL S 15 pF 015aaa040 (1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3), the VIO input is connected to pin VCC. Fig 4. Timing test circuit for CAN transceiver TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 9 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver HIGH TXD LOW CANH CANL dominant 0.9 V VO(dif)(bus) 0.5 V recessive HIGH 0.7VIO RXD 0.3VIO LOW td(TXD-busrec) td(TXD-busdom) td(busrec-RXD) td(busdom-RXD) tPD(TXD-RXD) Fig 5. tPD(TXD-RXD) 015aaa025 CAN transceiver timing diagram 12. Test information 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 10 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 6. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT96-1 (SO8) TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 11 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 X B D A A E A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K Eh 8 5 Dh 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c 0.2 D Dh E Eh e e1 K L 0.35 0.45 3.10 2.45 3.10 1.65 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.25 0.35 2.90 2.35 2.90 1.55 v 0.1 w y 0.05 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. Fig 7. References Outline version IEC JEDEC JEITA SOT782-1 --- MO-229 --- sot782-1_po European projection Issue date 09-08-25 09-08-28 Package outline SOT782-1 (HVSON8) TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 12 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 13 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 8) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 9. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 8. TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 14 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 8. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 15 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 15. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1051_4 20091020 Product data sheet - TJA1051_3 Modifications • Revised parameter values in Table 4 (VESD) TJA1051_3 20090825 Product data sheet - TJA1051_2 TJA1051_2 20090701 Product data sheet - TJA1051_1 TJA1051_1 20090309 Product data sheet - - TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 16 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TJA1051_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 20 October 2009 17 of 18 TJA1051 NXP Semiconductors High-speed CAN transceiver 18. Contents 1 2 2.1 2.2 2.3 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.3 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4 TXD dominant time-out function . . . . . . . . . . . . 4 Internal biasing of TXD and S input pins . . . . . 5 Undervoltage detection on pins VCC and VIO . . 5 Over-temperature protection. . . . . . . . . . . . . . . 5 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of SMD packages . . . . . . . . . . . . . . 13 Introduction to soldering . . . . . . . . . . . . . . . . . 13 Wave and reflow soldering . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 20 October 2009 Document identifier: TJA1051_4