INTEGRATED CIRCUITS DATA SHEET TDA1574T Integrated FM tuner for radio receivers Product specification File under Integrated Circuits, IC01 August 1990 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T GENERAL DESCRIPTION The TDA1574T is an integrated FM tuner circuit designed for use in the RF/IF section of car radios and home receivers. The circuit contains a mixer and an oscillator and a linear IF amplifier for signal processing. The circuit also incorporates the following features. Features • Keyed Automatic Gain Control (AGC) • Regulated reference voltage • Buffered oscillator output • Electronic standby switch • Internal buffered mixer driving. QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range (pin 17) VP 7 − 14 V V1,2-4 − 1 − V NF − 9 − dB V6-4 − 2 − V Y22 − V9-4 − 6 − V THD − −15 − dB Mixer input bias voltage (pins 1 and 2) Noise factor Oscillator output voltage (pin 6) Output admittance at pin 6 f = 108.7 MHz 1.5 + j2 ms Oscillator output buffer DC output voltage (pin 9) Total harmonic distortion Linear IF amplifier output voltage (pin 12) Noise factor RS = 300 Ω V12-4 − 4.5 − V NF − 6.5 − dB V20-4 0.5 − VP−0.3 V Keyed AGC output voltage range (pin 20) PACKAGE OUTLINE 20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 September 9. August 1990 2 Philips Semiconductors Product specification Integrated FM tuner for radio receivers Coil data L1: TOKO MC-108, 514HNE-150023S14; L = 0.078 µH L2: TOKO MC-111, E516HNS-200057; L = 0.08 µH L3: TOKO Coil set 7P, N1 = 5.5 5.5 turns, N2 = 4 turns Fig.1 Block diagram and test circuit. August 1990 3 TDA1574T Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T PINNING 1. Mixer input 1 2. Mixer input 2 3. Wideband information input 4. Ground 5. Voltage reference 6. Oscillator output 7. Oscillator input 1 8. Oscillator input 2 9. Buffered oscillator output 10. Not connected 11. Not connected 12. IF output 13. Standby switch 14. Narrowband information input 15. IF input 1 16. IF input 2 17. Supply voltage 18. Mixer output 1 19. Mixer output 2 20. AGC output Fig.2 Pinning diagram. FUNCTIONAL DESCRIPTION Mixer The mixer circuit uses a double balanced multiplier with a preamplifier (common base input) in order to obtain a large signal handling range and low oscillator radiation. Oscillator The oscillator circuit uses an amplifier with a differential input. Voltage regulation is achieved by utilizing the symmetrical tan h-transfer-function to obtain low order 2nd harmonics. Linear IF amplifier The IF amplifier is a one stage, differential input, wideband amplifier with an output buffer. Keyed AGC The AGC processor combines narrow and wideband information via an RF level detector, a comparator and an ANDing stage. The level dependent current sinking output has an active load which sets the AGC threshold. The AGC function can either be controlled by a combination of wideband narrowband information (keyed AGC) or by a wideband/narrowband information only. If narrowband AGC is required pin 3 should be connected to pin 5. If wideband AGC is required pin 14 should be connected to pin 15. August 1990 4 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134); note 1. PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT V17-4 − 14 V V18,19-4 − 35 V V13-4 − 23 V V5-4 − 7 V Total power dissipation Ptot − 500 mW Storage temperature range Tstg −55 + 150 °C Operating ambient temperature range Tamb −40 + 85 °C Supply voltage (pin 17) Mixer output voltage (pins 18 and 19) Standby switch input voltage (pin 13) Reference voltage (pin 5) Notes to the ratings 1. All pins are short-circuit protected to ground. THERMAL RESISTANCE From junction to ambient (in free air) August 1990 Rth j-a = 95 K/W 5 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T CHARACTERISTICS VP = V17-4 = 8.5 V; Tamb = 25 °C; measured in test circuit Fig.1; All measurements are with respect to ground (pin 4); unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply (pin 17) Supply voltage VP = V17 V17 7 − 14 V IP = I17 I17 16 23 30 mA V5 4.0 4.2 4.4 V V1,2 − 1 − V V18,19 4 − 35 V I18 + 19 − 4.5 − mA NF − 9 − dB Supply current (except mixer) Reference voltage (pin 5) Mixer DC characteristics Input bias voltage (pins 1 and 2) Output voltage (pins 18 and 19) Other current (pins 18 and 19) AC characteristics fi = 98 MHz Noise figure Noise figure including transforming network 3rd order intercept point Conversion power gain note 1 NF − 11 − dB EMF1IP3 − 115 − dB/µV GCP − 14 − dB R1,2 − 14 − Ω C18, 19 − 13 − pF V7,8 − 1.3 − V V6 − 2 − V ∆f − 2.2 − Hz V15 − 1.2 − V Input resistance (pins 1 and 2) Output capacitance (pins 18 and 19) Oscillator DC characteristics Input voltage (pins 7 and 8) Output voltage (pin 6) AC characteristics Residual FM (bandwidth = 300 Hz to 15 kHz) de-emphasis = 50 µs Linear IF amplifier DC characteristics Input bias voltage (pin 15) August 1990 6 Philips Semiconductors Product specification Integrated FM tuner for radio receivers PARAMETER CONDITIONS TDA1574T SYMBOL MIN. TYP. MAX. UNIT V12 − 4.5 − V R16-15 240 300 360 Ω C16-15 − 13 − pF R12 240 300 360 Ω C12 − 3 − pF Gv 27 30 − dB ∆GT − 0 − dB at VP = 8.5 V V12(rms) − 750 − mV at VP = 7.5 V V12(rms) − 550 − mV S/N − 6.5 − dB ∆V20 0.5 − VP−0.3 V −I20 25 50 100 µA I20 2 − 5 mA at V3 = 2 V; V14 = 550 mV V20 − − 1 V at V3 = 2 V; V14 = 450 mV V20 VP−0.3 − − V R3 − 4 − kΩ C3 − 3 − pF Output voltage (pin 12) AC characteristics fi = 10.7 MHz Input impedance Output impedance Voltage gain note 2 Voltage gain with variation of temperature Tamb = −40 to + 85 °C 1 dB compression point (RMS value) Signal-to-noise ratio RS = 300 Ω Keyed AGC DC characteristics Output voltage range (pin 20) AGC output current at I3 = 0 or V14 = 450 mV; V20 = VP/2 at V3 = 2 V and V14 = 1 V; V20 = V15 Narrowband threshold AC characteristics fi = 98 MHz Input impedance August 1990 7 Philips Semiconductors Product specification Integrated FM tuner for radio receivers PARAMETER CONDITIONS TDA1574T SYMBOL MIN. TYP. MAX. UNIT Wideband threshold (RMS value) (see Figs 3, 4, 5 and 6) at V14 = 0.7 V; EMF2(rms) − 17 − mV V9 − 6 − V at RL = oo; CL = 2 pF V9(rms) − 110 − mV at RL = 75 Ω V9(rms) 30 50 − mV R9-17 − 2.5 − kΩ THD − −15 − dB fS − −35 − dB V20 = VP/2; I20 = 0 Oscillator output buffer (pin 9) DC output voltage Oscillator output voltage (RMS value) DC output resistance Signal purity Total harmonic distortion Spurious frequencies at EMF 1 = 1 V; RS1 = 50 Ω Electronic standby switch (pin 11) Oscillator; linear IF amplifier; AGC Tamb = −40 to + 85 °C Input switching voltage for threshold ON V20 = > VP−3 V V13 0 − 2.3 V for threshold OFF V20 = < 0.5 V V13 3.3 − 23 V at ON condition V13 = 0 V −I13 − − 150 µA at OFF condition V13 = 23 V −I13 − − 10 µA I13 = 0 V13 − − 4.4 V Input current Input voltage Notes to the characteristics 1. Power gain conversion is equated by the following equation: 2 R S1 4 ( V M ( out ) 10.7MHz ) 10 log ---------------------------------------------------------- x ----------2 R ML ( EMF1 98 MHz ) 2. Voltage gain is equated by the following equation: V 12 20 log -----------------V 16 – 15 August 1990 8 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T Fig.3 Keyed AGC output voltage V20 as a function of RMS input voltage V3. Measured in test circuit Fig.1 at V14 = 0.7 V; I20 = 0. Fig.4 Keyed AGC output voltage V20 as a function of input voltage V14. Measured in test circuit Fig.1 at V3 = 2 V; I20 = 0. Fig.5 Keyed AGC output current I20 as a function of RMS input voltage V3. Measured in test circuit Fig.1 at V14 = 0.7 V; V20 = 8.5 V. Fig.6 Keyed AGC output voltage I20 as a function of input voltage V14. Measured in test circuit Fig.1 at V3 = 2 V; V20 = 8.5 V. August 1990 9 Philips Semiconductors Product specification Integrated FM tuner for radio receivers Coil data L1: TOKO MC-108, N1 = 5.5 turns, N2 = 1 turn L2: see Fig.1 L3: see Fig.1 (1) Field strength indication of main IF amplifier. Fig.7 TDA1574T application diagram. August 1990 10 TDA1574T Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC August 1990 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 11 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. August 1990 12 Philips Semiconductors Product specification Integrated FM tuner for radio receivers TDA1574T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1990 13