PHILIPS BGB100

DISCRETE SEMICONDUCTORS
DATA SHEET
BGB100
0 dBm TrueBlue radio module
Preliminary specification
2002 Jan 03
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
FEATURES
APPLICATIONS
• Plug-and-play Bluetooth class 2 radio module, needs
only external antenna and reference clock
Bluetooth transceivers in:
• Small dimensions (12.25 x 9.8 x 1.9 mm)
• Laptop computers
• Cellular phones
• Fully compliant to Bluetooth Radio Specification v1.1
• Personal digital assistants
• High sensitivity (typical −80 dBm)
• Consumer applications.
• Advanced DC offset compensation for improved
reception quality
• RSSI with high dynamic range
• Simple interfacing to baseband controller, control by
3-wire serial bus
• Internal shielding for better EMI (Electro Magnetic
Interference) immunity.
The interfacing to the baseband processor is very simple,
which leads to a low-power solution. Control of the module
operating mode is done through a 3-wire serial bus and
one additional control signal.
TX and RX data I/O lines are analogue-mode interfaces.
A high-dynamic range RSSI output allows
near-instantaneous assessment of radio link quality.
Frequency selection is done internally by a conventional
synthesizer. It is controlled by the same serial 3-wire bus.
The synthesizer accepts reference frequencies of 12, 13,
16 and 26 MHz. This reference frequency should be
supplied by an external source. This can be a dedicated
(temperature compensated) crystal oscillator or be part of
the baseband controller.
The circuit is designed to operate from 3.0 V nominal
supplies. Separate ground connections are provided for
reduced parasitic coupling between different stages of the
circuit. There is a basic amount of RF supply decoupling
incorporated into the circuit.
The envelope is a leadless SOT649A package with a
plastic cap.
DESCRIPTION
The BGB100 TrueBlue Bluetooth radio module is a
short-range radio transceiver for wireless links operating in
the globally available ISM band, between 2402 and
2480 MHz. It is composed of a fully integrated,
state-of-the-art near-zero-IF transceiver chip, an antenna
filter for out-of-band blocking performance, a TX/RX
switch, TX and RX baluns, the VCO resonator and a basic
amount of supply decoupling. The device is a “Plug-and
Play” module that needs no external components for
proper operation. Robust design allows for untrimmed
components, giving a cost-optimized solution.
Demodulation is done in open-loop mode to reduce the
effects of reference frequency breakthrough on reception
quality. An advanced offset compensation circuit
compensates for VCO drift and RF frequency errors during
open-loop demodulation, under control by the baseband
processor.
The circuit is integrated on a ceramic substrate. It is
connected to the main PCB through a LGA (Land Grid
Array). The RF port has a normalized 50 Ω impedance and
can be connected directly to an external antenna, with a
50 Ω transmission line.
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2002 Jan 03
2
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
PINNING
PIN
NAME
1,4,7,9,
12,17,18,
19,20,22,
23
GND
2
VS1
DESCRIPTION
ground
1
supply (for VCO, buffer and
synthesizer)
3
2
4
5
6
7
22
8
3
T_GFSK transmit data input
21
9
5
R_DATA
received data output
20
10
6
RSSI
received signal strength indicator
19
11
8
REFCLK reference clock input
10
S_DATA
11
S_EN
3-wire bus enable input
13
S_CLK
3-wire bus clock input
14
15
VS2
3-wire bus data input
18
17
16
15
14
13
12
supply (for RX part, TX part)
DCXCTR DC extractor control signal
16
NC
not connected
21
ANT
antenna input/output
Pin 23 represents the inner 5 x 4 = 20 LGA pads
Fig.1 Simplified outline
BLOCK DIAGRAM
BGB100
PLL loop
filter
VCO
tank
Regulator
T_GFSK
REFCLK
X2
Control logic
Synthesizer
S_EN
Tx balun
+ filter
Demod
S_CLK
DC
extractor
S_DATA
RF IC
Vs1
Vs2
Band
Supply
decoupling
Rx balun +
filter
GND
pass
filter
R_DATA DCXCTR RSSI
Fig.2 Block diagram.
2002 Jan 03
Tx/Rx
switch
3
ANT
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
QUICK REFERENCE DATA
VS = 3.0 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
VS
nominal supply voltage
IS1 + IS2
total supply current
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2.8
3
3.6
V
during RX guard space
−
25
−
mA
during demodulation
−
60
72
mA
during TX guard space
−
36
−
mA
during transmission
−
34
40
mA
in power-down mode
−
10
60
µA
Sens
receiver sensitivity
BER = 0.1 % under standard
conditions
−
−80
−73
dBm
Pout
output power
at nominal settings
−4
−1.5
+4
dBm
f0
RF frequency
2402
−
2480
MHz
fref
reference input frequency
12
−
26
MHz
Tamb
operating ambient temperature(1)
−10
−
55
°C
Note
1. In combination with the adaptive temperature-compensation scheme provided by the baseband processor
FUNCTIONAL DESCRIPTION
Control
The BGB100 TrueBlue Bluetooth Radio Module is controlled by a baseband processor via the serial 3-wire bus. These
3 wires are data (S_DATA), clock (S_CLK) and enable (S_EN). Data sent to the device is loaded in bursts framed by
S_EN. Data and clock (S_DATA and S_CLK) signals are ignored until S_EN goes low. The programmed information is
read directly into the internal registers when S_EN goes high. S_DATA and S_EN should be stable around the rising
edges of S_CLK. There are internal pull-down resistors on all these three pins.
Only the last 32 bits serially clocked into the device are retained within the register. Additional (leading) bits are ignored,
and no check is made on the number of bits received. The data format is shown in table 1. The first data bit entered is
b31, the last one b0.
The S_EN high-to-low transition also controls the opening of the PLL. A short S_EN high pulse at the end of a time slot,
either TX or RX, serves to reset and power-down the IC. This can be omitted, at the cost of extra power consumption.
In addition to the 3-wire serial bus, there is one control signal used for accurate timing of functions within the IC, under
control by the baseband processor. This is the DCXCTR signal, to control (in RX mode) the three subsequent operating
modes of the DC compensation circuit: coarse offset estimation during the early part of the Access Code, accurate offset
estimation during the Barker sequence and the trailer, retention of the offset information during the payload.
Transmit mode
The BGB100 TrueBlue Bluetooth Radio Module contains a fully integrated transmitter function. The RF channel
frequency is selected in a conventional synthesizer, which is controlled via the serial 3-wire bus. The VCO is directly
modulated by the signal present on the T_GFSK connection. The Gaussian filtering should therefore be performed
externally. The DC bias voltage for this pin should already be present during the S_EN programming pulse, so that the
PLL can correct for possible frequency errors that might otherwise occur. Also in RX mode, this pin should be connected
to a well-defined and stable DC voltage. The robust design of the VCO makes it unnecessary to trim its freerunning
frequency. This leads to a lower component cost. A carefully designed PLL loop filter keeps frequency drift during
open-loop modulation down to a very low value.
2002 Jan 03
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Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
The output stage of the transmit chain active part is balanced, for reduced spurious emissions (EMC). It is connected
through a balun (balanced-to-unbalanced) circuit to the TX/RX switch. This switch is controlled by internal logic circuits
in the active die. The balun circuit has built-in selectivity, to further reduce out-of-band spurious emissions.
Receive mode
Also the receiver functionality is fully integrated. It is a near-zero-IF (1 MHz) architecture with active image rejection. The
sensitive RX input of the active die is a balanced configuration, in order to reduce unwanted (spurious) responses. The
balun structure to convert from unbalanced to balanced signals has built-in selectivity. This suppresses GSM-900
frequencies by more than 40 dB. For better immunity to DCS, DECT, GSM-1800 and W_CDMA signals, an extra
band-pass filter has been included.
The synthesizer PLL may be switched off during demodulation. This reduces the effects that reference frequency
breakthrough may have on receiver sensitivity and adjacent channel selectivity, and also reduces the power
consumption. The demodulator contains an advanced DC offset compensation circuit. This reduces the effects of
frequency mismatch between (remote) transmitter and receiver. These may be caused by differences in reference
frequency, but also by frequency drift during open-loop modulation and demodulation.
Because the VCO is directly modulated by the signal present at the T_GFSK pin, this pin should be connected to a
well-defined and stable DC bias voltage, also when in RX mode. Moreover, this bias voltage should already be present
during the S_EN programming pulse. In this way, the PLL can correct for possible frequency offsets that might otherwise
occur.
The demodulated RF signal is compared against a reference (slicer) value and then output. This reference voltage is
derived from the demodulated output signal itself, by the DC extractor circuit. It operates in three subsequent phases,
controlled by the DCXCTR signal:
• In the first phase, during the preamble and the early part of the Acess Code, a Min/Max detector provides a crude but
fast estimate of the required DC voltage. The DCXCTR line should be low during this phase.
• When the DCXCTR line is pulled high, this crude estimate is used as an initial estimate for an integrator circuit that
provides an accurate estimate of the required DC voltage. This is the second phase. The DC value obtained is derived
from the Barker sequence and the trailer, which together make up the final 10 bits of the Acess Code. The DCXCTR
line should be pulled high 20 µs before the trailer sequence is expected to end (there is a ±10 µs timing uncertainty
between the expected and the actual end of the trailer sequence).
• Exactly at the end of the trailer, the DCXCTR line must be pulled low again. The device now enters the third phase,
during which the estimate of the offset voltage that was obtained during phases one and two is retained. A small and
slow variation to compensate carrier frequency drift can still be tracked.
An RSSI output with a high dynamic range of more than 50 dB provides near-instantaneous information on the quality
of the signal received.
Due to the IF frequency at 1 MHz, in RX mode the VCO frequency should be 1 MHz higher than the channel frequency.
This should be taken care of by the baseband controller.
Power-down mode
In Power-down mode, current consumption is reduced to below 60 µA. The 3-wire bus inputs present a high-ohmic
resistance to ground.
2002 Jan 03
5
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
Table 1
BGB100
Bit allocation
REGISTER BIT ALLOCATION(1)
Data field
FIRST IN
b31
b30
b29
b28
b20
b26
b25
(2)
0
0
b24
(2)
b23
(2)
b22
b21
b20
b19
b18
b17
b16
0
0
0
1
1
0
(2)
0
0
0
1
0
1
0
1
b14
b13
b12
b11
b10
b9
b8
b7 to b0 (7)
0
ref1
ref0
pwr1 pwr0 pll
see
below
LAST IN
see
b15
above
0
(3)
(3)
(4)
(4)
main divider programming (8)
trx
(5)
(6)
Notes
1. In normal operation, 32 bits are programmed into the register.
2. bits b26 to b23 can be used for adaptive temperature compensation by the baseband.
3. ref: bits ‘ref1’ and ‘ref0’ define the reference frequency (see Table 3).
4. pwr: bits ‘pwr1’ and ‘pwr0’ define the the typical output power (see Table 4).
5. trx: bit ‘trx’ = 1 forces the IC into RX mode.
6. pll: bit ‘pll’ = 1 forces the synthesizer PLL to remain on during the entire (TX or RX) slot.
7. Bit b7 is the MSB of the frequency control word composed of (b7, b6, b5, b4, b3, b2, b1 and b0).
8. The VCO frequency is equal to 2304 + d[b7:b0] (see Table 2).
Table 2
b7
Channel frequency programming examples
b6
b5
b4
b3
b2
b1
b0
Binary equivalent of n
MAIN DIVIDER
RATIO
SYNTHESIZED
FREQUENCY
(MHz)
2304 + n
1.0 × (2304 +n)
CHANNEL
FREQUENCY
0
1
1
0
0
0
1
0
2402
2402
TX channel 1
0
1
1
0
0
0
1
1
2403
2403
RX channel 1
TX channel 2
1
0
1
1
0
0
0
0
2480
2480
RX channel 78
TX channel 79
1
0
1
1
0
0
0
1
2481
2481
RX channel 79
Table 3
Reference frequency programming
2002 Jan 03
b13
b12
REFERENCE DIVIDER
RATIO
REFERENCE INPUT
FREQUENCY
0
0
12
12 MHz
0
1
16
16 MHz
1
0
13
13 MHz
1
1
26
26 MHz
6
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
Table 4
BGB100
Typical output programming
b11
b10
TYPICAL OUTPUT POWER
0
0
−4.5 dBm
0
1
−1.5 dBm (nominal value)
1
0
1.5 dBm
1
1
3.5 dBm
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.3
VS1, VS2
supply voltage
input control pin voltage
∆GND
difference in ground supply
voltage between ground pins
Ptot
total power dissipation
−
PD
drive power at receiver input
Tstg
storage temperature
Tj
junction temperature
MAX.
UNIT
3.6
V
−0.3
VS
V
−
0.01
V
tbd
W
−
0
dBm
−55
85
°C
−
150
°C
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient
VALUE
UNIT
tbd
K/W
SPURIOUS EMISSIONS
The conducted and radiated out-of-band spurious emissions in all operating modes are fully compliant with the
Regulatory Requirement FCC Part 15.247,C and ETS 300 328 (subclause 5.2.4.).
ESD PRECAUTIONS
Inputs and outputs are protected against electrostatic discharge (ESD) during handling and mounting. A human-body
model (HBM) and a machine model (MM) are used for ESD susceptibility testing. All pins withstands the following
threshold voltages:
PARAMETER
ESD threshold voltage
2002 Jan 03
METHOD
VALUE
CLASS
HBM (JESD22-A114-B)
≥3500 V
2
MM (JESD22-A115-A)
≥300 V
2
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Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
CHARACTERISTICS
VCC = 3.0 V;Tamb = 25 °C; fdev = 160 kHz; unless otherwise specified. Characteristics for which only a typical value is
given are not tested.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VS1, VS2
nominal supply voltage
IS1 + IS2
total supply current
2.8
3.0
3.6
V
during RX guard space
−
25
−
mA
during RX (PLL off)
−
60
72
mA
during TX guard space
−
36
−
mA
during TX (PLL off)
−
34
40
mA
power-down mode
−
10
60
µA
Frequency selection
fref
reference input frequency
∆fref
reference frequency inaccuracy
Vref(min)
sinusoidal input signal level
RMS value
250
−
500
mV
Ri
input resistance (real part of the
input impedance)
at 13MHz
−
2
−
kΩ
Ci
input capacitance (imaginary part
of the input impedance)
at 13MHz
−
2.5
−
pF
∆f1 slot
carrier drift
over 1 TX slot
−25
0
25
kHz
over 3, 5 TX slots (DM3, DH3,
DM5, DH5 packets)
−40
0
40
kHz
−75
0
75
kHz
across entire band
−
150
200
µs
∆f3, 5 slots
ICFT
Initial Carrier Frequency
Tolerance
tPLL
PLL settling time
12,13,
16,26
tbd
−
MHz
tbd
ppm
Transmitter performance
fRF
RF frequency
over full temperature and supply
range
2402
−
2480
MHz
kMOD
VCO modulation gain
from T_GFSK (pad 3) to
antenna (pad 21): note 2
−
400
−
kHz/V
Po
output power
wanted channel;
bits b11, b10 = 0, 1
−4
−1.5
4
dBm
Po 1 MHz
adjacent channel output power
at 1 MHz offset; measured in
100 kHz bandwidth; referred to
wanted channel
−
−
−20
dBc
VSWR
voltage standing wave ratio
normalized to Zo = 50 Ω
−
1.5
−
H1, VCO
VCO frequency feedtrough
referred to wanted output level;
fRF = 2450 MHz;
fVCO = 1225 MHz
−
tbd
tbd
dBc
−
tbd
tbd
dBc
−
tbd
tbd
dBc
−
tbd
tbd
dBc
3rd
H3, VCO
VCO
H4, VCO
VCO 4th harmonic
H6, VCO
2002 Jan 03
VCO
6th
harmonic
harmonic
8
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
SYMBOL
PARAMETER
out of band spurious emissions
(conducted)
BGB100
CONDITIONS
30 MHz to 1 GHz
MIN.
−
TYP.
tbd
MAX.
−36
UNIT
dBm
1 GHz to 12.75 GHz
−
tbd
−30
dBm
1.8 GHz to 1.9 GHz
−
tbd
−47
dBm
5.15 GHz to 5.3 GHz
−
tbd
−47
dBm
without carrier offset
−
−80
−73
dBm
with carrier offset up to ±55 kHz
under extreme test conditions
−
−
−70
dBm
dBm
Receiver performance
SENS
sensitivity for BER = 0.1 %
Pi max
maximum input power in one
channel
BER < 0.1 %
−20
−
−
VSWR
voltage standing wave ratio
normalized to Zo = 50 Ω
−
1.5
−
fRF
RF input frequency
over full temperature and supply
range
2402
−
2480
MHz
VRSSI
RSSI voltage (monotonic over
range −86 dBm to −36 dBm)
Pin = −86 dBm
−
0.5
−
V
Pin = −36 dBm
−
1.3
−
V
Ton
wake up time from the power up
signal to correct RSSI output
No external capacitor on the
RSSI pin; Rload > tbf kΩ
−
tbd
50
µs
IM3
intermodulation rejection
wanted signal −64 dBm;
Interferers 5 and 10 channels
away; BER < 0.1 %
−
25
−
dBc
RCO
co-channel rejection
wanted signal −60dBm;
BER < 0.1 %
−14
−11
−
dBc
RC/I 1MHz
adjacent channel rejection
(± 1 MHz)
wanted signal −60dBm;
BER < 0.1 %
−4
0
−
dBc
RC/I −2MHz
bi-adjacent channel rejection
(N-2)
wanted signal −60dBm;
BER < 0.1 %
30
35
−
dBc
RC/I Image
rejection at image frequency
(N+2)
wanted signal −60dBm;
BER < 0.1 %
6
10
−
dBc
RC/I Image
rejection at image-adjacent
frequency (N+3)
wanted signal −67dBm;
BER < 0.1 %
16
20
−
dBc
RC/I ≥3MHz
in-band interference rejection
ratio, three or more channels
away, except (N+3) and spurious
response frequencies
wanted signal −67dBm;
BER < 0.1 %
40
−
−
dBc
RC/I spurious
rejection at five spurious
response frequencies in the
range [2400 MHz to (N−3) or
(N+4) to 2480 MHz]
wanted signal −67dBm;
BER < 0.1 %
37
40
−
dBc
1MHz
2002 Jan 03
9
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
SYMBOL
PARAMETER
out of band blocking
spurious emissions
FTLOrf
BGB100
LO to RF feedthrough
CONDITIONS
MIN.
TYP.
MAX.
UNIT
wanted signal −67dBm; CW
interferer level
range 30 MHz to 2 GHz
−10
−
−
dBm
range 2 GHz to 2400 MHz
−27
−
−
dBm
range 2500 MHz to 3 GHz
−27
−
−
dBm
range 3 GHz to 12.75 GHz
−10
−
−
dBm
wanted signal −67dBm; GSM
−
modulated signal between 880
and 915 MHz (GSM−900 uplink)
tbd
−
dBm
wanted signal −67dBm; GSM
modulated signal between 1800
and 1785 MHz (GSM−1800
uplink)
tbd
−
dBm
−
30 MHz to 1 GHz
−
tbd
−36
dBc
1 GHz to 12.75 GHz
−
tbd
−30
dBc
measured at 2450MHz
−
tbd
−47
dBc
V
Interface (logic) inputs and outputs; pins S_DATA, S_CLK, S_EN, DCXCTR, R_DATA, T_GFSK
1.4
−
VS
−
−
0.4
V
−5
−
5
µA
note 4
−
10
−
MHz
minimum S_EN pulse duration
to switch off the module: note 3
−
1
−
µs
VOH
HIGH-level output voltage
for R_DATA output
2.1
−
2.4
V
VOL
LOW-level output voltage
for R_DATA output
−0.3
−
0.4
V
RR_DATA, load real part of the R_DATA load
admittance
at 500 kHz
−
tbd
−
Ω
CR_DATA, load imaginary part of the R_DATA
load admittance
at 500 kHz
−
10
30
pF
VT_GFSK,DC
T_GFSK DC voltage
note 2
−
1
−
V
RT_GFSK,in
real part of the T_GFSK input
admittance
at 500 kHz
−
tbd
−
Ω
CT_GSFK, in
imaginary part of the T_GFSK
input admittance
at 500 kHz
−
tbd
−
pF
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Ibias
input bias current
HIGH or LOW level
fS_CLKmax
maximum 3-wire bus frequency
tS_ENmin
note 3
Notes
1. The actual VCO frequency is one-half the programmed frequency. It is doubled internally.
2. T_GFSK is DC coupled. The DC voltage must be supplied by the baseband processor.
3. VIH should never exceed 3.6V.
4. See detailed timing information.
2002 Jan 03
10
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
TIMING DIAGRAMS
S_DATA
31 30 29
2 1 0
S_CLK
S_EN
t3
32 clock cycles
3-wire serial bus timing
TX packet
RX packet
S_CLK/DATA
REFCLK
t1
t1
t2
t2
S_EN
t3
t4
T_GFSK
t8
t5
t7
t3
t4
t6
t9
R_DATA
t10
DCXCTR
t11
Fig.3 Timing diagram.
2002 Jan 03
11
t12
t7
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
Timing Parameters
PARAMETER
DESCRIPTION
CONDITIONS
MIN.
TYP.
UNIT
t1
S_DATA last bit to REFCLK enable
0.1
−
µs
t2
S_EN falling edge to REFCLK disable
−
2
µs
t3
S_DATA last bit to S_EN rising edge
0.1
−
µs
t4
S_EN width
180
185
µs
t5
T_GFSK last bit to S_EN pulse start
−
2
µs
t6
R_DATA last bit to S_EN pulse start
−
2
µs
t7
S_EN pulse width
note 2
−
2
µs
note 3
note 1
t8
S_DATA last bit to T_GFSK DC bias
0.1
−
µs
t9
S_EN falling edge to T_GFSK first data bit
−
2
µs
t10
S_EN falling edge to R_DATA earliest data
bit
15
20
µs
t11
S_EN falling edge to DCXCTR high
note 4
−
64
µs
t12
DCXCTR width
note 5
−
20
µs
Notes
1. The S_EN signal going high switches the synthesiser on if preceded by S_DATA / S_CLK activity; the S_EN signal
going low disables the synthesizer in order to perform open-loop modulation or demodulation. Simultaneously, it
enables the receiver chain in RX mode. The length of the S_EN signal should be long enough for the synthesizer
loop to settle.
2. A single short S_EN pulse (without preceding S_DATA / S_CLK activity) serves to power-down the IC. It may be
omitted at the cost of increased power consumption. Any subsequent S_EN pulse without preceding
S_DATA / S_CLK activity toggles between power-up and power-down states, but brings the module into an
undefined power-up state. This mode should be avoided.
3. Because the VCO is directly modulated by the T_GFSK signal, the DC level on this pin should be present early on
during the synthesizer settling phase. Also in RX mode, there should be a well-defined and stable DC voltage on this
pin.
4. The DCXCTR signal should go high 20 µs before the expected end of the trailer sequence.
5. The DCXCTR signal should go low at the actual end of the trailer sequence. The timing for this transition should be
directly derived from the Acess Code detection algorithm inside the baseband processor.
2002 Jan 03
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Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
Advised solder types are types with a liquidus less than or
equal to 210 °C.
handbook, halfpage
T
(°C)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because of the nature
of the contacts.
100
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
The maximum ramp-up is 10 °C per second.
0
0
The maximum cool-down is 5 °C per second.
1
2
3
4
t (min)
5
Fig.5 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
Packing
• Acetone.
An extended packing / SMD specification can be found in
document RNR-T49D-2183.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
2002 Jan 03
13
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
PACKAGE OUTLINE
1
SOT649A
2
3
4
5
6
7
22
8
21
9
20
10
19
11
Fig.6
18
2002 Jan 03
17
16
15
14
13
12
14
Philips Semiconductors
Preliminary specification
0 dBm TrueBlue radio module
BGB100
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Jan 03
15
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
budgetnum/ed/pp16
Date of release: 2002
Jan 03
Document order number:
9397 750 09278