MB39C326 6MHz Synchronous Rectification Buck-Boost DC/DC Converter IC The MB39C326 is a high efficiency, low noise synchronous, Buck-boost DC/DC converter designed for powering the radio frequency power amplifiers (RFPA) in 3G/GSM mobile handsets and other mobile applications. Features High efficiency : Up to 93% Input voltage range : 2.5V to 5.5V Adjustable output voltage range : 0.8V to 5.0V Maximum output current : 1200 mA (VIN = 5.0V to 5.5V, at Vo=5.0V) : 1200 mA (VIN = 3.6V to 5.5V, at Vo=3.6V) (Buck, PWM mode) : 1200 mA (VIN = 3.3V to 5.5V, at Vo=3.3V) (Boost, PWM mode) : 900 mA (VIN = 3.7V to 5.0V, at Vo=5.0V) : 700 mA (VIN = 2.5V to 3.6V, at Vo=3.6V) : 800 mA (VIN = 2.5V to 3.3V, at Vo=3.3V) (Buck, Power save mode, : 600 mA (VIN = 5.0V to 5.5V, at Vo=5.0V) ILIMSEL=H) : 600 mA (VIN = 3.6V to 5.5V, at Vo=3.6V) : 600 mA (VIN = 3.3V to 5.5V, at Vo=3.3V) (Boost, Power save mode, : 500 mA (VIN = 3.7V to 5.0V, at Vo=5.0V) ILIMSEL=H) : 400 mA (VIN = 2.5V to 3.6V, at Vo=3.6V) : 500 mA (VIN = 2.5V to 3.3V, at Vo=3.3V) Quiescent current : 50 µA 6 MHz PWM operation allows 0.5 µH small form inductor Automatic Transition between Buck mode and boost mode Power save Mode for improved efficiency at light load current Selectable output voltage with external resistor Built-in Over temperature protection circuit Built-in Under voltage lockout protection circuit Package: WL-CSP (20pin 0.4 mm-ball-pitch 2.15 × 1.94 mm) Note: This product supports the web-based design simulation tool, Easy DesignSim. It can easily select external components and can display useful information. Please access from http://cypress.transim.com/login.aspx Applications Products that use 1-cell lithium batteries for the power supply RF power amplifier Cell-phone RF-PC card and PDA Cypress Semiconductor Corporation Document Number: 002-08348 *A • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised February 10, 2016 MB39C326 Contents 1. Pin Assignments .....................................................................................................................................3 2. Pin Descriptions .....................................................................................................................................3 3. Block Diagram .........................................................................................................................................4 4. Function...................................................................................................................................................4 5. Absolute Maximum Ratings ...................................................................................................................6 6. Recommended Operating Conditions...................................................................................................6 7. Electrical Characteristics .......................................................................................................................8 8. Typical Applications Circuit (RF Power Amplifier) ...............................................................................8 9. Application Notes ...................................................................................................................................9 10. Inductor Selection............................................................................................................................. 11 11. Input Capacitor Selection ................................................................................................................. 11 12. Output Capacitor Selection .............................................................................................................. 11 13. Thermal Information ......................................................................................................................... 11 14. Notes on Board Layout ....................................................................................................................12 15. Example of Standard Operation Characteristics ............................................................................13 16. Usage Precaution ............................................................................................................................. 16 17. Notes on Mounting ...........................................................................................................................16 18. Ordering Information ........................................................................................................................17 19. EV Board Ordering Information .......................................................................................................17 20. RoHS Compliance Information of Lead (Pb) Free Version ............................................................ 18 21. Marking ..............................................................................................................................................18 22. Labeling Sample ............................................................................................................................... 19 23. MB39C326PW Recommended Conditions of Moisture Sensitivity Level ....................................22 24. Package Dimensions ........................................................................................................................23 25. Major Changes ..................................................................................................................................24 Document History .........................................................................................................................................24 Document Number: 002-08348 *A Page 2 of 25 MB39C326 1. Pin Assignments TOP VIEW 4 EN ILIMSEL VCC XPS VSEL VSELSW GND 3 GND GND FB 2 VDD SWOUT DGND SWIN VOUT VDD SWOUT DGND SWIN VOUT D E 1 A B C 2. Pin Descriptions Pin No. Pin Name I/O Description A4 EN I IC Enable input pin (H: Enable, L: Shutdown) E3 FB I Voltage feedback pin C3, D3, E4 GND B4 ILIMSEL I Inductor peak current limit pin B1, B2 SWOUT I Connection pins for Inductor D1, D2 SWIN I Connection pins for Inductor C1, C2 DGND C4 VSEL D4 VSELSW A1, A2 VDD I Electric power input pin for DCDC converter output voltage A3 VCC I Electric power input pin for IC control block B3 XPS I Power save mode pin (H: PWM mode, L: Power save mode) E1, E2 VOUT O Buck-boost converter output pins Document Number: 002-08348 *A Control / Logic ground pins Power ground pins I Output voltage select pin (H: Using R3 L: No using R3) Connection pin for output voltage setting resistor R3 Page 3 of 25 MB39C326 3. Block Diagram L1 SWOUT VDD CIN SWIN SW1 VOUT SW5 COUT SW4 Current Sensor SW2 SW3 Vbatt DGND VCC Gate Controller EN Device Control ILIMSEL XPS BGR UVLO AGND Err Amp R1 FB R3 Over Temp Protection R2 VSELSW Oscillator VSEL 4. Function (1) Gate Controller It is controlled the synchronous rectification operation of built-in 2-P-ch MOS FETs and 2-N-ch MOS FETs according to frequency (6 MHz) set with a oscillator at the normal operation. (2) Error Amp & phase compensation circuit This compares the feedback voltage and the reference voltage (VREF). This IC contains the phase compensation circuit which optimizes the IC operation. Therefore, it is unnecessary to consideration of the phase compensation circuit, and external parts for the phase compensation. (3) Band gap reference circuit A high accuracy reference voltage is generated with BGR (band gap reference) circuit. (4) Oscillator The internal oscillator output a 6 MHz clock signal to set a switching frequency. (5) Over temperature protection circuit The over temperature protection circuit is built-in as a protection circuit. When junction temperature reaches +125°C, the over temperature protection circuit turns off all N-ch MOS FETs and P-ch MOS FETs. Also, when the junction temperature falls to +110°C, this IC operates normally. (6) Inductor peak current limit circuit (Current Sensor + Device Control) The inductor peak current limit circuit detects the current (ILX) which flows from built-in P-ch MOS FET connected to VDD into an external inductor and limits the inductor peak current (IPK). (7) Power save mode operation Power save mode is used to improve efficiency at the light load. By setting the XPS pin to "L" level, power save mode is set and the operation is performed in PWM mode or PFM mode depending on the load current. At this time, if the load current is low, this IC operates with PFM (PulseFrequency Modulation). It should be used above VOUT = 0.8V. If the output voltage becomes lower than the setting value at the light load, switching is performed several times and the output voltage rises. If the output voltage reaches the setting value, it changes to the stop state, all of the four FETs are turned off, and the switching loss and the dissipation power for the circuit are suppressed. Consumption current in stop state at the power save mode becomes about 50μA. Document Number: 002-08348 *A Page 4 of 25 MB39C326 Function Table Mode XPS Input Voltage Range[V] ILIMSEL Min PWM mode H Power save mode L Output Voltage Range[V] Max Min Max L H Inductor peak Current Limit (IPK) [A] 3.1 2.5 5.5 0.8 5.0 L 1.3 0.49 Note: Input of (XPS, ILIMSEL = H, H) is prohibited. (8) EN pin When the EN pin is set to "H" level, the device operation is enabled. When the EN pin is set to GND, the device is switched to shutdown mode. When the EN pin is set to "L" level, the device is switched to shutdown mode. In shutdown mode, the regulator stops switching, all FET switches are turned off, and the load is disconnected from the input. (9) VSEL pin MB39C326 has a function to change the output voltage with the VSEL pin and additional resistance. For details of the output voltage settings, see the section 2. of "Programming the Output Voltage" in 9. Application . (10) Buck-Boost operations MB39C326 operates in Buck or Boost mode by monitoring the VCC/VOUT voltage with a newly developed PWM controller. The transition between buck and boost mode is smooth and the efficiency is high. During Buck mode (VCC > VOUT), SW1 and SW2 perform switching while SW3 is fixed to OFF and SW4 and 5 are fixed to ON. During Boost mode (VCC < VOUT), SW3, SW4 and SW5 perform switching while SW1 is fixed to ON and SW2 is fixed to OFF. The voltage values of VCC and VDD at the switching between buck and boost vary depending on the load current, the environmental temperature and the process variations. (11) Startup circuit MB39C326 has the soft-start function to prevent rush current upon turning on of the power. The startup time is approximately 100μ seconds. Document Number: 002-08348 *A Page 5 of 25 MB39C326 5. Absolute Maximum Ratings Parameter Symbol Condition Min Rating Max Unit Power supply voltage VMAX VDD, VCC -0.3 +7.0 V Signal input voltage VINMAX EN, XPS, VSEL, ILIMSEL -0.3 VDD + 0.3 V Power dissipation PD Ta ≤ +25°C - 1080 mW Storage temperature TSTG - -65 +150 °C VESDH Human Body Model (100 pF, 1.5 kΩ) -2000 +2000 V VESDM Machine Model (200 pF, 0Ω) -200 +200 V VESDC Charged device model -1000 +1000 V Tj-MAX - - +95 °C ESD Voltage Maximum junction temperature WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. 6. Recommended Operating Conditions Parameter Symbol Condition Min Value Typ Max Unit Power supply voltage VDD VDD, VCC 2.5(*1) 3.7 5.5(*1) V Signal input voltage VIDD EN, XPS, VSEL, ILIMSEL 0.0 - VDD V Io (Max1) VIN = 5.5, Vo = 5.0V, XPS = H, ILIMSEL = L - - 1200 mA Io (Max2) VIN = 5.5, Vo = 4.4V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 5.5, Vo = 3.6V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 4.2, Vo = 3.6V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 5.5, Vo = 3.3V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 3.7, Vo = 3.3V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 5.5, Vo = 2.0V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 3.7, Vo = 2.0V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 2.5, Vo =2 .0V, XPS = H, ILIMSEL = L - - 1200 mA VIN = 5.5, Vo = 1.2V, XPS = H, ILIMSEL = L - - 700 mA VIN = 3.7, Vo = 1.2V, XPS = H, ILIMSEL = L - - 600 mA VIN = 2.5, Vo = 1.2V, XPS = H, ILIMSEL = L - - 600 mA VIN = 5.5, Vo = 0.8V, XPS = H, ILIMSEL = L - - 600 mA VIN = 3.7, Vo = 0.8V, XPS = H, ILIMSEL = L - - 500 mA Io (Max3) Io (Max4) Output current (Buck) PWM mode Io (Max5) Io (Max6) Io (Max7) Output current (Boost) PWM mode VIN = 2.5, Vo = 0.8V, XPS = H, ILIMSEL = L - - 250 mA Io (Max8) VIN = 2.5V, Vo = 3.3V, XPS = H, ILIMSEL = L - - 800 mA Io (Max9) VIN = 2.5V, Vo = 3.6V, XPS = H, ILIMSEL = L - - 700 mA VIN = 3.7V, Vo = 4.4V, XPS = H, ILIMSEL = L - - 1000 mA VIN = 2.5V, Vo = 4.4V, XPS = H, ILIMSEL = L - - 700 mA VIN = 3.7V, Vo = 5V, XPS = H, ILIMSEL = L - - 900 mA VIN = 2.5V, Vo = 5V, XPS = H, ILIMSEL = L - - 600 mA Io (Max12) VIN = 5.5, Vo = 5.0V, XPS = L, ILIMSEL = H - - 600 mA Io (Max13) VIN = 5.5, Vo = 4.4V, XPS = L, ILIMSEL = H - - 600 mA VIN = 5.5, Vo = 3.6V, XPS = L, ILIMSEL = H - - 600 mA VIN = 4.2, Vo = 3.6V, XPS = L, ILIMSEL = H - - 600 mA VIN = 5.5, Vo = 3.3V, XPS = L, ILIMSEL = H - - 600 mA VIN = 3.7, Vo = 3.3V, XPS = L, ILIMSEL = H - - 600 mA Io (Max10) Io (Max11) Output current (Buck) Power save mode, Io (Max14) ILIMSEL=H Io (Max15) Document Number: 002-08348 *A Page 6 of 25 MB39C326 Parameter Symbol Condition Min Value Typ Max Unit VIN = 5.5, Vo = 2.0V, XPS = L, ILIMSEL = H - - 600 mA VIN = 3.7, Vo = 2.0V, XPS = L, ILIMSEL = H - - 500 mA VIN = 2.5, Vo = 2.0V, XPS = L, ILIMSEL = H - - 500 mA VIN = 5.5, Vo = 1.2V, XPS = L, ILIMSEL = H - - 400 mA VIN = 3.7, Vo = 1.2V, XPS = L, ILIMSEL = H - - 300 mA VIN = 2.5, Vo = 1.2V, XPS = L, ILIMSEL = H - - 300 mA VIN = 5.5, Vo = 0.8V, XPS = L, ILIMSEL = H - - 400 mA VIN = 3.7, Vo = 0.8V, XPS = L, ILIMSEL = H - - 200 mA VIN = 2.5, Vo = 0.8V, XPS = L, ILIMSEL = H - - 200 mA Io (Max19) VIN = 2.5V, Vo = 3.3V, XPS = L, ILIMSEL = H - - 500 mA Io (Max20) VIN = 2.5V, Vo = 3.6V, XPS = L, ILIMSEL = H - - 400 mA VIN = 3.7V, Vo = 4.4V, XPS = L, ILIMSEL = H - - 600 mA VIN = 2.5V, Vo = 4.4V, XPS = L, ILIMSEL = H - - 350 mA VIN = 3.7V, Vo = 5V, XPS = L, ILIMSEL = H - - 500 mA VIN = 2.5V, Vo = 5V, XPS = L, ILIMSEL = H - - 300 mA Io (Max23) VIN = 3.7, Vo = 3.3V, XPS = L, ILIMSEL = L - - 160 mA Io (Max24) VIN = 2.5, Vo = 5V, XPS = L, ILIMSEL = L - - 60 mA Operating Ambient temperature Ta - -40 - +85 °C Junction temperature range Tj - -40 - +95 °C Inductor value L - - 0.5 - µH Feedback resistor value R1 - - 620 - kΩ Io (Max16) Io (Max17) Io (Max18) Output current (Boost) Power save mode, Io (Max21) ILIMSEL=H Io (Max22) Output current (Buck) Power save mode, ILIMSEL=L Output current (Boost) Power save mode, ILIMSEL=L *1: Depending on the setting condition. See "Function Table" in "4. Function (7) Power save mode operation". WARNING: 1. The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. 2. Any use of semiconductor devices will be under their recommended operating condition. 3. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. 4. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. Document Number: 002-08348 *A Page 7 of 25 MB39C326 7. Electrical Characteristics The specifications apply under the recommended operating condition. Parameter Symbol Condition Value Min Typ Max Unit Output voltage range VO - 0.8 - 5.0 V Feedback voltage VFB - 490 500 510 mV Line Regulation VLINE IO = 0 to 800 mA - 0.2 - % Load Regulation VLOAD IO = 0 to 800 mA - 0.3 - % XPS = H, ILIMSEL = L 2.50 3.10 3.75 A Inductor peak current limit IPK XPS = L, ILIMSEL = H 1.05 1.30 1.60 A XPS = L, ILIMSEL = L 0.36 0.49 0.60 A Oscillation frequency fOSC - 5.2 5.8 6.4 MHz Shutdown current ISD EN = L - - 2 μA Quiescent current IQ EN = H, XPS = L, VIN = 3.7V, VO = 3.3V, IO = 0 mA - 50 - μA SW1 - 63.5 84 SW2 - 124 175 - 82 116 - 123 164 SW FET ON resistance SW3 VDD = 3.7V, VO = 3.3V, Ta = +25°C Rdson SW4 SW5 Over temperature protection UVLO Threshold voltage Signal input threshold voltage Signal input current mΩ - 51 72 TOTPH - - 135(*1) - °C TOTPL - - 110(*1) - °C VUVLOH - 1.9 2.0 2.1 V VUVLOL - 1.8 1.9 2.0 V VIL EN, XPS, VSEL, ILIMSEL 0.0 - 0.25 V VIH EN, XPS, VSEL, ILIMSEL 1.5 - VDD V ICTL EN, XPS, VSEL, ILIMSEL - - 0.1 μA *1: This parameter is not be specified. This should be used as a reference to support designing the circuits. 8. Typical Applications Circuit (RF Power Amplifier) 0.5µH VBATT CIN SWOUT SWIN VO 10µF VDD VOUT COUT VCC EN VSEL AGND 2.2µF FB VSELSW Pin DGND PA Pout MB39C326 DAC Document Number: 002-08348 *A Page 8 of 25 MB39C326 9. Application Notes Programming the Output Voltage Output voltage is calculated using the equation (1) below. Use R1 resistor value of 620 kΩ. Built-in phase compensation circuit is generated according to this resistor value. 1. Not using a selectable voltage option VO = VFB × R1 + R2 R2 (VFB = 500 mV) L1 SWOUT VBATT VDD CIN SWIN VO VOUT VCC R1 EN FB COU T R2 XPS VSELSW VSEL ILIMSEL DGND GND 2. Using a selectable voltage option When VSEL = L VO = VFB × R1 + R2 R2 When VSEL = H VO = VFB × R1 (R2//R3) + R2//R3 L1 SWOUT SWIN VBATT VDD VCC CIN EN R1 VSEL COU T FB R3 XPS L or H VO VOUT R2 VSELSW ILIMSEL GND Document Number: 002-08348 *A DGND Page 9 of 25 MB39C326 3. When the output variable is dynamically performed VO = - R1 × VDAC + VFB × ( R3 R1 R3 R1 + R2 +1) (VFB = 500 mV) SWOUT SWIN VBATT VDD VCC CIN VO VOUT R1 FB EN XPS VSELSW VSEL COU T R3 R2 ILIMSEL DGND GND DAC Relationship between DAC and output when setting to R1 = 620 kΩ, R2 = 110 kΩ and R3 = 330 kΩ VO - DAC 4.50 4.00 3.50 VO (V) 3.00 2.50 2.00 1.50 1.00 0.50 0.00 0.000 0.500 1.000 1.500 2.000 2.500 DAC voltage (V) Document Number: 002-08348 *A Page 10 of 25 MB39C326 10. Inductor Selection The recommended inductor is 0.5 μH (0.47 μH). To acquire a high-efficiency, select an inductor with low ESR. Confirm in use conditions that the coil current does not exceed the rated saturation current. It is recommended that the switch current limit value is considered. Note that the permissible current value might be low about some products with high ESR because of the device temperature increasing. The following table shows the recommended inductor. Vendor Size Part # L[mm] W[mm] DCR[Ω] H[mm] (max) Isat[A] (-30%) Coilcraft XPL2010-501ML 1.9 2.0 1.0 0.045 2.64 ALPS GLCHKR4701A 2.0 1.6 1.0 0.035 3.6 Coilcraft : Coilcraft, Inc. ALPS : Alps Green Devices Co., Ltd 11. Input Capacitor Selection It is recommended to place a low ESR ceramic bypass capacitor at least 10 μF close to VDD and GND because the input capacitor is the power-supply voltage. The execution capacity of some ceramic capacitors greatly decreases when adding bias. Select a product by checking the part characteristics of manufacturer because small size parts or low voltage rating parts tend to have that characteristic. 12. Output Capacitor Selection The recommended standard capacity of the output capacitor is 2.2 μF in PWM mode. When using in power save mode, the capacitor with larger capacity (around 22 μF) is recommended to reduce the ripple voltage at PFM operation. To suppress the decrease of output voltage during the load change, adjust with a larger capacitor. Larger capacitors and low ESR capacitors is useful to reduce the ripple. 13. Thermal Information Power dissipation is 1080 mW Max. Thermal resistance(θja) is 65°C /W (JEDEC). This value can be used to calculate the chip temperature. Thermal resistance is calculated based on the usage of JEDEC standard boards. It is recommended to consider for the thermal design that the value may vary depending on the area of the board and the positions of the vias. See "Power dissipation vs. Operation ambient temperature" in "15. Example of Standard Operation ". Document Number: 002-08348 *A Page 11 of 25 MB39C326 14. Notes on Board Layout A suitable board layout is required for stable operations of this IC. Place the peripheral component, input capacitance CIN and the output capacitance COUT close to this IC as much as possible, and connect them with the shortest routes. The routes with large current, in particular, the routes with variable current must be placed on the front surface with the shortest routes. Separate DGND from GND and connect GND at one point close to COUT. Provide the ground plane as much as possible on the IC mounted face. It is useful for heat dissipation. R FB C VCC R R VDD Vout C C C C DGND L Document Number: 002-08348 *A Page 12 of 25 MB39C326 15. Example of Standard Operation Characteristics Efficiency vs. Load Current (VIN = 3.7V, Power save mode, ILIMSEL=H) Efficiency [%] Load Current (A) Load Current (A) Efficiency vs. Load Current (VO = 3.3V, PWM mode) Efficiency vs. Load Current (VO = 3.3V, Power save mode, ILIMSEL=H) 100% 100% 90% 90% 80% 80% 70% 70% 60% Efficiency [%] Efficiency [%] Efficiency [%] Efficiency vs. Load Current (VIN = 3.7V, PWM mode) XPS=H ILIMSEL=L 50% 40% Input voltage = 30% 5.5V 20% 0% 0.001 0.010 0.100 XPS=L ILIMSEL=H 40% Input voltage = 30% 5.5V 3.7V 10% 2.5V 0% 0.001 1.000 0.010 0.100 1.000 Load Current (A) Load Current (A) Efficiency vs. Load Current (VO = 5.0V, PWM mode) Efficiency vs. Load Current (VO = 5.0V, Power save mode, ILIMSEL=H) 100% 100% 90% 90% 80% 80% 70% 70% 60% XPS=H ILIMSEL=L 50% 40% Input voltage = 30% 5.5V 20% 3.7V 2.5V 10% 0% 0.001 Efficiency [%] Efficiency [%] 50% 20% 3.7V 2.5V 10% 60% 60% 50% 40% XPS=L ILIMSEL=H 30% Input voltage = 5.5V 3.7V 2.5V 20% 10% 0.010 0.100 Load Current (A) Document Number: 002-08348 *A 1.000 0% 0.001 0.010 0.100 Load Current (A) Page 13 of 25 1.000 MB39C326 Maximum Output Current vs. Input Voltage (Power save mode, ILIMSEL=H) Maximum Output Current (A) Maximum Output Current (A) Maximum Output Current vs. Input Voltage (PWM mode) Input Voltage [V] Input Voltage [V] Load sudden change waveform VIN=3.7V IO=0 0.4A COUT=2.2μF XPS=H, ILIMSEL=L VO, 100mV/div, AC 1 Output Current, 200mA/div 100μs/div Startup (PWM mode) EN, 2V/div EN, 2V/div VIN=3.7V, VO=3.3V, IO=0A XPS=H ILIMSEL=L 20μs/div VO, 1V/div 20μs/div Document Number: 002-08348 *A Startup (Power save mode, ILIMSEL=H) VIN=3.7V, VO=3.3V, IO=0A XPS=L ILIMSEL=H 20μs/div VO, 1V/div 20μs/div Page 14 of 25 MB39C326 VO step response (Rise) VO step response (Fall) VIN=3.7V, VO=4.0V→0.8V Rload=11Ω VO, 1V/div XPS=H ILIMSEL=L 10μs/div VIN=3.7V, VO=0.8V→4.0V VO, 1V/div Rload=11Ω XPS=H ILIMSEL=L 10μs/div DAC, 2V/div DAC, 2V/div 10μs/div 10μs/div Pd [W] Power consumption vs. Operating ambient temperature Temperature [°C] Document Number: 002-08348 *A Page 15 of 25 MB39C326 16. Usage Precaution Do not configure the IC over the maximum ratings. If the IC is used over the maximum ratings, the LSI may be permanently damaged. It is preferable for the device to be normally operated within the recommended usage conditions. Usage outside of these conditions can have a bad effect on the reliability of the LSI. Use the devices within recommended operating conditions. The recommended operating conditions are the recommended values that guarantee the normal operations of LSI. The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the conditions stated for each item. Printed circuit board ground lines should be set up with consideration for common impedance. Take appropriate measures against static electricity. Containers for semiconductor materials should have anti-static protection or be made of conductive material. After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. Work platforms, tools, and instruments should be properly grounded. Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in series between body and ground. Do not apply negative voltages. The use of negative voltages below -0.3V may cause the parasitic transistor to be activated on LSI lines, which can cause malfunctions. 17. Notes on Mounting In general, the underfill material and sealing method affect the reliability of mounting. Cypress does not evaluate the mounting using the underfill material. It is advisable for each customer to evaluate the mounting enough. WL-CSP has a surface boundary between silicon and resin at the side of the package. Resin may be pulled by the board because of the underfill material and its shape and the state, and stress may occur at the surface boundary. The result may vary depending on the board and the underfill material used by each customer; therefore, it is advisable for each customer to evaluate the mounting enough in order to apply to the products. When using the underfill materials, be sure to apply the underfill to the silicon side surface as shown below (fillet formation). Ensuring wettability of the silicon Silicon Underfill fillet Resin Underfill Document Number: 002-08348 *A Page 16 of 25 MB39C326 18. Ordering Information Part Number MB39C326PW Package Remarks 20-pin plastic WLP (WLP-20P-M01) 19. EV Board Ordering Information EV Board Number EV Board Version No. Remarks MB39C326-EVBSK-01 MB39C326-EVB-01 REV1.2 20pin-WL-CSP, Power save mode MB39C326-EVBSK-02 MB39C326-EVB-01 REV1.2 20pin-WL-CSP, PWM mode Document Number: 002-08348 *A Page 17 of 25 MB39C326 20. RoHS Compliance Information of Lead (Pb) Free Version The LSI products of Cypress with "E1" are compliant with RoHS Directive, and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part number has trailing characters "E1" is RoHS compliant. 21. Marking XXXXX 26C INDEX Document Number: 002-08348 *A Page 18 of 25 MB39C326 22. Labeling Sample Figure 22-1 Inner box label [Q-Pack label (4 × 8.5inch)] Ordering Part Number (P)+Part No. Quantity Mark lot information Label spec : Conformable JEDEC Barcode form : Code 39 Document Number: 002-08348 *A Page 19 of 25 MB39C326 Figure 22-2 Al(Aluminum) bag label [2-in-1 label (4 × 8.5inch)] Ordering Part Number (P)+Part No. Mark lot information Quantity Caution JEDEC MSL, if available. Document Number: 002-08348 *A Page 20 of 25 MB39C326 Figure 22-3 Reel label [Reel label (4 × 2.5inch)] Ordering Part Number (P)+Part No. Mark lot information Quantity Figure 22-4 Reel label [Dry pack & Reel label (4 × 2.5inch)] Figure 22-5 Outer box label [Shopping label (4 × 8.5inch)] Quantity Document Number: 002-08348 *A Ordering Part Number : (1P)+Part No. Page 21 of 25 MB39C326 23. MB39C326PW Recommended Conditions of Moisture Sensitivity Level [Cypress Recommended Mounting Conditions] Item Condition Mounting Method IR (infrared reflow), warm air reflow Mounting times 2 times Before opening Storage period Please use it within two years after manufacture. From opening to the 2nd reflow Storage conditions 5°C to 30°C, 70% RH or less (the lowest possible humidity) [Parameters for Each Mounting Method] IR (infrared reflow) 260 °C 255 °C 170 °C to 190 °C (b) RT (a) H rank: 260°C Max (a) Temperature Increase gradient (b) Preliminary heating (c) Temperature Increase gradient (d) Actual heating (d’) (e) Cooling (c) (d) (e) (d') : Average 1°C/s to 4°C/s : Temperature 170°C to 190°C, 60s to 180s : Average 1°C/s to 4°C/s : Temperature 260°C Max; 255°C or more, 10s or less : Temperature 230°C or more, 40s or less or Temperature 225°C or more, 60s or less or Temperature 220°C or more, 80s or less : Natural cooling or forced cooling Note : Temperature : the top of the package body Document Number: 002-08348 *A Page 22 of 25 MB39C326 24. Package Dimensions 20-pin plastic WLP (WLP-20P-M01) Lead pitch 0.4 mm Package width × package length 2.15 mm × 1.94 Lead shape Soldering ball Sealing method Print Mounting height 0.625 mm Max. Weight 0.005 g Code (Reference) S-WF BGA20-2.15 × 1.94-0.40 20-pin plastic WLP (WLP-20P-M01) 2.15 ± 0.05(.085 ± .002) (1.60(.063)) 0.40(.016)TYP X 4 1.94 ± 0.05 (.076 ± .002) 3 (1.20(.047)) 2 1 Y 0.40(.016) TYP E D C INDEX (Laser Marking) B 1-0.13 20-ø0.26 ± 0.04 (20-ø.010±.002) A (.005 ) ø0.05(.002) M XYZ 0.625(.025)MAX Z 0.05(.002) Z C 0.21 ± 0.04 (.008 ± .002) 2011 FUJITSU SEMICONDUCTOR LIMITED W20001Sc-1-1 Document Number: 002-08348 *A Dimensions in mm (inches). Note: The values in parentheses are reference values. Page 23 of 25 MB39C326 25. Major Changes Spansion Publication Number: MB39C326_ DS405-00001 Page Section Change Results Revision 1.0 - - Initial release NOTE: Please see “Document History” about later revised information. Document History Document Title: MB39C326 6MHz Synchronous Rectification Buck-Boost DC/DC Converter IC Document Number: 002-08348 Revision ECN Orig. of Change Submission Date ** TAOA 01/31/2014 *A 5131396 TAOA 02/10/2016 Updated to Cypress template Document Number: 002-08348 *A Description of Change Migrated to Cypress and assigned document number 002-08348. No change to document contents or format. Page 24 of 25 MB39C326 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive PSoC® Solutions cypress.com/go/automotive Clocks & Buffers Interface cypress.com/go/clocks cypress.com/go/interface psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Lighting & Power Control cypress.com/go/powerpsoc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing Spansion Products Technical Support cypress.com/go/touch USB Controllers Wireless/RF Community | Forums | Blogs | Video | Training cypress.com/go/USB cypress.com/go/support cypress.com/go/wireless cypress.com/spansion products Cypress®, the Cypress logo, Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of Cypress Semiconductor Corp. ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries. All other trademarks or registered trademarks referenced herein are the property of their respective owners. © Cypress Semiconductor Corporation, 2014-2016. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. This Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 002-08348 *A Page 25 of 25