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ERmet ZDHD
www.erni.com
Catalog
Katalog D
E XXXXXX
074518
Ausgabe 3, 03/05 01/14
www.erni.com
Edition
3
1
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Catalog E XXXXXX
01/142 Edition 3
ERmet ZDHD
High-Speed Connector Sytem for Datarate up to 25 Gbit/s
ERNI’s new ZDHD connector is a high speed, differential board to
backplane connector. It is a higher density extension of our standard ERmet ZD product line. The ZDHD has an optimized footprint
for improved electrical performance and is designed for data rates
up to 25 Gbits/s. ERNI’s ZD HD will be available in a 6-pair version.
Future additions to the product line will include a 2- and 4-pair version.
Features
•
•
•
•
•
•
•
•
•
•
•
14 rows per inch by 6 differential pairs per row
84 differential pairs per inch
L-shield for each differential pair
Impedance 100 Ohm, 85 Ohm on request
Datarate up to 25 Gbit/s
Superior crosstalk behavior
Pitch 1,8 mm between rows
Pitch 3,6 mm between diff. pair within a row
Downsized pressfit technology 0.46 mm dia. hole
Robust alignment guides on male side walls
Dual beam female contact design
Catalog E XXXXXX
01/14
Edition 3
Technical Features
• Operating temperature: -55/125 °C
• Mechanical operation: >250 mating cycles
• Insertion and withdrawal force: 0,7 N/pin (Signal)
Material
•
•
Housing materaial: LCP
Contact material:
Base material: Cu alloy
Mating area: PdNi + Au
Termination area: Sn
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3
ERmet ZDHD
Vertical Male Connectors 6 Pair
Dimensional Drawings
3
6,35
12
27,2
25,7
X
1,8
23,4
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
9
8
7
6
5
4
3
2 1
4,35
1,95
14 13 12 11 10
1,8
1,3
3,6
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
i
j
GND i/j
k
l
GND k/l
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
i
j
GND i/j
k
l
GND k/l
1,8
0,55
23,4
25,3
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
Lochbild für Leiterplatte
(Bestückungsplan)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23,4)
1,8
1,8
1)
GND d/e
GND f/g
GND h/i
GND j/k
GND l
±0.05
Durchmesser des metallisierten Loches
Ø 0.46
±0.05
Diameter of finished plated- through hole
1,9
GND a
a
b
GND b/c
c
d
GND d/e
e
f
GND f/g
g
h
GND h/i
i
j
GND j/k
k
l
GND l
a
b
c
d
e
f
g
h
i
j
k
l
14 13 12 11 10
9
8
7
6
5
4
3
2 1
Ø 0.55
±0.02
Bohrungsdurchmesser des Loches
Ø 0.55
±0.02
Diameter of drilled hole
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
Metal plating of plated-through hole
see drawing 384191
18 x 1,2 = (21,6)
GND b/c
1) Ø 0.46
1,2
GND a
Ø 0,05
alle Löcher
all holes
ground
4Catalog E XXXXXX
01/14
Edition 3
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ERmet ZDHD
Right Angle Female Connectors 6 Pair
Dimensional Drawings
23,4
1,8
l
k
GND k/l
l
k
GND i/j
j
i
GND g/h
h
g
GND e/f
f
e
GND c/d
d
c
GND a/b
b
a
j
i
GND g/h
GND e/f
GND c/d
f
e
d
c
b
a
1,8
4,15
1,3
GND a/b
h
g
25,5
GND i/j
3,6
GND k/l
0,65
14 13 12 11 10 9 8
7
6
5
4
3
2
1
Leiterplattenoberfläche
Top surface of daughter card
1,6
10,8
34,75
25,18
21,35
25,5
Lochbild für Leiterplatte
(Bestückungsseite)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23.4)
Ø 0,05
alle Löcher
all holes
1)
GND l
l
k
GND j/k
j
i
GND h/i
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
9
8
7
6 5
4
3
2 1
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
1,5
3,6
18 x 1,2 = (21,6)
Metal plating of plated-through hole
see drawing 384191
1,8
14 13 12 11 10
1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches
Ø 0.46 ± 0.05 Diameter of finished plated-through hole
Ø 0.55 ± 0.02 Bohrdurchmesser des Loches
Ø 0.55 ± 0.02 Diameter of drilled hole
GND l
l
k
GND j/k
j
i
GND h/i
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
4,5
1,2
3,6
19,2
1,8
ground
Catalog E XXXXXX
01/14
Edition 3
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5
ERmet ZDHD
Vertical Male Connectors 4 Pair
Dimensional Drawings
3
6,35
12
20
18,5
X
1,8
23,4
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
9
8
7
6
5
4
3
2 1
1,8
4,35
1,95
14 13 12 11 10
1,3
3,6
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
1,8
23,4
25,3
0,55
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
Lochbild für Leiterplatte
(Bestückungsplan)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23,4)
Ø 0,05
1,8
1,8
GND d/e
GND f/g
GND h
1,9
a
b
c
d
e
f
g
h
14 13 12 11 10
9
8
7
6
5
4
3
2 1
±0.05
Durchmesser des matallisierten Loches
Ø 0.46
±0.05
Diameter of finished plated-through hole
Ø 0.55
±0.02
Bohrungsdurchmesser des Loches
Ø 0.55
±0.02
Diameter of drilled hole
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
12 x 1,2 = (21,6)
GND b/c
GND a
a
b
GND b/c
c
d
GND d/e
e
f
GND f/g
g
h
GND h
1) Ø 0.46
Metal plating of plated-through hole
see drawing 384191
1,2
GND a
alle Löcher
all holes
1)
ground
6Catalog E XXXXXX
01/14
Edition 3
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ERmet ZDHD
Right Angle Female Connectors 4 Pair
Dimensional Drawings
23,4
GND e/f
GND c/d
GND g/h
h
g
GND e/f
f
e
GND c/d
d
c
GND a/b
b
a
f
e
d
c
b
a
1,8
4,15
1,3
GND a/b
h
g
18,3
GND g/h
0,65
3,6
1,8
14 13 12 11 10 9 8
7
6
5
4
3
2
1
Leiterplattenoberfläche
Top surface of daughter card
1,6
10,8
27,55
25,18
14,15
18,3
Lochbild für Leiterplatte
(Bestückungsseite)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23,4)
Ø 0,05
alle Löcher
all holes
1)
GND h
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
9
8
7
6 5
4
3
2 1
Ø 0.55 ± 0.02 Bohrdurchmesser des Loches
Ø 0.55 ± 0.02 Diameter of drilled hole
1,5
3,6
12 x 1,2 = (14,4)
Metal plating of plated-through hole
see drawing 384191
1,8
14 13 12 11 10
1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches
Ø 0.46 ± 0.05 Diameter of finished plated-through hole
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
GND h
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
4,5
1,2
3,6
13,2
1,8
ground
Catalog E XXXXXX
01/14
Edition 3
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7
ERmet ZDHD
Vertical Male Connectors 2 Pair
Dimensional Drawings
3
6,35
12
14,4
12,9
X
1,8
23,4
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
8
7
6
5
4
3
2 1
3,6
a
b
GND a/b
c
d
GND c/d
a
b
GND a/b
c
d
GND c/d
1,3
1,8
1,95
9
4,35
14 13 12 11 10
1,8
23,4
25,3
0,55
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
Lochbild für Leiterplatte
(Bestückungsplan)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23,4)
Ø 0,05
1,8
1,9
GND a
a
b
GND b/c
c
d
GND d
a
b
c
d
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
Metal plating of plated-through hole
see drawing 384191
1,2
GND d
±0.05 Durchmesser des
metallisierten Loches
±0.05 Diameter of finished
plated- through hole
Ø 0.55 ±0.02 Bohrungsdurchmesser
des Loches
Ø 0.55 ±0.02 Diameter of drilled hole
Ø 0.46
6 x 1,2 = (7,2)
GND b/c
1) Ø 0.46
1)
1,8
GND a
alle Löcher
all holes
14 13 12 11 10
9
8
7
6
5
4
3
2 1
ground
8Catalog E XXXXXX
01/14
Edition 3
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ERmet ZDHD
Right Angle Female Connectors 2 Pair
Dimensional Drawings
23,4
3,6
b
a
12,7
GND c/d
d
c
GND a/b
b
a
1,8
GND a/b
d
c
1,3
GND c/d
0,65
4,15
1,8
14 13 12 11 10 9 8
7
6
5
4
3
2
1
Leiterplattenoberfläche
Top surface of daughter card
25,18
10,8
20,35
1,6
8,55
12,7
Lochbild für Leiterplatte
(Bestückungsseite)
Board hole pattern
(Component mounting side)
13 x 1,8 = (23,4)
Ø 0,05
alle Löcher
all holes
Ø 1)
1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches
Ø 0.46 ± 0.05 Diameter of finished plated-through hole
9
8
7
6 5
4
3
2 1
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
1,5
Metal plating of plated-through hole
see drawing 384191
1,8
14 13 12 11 10
3,6
GND d
d
c
GND b/c
b
a
GND a
6 x 1,2 = (7,2)
Ø 0.55 ± 0.02 Bohrdurchmesser des Loches
Ø 0.55 ± 0.02 Diameter of drilled hole
GND d
d
c
GND b/c
b
a
GND a
4,5
3,6
6
1,2
1,8
ground
Catalog E XXXXXX
01/14
Edition 3
www.erni.com
9
ERmet ZDHD
Mating Conditions
1
1
Allowed misalignment tolerances longitudinal and transverse axes ±1 mm
2°
2°
Allowed angular inclination tolerances, longitudinal ±2°, transverse ±2°
Wipe length max. 1.5 mm
14
12.5
10Catalog E XXXXXX
01/14
Edition 3
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ERmet ZDHD
Mating Conditions
ERmet ZDHD 6-14, mated
27,2
21,35
22,2
37,75
5
Daughtercard
Backplane
13,8
ERmet ZDHD 4-14, mated
30,55
5
20
14,15
15
Backplane
Daughtercard
13,8
ERmet ZDHD 2-14, mated
Backplane
5
14,4
8,55
9,4
23,35
Daughtercard
13,8
Catalog E XXXXXX
01/14
Edition 3
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11
ERmet ZDHD
High-Speed Connector Sytem for Datarate up to 25 Gbit/s
Ordering Information
Configuration
Part Number
Vertical Male Connector 6 Pair
384787
Right Angle Female Connector 6 Pair
384786
Vertical Male Connector 4 Pair
444798
Right Angle Female Connector 4 Pair
444797
Vertical Male Connector 2 Pair
on request
Right Angle Female Connector 2 Pair
on request
Simulations
25 Gbit/s transmission behavior of a backplane system, with a dauhtercard trace length of 25 mm and a backplane trace length of
200 mm. Boardmaterial: Dielectric loss = 0,009
without Equalizing
12Catalog E XXXXXX
with 6-Tab FFE Equalizing
01/14
Edition 3
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ERmet ZDHD
Notes
Catalog E XXXXXX
01/14
Edition 3
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13
ERmet ZDHD
Notes
14Catalog E XXXXXX
01/14
Edition 3
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Member
www.erni.com
Catalog
Katalog D
E XXXXXX
074518
Ausgabe
01/14
3, 03/05 www.erni.com
Edition
3
15
ERNI Electronics GmbH & Co. KG
Seestrasse 9
73099 Adelberg, Germany
Tel +49 7166 50-0
Fax +49 7166 50-282
[email protected]
Europe
ERNI Electronics, Inc.
2201 Westwood Ave
Richmond, VA 23230
Tel +1 804 228-4100
Fax +1 804 228-4099
[email protected]
North America
Canada
ERNI Asia Holding Pte Ltd.
Blk 4008 Ang Mo Kio Avenue 10
#04-01/02 Techplace I
Singapore 569625
Tel +65 6 555 5885
Fax +65 6 555 5995
[email protected]
Asia
New Zealand
South America
Australia
Africa Japan
Mexico
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© ERNI Electronics GmbH & Co. KG 2014 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is
reserved. ERNI®, MicroStac®, MicroSpeed®, MiniBridge®, MaxiBridge®, ERmet®, ERmet ZD®, ERbic® and ERNIPRESS® are trademarks (registered or applied for in various
countries) of ERNI Electronics GmbH & Co. KG.
16
Katalog D
Catalog
E XXXXXX
074518
Ausgabe
01/14
3, 03/05 www.erni.com
Edition
3
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