PHILIPS IP3319CX6

IP3319CX6
Single-channel common-mode filter with integrated ESD
protection network
Rev. 1 — 30 January 2013
Product data sheet
1. Product profile
1.1 General description
2-lines (one differential channel) common-mode filter with integrated ESD protection up to
15 kV contact discharge, exceeding IEC 61000-4-2, level 4. The device can eliminate
efficiently common-mode noise from USB 2.0 and other high-speed interfaces with
differential lines. IP3319CX6 attenuates significantly common-mode noise above
800 MHz while differential-mode signal extends out to more than 1 GHz before reaching
the 6 dB point.
IP3319CX6 is designed to protect sensitive I/Os, such as USB 2.0, Ethernet, Digital Video
Interface (DVI) and Low-Voltage Differential Signaling (LVDS) interfaces from destruction
by ElectroStatic Discharge (ESD).
IP3319CX6 is a combination of an integrated copper-coils common-mode filter and a
monolithic silicon technology-based ESD protection. It integrates two ultra-low
capacitance rail-to-rail diodes plus a separated protection diode in a 0.4 mm pitch
Wafer-Level Chip-Size Package (WLCSP). Due to the rail-to-rail concept, the protection is
working independently from availability of a supply voltage
1.2 Features and benefits
 2-lines (one differential mode)
common-mode filter
 ESD protection for the USB ID line
 Extremely low clamping voltage
 ESD protection up to 15 kV on external
contact pins
 Ultra low ESD diode capacitance
 WLCSP6 with 0.4 mm pitch
1.3 Applications
 USB 2.0 High-speed lines
 LVDS interfaces
 DVI
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Rs(ch)
channel series resistance
Cd
diode capacitance
[1]
This parameter is guaranteed by design.
Conditions
VR = 0 V; f = 1 MHz;
pins A1, B2 to GND
[1]
Min
Typ
Max
Unit
-
6
-

-
1.5
-
pF
IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
2. Pinning information
EXPS$
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Fig 1.
Pin configuration
Table 2.
Pinning
Symbol [1] Description [1]
Pin
A1
D+_OUT
USB data D+ (host side)
A2
D+_IN
USB data D+ (connector side)
B1
D_OUT
USB data D (host side)
B2
D_IN
USB data D (connector side)
C1
GND
ground
C2
ID
USB identification
[1]
D+ and D are interchangeable.
3. Ordering information
Table 3.
Type number
Package
Name
Description
Version
IP3319CX6
WLCSP6
wafer level chip-size package; 6 bumps (2  3) [1]
IP3319CX6
[1]
IP3319CX6
Product data sheet
Ordering information
Size: 1.34 mm  0.95 mm  0.57 mm
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
4. Marking
IP3319CX6 is laser-marked with the following information (see Figure 2):
• A marker indicating the pin A1 position.
• Two lines of characters or numbers:
– The first line (placeholder <marking code>) indicates the marking code.
Mapping of product type number to marking code is given in Table 4.
– The second line (placeholder <lot ID>) indicates the production lot.
This information enables tracking a device down to a particular production date.
SLQ$PDUNHU
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Fig 2.
IP3319CX6: outline of the marking
Table 4.
Marking codes
Type number
Marking code
IP3319CX6
319
5. Functional diagram
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D+ and D- are interchangeable.
Fig 3.
IP3319CX6
Product data sheet
Functional diagram
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
6. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge
voltage
Min
Max
Unit
0
5.5
V
contact discharge
-
15
kV
air discharge
-
15
kV
contact discharge
-
2
kV
air discharge
-
2
kV
IEC 61000-4-2, level 4;
pins A2, B2, C2 to GND (C1)
IEC 61000-4-2, level 4;
pins A1, B1 to GND (C1)
Tstg
storage temperature
55
+125
C
Tamb
ambient temperature
40
+85
C
7. Characteristics
7.1 Electrical characteristics
Table 6.
Electrical characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Rs(ch)
channel series
resistance
Conditions
Cd
diode capacitance
Max
Unit
-

[1]
-
1.5
-
pF
pin C2 to GND
[1]
-
1.7
-
pF
IRM
reverse leakage
current
pins A2, B2, C2 to GND;
VI = 3 V
-
0.01
1
A
VBR
breakdown voltage
pins A2, B2, C2; IR = 10 mA
6
-
10
V
VF
forward voltage
IF = 10 mA
-
0.7
-
V
Rdyn
dynamic resistance
TLP
-
0.25
-

-
0.20
-

-
0.20
-

[2]
negative transient
surge
[3]
positive transient
-
0.14
-

ICL = 6 A
[3]
-
4
-
V
ICL = 6 A
[3]
-
2.5
-
V
negative transient
VCL
[1]
Product data sheet
Typ
6
pins A1, B2 to GND
positive transient
IP3319CX6
Min
-
clamping voltage
This parameter is guaranteed by design.
[2]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns.
[3]
According to IEC 61000-4-5 (8/20 s).
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
4 of 15
IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
,&/
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9&/9
Pin A2; tp = 100 ns; Transmission Line Pulse (TLP)
Fig 4.
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Dynamic resistance with positive clamping
Fig 5.
,&/
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9&/9
Pin C2; tp = 100 ns; Transmission Line Pulse (TLP)
Fig 6.
Dynamic resistance with positive clamping
9&/9
DDD
Dynamic resistance with negative clamping
Pin A2; tp = 100 ns; Transmission Line Pulse (TLP)
DDD
DDD
9&/9
Pin C2; tp = 100 ns; Transmission Line Pulse (TLP)
Fig 7.
Dynamic resistance with negative clamping
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
IP3319CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
5 of 15
IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
7.2 Frequency characteristics
Table 7.
Frequency characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
700 MHz  f  1.8 GHz
-
-
13
dB
f > 1.8 GHz
-
-
11
dB
f = 500 MHz; Rgen = 50 
3
-
-
dB
f = 1 GHz; RL = 50 
5
-
-
dB
Common mode
il
S21cc; Rgen = 50 ;
RL = 50 
insertion loss
Differential mode
il
insertion loss
S21dd
Figure 8 shows the common mode and differential mode attenuation measured in a 50 
NetWork Analyzer (NWA) system.
The 3 dB point for the differential-mode signal is above 1 GHz. The common-mode
attenuation reaches a typical value of 25 dB in the GSM band.
ĮLO
G%
DDD
I+]
(1) S21dd: differential mode
(2) S21cc: common mode
Fig 8.
IP3319CX6
Product data sheet
Common-mode and differential-mode insertion loss
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
DDD
Data rate: 480 Mbit/s (USB 2.0 High-speed)
Vertical scale = 124 mV/div
Horizontal scale = 260 ps/div
Fig 9.
USB 2.0 eye diagram Printed-Circuit Board (PCB) with IP3319CX6
DDD
Data rate: 480 Mbit/s (USB 2.0 High-speed)
Vertical scale = 124 mV/div
Horizontal scale = 260 ps/div
Fig 10. USB 2.0 eye diagram PCB without IP3319CX6 (reference)
IP3319CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
7 of 15
IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
8. Package outline
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Fig 11. Package outline WLCSP6
Table 8.
Package outline dimensions of WLCSP6
Symbol
Min
Typ
Max
Unit
A
0.54
0.57
0.60
mm
A1
0.36
0.37
0.38
mm
b
0.21
0.26
0.31
mm
D
0.90
0.95
1.00
mm
E
1.29
1.34
1.39
mm
e
0.38
0.40
0.42
mm
e1
0.76
0.80
0.84
mm
IP3319CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
8 of 15
IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
4 500
IP3319CX6
[1]
WLCSP6
4 mm pitch, 8 mm tape and reel
-135
For further information and the availability of packing methods, see Section 14.
10. Soldering
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Fig 12. Reflow soldering footprint WLCSP6
Table 10.
IP3319CX6
Product data sheet
Reflow soldering dimensions of WLCSP6
Symbol
Min
Typ
Max
Unit
c
-
0.25
-
mm
D
0.91
0.96
1.01
mm
E
1.31
1.36
1.41
mm
e
-
0.40
-
mm
f
-
0.325
-
mm
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
11. Design and assembly recommendations
11.1 PCB design guidelines
For optimum performance, use a Non-Solder Mask Defined (NSMD), also known as a
copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads
to a buried ground-plane layer. This results in the lowest possible ground inductance and
provides the best high frequency and ESD performance. Refer to Table 11 for the
recommended Printed-Circuit Board (PCB) design parameters.
Table 11.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
250 m
Micro-via diameter
100 m (0.004 inch)
Solder mask aperture diameter
325 m
Copper thickness
20 m to 40 m
Copper finish
AuNi
PCB material
FR4
11.2 PCB assembly guidelines for Pb-free soldering
Table 12.
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
290 m
Solder screen thickness
100 m (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
Solder to flux ratio
50 : 50
Solder reflow profile
see Figure 13
T
(°C)
Treflow(peak)
250
230
cooling rate
217
preheat
t1
t2
t3
t4
t (s)
t5
001aai943
The device can withstand at least three reflows of this profile.
Fig 13. Pb-free solder reflow profile
IP3319CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
Table 13.
Symbol
Characteristics
Parameter
Conditions
Treflow(peak) peak reflow temperature
Product data sheet
Typ
Max
Unit
230
-
260
C
t1
time 1
soak time
60
-
180
s
t2
time 2
time during T  250 C
-
-
30
s
t3
time 3
time during T  230 C
10
-
50
s
t4
time 4
time during T > 217 C
30
-
150
s
t5
time 5
-
-
540
s
dT/dt
rate of change of temperature cooling rate
-
-
6
C/s
2.5
-
4.0
C/s
pre-heat
IP3319CX6
Min
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
12. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP3319CX6 v.1
20130130
Product data sheet
-
-
IP3319CX6
Product data sheet
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Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
IP3319CX6
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
© NXP B.V. 2013. All rights reserved.
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP3319CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 January 2013
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IP3319CX6
NXP Semiconductors
1-channel common-mode filter with integrated ESD protection network
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
11.2
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . 4
Frequency characteristics. . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Design and assembly recommendations . . . 10
PCB design guidelines . . . . . . . . . . . . . . . . . . 10
PCB assembly guidelines for Pb-free
soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 January 2013
Document identifier: IP3319CX6