Component - PSoC 4 Die Temp V1.0

PSoC® Creator™ Component Datasheet
PSoC 4 Die Temperature (DieTemp)
1.0
Features
 Typical measured accuracy of +/- 1 ºC
 Valid operating range from –40 °C to +85 °C
General Description
The Die Temperature component provides access to the analog signal whose voltage represents
the temperature of the die. It also provides the API needed to convert the digital voltage
representation of that analog signal to a temperature. This component does not provide the
mechanism to convert the analog voltage to a digital value. That must be done in the design by
connecting the signal to the ADC in the device and sampling the voltage.
When to Use DieTemp
This component can be used to get a rough temperature measurement of the device. This value
will also be correlated with the temperature within the enclosure the device is in.
Input/Output Connections
temp – Analog
This analog output is the connection of the die temperature to the SAR ADC for conversion.
Component Parameters
There are no parameters or user interface available for this component.
Placement
The DieTemp component uses the die temperature sensor, which is a part of SAR block.
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Document Number: 001-86290 Rev. *F
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Revised May 4, 2016
PSoC 4 Die Temperature (DieTemp)
PSoC® Creator™ Component Datasheet
Application Programming Interface
Application Programming Interface (API) routines allow you to configure the component using
software. The following table lists and describes the interface to each function. The subsequent
sections cover each function in more detail.
By default, PSoC Creator assigns the instance name "DieTemp_1" to the first instance of a
component in a given design. You can rename it to any unique value that follows the syntactic
rules for identifiers. The instance name becomes the prefix of every global function name,
variable, and constant symbol. For readability, the instance name used in the following table is
"DieTemp".
int32 DieTemp_CountsTo_Celsius(int32 adcCounts)
Description:
Converts the ADC output to degrees Celsius.
Parameters:
(int32) adcCounts
Return Value:
Die Temperature in degrees Celsius.
Sample Firmware Source Code
PSoC Creator provides numerous example projects that include schematics and example code
in the Find Example Project dialog. For component-specific examples, open the dialog from the
Component Catalog or an instance of the component in a schematic. For general examples,
open the dialog from the Start Page or File menu. As needed, use the Filter Options in the
dialog to narrow the list of projects available to select.
Refer to the "Find Example Project" topic in the PSoC Creator Help for more information.
MISRA Compliance
This section describes the MISRA-C:2004 compliance and deviations for the component. There
are two types of deviations defined:


project deviations – deviations that are applicable for all PSoC Creator components
specific deviations – deviations that are applicable only for this component
This section provides information on component-specific deviations. Project deviations are
described in the MISRA Compliance section of the System Reference Guide along with
information on the MISRA compliance verification environment.
The Die Temperature component does not have any specific deviations.
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Document Number: 001-86290 Rev. *F
PSoC® Creator™ Component Datasheet
PSoC 4 Die Temperature (DieTemp)
API Memory Usage
The component memory usage varies significantly, depending on the compiler, device, number
of APIs used and component configuration. The following table provides the memory usage for
all APIs available in the given component configuration.
The measurements have been done with the associated compiler configured in Release mode
with optimization set for Size. For a specific design, the map file generated by the compiler can
be analyzed to determine the memory usage.
Configuration
PSoC 4 (GCC)
Flash Bytes
SRAM Bytes
80
0
Default
Functional Description
DieTemp component is always used in conjunction with the ADC SAR Sequencer to sample the
analog voltage and produce a digital value. Since the temperature changes slowly, this signal is
commonly used with the injection channel to sample the value infrequently compared to other
signals being converted by the ADC.
Recommended ADC SAR Sequencer settings for a die temperature measurement:
Note This configuration assumes that channel 0 is used by the application and must be
connected to a driver.
Figure 1. Component Connection
Document Number: 001-86290 Rev. *F
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PSoC 4 Die Temperature (DieTemp)
PSoC® Creator™ Component Datasheet
Figure 2. ADC SAR Sequencer Settings – General Tab
Figure 3. ADC SAR Sequencer Settings – Channels Tab
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Document Number: 001-86290 Rev. *F
PSoC® Creator™ Component Datasheet
PSoC 4 Die Temperature (DieTemp)
Figure 2 and Figure 3 show recommended ADC SAR Sequencer Settings.
Key parameters of ADC SAR Sequencer include:








Channel Mode 1 – Single
Resolution 1 – 12 bit
Data format justification – Right
Reference – Internal, 1.024 volts
Sample rate - <= 100 ksps
Samples averaged – value >16 may be used to reduce noise
Averaging mode – Fixed Resolution
Single ended negative input – Vss.
Not following the proposed settings may lead to unexpected behavior of the component or poor
accuracy of measurements. However, the value of Vref can be different from 1024 mV. If the
value of Vref in the ADC SAR Sequencer settings is different from the proposed, the value of
adcCounts that is passed to DieTemp_CountsTo_Celsius API should be adjusted:
ADCCountsCorrected = (Refact /1.024) * ADCCounts
Where:



ADCCountsCorrected is the corrected number of ADC counts, which should be used as a
parameter for the DieTemp_CountsTo_Celsius API.
ADCCounts is the actual measurement result from ADC SAR.
Refact is the actual voltage reference in volts.
Using the Injection channel is recommended because conversion can only be triggered with a
firmware trigger and it is not a part of a regular scan. If the component is used with other
channels, it is recommended to configure acquisition time to be at least 5 µs, otherwise
temperature values will be unreliable due to temperature sensor settling time.
Triggering the Injection channel is recommended no sooner than one second after the previous
trigger has completed.
1
For Injection channel (or the one to which the component is connected.)
Document Number: 001-86290 Rev. *F
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PSoC® Creator™ Component Datasheet
PSoC 4 Die Temperature (DieTemp)
The component is only intended for operation with the on-chip ADC SAR and should not be
connected to any other analog resource or routed off the chip.
Resources
Configuration
Resource Type
Die tempersture sensor of the SAR block
Default
1
DC and AC Electrical Characteristics
Note Final characterization data for PSoC 4000S, PSoC 4100S and PSoC Analog Coprocessor
devices is not available at this time. Once the data is available, the component datasheet will be
updated on the Cypress web site.
Parameter
TSENSACC
Description
Temperature sensor accuracy
Min
–5
Typ
±1
Max
+5
Units
°C
Details/Conditions
–40 to +85 °C
Component Changes
This section lists the major changes in the component from the previous version.
Version
Description of Changes
Reason for Changes / Impact
1.0.f
Edited datasheet.
Final characterization data for PSoC 4000S,
PSoC 4100S and PSoC Analog Coprocessor devices
is not available at this time. Once the data is available,
the component datasheet will be updated on the
Cypress web site.
1.0.e
Updated the Component Catalog visibility
expression to support PSoC 4100S and
PSoC Analog Coprocessor devices.
Added new device support.
1.0.d
Updated datasheet.
1.0.c
Updated datasheet.
Updated the MISRA Compliance section.
Clarified the Features section.
Clarified the Functional Description section.
1.0.b
Updated the Functional Description section of
the datasheet.
To clarify ADC SAR Sequencer required settings and
timing information.
1.0.a
Updated datasheet.
Updated MISRA Compliance section.
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Document Number: 001-86290 Rev. *F
PSoC® Creator™ Component Datasheet
Version
1.0
Description of Changes
PSoC 4 Die Temperature (DieTemp)
Reason for Changes / Impact
First release
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