PDF Drawing

Leiterplatten-Layout Vorschlag für SMT
PCB-Layout Proposal for SMT
1,2
1,6 -0,03
0,8
2 ±0,05
a25
Verpackt im Gurt nach DIN IEC 60286-3
0,3
Tape on Reel Packaging according to DIN IEC 60286-3
Verpackungseinheit: 560 Stück
a1
Packaging unit: 560 pcs
Anforderungsstufe 1
7,6
2,2
Performance Level 1
Kontaktbereich vergoldet
1,27
Mating Area gold plating
1,27
Anschlussbereich verzinnt 4-6 µm
Terminal Area 4-6 µm tin plating
2,21 ±0,03
24 x 1,27 = 30,48
Koplanarität der Anschlüsse ≤ 0,1 mm
Coplanarity Area of Termination ≤ 0,1 mm
34,9 ±0,03
330
1,5 -0,03
7,2
b1
7,2
9,6
5,2
Abspulrichtung - Reel off Direction
b25
b1
3,85
56
0,75 -0,05
34,9 ±0,03
1,55
3,05
1,27
32,5
16
1,27
24 x 1,27 = 30,48
33,5
BA7-03 - Standard Bauhöhe
36,83
1
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
2
3,27
1,5
type7-03 - Standard Assembly Height
Tolerances
Information:
Scale
3:1
All Dimensions
in mm
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Federl. SMC-Q 50-SMD-BA7-03
Female SMC-Q 50-SMD-type7-03
154742
www.ERNI.com
g
22.04.2014
Index
Date
Class
SMCQ
I
A3