TRF370x Quadrature Modulator Evaluation Module User's Guide Literature Number: SLWU062 March 2010 2 SLWU062 – March 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated 1 2 3 4 5 ............................................................................................................................ 5 1.1 Purpose ................................................................................................................... 5 1.2 EVM Circuit Overview ................................................................................................... 5 1.3 Power Requirements .................................................................................................... 5 1.4 TRF370x EVM Operating Procedure ................................................................................. 6 Physical Description .......................................................................................................... 11 2.1 PCB Layout ............................................................................................................. 11 2.2 Parts List ................................................................................................................ 16 Circuit Description ............................................................................................................. 16 3.1 Circuit Function ......................................................................................................... 16 Circuit Board .................................................................................................................... 17 Schematic ......................................................................................................................... 18 Overview SLWU062 – March 2010 Submit Documentation Feedback Table of Contents Copyright © 2010, Texas Instruments Incorporated 3 www.ti.com List of Figures 1 Unadjusted Sideband Suppression ....................................................................................... 7 2 Optimized Sideband Suppression ........................................................................................ 8 3 GSM EDGE EVM at 1800 MHz ........................................................................................... 9 4 1.5-V Interface Network for 19.2 mA Full Scale ....................................................................... 10 5 3.3-V Interface Network for 19.2 mA Full Scale ....................................................................... 10 6 Top Layer 1 11 7 Top Layer 2 12 8 9 10 11 12 13 14 ................................................................................................................ ................................................................................................................ Ground Plane 1 ............................................................................................................ Ground Plane 2 ............................................................................................................ Bottom Layer 1............................................................................................................. Bottom Layer 2............................................................................................................. Drill Pattern ................................................................................................................. Silkscreen Top Layer ..................................................................................................... TRF370x EVM Schematic ................................................................................................ 12 13 13 14 15 17 18 List of Tables 4 1 Bill of Materials for TRF370x EVM ...................................................................................... 16 2 Power Supply Connection ................................................................................................ 17 List of Figures SLWU062 – March 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated User's Guide SLWU062 – March 2010 TRF370x Quadrature Modulator Evaluation Module 1 Overview This document relates to the TRF370x direct quadrature modulator for applications in the transmit path of base stations and communications equipment. The quadrature modulator is used for upconversion of signals from the transmit chain DAC to the RF power amplifier device. Evaluating modulator complex performance involves careful bias-voltage setup, an LO signal, and two differential (I/Q) signals at the input of the modulator. This document describes the wide range of test options available and the factors that must be considered in using this EVM. 1.1 Purpose The TRF370x evaluation module (EVM) is intended for the evaluation of the TRF370333, TRF370317, TRF370315, and TRF370417 direct-launch quadrature modulators. Unless otherwise stated, the functionality described in this manual applies to all the TRF370x devices. 1.2 EVM Circuit Overview The EVM comes configured for differential I/Q input signals via four SMA connectors as shown in the schematic, Figure 14, and in Table 1. For the upper sideband, the I signals are connected to J4 (I+) and J3 (I–). The Q signals are connected to J5 (Q–) and J6 (Q+). The LO signal is fed to SMA connector J1, whereas J2 must be terminated with 50 Ω to ground. SMA connector J7 is used to monitor the RF output signal from the quadrature modulator (U1). The quadrature modulator requires a supply voltage of 4.5 V–5.5V from a regulated power supply through headers TP2 and TP4. The TRF370x quadrature modulators require a dc common-mode bias voltage (3.3 VDC, 1.7 VDC, or 1.5 VDC, corresponding to the last two digits of the part number) on all four input pins. 1.3 Power Requirements The TRF370x EVM requires two 5-V VCC dc power-supply connectors through headers TP2 and TP4. Header TP4 supplies 5 V to the LO circuitry, and TP2 supplies 5 V to the modulator circuitry. CAUTION Voltage Limits Exceeding 5.6 V may damage the TRF370x. SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 5 Overview 1.4 www.ti.com TRF370x EVM Operating Procedure Set up the EVM as follows: 1. Power-supply connection: (a) Switch on the VCC (5-V) supply and set the current limit to 235 mA. (b) Connect the 5-V supply to headers TP2 and TP4. Connect ground to TP1 and TP3. (c) Verify that the current draw is ≤ 205 mA for the TRF370x1x and ≤ 235 mA for the TRF370333. 2. Use a suitable 50-Ω output signal generator or the TRF3761 to supply the LO signal at the desired frequency to J1, and terminate J2 with 50 Ω to ground. 3. Use a DAC or an arbitrary waveform generator to provide the I/Q input signals. A typical setup is as follows: a 1-Vp-p sine wave, a frequency of 50 kHz, a dc offset of 0 V, and an output impedance of 50 Ω (typically an ESG vector signal generator or similar). 4. Set the common mode on the ESG to either 1.65 V, 0.75 V, or 0.85 V, depending on device type (set to 1.65 V for the TRF370333, to 0.75 V for the TRF370315, or to 0.85 V for the TRF370x17). 5. Use an arbitrary waveform generator to suppress the sideband. Adjust the I/Q amplitude and phase of the CW signal coming from the arbitrary waveform generator. 6. Connect a spectrum analyzer to the SMA connector marked RFOUT (J7) and monitor the TRF370x output. 1.4.1 Typical Test Results 1.4.1.1 Unadjusted Sideband Suppression Unadjusted sideband suppression measures the amount of the unwanted sideband of the input signal, relative to the wanted sideband. This assumes that the baseband inputs delivered to the modulator input pins are perfectly matched in amplitude and are exactly 90° out of phase. Unadjusted sideband suppression is measured in dBc. An iterative test is required in order to match perfectly the inputs to the modulator. This ensures that any equipment, board, or signal conditioning component imbalances are corrected before the signals are applied to the device under test. Once the baseband inputs to the modulator are balanced, the amount of suppression attained is a measure of the internal mismatches of the modulator, inherent to any modulator design. This suppression is the one specified in the TRF370x data sheet. See Figure 1. 6 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Overview www.ti.com C003 Figure 1. Unadjusted Sideband Suppression 1.4.1.2 Optimized Sideband Suppression The sideband suppression of the TRF370x can be optimized by adjusting the amplitude and phase balance between the quadrature inputs. The ideal condition is when all four inputs (I, I, Q, and Q) have exactly the same amplitude and the phase relationship is: I = 0°, I = 180°, Q = 90°, and Q = 270°. Using an iterative procedure, the gain and phase balance can be adjusted to achieve suppression levels that exceed 60 dBc. The level of suppression observed depends on the amount of resolution available from the source driving the modulator. By using TI’s DAC568x, the user can take advantage of built-in features to optimize the sideband suppression by changing the amplitude and phase relationship of the signals. If another DAC is used, then the user must provide this level of adjustment by controlling the regular digital inputs to the DAC. See Figure 2. SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 7 Overview www.ti.com C002 Figure 2. Optimized Sideband Suppression 1.4.1.3 Carrier Feedthrough Carrier feedthrough is the amount of the LO that leaks onto the output spectrum of the modulator. Ideally for the TRF370x, inputs (I, I, Q, and Q) must be at approximately 3.3 V for TRF370333, 1.5 V for TRF370315, and 1.7 V for TRF370317 and TFR370417. The DAC dc settings are also useful to correct the dc mismatch between I and I and between Q and Q to minimize the LO feedthrough. If using TI's DAC568x, then the internal controls for the I/Q offsets provide excellent carrier suppression (very low LO leakage). Alternatively, if an ESG is being used, adjust the I and Q voltage offsets in mV steps until you obtain the minimum carrier feedthrough. A typical carrier feedthrough value exceeds –50 dBm. See Figure 2. 1.4.1.4 GSM (EDGE EVM Measurements) 1. Provide a GSM edge signal of the desired frequency into the differential baseband inputs (example sample rate = 4.33 MHz). 2. Use a spectrum analyzer with edge personality to measure the transmit power to either 0 or –5 dBm. 3. PSA: Mode → GSM (with EDGE) → measure → Transmit Pwr (usually 0 or –5 dBm) → more → EDGE EVM. 4. ESG: Mode setup → select waveform → highlight EDGE → select waveform → ARB setup → type 4.33333 MHz → I/Q → I/Q output control → Common mode I/Q offset → (set to 1.65 V, 0.75 V, or 0.85 V, depending on device) → I/Q → I/Q output control → I/Q output atten (adjust to get desired transmit power to either 0 or –5 dBm). See Figure 3. 8 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Overview www.ti.com C001 Figure 3. GSM EDGE EVM at 1800 MHz 1.4.2 Interface to TI's DAC All the TRF370x devices work well with TI's DACs. Figure 4 shows an example of the interface network between a DAC56x2 and a TRF370315. Figure 5 shows an example of interfacing the DAC568x to the TRF370333 with options for selecting the desired amount of attenuation between the two. Additional interfacing networks for each modulator can be found in their respective data sheets or by using the DAC interface calculator (SLWC083). SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 9 Overview www.ti.com 5V R3 R3 R2 I I I I R2 R1 5V R1 DAC56x2 TRF370315 R3 R3 R2 Q Q Q Q R2 R1 R1 S0225-02 TYPICAL VALUES R1 R2 R3 53 Ω 210 Ω 931 Ω NOTE: A DAC interface calculator is available (SLWC083). Figure 4. 1.5-V Interface Network for 19.2 mA Full Scale 5V R1 I I R5 R3 5V DAC568x TRF370333 R6 R1 R5 I I R3 S0226-02 LOSS 1 dB 2 dB 3 dB 4 dB 5 dB Pullup R1 115 115 115 115 115 Pulldown R3 634 634 634 634 634 Series R5 11 21 30 37.4 45.3 Shunt R6 187 165 147 130 118 Figure 5. 3.3-V Interface Network for 19.2 mA Full Scale 10 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Physical Description www.ti.com 2 Physical Description This chapter discusses the four-layer PCB layout, component placement, and list of components used on the evaluation module. 2.1 PCB Layout The EVM is constructed on a four-layer, 38,1-mm × 38,1-mm × 1,579-mm thick PCB using FR-4 material. Figure 6 through Figure 12 show the individual layers. K001 Figure 6. Top Layer 1 SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 11 Physical Description www.ti.com K002 Figure 7. Top Layer 2 K003 Figure 8. Ground Plane 1 12 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Physical Description www.ti.com K004 Figure 9. Ground Plane 2 K005 Figure 10. Bottom Layer 1 SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 13 Physical Description www.ti.com K006 Figure 11. Bottom Layer 2 14 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Physical Description www.ti.com D001 Figure 12. Drill Pattern SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 15 Circuit Description 2.2 www.ti.com Parts List Table 1. Bill of Materials for TRF370x EVM Item Number Quantity 1 3 C1, C2, C3 100 pF 0402 PANASONIC ECJ-0EC1H101J 2 2 C4, C5 1000 pF 0402 PANASONIC ECJ-0VC1H102J 3 2 C6, C7 4.7 mF TANT_A KERMET T491A475K016AS 4 0 C8, C9 1 mF 0402 PANASONIC ECJ0EC1H010C_DNI DNI 5 0 C10, C11, C12, C13 0.1 mF 0402 PANASONIC ECJ0EB1A104K_DNI DNI 6 2 C14, C15 10 pF 0402 MURATA GRM1555C1H100J Z01D 7 7 J1, J2, J3, J4, J5, J6, J7 LOP SMA_SMEL_250x215 JOHNSON COMPONENTS 142-0711-821 8 2 R1 0 0402 PANASONIC ERJ-2GE0R00 OR EQUIVALENT 9 4 R2, R3, R4, R5 0 0402 PANASONIC ERJ-2GE0R00 OR EQUIVALENT TRF370333 QFN_24_163x163_ 0p50mm TI TRF370333 For TRF370333 EVM, TI supplied TRF370317 QFN_24_163x163_ 0p50mm TI TRF370317 For TRF370317 EVM, TI supplied TRF370315 QFN_24_163x163_ 0p50mm TI TRF370315 For TRF370315 EVM, TI supplied TRF370417 QFN_24_163x163_ 0p50mm TI TRF370417 For TRF370417 EVM, TI supplied 10 3 1 Reference Designator Value PCB Footprint Mfr. Name Mfr. Part Number U1 11 2 TP1, TP3 BLK TP_THVT_100_RND KEYSTONE 5001K 12 2 TP2, TP4 RED TP_THVT_100_RND KEYSTONE 5000K Note Circuit Description This chapter discusses the various functions of the EVM. 3.1 Circuit Function • • • • 16 Headers TP2 and TP4 supply 5-V VCC dc power to the modulator. Header TP4 supplies 5 V to the LO circuitry, and TP2 supplies 5 V to the modulator circuitry. Four SMA connectors are provided on the EVM for inputting differential I/Q signals directly to the input pins of the TRF370x. Connectors J3, J4, J5, and J6 are used to connect the signal source I/Q signals directly to the TRF370x. Two SMA connectors are provided for LO input: J1 = LOP and J2 = LON. Terminate whichever LO port is not being used through 50 Ω to ground. One SMA connector is for RF_OUT: J7. TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback Circuit Board www.ti.com 3.1.1 Power Table 2. Power Supply Connection 4 Power Supply Connection Description TP4 5-V (VCC), U1 analog supply TP2 5-V (VCC), U1 analog supply TP3, TP1 Analog ground Circuit Board This chapter shows the circuit board test points. GND +5 V +5 V BBIN GND BBIP LOP RF_OUT LON 50 W BBQP BBQN K007 Figure 13. Silkscreen Top Layer SLWU062 – March 2010 Submit Documentation Feedback TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated 17 Schematic 5 www.ti.com Schematic This chapter shows the EVM schematic. DNI C10 DNI C11 .1uF .1uF J3 BBIN J4 BBIP 2 3 4 5 1 TP3 GND BLK TP4 VCC2 R2 R3 0 0 SMA_END 5 4 3 2 1 SMA_END TP2 VCC1 RED RED C5 C4 1000pF 1000pF + C6 TP1 GND BLK + C7 4.7uF 4.7uF C15 C14 10pF 10pF J1 LOP 100pF 25 24 23 22 21 20 19 GND VCC2 GND10 BBIN BBIP GND9 GND8 2 3 4 5 NC1 GND1 LOP LON GND2 NC2 VCC1 GND7 RF_OUT U1 NC5 TRF370x GND6 NC4 J7 RF_OUT 18 17 16 15 14 13 C3 C2 1 0 SMA_END 1 C8 C9 1uF DNI 1uF DNI 7 8 9 10 11 12 J2 LON R1 100pF NC3 GND3 BBQN BBQP GND4 GND5 1 2 3 4 5 6 5 4 3 2 C1 1 SMA_END 100pF 2 3 4 5 SMA_END TRF370333 0 DNI TRF370317 0 TRF370315 0 J5 QN R4 R5 0 0 J6 QP DNI 0 1 SMA_END 2 3 4 5 DNI 1 DNI DNI C12 C13 .1uF .1uF SMA_END 5 4 3 2 TRF370417 S0214-03 DNI = Do not install. Figure 14. TRF370x EVM Schematic 18 TRF370x Quadrature Modulator Evaluation Module Copyright © 2010, Texas Instruments Incorporated SLWU062 – March 2010 Submit Documentation Feedback EVALUATION BOARD/KIT IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. 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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated EVM WARNINGS AND RESTRICTIONS It is important to operate this EVM within the input voltage range of 4.5 V to 5.5 V and the output voltage range of 4.5 V to 5.5 V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 59°C. 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