121-BGA 10X10X1.2MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BK
B1: 202.9995mg
B2: 200.7815 mg
Body Size (mil/mm)
Package Weight – Site 2
10x10x1.2mm
B1 : 190.3900 mg
B2 : 194.3800 mg
SUMMARY
The 121- BGA Pb-Free package is compliant to RoHS. Packages from different assembly sites are likely to have
different materials composition. However, Cypress guarantees that product ordered with a part number containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report #s 110501, 120610 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BK121CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 1 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3
Using Au Wire
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Cured Resin
Proprietary
Glass Fabrics
Proprietary
Copper Foil
7440-50-8
Diethylene Glycol
Monoethyl Ether
Acetate
Acetophenone
Derirative
Silica Crystalline
Solvent naptha
Sn
Ag
Cu
Silver
Bismaleimide
Resin
Synthetic Resin
Additive
Silicon
Au
Silica
Epoxy Resin
Phenol Resin
Carbon Black
Pigment
Proprietary
Weight by
mg
% weight of
substance per
Homogeneous
material
23.2400
28.0000%
18.2600
22.0000%
89,951
8.9951%
24.9000
30.0000%
122,660
12.2660%
4.1500
5.0000%
20,443
2.0443%
4.1500
4.1500
4.1500
16.7450
0.1700
0.0850
0.5990
5.0000%
5.0000%
5.0000%
98.5000%
1.0000%
0.5000%
80.0000%
20,443
20,443
20,443
82,488
837
419
2,951
2.0443%
2.0443%
2.0443%
8.2488%
0.0837%
0.0419%
0.2951%
0.0749
0.0524
0.0225
21.4000
4.1580
67.4896
4.9850
3.8346
10.0000%
7.0000%
3.0000%
100.0000%
100.0000%
88.0000%
6.5000%
5.0000%
369
258
111
105,419
20,483
332,462
24,557
18,890
0.0369%
0.0258%
0.0111%
10.5419%
2.0483%
33.2462%
2.4557%
1.8890%
0.3835
0.5000%
PPM
114,483
% weight of
substance
per
package
11.4483%
Proprietary
14808-60-7
Proprietary
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Proprietary
Proprietary
Proprietary
7440-21-3
7440-57-5
60676-86-0
Proprietary
Proprietary
1333-86-4
Package Weight (mg):
202.9995
1,889
% Total:
0.1889%
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 2 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3
Using CuPd Wire
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Cured Resin
Proprietary
23.2400
% weight of
substance per
Homogeneous
material
28.0000%
115,748
% weight of
substance
per
package
11.5748%
Glass Fabrics
Proprietary
18.2600
22.0000%
90,945
9.0945%
Copper Foil
Diethylene Glycol
Monoethyl Ether
Acetate
Acetophenone
Derirative
Silica Crystalline
Solvent naptha
Sn
Ag
Cu
Silver
Bismaleimide
Resin
Synthetic Resin
Additive
Silicon
Copper
Palladium
Silica
Epoxy Resin (1)
Epoxy Resin (2)
Phenol Resin
7440-50-8
24.9000
30.0000%
124,015
12.4015%
Proprietary
4.1500
5.0000%
20,669
2.0669%
Proprietary
4.1500
5.0000%
20,669
2.0669%
14808-60-7
Proprietary
7440-31-5
7440-22-4
7440-50-8
7440-22-4
4.1500
4.1500
16.7450
0.1700
0.0850
0.5990
5.0000%
5.0000%
98.5000%
1.0000%
0.5000%
79.9947%
20,669
20,669
83,399
847
423
2,983
2.0669%
2.0669%
8.3399%
0.0847%
0.0423%
0.2983%
0.0749
10.0027%
373
0.0373%
0.0524
0.0225
21.4000
1.9200
0.0200
6.9979%
3.0047%
100.0000%
99.0000%
1.0000%
89.0000%
5.0000%
2.0000%
4.0000%
261
112
106,584
9,563
100
339,954
19,098
7,640
15,279
0.0261%
0.0112%
10.6584%
0.9563%
0.0100%
33.9954%
1.9098%
0.7640%
1.5279%
Substance
Composition
CAS Number
Proprietary
Proprietary
Proprietary
7440-21-3
7440-50-8
7440-05-3
60676-86-0
93705-66-9
Proprietary
106466-55-1
Package Weight (mg):
Weight by
mg
68.2565
3.8346
1.5339
3.0677
200.7815
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 3 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 115001, 120403 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BK121ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 4 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using CuPd Bond Wire Material
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
SiO2
60676-86-0
8.1100
% weight of
substance per
Homogeneous
material
10.9996%
Acrylic
29690-82-2
7.3700
9.9959%
Substance
Composition
CAS Number
Weight by
mg
42,595
% weight of
substance
per
package
4.2595%
38,722
3.8722%
PPM
Epoxy
68541-56-0
5.9000
8.0022%
30,978
3.0978%
Bisphenol
13676-54-5
11.0600
15.0007%
58,084
5.8084%
Trazol
25722-66-1
12.9000
17.4963%
67,764
6.7764%
Copper
Gold
Nickel
Sn
Ag
Cu
Silver
Epoxy Resin
Functionalize
Ester
Diester
Silicon
Copper
Palladium
Silica
Epoxy Resin
Phenol Resin
Carbon Black
Pigment
7440-50-8
7440-57-5
7440-02-0
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Proprietary
26.8700
0.4100
1.1100
12.3300
0.1300
0.0600
3.7500
0.2700
36.4438%
0.5561%
1.5055%
98.5000%
1.0000%
0.5000%
76.5306%
5.5102%
141,143
2,130
5,808
64,776
658
329
19,705
1,417
14.1143%
0.2130%
0.5808%
6.4776%
0.0658%
0.0329%
1.9705%
0.1417%
Proprietary
0.2700
5.5102%
1,417
0.1417%
Proprietary
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Proprietary
Proprietary
0.6100
11.0200
1.8700
0.0500
77.4100
4.7500
3.8800
12.4490%
100.0000%
99.0000%
1.0000%
89.6987%
5.5041%
4.4959%
3,220
57,880
9,816
272
406,598
24,931
20,398
0.3220%
5.7880%
0.9816%
0.0272%
40.6598%
2.4931%
2.0398%
1333-86-4
0.2600
0.3013%
1,360
0.1360%
Package Weight (mg):
190.3900
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 5 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Au Bond Wire Material
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
SiO2
60676-86-0
8.1100
% weight of
substance per
Homogeneous
material
10.9996%
Acrylic
29690-82-2
7.3700
9.9959%
Substance
Composition
CAS Number
Weight by
mg
41,722
% weight of
substance
per
package
4.1722%
37,915
3.7915%
PPM
Epoxy
68541-56-0
5.9000
8.0022%
30,353
3.0353%
Bisphenol
13676-54-5
11.0600
15.0007%
56,899
5.6899%
Trazol
25722-66-1
12.9000
17.4963%
66,365
6.6365%
Copper
Gold
Nickel
Sn
Ag
Cu
Silver
Epoxy Resin
Functionalize
Ester
Diester
Silicon
Gold
Silica
Epoxy Resin
Phenol Resin
Carbon Black
Pigment
7440-50-8
7440-57-5
7440-02-0
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Proprietary
26.8700
0.4100
1.1100
12.3300
0.1300
0.0600
3.7500
0.2700
36.4438%
0.5561%
1.5055%
98.5000%
1.0000%
0.5000%
76.5306%
5.5102%
138,234
2,109
5,710
63,432
669
309
19,292
1,389
13.8234%
0.2109%
0.5710%
6.3432%
0.0669%
0.0309%
1.9292%
0.1389%
Proprietary
0.2700
5.5102%
1,389
0.1389%
Proprietary
7440-21-3
7440-57-5
60676-86-0
Proprietary
Proprietary
0.6100
11.0200
5.91
77.4100
4.7500
3.8800
12.4490%
100.0000%
100.0000%
89.6987%
5.5041%
4.4959%
3,138
56,693
30,404
398,241
24,437
19,961
0.3138%
5.6693%
3.0404%
39.8241%
2.4437%
1.9961%
1333-86-4
0.2600
0.3013%
1,338
0.1338%
Package Weight (mg):
194.3800
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-G
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-CART-G
CoA-PLRL-G
CoA-TRAY-G
CoA-MBBG-G
CoA-SBAG-G
CoA-PROB-G
CoA-ABOX-G
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 6 of 7
121– BGA
(10 x 10 x 1.2 mm)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
*A
*B
*C
*D
*E
*F
*G
*H
121-BGA 10X10x1.2MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-70381
ECN No. Orig. of Description of Change
Change
3290889 HLR
Initial Spec
3587519 COPI
Added PMMD for Assy Site 2. Reference QTP # 120610 – CML RA
Copper Pd Wire Qualification.
3637762 MLA
Removed 48FBGA data (site 2). Added new data for 121FBGA at
ASE-G location, reference QTP # 115001.
3646058 MLA
Correct total package weight from 200.7815 to 190.3900 grams for
site #2 (CuPd wire). Add site #2 (Au wire) table.
3648817 GLAN
Change reference QTP # of Assembly Site 2 from 115001 to
120403
3793547 JARG
Added Material Composition B2 for Assembly Site 1 using CuPd
wire. Reference QTP 120610
Added QTP 115001 for CuPd Wire Material Composition for
Assembly Site 2-B1
4056911 HLR
Changed Assembly Site Code to Assembly Site Name.
Added Assembly Site Name on heading for Assembly Site 1 and 2.
4084026 YUM
Corrected total package weight of Material Composition in Site
1:B1.
4445982 HLR
Added CAS Number of Copper on Assembly Site 1.
Corrected the CAS Number of Copper on Substrate Material for
Assembly Site 2.
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-70381 Rev.*H
Page 7 of 7
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