Document No.001-77743 Rev. *B ECN # 4321669 Cypress Semiconductor Package Qualification Report QTP# 120205 VERSION *B March 2014 48 QFN (6x6x0.6mm) / 36 QFN (5x5x0.6mm) / 56 QFN (7x7x0.6mm) NiPdAu, 100% Cu Wire MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Lorena R. Zapanta (ILZ) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro(RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-77743 Rev. *B ECN # 4321669 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 120205 Qualification of 48 QFN (6X6X0.6mm), 36 QFN (5x5x0.6mm) and 56 QFN (7x7x0.6mm) package dimensions at CML Autoline (RA) using NiPdAu Leadframe, 100% Cu Wire , GE7470 mold compound and QMI 519 epoxy Mar 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Document No.001-77743 Rev. *B ECN # 4321669 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ48 Package Outline, Type, or Name: 48-Lead Quad Flat No Lead, 6x6x0.6mm Package Mold Compound Name/Manufacturer: GE7470 / Nitto Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% N/A Lead Frame Designation: C7025 Lead Frame Material: Copper (PPF) Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Dexter Die Attach Material: QMI 519 Bond Diagram Designation 001-57376 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu Thermal Resistance Theta JA C/W: 18.69 Package Cross Section Yes/No: Yes Assembly Process Flow: 001-80666 Name/Location of Assembly (prime) facility: CML-RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No.001-77743 Rev. *B ECN # 4321669 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F Ball Shear Dynamic Operating Condition, Vcc = 5.75, 150 C JESD22-A108 Dynamic Operating Condition, Vcc = 5.75V, 150 C JESD22-A108 JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Meet external and internal characteristics of a package P Dye Penetrant Test P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 P Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and Thermal Shock P P P P P P P P JESD22-A106B, Condition C, -55 C to 125C X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 Document No.001-77743 Rev. *B ECN # 4321669 Reliability Test Data QTP #: 120205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 5 0 5137028 611158285 RA-CML COMP 5 0 STRESS: CROSS SECTION CY8CTMA300E (8C20323E) STRESS: DYE PENETRATION TEST CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 15 0 RA-CML COMP 30 0 STRESS: ELECTRICAL CHARACTERIZATION CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 5.75V, Vcc Max) CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 48 1493 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V, Vcc Max) CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 80 116 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 500 114 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.001-77743 Rev. *B ECN # 4321669 Reliability Test Data QTP #: 120205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 128 79 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 192 39 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 128 79 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 192 40 0 STRESS: HIGH TEMP STORAGE, 150C CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1500 94 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 2000 94 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 2500 94 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 3000 94 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1500 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 2000 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 2500 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 3000 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1500 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 2000 103 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 2500 103 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 3000 103 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 5 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 5 0 STRESS: INTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-77743 Rev. *B ECN # 4321669 Reliability Test Data QTP #: 120205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 168 114 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 288 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 168 114 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 288 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 168 114 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 288 104 0 CY8CTMA300E(8CC20323EK) 5227044 611240187 RA-CML 168 45 0 CY8CTMA300E(8CC20323EK) 5227044 611240187 RA-CML 288 45 0 CY8CTMA300E(8CC20323EK) 5227044 611240187 RA-CML 500 44 0 STRESS: PHYSICAL DIMENSION CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 30 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 30 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 30 0 611158285 RA-CML COMP 4 0 611158285 RA-CML COMP RA-CML COMP 3 0 RA-CML 128 5 0 RA-CML 1000 5 0 STRESS: POST MSL3 BALL SHEAR CY8CTMA300E (8C20323E) 5137028 STRESS: POST MSL3 BOND PULL CY8CTMA300E (8C20323E) 5137028 0 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 168 5 0 CY8CTMA300E(8CC20323EK) 5227044 611240187 RA-CML 500 5 0 611158285 RA-CML 500 5 0 STRESS: POST TC BALL SHEAR CY8CTMA300E (8C20323E) 5137028 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-77743 Rev. *B ECN # 4321669 Reliability Test Data QTP #: 120205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST HIGH TEMP STORAGE BOND PULL CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1000 5 0 128 5 0 STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML STRESS: POST PRESSURE COOKER TEST BOND PULL TEST CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 168 5 0 5137028 611158285 RA-CML 500 5 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 200 77 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1000 77 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML COMP 15 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML COMP 15 0 STRESS: POST TC BOND PULL CY8CTMA300E (8C20323E) STRESS: THERMAL SHOCK STRESS: X-RAY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1500 94 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 2000 94 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1500 94 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 2000 94 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1500 92 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 2000 92 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-77743 Rev. *B ECN # 4321669 Document History Page Document Title: QTP 120205: 48 QFN (6x6x0.6mm) / 36 QFN (5x5x0.6mm) / 56 QFN (7x7x0.6mm) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA 001-77743 Document Number: Rev. ECN No. ** 3553253 *A 3577076 *B Orig. of Change NSR NSR 4321669 ILZ Description of Change Initial spec release Added extended readpoints 1500 Cycle TCT, 192H HAST and 1500H HTS. Added the reference Industry Standards (JEDEC and MIL) in the stress test conditions table. Sunset Spec Review Updated front page to reflect new qual report template per Spec 001-57716 Page 2 - Added LF and Wire material on Qual Title on Package qualification history page Page 3 - Major package information table – Changed assembly process flow from 001-69810M to 001-80666 Page 4 – Reliability Tests performed per specification table: Deleted Cypress reference specs for Constructional analysis, dye penetrant, internal visual, final visual and physical dimension testing Added extended readpoints for the following stress: >2000 cycles TCT >2000/2500/3000Hrs HTS >500Hrs PCT Added Post 500Hrs PCT ball shear Updated spec title to QTP 120205: 48 QFN (6x6x0.6mm) / 36 QFN (5x5x0.6mm) / 56 QFN (7x7x0.6mm) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9