Document No.001-75329 Rev. *B ECN # 4648768 Cypress Semiconductor Package Qualification Report QTP# 114401 VERSION*B February, 2015 24 QFN (4x4x0.6mm)/ 32/36 QFN(5x5x0.6mm) NiPdAu, Cu-Pd Wire MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-75329 Rev. *B ECN # 4648768 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose 114401 Qualification of Copper (Cu-Pd) wire bond on 24 QFN(4x4x0.6mm) and 32/36 QFN (5x5x0.6mm) package dimensions at ASE , Kaohsiung Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Jan 2012 Document No.001-75329 Rev. *B ECN # 4648768 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Mold Compound Name/Manufacturer: LQ24A/ LQ32A/LQ36 24 Quad Flat No-Lead (4X4X0.6mm) 32 / 36 Quad Flat No-Lead (5x5x0.6mm) G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69159 Wire Bond Method: Thermosonic Wire Material/Size: Package Cross Section Yes/No: 0.8mil / Cu- Pd LQ24A Device 7C638055AK - 35°C/W LQ24A Device 8C20334BK - 96°C/W LQ32A Device 8C204662B - 19.51°C/W Yes Assembly Process Flow: 001-70516M Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C Package Outline, Type, or Name: Thermal Resistance Theta JA °C/W: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-75329 Rev. *B ECN # 4648768 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc = 2.1V, 150°C JESD22-A108 Dynamic Operating Condition, Vcc = 2.1V, 150°C JESD22-A108 JEDEC STD 22-A110: 130°C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A102: 121°C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A103:150°C, no bias Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Dye Penetrant Test J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-B116 Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack Result P/F P P P P P P P P P P P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C P X-Ray MIL-STD-883 – 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 – 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No.001-75329 Rev. *B ECN # 4648768 Reliability Test Data QTP #: 114401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 15 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 15 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 15 0 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 5 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 5 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 5 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 5 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 15 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 15 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 15 0 STRESS: DYE PENETRATION TEST CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 15 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 15 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN 128 79 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 128 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 48 1500 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-75329 Rev. *B ECN # 4648768 Reliability Test Data QTP #: 114401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 500 116 0 STRESS: HIGH TEMP STORAGE, 150C CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN 1000 80 0 CY8C20466A(8C2046625AK) 5104069 611128981 G-TAIWAN 1000 80 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 1000 80 0 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 5 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 5 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN 168 220 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN 168 220 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 168 220 0 STRESS: PHYSICAL DIMENSION CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 5 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 5 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 611145346 G-TAIWAN COMP 1 0 611145346 G-TAIWAN COMP 1 0 STRESS: POST MSL3 BALL SHEAR CY8CTMG240 (8C204662BK) 5125017 STRESS: POST MSL3 BOND SHEAR CY8CTMG240 (8C204662BK) 5125017 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 1 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 1 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 1 0 COMP 5 0 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-75329 Rev. *B ECN # 4648768 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 5 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 5 0 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 611145346 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 STRESS: POST TC BALL SHEAR CY8CTMG240 (8C204662BK) 5125017 STRESS: POST HI-ACCEL SATURATION TEST BOND SHEAR CY8CTMG240 (8C204662BK) 5125017 611145346 STRESS: POST HIGH TEMP STORAGE BOND SHEAR CY8CTMG240 (8C204662BK) 5125017 611145346 STRESS: POST PRESSURE COOKER TEST BOND SHEAR TEST CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 5 0 611145346 G-TAIWAN COMP 5 0 STRESS: POST TC BOND SHEAR CY8CTMG240 (8C204662BK) 5125017 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN 500 220 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN 500 220 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 500 220 0 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN 200 100 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN 200 100 0 CY7C63803 (7C638055AK) 5119008 611144727 G-TAIWAN COMP 15 0 CY8C20324 (8C20334BK) 5111046 611144587 G-TAIWAN COMP 15 0 CY8CTMG240 (8C204662BK) 5125017 611145346 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-75329 Rev. *B ECN # 4648768 Document History Page Document Title: QTP 114401: 24 QFN (4X4X0.6MM), 32/36 QFN(5x5x0.6mm) NIPDAU, CU-PD Wire, MSL3 260C REFLOW ASEK- TAIWAN Document Number: 001-75329 Rev. ECN No. ** 3473919 *A 4272218 *B 4648768 Orig. of Change ILZ JYF JYF Description of Change Initial spec release No Change Sunset review: Updated QTP title page and Reliability Tests Performed table (EFR/LFR, HAST, PCT, HTS, Acoustic, Ball Shear, Bond Pull, CA, DPT, IVI/FVI, Physical Dimension, Therml Shock) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8