APT28F60B APT28F60S 600V, 30A, 0.22Ω Max, trr ≤230ns N-Channel FREDFET Power MOS 8™ is a high speed, high voltage N-channel switch-mode power MOSFET. This 'FREDFET' version has a drain-source (body) diode that has been optimized for high reliability in ZVS phase shifted bridge and other circuits through reduced trr, soft recovery, and high recovery dv/dt capability. Low gate charge, high gain, and a greatly reduced ratio of Crss/Ciss result in excellent noise immunity and low switching loss. The intrinsic gate resistance and capacitance of the poly-silicon gate structure help control di/dt during switching, resulting in low EMI and reliable paralleling, even when switching at very high frequency. TO -24 7 D 3 PAK APT28F60B APT28F60S D Single die FREDFET G S TYPICAL APPLICATIONS FEATURES • Fast switching with low EMI • ZVS phase shifted and other full bridge • Low trr for high reliability • Half bridge • Ultra low Crss for improved noise immunity • PFC and other boost converter • Low gate charge • Buck converter • Avalanche energy rated • Single and two switch forward • RoHS compliant • Flyback Absolute Maximum Ratings Symbol ID Parameter Unit Ratings Continuous Drain Current @ TC = 25°C 30 Continuous Drain Current @ TC = 100°C 19 A IDM Pulsed Drain Current VGS Gate-Source Voltage ±30 V EAS Single Pulse Avalanche Energy 2 780 mJ IAR Avalanche Current, Repetitive or Non-Repetitive 14 A 1 105 Thermal and Mechanical Characteristics Max Unit W PD Total Power Dissipation @ TC = 25°C 520 RθJC Junction to Case Thermal Resistance 0.24 RθCS Case to Sink Thermal Resistance, Flat, Greased Surface TJ,TSTG Operating and Storage Junction Temperature Range TL Soldering Temperature for 10 Seconds (1.6mm from case) WT Package Weight Torque Mounting Torque ( TO-264 Package), 4-40 or M3 screw Microsemi Website - http://www.microsemi.com 0.11 -55 150 300 °C/W °C 0.22 oz 6.2 g 10 in·lbf 1.1 N·m 8-2011 Typ Rev D Min Characteristic 050-8118 Symbol Static Characteristics TJ = 25°C unless otherwise specified Symbol Parameter Test Conditions Min VBR(DSS) Drain-Source Breakdown Voltage VGS = 0V, ID = 250μA 600 ∆VBR(DSS)/∆TJ Drain-Source On Resistance VGS(th) Gate-Source Threshold Voltage ∆VGS(th)/∆TJ VGS = 10V, ID = 14A 3 Zero Gate Voltage Drain Current IGSS Gate-Source Leakage Current Dynamic Characteristics Forward Transconductance Ciss Input Capacitance Crss Reverse Transfer Capacitance Coss Output Capacitance VDS = 600V TJ = 25°C VGS = 0V TJ = 125°C Typ Max 0.57 0.17 4 -10 0.22 5 250 1000 ±100 VGS = ±30V Unit V V/°C Ω V mV/°C μA nA TJ = 25°C unless otherwise specified Parameter gfs 2.5 VGS = VDS, ID = 1mA Threshold Voltage Temperature Coefficient IDSS Symbol Reference to 25°C, ID = 250μA Breakdown Voltage Temperature Coefficient RDS(on) APT28F60B_S Min Test Conditions VDS = 50V, ID = 14A 4 Effective Output Capacitance, Charge Related Co(er) 5 Effective Output Capacitance, Energy Related Max 27 5575 55 510 VGS = 0V, VDS = 25V f = 1MHz Co(cr) Typ Unit S pF 270 VGS = 0V, VDS = 0V to 400V 140 Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge td(on) Turn-On Delay Time Resistive Switching Current Rise Time VDD = 400V, ID = 14A tr td(off) tf Turn-Off Delay Time 140 30 60 31 36 95 29 VGS = 0 to 10V, ID = 14A, VDS = 300V RG = 4.7Ω 6 , VGG = 15V Current Fall Time nC ns Source-Drain Diode Characteristics Symbol IS ISM VSD Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) 1 Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge Irrm Reverse Recovery Current dv/dt Peak Recovery dv/dt Test Conditions Min Typ D MOSFET symbol showing the integral reverse p-n junction diode (body diode) Max 30 A G 105 S ISD = 14A, TJ = 25°C, VGS = 0V 1.0 230 430 TJ = 25°C TJ = 125°C ISD = 14A 3 TJ = 25°C diSD/dt = 100A/μs TJ = 125°C VDD = 100V TJ = 25°C Unit TJ = 125°C ISD ≤ 14A, di/dt ≤1000A/μs, VDD = 400V, TJ = 125°C 0.83 2.07 8.0 11.2 V ns μC A 20 V/ns 1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature. 2 Starting at TJ = 25°C, L = 7.96mH, RG = 25Ω, IAS = 14A. 050-8118 Rev D 8-2011 3 Pulse test: Pulse Width < 380μs, duty cycle < 2%. 4 Co(cr) is defined as a fixed capacitance with the same stored charge as COSS with VDS = 67% of V(BR)DSS. 5 Co(er) is defined as a fixed capacitance with the same stored energy as COSS with VDS = 67% of V(BR)DSS. To calculate Co(er) for any value of VDS less than V(BR)DSS, use this equation: Co(er) = -1.33E-7/VDS^2 + 3.06E-8/VDS + 8.83E-11. 6 RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452) Microsemi reserves the right to change, without notice, the specifications and information contained herein. APT28F60B_S 120 V GS 45 = 10V T = 125°C J 40 V TJ = -55°C 80 TJ = 25°C 60 40 TJ = 150°C 20 ID, DRIAN CURRENT (A) ID, DRAIN CURRENT (A) 100 30 6.5V 25 20 15 6V 10 5 TJ = 125°C 0 0 0 5 10 15 20 25 30 VDS(ON), DRAIN-TO-SOURCE VOLTAGE (V) 5.5V 5V 0 NORMALIZED TO 250μSEC. PULSE TEST @ <0.5 % DUTY CYCLE 80 2.0 1.5 1.0 0.5 0 -55 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 3, RDS(ON) vs Junction Temperature 60 TJ = -55°C TJ = 25°C 40 TJ = 125°C 20 0 50 0 1 2 3 4 5 6 7 8 VGS, GATE-TO-SOURCE VOLTAGE (V) Figure 4, Transfer Characteristics 10,000 40 TJ = -55°C C, CAPACITANCE (pF) gfs, TRANSCONDUCTANCE VDS> ID(ON) x RDS(ON) MAX. VGS = 10V @ 14A 2.5 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 2, Output Characteristics 100 ID, DRAIN CURRENT (A) RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE Figure 1, Output Characteristics 3.0 = 7 &,10V GS 35 TJ = 25°C 30 TJ = 125°C 20 Ciss 1000 Coss 100 10 Crss 10 15 20 25 30 ID, DRAIN CURRENT (A) Figure 5, Gain vs Drain Current 100 200 300 400 500 600 VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 6, Capacitance vs Drain-to-Source Voltage VDS = 120V 10 VDS = 300V 8 6 VDS = 480V 4 2 0 20 40 60 80 100 120 140 160 180 200 Qg, TOTAL GATE CHARGE (nC) Figure 7, Gate Charge vs Gate-to-Source Voltage 90 80 70 60 50 TJ = 25°C 40 30 TJ = 150°C 20 10 0 0 0.3 0.6 0.9 1.2 1.5 VSD, SOURCE-TO-DRAIN VOLTAGE (V) Figure 8, Reverse Drain Current vs Source-to-Drain Voltage 8-2011 12 0 100 ID = 14A 14 0 10 35 Rev D VGS, GATE-TO-SOURCE VOLTAGE (V) 16 5 050-8118 0 ISD, REVERSE DRAIN CURRENT (A) 0 200 100 100 IDM ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) APT28F60B_S 200 10 13μs 100μs Rds(on) 1 0.1 1ms 10ms 10 13μs 100μs 1ms 100ms DC line Scaling for Different Case & Junction Temperatures: ID = ID(T = 25°C)*(TJ - TC)/125 DC line 0.1 10 100 800 VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 9, Forward Safe Operating Area 10ms TJ = 150°C TC = 25°C 1 100ms TJ = 125°C TC = 75°C 1 IDM Rds(on) C 1 10 100 800 VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 10, Maximum Forward Safe Operating Area 0.25 0.7 0.15 Note: 0.5 P DM ZθJC, THERMAL IMPEDANCE (°C/W) D = 0.9 0.20 0.10 t1 t2 0.3 t1 = Pulse Duration t 0.05 SINGLE PULSE 0.1 0 Duty Factor D = 1 /t2 Peak T J = P DM x Z θJC + T C 0.05 10-5 10-4 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (seconds) Figure 11. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration D3PAK Package Outline TO-247 (B) Package Outline e3 100% Sn Plated 15.49 (.610) 16.26 (.640) Drai n 6.15 (.242) BSC 5.38 (.212) 6.20 (.244) Drai n (Heat Sink) e1 SAC: Tin, Silver, Copper 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 1.0 4.98 (.196) 5.08 (.200) 1.47 (.058) 1.57 (.062) 15.95 (.628) 16.05(.632) Revised 4/18/95 20.80 (.819) 21.46 (.845) 1.04 (.041) 1.15(.045) 13.79 (.543) 13.99(.551) 13.41 (.528) 13.51(.532) Revised 8/29/97 11.51 (.453) 11.61 (.457) 3.50 (.138) 3.81 (.150) 050-8118 Rev D 8-2011 0.46 (.018) 0.56 (.022) {3 Plcs} 4.50 (.177) Max. 0.40 (.016) 1.016(.040) 2.87 (.113) 3.12 (.123) 1.65 (.065) 2.13 (.084) 19.81 (.780) 20.32 (.800) 1.01 (.040) 1.40 (.055) Gate Drai n 0.020 (.001) 0.178 (.007) 2.67 (.105) 2.84 (.112) 1.27 (.050) 1.40 (.055) 1.22 (.048) 1.32 (.052) 1.98 (.078) 2.08 (.082) 5.45 (.215) BSC {2 Plcs. } Source 2.21 (.087) 2.59 (.102) 5.45 (.215) BSC 2-Plcs. Dimensions in Millimeters (Inches) Source Drai n Gate Dimensions in Millimeters (Inches) 3.81 (.150) 4.06 (.160) (Base of Lead) Heat Sink (Drain) and Leads are Plated