APT30DF60HJ-Rev1.pdf

APT30DF60HJ
ISOTOP®Fast Diode
Full Bridge Power Module
VRRM = 600V
IF = 30A @ Tc = 80°C
Application




Switch mode power supplies rectifier
Induction heating
Welding equipment
High speed rectifiers
Features
+
~








~
Ultra fast recovery times
Soft recovery characteristics
High blocking voltage
High current
Low leakage current
Very low stray inductance
High level of integration
ISOTOP® Package (SOT-227)
Benefits
-






Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Symbol
VR
VRRM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
IF(AV)
Maximum Average Forward
Current
IFSM
Non-Repetitive Forward Surge Current
Duty cycle = 50%
8.3ms
Max ratings
Unit
600
V
TC = 25°C
60
TC = 80°C
TJ = 45°C
30
A
320
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
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1-5
APT30DF60HJ – Rev 1 October 2012
Absolute maximum ratings
APT30DF60HJ
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
VF
Diode Forward Voltage
IRM
Maximum Reverse Leakage Current
CT
Junction Capacitance
Test Conditions
IF = 30A
IF = 60A
Tj = 125°C
IF = 30A
Tj = 25°C
VR = 600V
Tj = 125°C
Min
Typ
1.8
2.2
1.5
Max
2.2
V
250
500
VR = 200V
Unit
36
µA
pF
Dynamic Characteristics
Symbol Characteristic
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
Test Conditions
IF = 30A
VR = 400V
di/dt = 200A/µs
IF = 30A
VR = 400V
di/dt=1000A/µs
Min
Typ
Tj = 25°C
25
Tj = 125°C
160
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
35
480
3
6
Tj = 125°C
Max
Unit
ns
nC
A
85
ns
920
nC
20
A
Thermal and package characteristics
Characteristic
Junction to Case Thermal resistance
Junction to Ambient
Min
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
2500
-55
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Package Weight
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Typ
Max
1.2
20
Unit
°C/W
V
175
300
1.5
29.2
°C
N.m
g
2-5
APT30DF60HJ – Rev 1 October 2012
Symbol
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Wt
APT30DF60HJ
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
1.4
1.2
0.9
1
0.7
0.8
0.5
0.6
0.3
0.4
0.1
0.05
0.2
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds)
Forward Current vs Forward Voltage
trr, Reverse Recovery Time (ns)
IF, Forward Current (A)
Trr vs. Current Rate of Charge
175
120
100
80
TJ=125°C
60
40
20
TJ=25°C
0
0.0
0.5
1.0
1.5
2.0
2.5
TJ=125°C
VR=400V
150
125
60 A
100
30 A
75
15 A
50
3.0
0
200
TJ=125°C
VR=400V
60 A
1.0
30 A
15 A
0.5
0.0
0
200
400
600
800
1000 1200
IRRM, Reverse Recovery Current (A)
QRR, Reverse Recovery Charge (µC)
QRR vs. Current Rate Charge
1.5
400
600
800
1000 1200
-diF/dt (A/µs)
VF, Anode to Cathode Voltage (V)
IRRM vs. Current Rate of Charge
30
TJ=125°C
VR=400V
25
60 A
20
15
30 A
15 A
10
5
0
-diF/dt (A/µs)
0
200
400
600
800
1000 1200
-diF/dt (A/µs)
Capacitance vs. Reverse Voltage
200
150
125
100
75
50
25
0
1
10
100
1000
VR, Reverse Voltage (V)
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3-5
APT30DF60HJ – Rev 1 October 2012
C, Capacitance (pF)
175
APT30DF60HJ
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
31.5 (1.240)
31.7 (1.248)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
7.8 (.307)
8.2 (.322)
r = 4.0 (.157)
(2 places)
4.0 (.157)
4.2 (.165)
(2 places)
3.3 (.129)
3.6 (.143)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
0.75 (.030)
0.85 (.033)
25.2 (0.992)
25.4 (1.000)
3.30 (.130) 12.6 (.496)
4.57 (.180) 12.8 (.504)
1.95 (.077)
2.14 (.084)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
Dimensions in Millimeters and (Inches)
ISOTOP® is a registered trademark of ST Microelectronics NV
www.microsemi.com
4-5
APT30DF60HJ – Rev 1 October 2012
38.0 (1.496)
38.2 (1.504)
APT30DF60HJ
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Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
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application. User or customer shall not rely on any data and performance specifications or parameters provided by
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is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
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5-5
APT30DF60HJ – Rev 1 October 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
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