CY7C1380S/CY7C1382S, 18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM Datasheet.pdf

CY7C1380S
CY7C1382S
18-Mbit (512 K × 36/1 M × 18) Pipelined
SRAM
18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM
Features
Functional Description
■
Supports bus operation up to 167 MHz
■
Available speed grade is 167 MHz
■
Registered inputs and outputs for pipelined operation
■
3.3 V core power supply
■
2.5 V or 3.3 V I/O power supply
■
Fast clock-to-output times
❐ 3.4 ns (for 167 MHz device)
■
Provides high-performance 3-1-1-1 access rate
■
User selectable burst counter supporting Intel Pentium®
interleaved or linear burst sequences
■
Separate processor and controller address strobes
■
Synchronous self-timed write
■
Asynchronous output enable
■
Single cycle chip deselect
■
CY7C1380S available in JEDEC-standard Pb-free 100-pin
TQFP and non Pb-free 165-ball FBGA package and
CY7C1382S available in JEDEC-standard Pb-free 100-pin
TQFP
■
IEEE 1149.1 JTAG-Compatible Boundary Scan
■
ZZ sleep mode option
The CY7C1380S/CY7C1382S SRAM integrates 524,288 × 36
and 1,048,576 × 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive edge triggered clock input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining chip enable (CE1), depth-expansion chip
enables (CE2 and CE3), burst control inputs (ADSC, ADSP, and
ADV), write enables (BWX, and BWE), and global write (GW).
Asynchronous inputs include the output enable (OE) and the ZZ
pin.
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP) or address strobe
controller (ADSC) are active. Subsequent burst addresses can
be internally generated as they are controlled by the advance pin
(ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 6 and Truth Table on
page 9 for further details). Write cycles can be one to two or four
bytes wide as controlled by the byte write control inputs. GW
when active LOW writes all bytes.
The CY7C1380S/CY7C1382S operates from a +3.3 V core
power supply while all outputs operate with a +2.5 or +3.3 V
power supply. All inputs and outputs are JEDEC-standard and
JESD8-5-compatible.
Selection Guide
Description
167 MHz
Unit
Maximum Access Time
3.4
ns
Maximum Operating Current
275
mA
Maximum CMOS Standby Current
70
mA
Cypress Semiconductor Corporation
Document Number: 001-43822 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 20, 2013
CY7C1380S
CY7C1382S
Logic Block Diagram – CY7C1380S
A0, A1, A
ADDRESS
REGISTER
2
A [1:0]
MODE
ADV
CLK
Q1
BURST
COUNTER
CLR AND
LOGIC
ADSC
Q0
ADSP
BW D
DQ D , DQP D
BYTE
WRITE REGISTER
DQ D ,DQP D
BYTE
WRITE DRIVER
BW C
DQ C , DQP C
BYTE
WRITE REGISTER
DQ C , DQP C
BYTE
WRITE DRIVER
DQ B , DQP B
BYTE
WRITE REGISTER
DQ B , DQP B
BYTE
WRITE DRIVER
BW B
GW
CE 1
CE 2
CE 3
OE
ZZ
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
E
DQs
DQP A
DQP B
DQP C
DQP D
DQ A , DQP A
BYTE
WRITE DRIVER
DQ A , DQP A
BYTE
WRITE REGISTER
BW A
BWE
MEMORY
ARRAY
ENABLE
REGISTER
INPUT
REGISTERS
PIPELINED
ENABLE
SLEEP
CONTROL
Logic Block Diagram – CY7C1382S
A0, A1, A
ADDRESS
REGISTER
2
BURST Q1
COUNTER AND
LOGIC
ADV
CLK
ADSC
BW B
DQ B, DQP B
WRITE DRIVER
DQ B, DQP B
WRITE REGISTER
MEMORY
ARRAY
BW A
SENSE
OUTPUT
OUTPUT
BUFFERS
DQs
DQP A
DQP B
DQ A, DQP A
WRITE DRIVER
DQ A, DQP A
WRITE REGISTER
BWE
GW
CE 1
CE2
CE3
INPUT
ENABLE
REGISTER
PIPELINED
ENABLE
OE
ZZ
SLEEP
CONTROL
Document Number: 001-43822 Rev. *F
Page 2 of 31
CY7C1380S
CY7C1382S
Contents
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 6
Functional Overview ........................................................ 7
Single Read Accesses ................................................ 7
Single Write Accesses Initiated by ADSP ................... 7
Single Write Accesses Initiated by ADSC ................... 8
Burst Sequences ......................................................... 8
Sleep Mode ................................................................. 8
Interleaved Burst Address Table ................................. 8
Linear Burst Address Table ......................................... 8
ZZ Mode Electrical Characteristics .............................. 8
Truth Table ........................................................................ 9
Truth Table for Read/Write ............................................ 10
Truth Table for Read/Write ............................................ 10
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 11
Disabling the JTAG Feature ...................................... 11
Test Access Port (TAP) ............................................. 11
PERFORMING A TAP RESET .................................. 11
TAP REGISTERS ...................................................... 11
TAP Instruction Set ................................................... 11
Reserved ................................................................... 12
TAP Controller State Diagram ....................................... 13
TAP Controller Block Diagram ...................................... 14
TAP Timing ...................................................................... 15
TAP AC Switching Characteristics ............................... 15
3.3 V TAP AC Test Conditions ....................................... 16
3.3 V TAP AC Output Load Equivalent ......................... 16
Document Number: 001-43822 Rev. *F
2.5 V TAP AC Test Conditions ....................................... 16
2.5 V TAP AC Output Load Equivalent ......................... 16
TAP DC Electrical Characteristics and
Operating Conditions ..................................................... 16
Identification Register Definitions ................................ 17
Scan Register Sizes ....................................................... 17
Identification Codes ....................................................... 17
Boundary Scan Order .................................................... 18
Maximum Ratings ........................................................... 19
Operating Range ............................................................. 19
Electrical Characteristics ............................................... 19
Capacitance .................................................................... 20
Thermal Resistance ........................................................ 20
AC Test Loads and Waveforms ..................................... 20
Switching Characteristics .............................................. 21
Switching Waveforms .................................................... 22
Ordering Information ...................................................... 26
Ordering Code Definitions ......................................... 26
Package Diagrams .......................................................... 27
Acronyms ........................................................................ 29
Document Conventions ................................................. 29
Units of Measure ....................................................... 29
Document History Page ................................................. 30
Sales, Solutions, and Legal Information ...................... 31
Worldwide Sales and Design Support ....................... 31
Products .................................................................... 31
PSoC Solutions ......................................................... 31
Page 3 of 31
CY7C1380S
CY7C1382S
Pin Configurations
NC
NC
NC
CY7C1382S
(1 M × 18)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Document Number: 001-43822 Rev. *F
A
NC
NC
VDDQ
VSSQ
NC
DQPA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
NC
NC
VSSQ
VDDQ
NC
NC
NC
A
A
A
A
A
A
A
A
A
A
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VDDQ
VSSQ
NC
NC
DQB
DQB
VSSQ
VDDQ
DQB
DQB
NC
VDD
NC
VSS
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQPB
NC
VSSQ
VDDQ
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
DQPB
DQB
DQB
VDDQ
VSSQ
DQB
DQB
DQB
DQB
VSSQ
VDDQ
DQB
DQB
VSS
NC
VDD
ZZ
DQA
DQA
VDDQ
VSSQ
DQA
DQA
DQA
DQA
VSSQ
VDDQ
DQA
DQA
DQPA
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
CY7C1380S
(512 K × 36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
NC/72M
NC/36M
VSS
VDD
A
A
A
A
A
A
A
A
DQPC
DQC
DQc
VDDQ
VSSQ
DQC
DQC
DQC
DQC
VSSQ
VDDQ
DQC
DQC
NC
VDD
NC
VSS
DQD
DQD
VDDQ
VSSQ
DQD
DQD
DQD
DQD
VSSQ
VDDQ
DQD
DQD
DQPD
A
A
CE1
CE2
NC
NC
BWB
BWA
CE3
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
A
A
CE1
CE2
BWD
BWC
BWB
BWA
CE3
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A
A
Figure 1. Pin Diagram - 100-pin TQFP (14 × 20 × 1.4 mm) pinout (3 Chip Enable)
Page 4 of 31
CY7C1380S
CY7C1382S
Pin Configurations (continued)
Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout (3 Chip Enable)
CY7C1380S (512 K × 36)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC/288M
R
2
3
4
5
6
7
8
9
10
11
NC
CE1
BWC
BWB
CE3
BWE
ADSC
ADV
A
NC/144M
A
CE2
BWD
BWA
CLK
OE
NC/576M
NC
DQC
VDDQ
VSS
VDDQ
VSS
VDD
VSS
VSS
VSS
ADSP
VDDQ
A
DQPC
DQC
GW
VSS
VDDQ
NC/1G
DQB
DQPB
DQB
DQC
DQC
VDDQ
VDD
VSS
VDDQ
DQB
DQB
A
VSS
VSS
VDD
VSS
VSS
VDD
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
DQC
NC
DQD
DQC
NC
DQD
VDDQ
NC
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
NC
VDDQ
DQB
NC
DQA
DQB
ZZ
DQA
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
DQD
DQPD
DQD
NC
VDDQ
VDDQ
VDD
VSS
VSS
NC
VSS
A
VSS
NC
VDD
VSS
VDDQ
VDDQ
DQA
NC
DQA
DQPA
NC
NC/72M
A
A
TDI
A1
TDO
A
A
A
A
MODE
NC/36M
A
A
TMS
TCK
A
A
A
A
Document Number: 001-43822 Rev. *F
A0
Page 5 of 31
CY7C1380S
CY7C1382S
Pin Definitions
Name
I/O
Description
A0, A1, A
InputAddress Inputs Used to Select One of the Address Locations. Sampled at the rising edge of the
Synchronous CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A1:A0 are fed to
the two-bit counter.
BWA, BWB,
BWC, BWD
InputByte Write Select Inputs, Active LOW. Qualified with BWE to conduct byte writes to the SRAM.
Synchronous Sampled on the rising edge of CLK.
GW
InputGlobal Write Enable Input, Active LOW. When asserted LOW on the rising edge of CLK, a global
Synchronous write is conducted (all bytes are written, regardless of the values on BWX and BWE).
BWE
InputByte Write Enable Input, Active LOW. Sampled on the rising edge of CLK. This signal must be
Synchronous asserted LOW to conduct a byte write.
CLK
InputClock
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE1
InputChip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE and CE to select or deselect the device. ADSP is ignored if CE is HIGH. CE is sampled only
2
3
1
1
when a new external address is loaded.
CE2
InputChip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE3 to select or deselect the device. CE2 is sampled only when a new external address is
loaded.
CE3
InputChip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE2 to select or deselect the device. CE3 is sampled only when a new external address is
loaded.
OE
InputOutput Enable, Asynchronous Input, Active LOW. Controls the direction of the I/O pins. When
Asynchronous LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input
data pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
InputAdvance Input Signal, Sampled on the Rising Edge of CLK, Active LOW. When asserted, it
Synchronous automatically increments the address in a burst cycle.
ADSP
InputAddress Strobe from Processor, Sampled on the Rising Edge of Clk, Active LOW. When
Synchronous asserted LOW, addresses presented to the device are captured in the address registers. A1:A0 are
also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is
recognized. ASDP is ignored when CE1 is deasserted HIGH.
ADSC
InputAddress Strobe from Controller, Sampled on the Rising Edge of CLK, Active LOW. When
Synchronous asserted LOW, addresses presented to the device are captured in the address registers. A1:A0 are
also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is
recognized.
ZZ
InputZZ Sleep Input. This active HIGH input places the device in a non-time critical sleep condition with
Asynchronous data integrity preserved. For normal operation, this pin must be LOW or left floating. ZZ pin has an
internal pull down.
DQs, DQPX
I/OBidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered by
Synchronous the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by the addresses presented during the previous clock rise of the read cycle. The direction of the pins
is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and
DQPX are placed in a tri-state condition.
VDD
Power Supply Power Supply Inputs to the Core of the Device.
Document Number: 001-43822 Rev. *F
Page 6 of 31
CY7C1380S
CY7C1382S
Pin Definitions (continued)
Name
VSS
I/O
Ground
Description
Ground for the Core of the Device.
VSSQ
I/O Ground
Ground for the I/O Circuitry.
VDDQ
I/O Power
Supply
Power Supply for the I/O Circuitry.
MODE
Input-Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left
floating selects interleaved burst sequence. This is a strap pin and must remain static during device
operation. Mode pin has an internal pull up.
TDO
JTAG serial Serial Data Out to the JTAG Circuit. Delivers data on the negative edge of TCK. If the JTAG feature
output
is not being utilized, this pin must be disconnected. This pin is not available on TQFP packages.
Synchronous
TDI
JTAG serial Serial Data In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG feature is not
input
being utilized, this pin can be disconnected or connected to VDD. This pin is not available on TQFP
Synchronous packages.
TMS
JTAG serial Serial Data In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not
input
being utilized, this pin can be disconnected or connected to VDD. This pin is not available on TQFP
Synchronous packages.
TCK
JTAGClock
Clock Input to the JTAG circuitry. If the JTAG feature is not being utilized, this pin must be
connected to VSS. This pin is not available on TQFP packages.
NC
–
No Connects. 36M, 72M, 144M, 288M, 576M and 1G are address expansion pins and are not
internally connected to the die.
Functional Overview
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (tCO) is 3.4 ns (167 MHz device).
The CY7C1380S/CY7C1382S supports secondary cache in
systems utilizing a linear or interleaved burst sequence. The
interleaved burst order supports Pentium® and i486
processors. The linear burst sequence is suited for processors
that use a linear burst sequence. The burst order is user
selectable, and is determined by sampling the MODE input.
Accesses can be initiated with either the processor address
strobe (ADSP) or the controller address strobe (ADSC). Address
advancement through the burst sequence is controlled by the
ADV input. A two-bit on-chip wraparound burst counter captures
the first address in a burst sequence and automatically
increments the address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BWE) and byte write select (BWX) inputs. A global write enable
(GW) overrides all byte write inputs and writes data to all four
bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Three synchronous chip selects (CE1, CE2, CE3) and an
asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. ADSP is ignored if CE1 is
HIGH.
Document Number: 001-43822 Rev. *F
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE1, CE2, CE3 are all asserted active, and (3) the write
signals (GW, BWE) are all deserted HIGH. ADSP is ignored if
CE1 is HIGH. The address presented to the address inputs (A)
is stored into the address advancement logic and the address
register while being presented to the memory array. The
corresponding data is allowed to propagate to the input of the
output registers. At the rising edge of the next clock the data is
allowed to propagate through the output register and onto the
data bus within 3.4 ns (167 MHz device) if OE is active LOW. The
only exception occurs when the SRAM is emerging from a
deselected state to a selected state, its outputs are always
tri-stated during the first cycle of the access. After the first cycle
of the access, the outputs are controlled by the OE signal.
Consecutive single read cycles are supported. After the SRAM
is deselected at clock rise by the chip select and either ADSP or
ADSC signals, its output tri-states immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both of the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE1,
CE2, CE3 are all asserted active. The address presented to A is
loaded into the address register and the address advancement
logic while being delivered to the memory array. The write signals
(GW, BWE, and BWX) and ADV inputs are ignored during this
first cycle.
Page 7 of 31
CY7C1380S
CY7C1382S
ADSP triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the
corresponding address location in the memory array. If GW is
HIGH, then the write operation is controlled by BWE and BWX
signals.
The CY7C1380S/CY7C1382S provides byte write capability that
is described in the write cycle descriptions table. Asserting the
byte write enable input (BWE) with the selected byte write (BWX)
input, selectively writes the desired bytes. Bytes not selected
during a byte write operation remains unaltered. A synchronous
self-timed write mechanism has been provided to simplify the
write operations.
The CY7C1380S/CY7C1382S is a common I/O device, the
output enable (OE) must be deserted HIGH before presenting
data to the DQs inputs. Doing so tri-states the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever a
write cycle is detected, regardless of the state of OE.
Single Write Accesses Initiated by ADSC
ADSC write accesses are initiated when the following conditions
are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deserted
HIGH, (3) CE1, CE2, CE3 are all asserted active, and (4) the
appropriate combination of the write inputs (GW, BWE, and
BWX) are asserted active to conduct a write to the desired
byte(s). ADSC-triggered Write accesses require a single clock
cycle to complete. The address presented to A is loaded into the
address register and the address advancement logic while being
delivered to the memory array. The ADV input is ignored during
this cycle. If a global write is conducted, the data presented to
the DQs is written into the corresponding address location in the
memory core. If a byte write is conducted, only the selected bytes
are written. Bytes not selected during a byte write operation
remains unaltered. A synchronous self-timed write mechanism
has been provided to simplify the write operations.
The CY7C1380S/CY7C1382S is a common I/O device, the
output enable (OE) must be deserted HIGH before presenting
data to the DQs inputs. Doing so tri-states the output drivers. As
a safety precaution, DQs are automatically tri-stated whenever a
write cycle is detected, regardless of the state of OE.
Burst Sequences
The CY7C1380S/CY7C1382S provides a two-bit wraparound
counter, fed by A1:A0, that implements an interleaved or a linear
burst sequence. The interleaved burst sequence is designed
specifically to support Intel Pentium applications. The linear
burst sequence is designed to support processors that follow a
linear burst sequence. The burst sequence is user selectable
through the MODE input.
Asserting ADV LOW at clock rise automatically increments the
burst counter to the next address in the burst sequence. Both
read and write burst operations are supported.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation sleep mode. Two clock cycles
are required to enter into or exit from this sleep mode. While in
this mode, data integrity is guaranteed. Accesses pending when
entering the sleep mode are not considered valid nor is the
completion of the operation guaranteed. The device must be
deselected prior to entering the sleep mode. CE1, CE2, CE3,
ADSP, and ADSC must remain inactive for the duration of tZZREC
after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address
A1:A0
00
01
10
11
Second
Address
A1:A0
01
00
11
10
Third
Address
A1:A0
10
11
00
01
Fourth
Address
A1:A0
11
10
01
00
Third
Address
A1:A0
10
11
00
01
Fourth
Address
A1:A0
11
00
01
10
Linear Burst Address Table
(MODE = GND)
First
Address
A1:A0
00
01
10
11
Second
Address
A1:A0
01
10
11
00
ZZ Mode Electrical Characteristics
Parameter
IDDZZ
tZZS
tZZREC
tZZI
tRZZI
Description
Sleep mode standby current
Device operation to ZZ
ZZ recovery time
ZZ Active to sleep current
ZZ Inactive to exit sleep current
Document Number: 001-43822 Rev. *F
Test Conditions
ZZ > VDD– 0.2 V
ZZ > VDD – 0.2 V
ZZ < 0.2 V
This parameter is sampled
This parameter is sampled
Min
–
–
2tCYC
–
0
Max
80
2tCYC
–
2tCYC
–
Unit
mA
ns
ns
ns
ns
Page 8 of 31
CY7C1380S
CY7C1382S
Truth Table
Operation [1, 2, 3, 4, 5]
Add. Used
CE1 CE2 CE3 ZZ ADSP ADSC ADV WRITE OE CLK
X
X
L
X
L
X
X
X
DQ
Deselect Cycle, Power Down
None
H
L–H Tri-State
Deselect Cycle, Power Down
None
L
L
X
L
L
X
X
X
X
L–H Tri-State
Deselect Cycle, Power Down
None
L
X
H
L
L
X
X
X
X
L–H Tri-State
Deselect Cycle, Power Down
None
L
L
X
L
H
L
X
X
X
L–H Tri-State
Deselect Cycle, Power Down
None
L
X
H
L
H
L
X
X
X
L–H Tri-State
Sleep Mode, Power Down
None
X
X
X
H
X
X
X
X
X
X
Tri-State
READ Cycle, Begin Burst
External
L
H
L
L
L
X
X
X
L
L–H
Q
READ Cycle, Begin Burst
External
L
H
L
L
L
X
X
X
H
L–H Tri-State
WRITE Cycle, Begin Burst
External
L
H
L
L
H
L
X
L
X
L–H
D
READ Cycle, Begin Burst
External
L
H
L
L
H
L
X
H
L
L–H
Q
READ Cycle, Begin Burst
External
L
H
L
L
H
L
X
H
H
L–H Tri-State
READ Cycle, Continue Burst
Next
X
X
X
L
H
H
L
H
L
L–H
READ Cycle, Continue Burst
Next
X
X
X
L
H
H
L
H
H
L–H Tri-State
READ Cycle, Continue Burst
Next
H
X
X
L
X
H
L
H
L
L–H
READ Cycle, Continue Burst
Next
H
X
X
L
X
H
L
H
H
L–H Tri-State
WRITE Cycle, Continue Burst
Next
X
X
X
L
H
H
L
L
X
L–H
D
WRITE Cycle, Continue Burst
Next
H
X
X
L
X
H
L
L
X
L–H
D
READ Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
H
L
L–H
Q
READ Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
H
H
L–H Tri-State
READ Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
H
L
L–H
READ Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
H
H
L–H Tri-State
WRITE Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
L
X
L–H
D
WRITE Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
L
X
L–H
D
Q
Q
Q
Notes
1. X = Don't Care, H = Logic HIGH, L = Logic LOW.
2. WRITE = L when any one or more byte write enable signals, and BWE = L or GW = L. WRITE = H when all byte write enable signals, BWE, GW = H.
3. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
4. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after the
ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to tri-state. OE is a don't care for the
remainder of the write cycle.
5. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive
or when the device is deselected, and all data bits behave as output when OE is active (LOW).
Document Number: 001-43822 Rev. *F
Page 9 of 31
CY7C1380S
CY7C1382S
Truth Table for Read/Write
Function (CY7C1380S) [6, 7]
GW
BWE
BWD
BWC
BWB
BWA
Read
H
H
X
X
X
X
Read
H
L
H
H
H
H
Write Byte A – (DQA and DQPA)
Write Byte B – (DQB and DQPB)
H
L
H
H
H
L
H
L
H
H
L
H
Write Bytes B, A
H
L
H
H
L
L
Write Byte C – (DQC and DQPC)
H
L
H
L
H
H
Write Bytes C, A
H
L
H
L
H
L
Write Bytes C, B
H
L
H
L
L
H
Write Bytes C, B, A
H
L
H
L
L
L
Write Byte D – (DQD and DQPD)
H
L
L
H
H
H
Write Bytes D, A
H
L
L
H
H
L
Write Bytes D, B
H
L
L
H
L
H
Write Bytes D, B, A
H
L
L
H
L
L
Write Bytes D, C
H
L
L
L
H
H
Write Bytes D, C, A
H
L
L
L
H
L
Write Bytes D, C, B
H
L
L
L
L
H
Write All Bytes
H
L
L
L
L
L
Write All Bytes
L
X
X
X
X
X
GW
BWE
BWB
BWA
Read
H
H
X
X
Read
H
L
H
H
Write Byte A – (DQA and DQPA)
Write Byte B – (DQB and DQPB)
H
L
H
L
H
L
L
H
Write Bytes B, A
H
L
L
L
Write All Bytes
H
L
L
L
Write All Bytes
L
X
X
X
Truth Table for Read/Write
Function (CY7C1382S) [6, 7]
Notes
6. X = Don't Care, H = Logic HIGH, L = Logic LOW.
7. Table only lists a partial listing of the byte write combinations. Any combination of BWX is valid. Appropriate write is done based on which byte write is active.
Document Number: 001-43822 Rev. *F
Page 10 of 31
CY7C1380S
CY7C1382S
IEEE 1149.1 Serial Boundary Scan (JTAG)
The CY7C1380S incorporates a serial boundary scan test
access port (TAP).This part is fully compliant with 1149.1. The
TAP operates using JEDEC-standard 3.3 V or 2.5 V I/O logic
levels.
The CY7C1380S contains a TAP controller, instruction register,
boundary scan register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternately be connected to VDD through a pull up resistor. TDO
must be left unconnected. Upon power up, the device is up in a
reset state and does not interfere with the operation of the
device.
Test Access Port (TAP)
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information about
loading the instruction register, see the TAP Controller State
Diagram on page 13. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) of any register.
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine (see Identification Codes on page 17).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This Reset does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
At power up, the TAP is reset internally to ensure that TDO
comes up in a High Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
scan data in and out of the SRAM test circuitry. Only one register
can be selected at a time through the instruction register. Data is
Document Number: 001-43822 Rev. *F
serially loaded into the TDI ball on the rising edge of TCK. Data
is output on the TDO ball on the falling edge of TCK.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO balls as shown in the TAP Controller Block Diagram on
page 14. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary ‘01’ pattern to allow for
fault isolation of the board-level serial test data path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This shifts data through the SRAM with
minimal delay. The bypass register is set LOW (VSS) when the
BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
balls when the controller is moved to the Shift-DR state. The
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can
be used to capture the contents of the input and output ring.
The Boundary Scan Order on page 18 show the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI, and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in the Identification Register Definitions on
page 17.
TAP Instruction Set
Overview
Eight different instructions are possible with the three bit
instruction register. All combinations are listed in Identification
Codes on page 17. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in detail below.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction after it is shifted in, the TAP controller is moved
into the Update-IR state.
Page 11 of 31
CY7C1380S
CY7C1382S
EXTEST
The EXTEST instruction drives the preloaded data out through
the system output pins. This instruction also connects the
boundary scan register for serial access between the TDI and
TDO in the Shift-DR controller state.
IDCODE
The IDCODE instruction loads a vendor-specific 32-bit code into
the instruction register. It also places the instruction register
between the TDI and TDO balls and shifts the IDCODE out of the
device when the TAP controller enters the Shift-DR state.
The IDCODE instruction is loaded into the instruction register
upon power up or whenever the TAP controller is supplied a test
logic reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO balls when the TAP controller is in a
Shift-DR state. The SAMPLE Z command places all SRAM
outputs into a High Z state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is captured
in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. As there is a
large difference in the clock frequencies, it is possible that during
the Capture-DR state, an input or output undergoes a transition.
The TAP may then try to capture a signal while in transition
(metastable state). This does not harm the device, but there is
no guarantee as to the value that is captured. Repeatable results
may not be possible.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
Document Number: 001-43822 Rev. *F
still possible to capture all other signals and simply ignore the
value of the CK and CK# captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
PRELOAD places an initial data pattern at the latched parallel
outputs of the boundary scan register cells prior to the selection
of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required; that is, while data captured is
shifted out, the preloaded data is shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
EXTEST Output Bus Tri-State
IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tri-state mode.
The boundary scan register has a special bit located at bit #89
(for 165-ball FBGA package). When this scan cell, called the
“extest output bus tri-state,” is latched into the preload register
during the Update-DR state in the TAP controller, it directly
controls the state of the output (Q-bus) pins, when the EXTEST
is entered as the current instruction. When HIGH, it enables the
output buffers to drive the output bus. When LOW, this bit places
the output bus into a High Z condition.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that cell,
during the Shift-DR state. During Update-DR, the value loaded
into that shift-register cell latches into the preload register. When
the EXTEST instruction is entered, this bit directly controls the
output Q-bus pins. Note that this bit is preset HIGH to enable the
output when the device is powered up, and also when the TAP
controller is in the Test-Logic-Reset state.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 12 of 31
CY7C1380S
CY7C1382S
TAP Controller State Diagram
1
TEST-LOGIC
RESET
0
0
RUN-TEST/
IDLE
1
SELECT
DR-SCAN
1
SELECT
IR-SCAN
0
1
0
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-DR
UPDATE-IR
1
0
1
EXIT1-DR
0
1
0
1
0
The 0 or 1 next to each state represents the value of TMS at the rising edge of TCK.
Document Number: 001-43822 Rev. *F
Page 13 of 31
CY7C1380S
CY7C1382S
TAP Controller Block Diagram
0
Bypass Register
2 1 0
TDI
Selection
Circuitry
Instruction Register
31 30 29 . . . 2 1 0
S election
Circuitr y
TDO
Identification Register
x . . . . . 2 1 0
Boundary Scan Register
TCK
TMS
Document Number: 001-43822 Rev. *F
TAP CONTROLLER
Page 14 of 31
CY7C1380S
CY7C1382S
TAP Timing
Figure 3. TAP Timing
Test Clock
(TCK)
t
t TH
t TMSS
t TMSH
t TDIS
t TDIH
TL
t CYC
Test Mode Select
(TMS)
Test Data-In
(TDI)
t TDOV
t TDOX
Test Data-Out
(TDO)
DON’T CARE
UNDEFINED
TAP AC Switching Characteristics
Over the Operating Range
Parameter [8, 9]
Description
Min
Max
Unit
50
–
ns
Clock
tTCYC
TCK Clock Cycle Time
tTF
TCK Clock Frequency
–
20
MHz
tTH
TCK Clock HIGH time
20
–
ns
tTL
TCK Clock LOW time
20
–
ns
tTDOV
TCK Clock LOW to TDO Valid
–
10
ns
tTDOX
TCK Clock LOW to TDO Invalid
0
–
ns
tTMSS
TMS Setup to TCK Clock Rise
5
–
ns
tTDIS
TDI Setup to TCK Clock Rise
5
–
ns
tCS
Capture Setup to TCK Rise
5
–
ns
tTMSH
TMS Hold after TCK Clock Rise
5
–
ns
tTDIH
TDI Hold after Clock Rise
5
–
ns
tCH
Capture Hold after Clock Rise
5
–
ns
Output Times
Setup Times
Hold Times
Notes
8. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
9. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns.
Document Number: 001-43822 Rev. *F
Page 15 of 31
CY7C1380S
CY7C1382S
3.3 V TAP AC Test Conditions
2.5 V TAP AC Test Conditions
Input pulse levels ...............................................VSS to 3.3 V
Input pulse levels ............................................... VSS to 2.5 V
Input rise and fall times ...................................................1 ns
Input rise and fall time ................................................... 1 ns
Input timing reference levels ......................................... 1.5 V
Input timing reference levels ....................................... 1.25 V
Output reference levels ................................................ 1.5 V
Output reference levels .............................................. 1.25 V
Test load termination supply voltage ............................ 1.5 V
Test load termination supply voltage .......................... 1.25 V
3.3 V TAP AC Output Load Equivalent
2.5 V TAP AC Output Load Equivalent
1.5V
1.25V
50Ω
50Ω
TDO
TDO
Z O= 50 Ω
Z O= 50 Ω
20pF
20pF
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < TA < +70 °C; VDD = 3.3 V ± 0.165 V unless otherwise noted)
Parameter [10]
Description
Min
Max
Unit
IOH = –4.0 mA, VDDQ = 3.3 V
Test Conditions
2.4
–
V
IOH = –1.0 mA, VDDQ = 2.5 V
2.0
–
V
IOH = –100 µA
VDDQ = 3.3 V
2.9
–
V
VDDQ = 2.5 V
2.1
–
V
VDDQ = 3.3 V
–
0.4
V
VDDQ = 2.5 V
–
0.4
V
VDDQ = 3.3 V
–
0.2
V
–
0.2
V
2.0
VDD + 0.3
V
1.7
VDD + 0.3
V
–0.3
0.8
V
VOH1
Output HIGH Voltage
VOH2
Output HIGH Voltage
VOL1
Output LOW Voltage
IOL = 8.0 mA
VOL2
Output LOW Voltage
IOL = 100 µA
VDDQ = 2.5 V
VIH
Input HIGH Voltage
VDDQ = 3.3 V
VDDQ = 2.5 V
VIL
Input LOW Voltage
VDDQ = 3.3 V
VDDQ = 2.5 V
–0.3
0.7
V
IX
Input Load Current
–5
5
µA
GND < VIN < VDDQ
Note
10. All voltages referenced to VSS (GND).
Document Number: 001-43822 Rev. *F
Page 16 of 31
CY7C1380S
CY7C1382S
Identification Register Definitions
CY7C1380S
(512 K × 36)
Instruction Field
Revision Number (31:29)
000
Device Depth (28:24) [11]
01011
Description
Describes the version number.
Reserved for internal use.
Device Width (23:18) 165-FBGA
000000
Defines the memory type and architecture.
Cypress Device ID (17:12)
100101
Defines the width and density.
Cypress JEDEC ID Code (11:1)
00000110100
ID Register Presence Indicator (0)
1
Allows unique identification of SRAM vendor.
Indicates the presence of an ID register.
Scan Register Sizes
Register Name
Bit Size (× 36)
Instruction
3
Bypass
1
ID
32
Boundary Scan Order (165-ball FBGA package)
89
Identification Codes
Instruction
Code
Description
EXTEST
000
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM outputs to High Z state.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z
010
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM output drivers to a High Z state.
RESERVED
011
Do Not Use. This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation.
RESERVED
101
Do Not Use. This instruction is reserved for future use.
RESERVED
110
Do Not Use. This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note
11. Bit #24 is 1 in the register definitions for both 2.5 V and 3.3 V versions of this device.
Document Number: 001-43822 Rev. *F
Page 17 of 31
CY7C1380S
CY7C1382S
Boundary Scan Order
165-ball BGA [12, 13]
Bit #
Ball ID
Bit #
Ball ID
Bit #
Ball ID
1
N6
31
D10
61
G1
2
N7
32
C11
62
D2
3
N10
33
A11
63
E2
4
P11
34
B11
64
F2
5
P8
35
A10
65
G2
6
R8
36
B10
66
H1
7
R9
37
A9
67
H3
8
P9
38
B9
68
J1
9
P10
39
C10
69
K1
10
R10
40
A8
70
L1
11
R11
41
B8
71
M1
12
H11
42
A7
72
J2
13
N11
43
B7
73
K2
14
M11
44
B6
74
L2
15
L11
45
A6
75
M2
16
K11
46
B5
76
N1
17
J11
47
A5
77
N2
18
M10
48
A4
78
P1
19
L10
49
B4
79
R1
20
K10
50
B3
80
R2
21
J10
51
A3
81
P3
22
H9
52
A2
82
R3
23
H10
53
B2
83
P2
24
G11
54
C2
84
R4
25
F11
55
B1
85
P4
26
E11
56
A1
86
N5
27
D11
57
C1
87
P6
28
G10
58
D1
88
R6
89
Internal
29
F10
59
E1
30
E10
60
F1
Notes
12. Balls which are NC (No Connect) are pre-set LOW.
13. Bit# 89 is pre-set HIGH.
Document Number: 001-43822 Rev. *F
Page 18 of 31
CY7C1380S
CY7C1382S
Maximum Ratings
DC Input Voltage ................................ –0.5 V to VDD + 0.5 V
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature ............................... –65 °C to +150 °C
Ambient Temperature with
Power Applied ......................................... –55 °C to +125 °C
Supply Voltage on VDD Relative to GND .....–0.3 V to +4.6 V
Supply Voltage on VDDQ Relative to GND .... –0.3 V to +VDD
DC Voltage Applied to Outputs
in Tri-State ........................................–0.5 V to VDDQ + 0.5 V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ......................... > 2001 V
Latch-up Current ................................................... > 200 mA
Operating Range
Range
Commercial
Ambient
Temperature
0 °C to +70 °C
VDD
VDDQ
3.3 V– 5% / 2.5 V – 5% to
+ 10%
VDD
Electrical Characteristics
Over the Operating Range
Parameter [14, 15]
Description
VDD
Power Supply Voltage
VDDQ
I/O Supply Voltage
VOH
VOL
VIH
VIL
IX
IOZ
IDD [16]
Test Conditions
for 3.3 V I/O
for 2.5 V I/O
Output HIGH Voltage
for 3.3 V I/O, IOH = –4.0 mA
for 2.5 V I/O, IOH = –1.0 mA
Output LOW Voltage
for 3.3 V I/O, IOL = 8.0 mA
for 2.5 V I/O, IOL = 1.0 mA
Input HIGH Voltage [14]
for 3.3 V I/O
for 2.5 V I/O
Input LOW Voltage [14]
for 3.3 V I/O
for 2.5 V I/O
Input Leakage Current except ZZ GND  VI  VDDQ
and MODE
Input Current of MODE
Input = VSS
Input = VDD
Input Current of ZZ
Input = VSS
Input = VDD
Output Leakage Current
GND  VI  VDDQ, Output Disabled
VDD Operating Supply Current
VDD = Max, IOUT = 0 mA,
6.0-ns cycle,
f = fMAX = 1/tCYC
167 MHz
ISB1
Automatic CE Power Down
Current—TTL Inputs
ISB2
Automatic CE Power Down
Current-CMOS Inputs
ISB3
Automatic CE Power Down
Current—CMOS Inputs
ISB4
Automatic CE Power Down
Current—TTL Inputs
VDD = Max, Device Deselected,
VIN  VIH or VIN  VIL,
f = fMAX = 1/tCYC
VDD = Max, Device Deselected,
VIN  0.3 V or VIN > VDDQ – 0.3 V,
f=0
VDD = Max, Device Deselected,
VIN  0.3 V or VIN > VDDQ – 0.3 V,
f = fMAX = 1/tCYC
VDD = Max, Device Deselected,
VIN  VIH or VIN  VIL, f = 0
Min
3.135
3.135
2.375
2.4
2.0
–
–
2.0
1.7
–0.3
–0.3
–5
Max
Unit
3.6
V
VDD
V
2.625
V
–
V
–
V
0.4
V
0.4
V
VDD + 0.3 V
V
VDD + 0.3 V
V
0.8
V
0.7
V
5
A
–30
–
–5
–
–5
–
–
5
–
30
5
275
A
A
A
A
A
mA
6.0-ns cycle,
167 MHz
–
140
mA
6.0-ns cycle,
167 MHz
–
70
mA
6.0-ns cycle,
167 MHz
–
125
mA
6.0-ns cycle,
167 MHz
–
80
mA
Notes
14. Overshoot: VIH(AC) < VDD + 1.5 V (pulse width less than tCYC/2), undershoot: VIL(AC) > –2 V (pulse width less than tCYC/2).
15. TPower up: Assumes a linear ramp from 0 V to VDD(Min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
16. The operation current is calculated with 50% read cycle and 50% write cycle.
Document Number: 001-43822 Rev. *F
Page 19 of 31
CY7C1380S
CY7C1382S
Capacitance
Parameter [17]
Description
CIN
Input capacitance
CCLK
Clock input capacitance
CIO
Input/Output capacitance
100-pin TQFP 165-ball FBGA Unit
Package
Package
Test Conditions
TA = 25 °C, f = 1 MHz,
VDD = 3.3 V, VDDQ = 2.5 V
5
9
pF
5
9
pF
5
9
pF
Thermal Resistance
Parameter [17]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
100-pin TQFP 165-ball FBGA Unit
Package
Package
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, in accordance with
EIA/JESD51.
28.66
20.7
°C/W
4.08
4.0
°C/W
AC Test Loads and Waveforms
Figure 4. AC Test Loads and Waveforms
3.3 V I/O Test Load
R = 317 
3.3 V
OUTPUT
OUTPUT
RL = 50 
Z0 = 50 
GND
5 pF
R = 351 
VT = 1.5 V
INCLUDING
JIG AND
SCOPE
(a)
2.5 V I/O Test Load
OUTPUT
RL = 50 
Z0 = 50 
VT = 1.25 V
(a)
10%
(c)
ALL INPUT PULSES
VDDQ
INCLUDING
JIG AND
SCOPE
 1 ns
(b)
GND
5 pF
90%
10%
90%
 1 ns
R = 1667 
2.5 V
OUTPUT
ALL INPUT PULSES
VDDQ
R = 1538 
(b)
10%
90%
10%
90%
 1 ns
 1 ns
(c)
Note
17. Tested initially and after any design or process change that may affect these parameters.
Document Number: 001-43822 Rev. *F
Page 20 of 31
CY7C1380S
CY7C1382S
Switching Characteristics
Over the Operating Range
Parameter [18, 19]
Description
167 MHz
Unit
Min
Max
VDD(typical) to the first access [20]
1
–
ms
tCYC
Clock cycle time
6
–
ns
tCH
Clock HIGH
2.2
–
ns
tCL
Clock LOW
2.2
–
ns
tPOWER
Clock
Output Times
tCO
Data output valid after CLK rise
–
3.4
ns
tDOH
Data output hold after CLK rise
1.3
–
ns
1.3
–
ns
–
3.4
ns
–
3.4
ns
0
–
ns
–
3.4
ns
[21, 22, 23]
tCLZ
Clock to low Z
tCHZ
Clock to high Z [21, 22, 23]
tOEV
OE LOW to output valid
tOELZ
tOEHZ
OE LOW to output low Z
[21, 22, 23]
OE HIGH to output high Z
[21, 22, 23]
Setup Times
tAS
Address setup before CLK rise
1.5
–
ns
tADS
ADSC, ADSP setup before CLK rise
1.5
–
ns
tADVS
ADV setup before CLK rise
1.5
–
ns
tWES
GW, BWE, BWX setup before CLK rise
1.5
–
ns
tDS
Data input setup before CLK rise
1.5
–
ns
tCES
Chip enable setup before CLK rise
1.5
–
ns
tAH
Address hold after CLK rise
0.5
–
ns
tADH
ADSP, ADSC hold after CLK rise
0.5
–
ns
tADVH
ADV hold after CLK rise
0.5
–
ns
tWEH
GW, BWE, BWX hold after CLK rise
0.5
–
ns
tDH
Data input hold after CLK rise
0.5
–
ns
tCEH
Chip enable hold after CLK rise
0.5
–
ns
Hold Times
Notes
18. Timing reference level is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V.
19. Test conditions shown in (a) of Figure 4 on page 20 unless otherwise noted.
20. This part has a voltage regulator internally; tPOWER is the time that the power is supplied above VDD(minimum) initially before a read or write operation can be initiated.
21. tCHZ, tCLZ, tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of Figure 4 on page 20. Transition is measured ±200 mV from steady-state voltage.
22. At any voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus.
These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High Z
prior to Low Z under the same system conditions.
23. This parameter is sampled and not 100% tested.
Document Number: 001-43822 Rev. *F
Page 21 of 31
CY7C1380S
CY7C1382S
Switching Waveforms
Figure 5. Read Cycle Timing [24]
t CYC
CLK
t
t
ADS
CH
t
CL
t
ADH
ADSP
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
t WES
A3
Burst continued with
new base address
tWEH
GW, BWE,
BWx
t CES
Deselect
cycle
tCEH
CE
t ADVS
tADVH
ADV
ADV
suspends
burst.
OE
t OEHZ
t CLZ
Data Out (Q)
High-Z
Q(A1)
t OEV
t CO
t OELZ
t DOH
Q(A2)
t CHZ
Q(A2 + 1)
Q(A2 + 2)
Q(A2 + 3)
Q(A2)
Q(A2 + 1)
t CO
Burst wraps around
to its initial state
Single READ
BURST READ
DON’T CARE
UNDEFINED
Note
24. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
Document Number: 001-43822 Rev. *F
Page 22 of 31
CY7C1380S
CY7C1382S
Switching Waveforms (continued)
Figure 6. Write Cycle Timing [25, 26]
t CYC
CLK
tCH
t ADS
tCL
tADH
ADSP
t ADS
ADSC extends burst
tADH
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
A3
Byte write signals are
ignored for first cycle when
ADSP initiates burst
t WES tWEH
BWE,
BW X
t WES tWEH
GW
t CES
tCEH
CE
t
t
ADVS ADVH
ADV
ADV suspends burst
OE
t DS
Data In (D)
High-Z
t
OEHZ
tDH
D(A1)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
Data Out (Q)
BURST READ
Single WRITE
BURST WRITE
DON’T CARE
Extended BURST WRITE
UNDEFINED
Notes
25. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
26. Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW.
Document Number: 001-43822 Rev. *F
Page 23 of 31
CY7C1380S
CY7C1382S
Switching Waveforms (continued)
Figure 7. Read/Write Cycle Timing [27, 28, 29]
tCYC
CLK
tCL
tCH
t ADS
tADH
t AS
tAH
ADSP
ADSC
ADDRESS
A1
A2
A3
A4
A5
A6
t WES tWEH
BWE,
BW X
t CES
tCEH
CE
ADV
OE
t DS
tCO
tDH
t OELZ
Data In (D)
High-Z
tCLZ
Data Out (Q)
High-Z
Q(A1)
tOEHZ
D(A5)
D(A3)
Q(A2)
Back-to-Back READs
Q(A4)
Single WRITE
Q(A4+1)
BURST READ
DON’T CARE
Q(A4+2)
D(A6)
Q(A4+3)
Back-to-Back
WRITEs
UNDEFINED
Notes
27. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
28. The data bus (Q) remains in high Z following a WRITE cycle, unless a new read access is initiated by ADSP or ADSC.
29. GW is HIGH.
Document Number: 001-43822 Rev. *F
Page 24 of 31
CY7C1380S
CY7C1382S
Switching Waveforms (continued)
Figure 8. ZZ Mode Timing [30, 31]
CLK
t
ZZ
I
t
t
ZZ
ZZREC
ZZI
SUPPLY
I
t RZZI
DDZZ
ALL INPUTS
(except ZZ)
Outputs (Q)
DESELECT or READ Only
High-Z
DON’T CARE
Notes
30. Device must be deselected when entering ZZ mode. See Truth Table on page 9 for all possible signal conditions to deselect the device.
31. DQs are in high Z when exiting ZZ sleep mode.
Document Number: 001-43822 Rev. *F
Page 25 of 31
CY7C1380S
CY7C1382S
Ordering Information
The following table contains only the parts that are currently available. If you do not see what you are looking for, contact your local
sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary page
at http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
Speed
(MHz)
167
Ordering Code
CY7C1380S-167AXC
Package
Diagram
Part and Package Type
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Operating
Range
Commercial
CY7C1382S-167AXC
CY7C1380S-167BZC
51-85180 165-ball FBGA (13 × 15 × 1.4 mm)
Ordering Code Definitions
CY
7
C 138X S - 167 XX X
C
Temperature Range:
C = Commercial
Pb-free
Package Type: XX = A or BZ
A = 100-pin TQFP
BZ = 165-ball FBGA
Frequency Range: 167 MHz
Die Revision
Part Identifier: 138X = 1380 or 1382
1380 = SCD, 512 K × 36 (18 Mb)
1382 = SCD, 1 Mb × 18 (18 Mb)
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 001-43822 Rev. *F
Page 26 of 31
CY7C1380S
CY7C1382S
Package Diagrams
Figure 9. 100-pin TQFP (14 × 20 × 1.4 mm) A100RA Package Outline, 51-85050
51-85050 *D
Document Number: 001-43822 Rev. *F
Page 27 of 31
CY7C1380S
CY7C1382S
Package Diagrams (continued)
Figure 10. 165-ball FBGA (13 × 15 × 1.4 mm) BB165D/BW165D (0.5 Ball Diameter) Package Outline, 51-85180
51-85180 *F
Document Number: 001-43822 Rev. *F
Page 28 of 31
CY7C1380S
CY7C1382S
Acronyms
Acronym
Document Conventions
Description
Units of Measure
BGA
Ball grid array
CMOS
Complementary Metal Oxide Semiconductor
°C
degree Celsius
FBGA
Fine-Pitch Ball Grid Array
MHz
megahertz
I/O
Input/Output
µA
microampere
JTAG
Joint Test Action Group
mA
milliampere
LSB
Least Significant Bit
mm
millimeter
MSB
Most Significant Bit
ms
millisecond
OE
Output Enable
mV
millivolt
SRAM
Static Random Access Memory
ns
nanosecond
TAP
Test Access Port

ohm
TCK
Test Clock
%
percent
TMS
Test Mode Select
pF
picofarad
TDI
Test Data-In
V
volt
TDO
Test Data-Out
W
watt
TQFP
Thin Quad Flat Pack
WE
Write Enable
Document Number: 001-43822 Rev. *F
Symbol
Unit of Measure
Page 29 of 31
CY7C1380S
CY7C1382S
Document History Page
Document Title: CY7C1380S/CY7C1382S,18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM
Document Number: 001-43822
Rev.
ECN No.
Issue Date
Orig. of
Change
**
1897927
See ECN
VKN /
AESA
New data sheet.
*A
2082246
See ECN
JASM
Changed status from Preliminary to Final.
*B
2904797
04/05/10
VKN
Updated Ordering Information (Removed inactive parts).
Updated Package Diagrams.
*C
2956375
06/19/10
VKN
Updated Ordering Information (Updated part numbers).
Updated Package Diagrams (Removed spec 51-85115).
*D
3218966
04/07/2011
NJY
Added Ordering Code Definitions.
Updated Package Diagrams.
Added Acronyms and Units of Measure.
Updated in new template.
*E
3571224
04/03/2012
PRIT
Updated Functional Description (Removed the Note “For best practices or
recommendations, please refer to the Cypress application note AN1064,
SRAM System Design Guidelines on www.cypress.com.” and its reference,
removed the Note “CE3, CE2 are for 100-pin TQFP and 165-ball FBGA
packages only. 119-ball BGA is offered only in 1 chip enable.” and its
reference).
Updated Selection Guide (Removed 250 MHz, and 200 MHz frequencies
related information).
Updated Pin Configurations (Removed 119-ball BGA package related
information and 165-ball FBGA package related information (only for
CY7C1382S).
Updated Pin Definitions (Removed the Note “CE3, CE2 are for 100-pin TQFP
and 165-ball FBGA packages only. 119-ball BGA is offered only in 1 chip
enable.” and its reference).
Updated Functional Overview (Removed 250 MHz, and 200 MHz frequencies
related information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG) (Removed CY7C1382S
related information).
Updated Identification Register Definitions (Removed 119-ball BGA package
related information, removed CY7C1382S related information).
Updated Scan Register Sizes (Removed Bit Size (× 18) column).
Updated Boundary Scan Order (Removed 119-ball BGA package related
information).
Updated Operating Range (Removed Industrial Temperature range).
Updated Electrical Characteristics (Removed 250 MHz, and 200 MHz
frequencies related information).
Updated Capacitance (Removed 119-ball BGA package related information).
Updated Thermal Resistance (Removed 119-ball BGA package related
information).
Updated Switching Characteristics (Removed 250 MHz, and 200 MHz
frequencies related information).
Updated Package Diagrams (Removed 119-ball BGA package related
information).
Replaced all instances of IO with I/O across the document.
*F
3975671
04/20/2013
PRIT
Updated Package Diagrams:
spec 51-85180 – Changed revision from *E to *F.
Description of Change
Completing Sunset Review.
Document Number: 001-43822 Rev. *F
Page 30 of 31
CY7C1380S
CY7C1382S
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
cypress.com/go/interface
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
cypress.com/go/memory
cypress.com/go/image
PSoC
Touch Sensing
cypress.com/go/psoc
cypress.com/go/touch
USB Controllers
Wireless/RF
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2008-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-43822 Rev. *F
Revised April 20, 2013
Page 31 of 31
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