REVISIONS LTR DESCRIPTION DATE APPROVED A Add released devices and a footnote to Table I. Make change to lead temperature value as specified under 1.3. 04-09-16 R. MONNIN B Add case Y. Make changes to 1.2.2, 1.3, and figure 1, and figure 2. - ro 06-01-19 R. MONNIN Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY TOM HESS 03-03-12 TITLE MICROCIRCUIT, LINEAR, CURRENT MODE PULSE WIDTH MODULATOR CONTROLLER, MONOLITHIC SILICON APPROVED BY RAYMOND MONNIN SIZE CODE IDENT. NO. A REV AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DWG NO. V62/03625 16236 B PAGE 1 OF 15 5962-V043-06 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance current mode pulse width modulator controller microcircuit, with an operating temperature range of -55°C to +125°C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/03625 - Drawing number 01 Y E Device type (See 1.2.1) Case outline (See 1.2.2) Lead finish (See 1.2.3) 1.2.1 Device type(s). Device type 01 02 03 04 Generic Undervoltage lockout ON Circuit function UC1842A-EP UC1843A-EP UC1844A-EP UC1845A-EP Pulse width modulator Pulse width modulator Pulse width modulator Pulse width modulator Undervoltage lockout OFF 16 V 8.5 V 16 V 8.5 V 10 V 7.9 V 10 V 7.9 V 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins X Y 14 8 JEDEC PUB 95 Package style MS-012 MS-012-AA Plastic small outline Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator A B C D E Z DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Material Hot solder dip Tin-lead plate Gold plate Palladium Gold flash palladium Other SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 2 1.3 Absolute maximum ratings. 1/ 2/ VCC voltage (low impedance source) ......................................................................... 30 V VCC voltage (ICC mA) ................................................................................................ Self limiting Output current (IO) ..................................................................................................... ±1 A Output energy (capacitive load) ................................................................................. 5 µJ Analog inputs ( VFB and ISENSE pins) ....................................................................... -0.3 V to 6.3 V Error amp output sink current ..................................................................................... 10 mA Power dissipation (PD) at TA < +25°C ........................................................................ 1 W Package thermal impedance, (θJA) (case Y only) ...................................................... 97°C/W 3/ Storage temperature range (TSTG) ............................................................................ -65°C to 150°C Lead temperature soldering 1.6 mm (1/16 inch) from case for 10 seconds ................ +260°C 1.4 Recommended operating conditions. 4/ Supply voltage (VCC) ................................................................................................. 15 V Operating free-air temperature range (TA) ................................................................. -55°C to +125°C 1/ 2/ 3/ 4/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals. Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 3 2. APPLICABLE DOCUMENTS JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http://www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. B. C. Manufacturer’s name, CAGE code, or logo Pin 1 identifier ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as shown in figure 3. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ Temperature, TA Limits Device type Unit Min Max 4.95 5.05 V Reference section TJ = +25°C All VIN = 12 V to 25 V -55°C to +125°C All 20 mV IO = 1 mA to 20 mA -55°C to +125°C All 25 mV 3/ 4/ -55°C to +125°C All 0.4 mV/°C -55°C to +125°C All 5.1 V TJ = +25°C All +125°C All -55°C to +125°C All TJ = +25°C All Output voltage VOUT IO = 1 mA Line regulation voltage VLINE Load regulation voltage VLOAD Temperature stability Total output variation voltage VTV Line, load, temperature Output noise voltage VON f = 10 Hz to 10 kHz Long term stability Output short circuit current 1,000 hours 3/ 3/ IOS 4.9 µV 50 typical 25 mV -30 -180 mA 47 57 kHz 1 % Oscillator section Initial accuracy 5/ Voltage stability VCC = 12 V to 25 V -55°C to +125°C All Temperature stability 3/ -55°C to +125°C All 5 typical % Amplitude peak-to peak VRT / CT pin 3/ -55°C to +125°C All 1.7 typical V TJ = +25°C All Discharge current IDISC VRT / CT pin = 2 V 6/ TJ = -55°C to +125°C 7.8 8.8 7.5 8.8 mA See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 5 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ 2/ Limits Device type Temperature, TA Unit Min Max 2.45 2.55 V -1 µA Error amplifier section -55°C to +125°C All -55°C to +125°C All -55°C to +125°C All 65 dB TJ = +25°C All 0.7 MHz VCC = 12 V to 25 V -55°C to +125°C All 60 dB ISINK FB = 2.7 V, COMP = 1.1 V -55°C to +125°C All 2 mA Output source current ISOURCE FB = 2.3 V, COMP = 5 V -55°C to +125°C All -0.5 mA Output voltage high VOUTH FB = 2.3 V, RL = 15 kΩ to GND -55°C to +125°C All 5 V Output voltage low VOUTL FB = 2.7 V, RL = 15 kΩ to VREF -55°C to +125°C All Gain 7/ 8/ -55°C to +125°C All Maximum input signal COMP = 5 V 7/ -55°C to +125°C All VCC = 12 V to 25 V 7/ -55°C to +125°C All -55°C to +125°C All -10 µA -55°C to +125°C All 300 ns Input voltage VIN COMP = 2.5 V Input bias current IIB Open loop voltage gain AVOL VO = 2 V to 4 V Unity gain bandwidth UGBW 3/ Power supply rejection ratio PSRR Output sink current 1.1 V 2.85 3.15 V/V 0.9 1.1 V Current sense section Power supply rejection ratio PSRR Input bias current IIB Delay to output ISENSE = 0 V to 2 V 3/ 70 typical dB See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 6 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ 2/ Limits Device type Temperature, TA Min Unit Max Output (OUT) section Low-level output voltage VOL -55°C to +125°C IOUT = 20 mA All 0.4 2.2 IOUT = 200 mA High-level output voltage VOH V -55°C to +125°C IOUT = -20 mA All 13 V 12 IOUT = -200 mA Rise time tr CL = 1 nF 3/ TJ = +25°C All 150 ns Fall time tf CL = 1 nF 3/ TJ = +25°C All 150 ns -55°C to +125°C All 1.2 V -55°C to +125°C 01,03 15 17 V 02,04 7.8 9 01,03 9 11 02,04 7 8.2 Undervoltage lockout saturation VCC = 5 V, IOUT = 10 mA Undervoltage lockout section Start threshold -55°C to +125°C Minimum operation voltage after turn on V See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 7 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ 2/ Temperature, TA Limits Device type Unit Min Max 01,02 94 100 03,04 47 50 PWM section -55°C to +125°C Maximum duty cycle % -55°C to +125°C All 0 % -55°C to +125°C All 0.5 mA FB = 0 V, SENSE = 0 V -55°C to +125°C All 17 mA ICC = 25 mA -55°C to +125°C All Minimum duty cycle Total standby current section Start up current ISU Operating supply current ICC VCC internal zener voltage 30 V 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, VCC = 15 V, RT = 10 kΩ, CT = 3.3 nF and TA = TJ. Adust VCC above the start threshold before settling at 15 V. 3/ Not production tested. 4/ Temperature stability, sometimes referred to as average temperature coefficient, is described by the equation: Temp stability = [(VREF (max) – VREF (min)) / (TJ (max) – TJ (min))]. VREF (max) and VREF (min) are the maximum and minimum reference voltage measured over the appropriate temperature range. Note that the extremes in voltage do not necessarily occur at the extremes in temperature. 5/ Output frequency equals oscillator frequency for device types 01 and 02. Output frequency is one half oscillator frequency for device types 03 and 04. 6/ This parameter is measured with RT = 10 kΩ to VREF. This contributes approximately 300 µA of current to the measurement. The total current flowing into the RT / CT pin will be approximately 300 µA higher than the measured value. 7/ Parameter measured at trip point of latch with VFB at 0 V. 8/ Gain is defined by: A = ∆VCOMP / ∆VSENSE ; 0 ≤ VSENSE ≤ 0.8 V DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 8 Case X FIGURE 1. Case outlines – continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 9 Case X Dimensions Symbol Inches Millimeters Min Max Min Max A --- 0.069 --- 1.75 A1 0.004 0.010 0.10 0.25 b 0.014 0.020 0.35 0.51 c D 0.008 nominal 0.337 e 0.20 nominal 0.344 8.55 0.050 8.75 1.27 E 0.150 0.157 3.81 4.00 E1 0.228 0.244 5.80 6.20 L 0.016 0.044 0.40 1.12 n 14 leads 14 leads NOTE: 1. Controlling dimensions are inches, millimeters dimensions are given for reference only. 2. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 inch (0.15 mm). 3. Falls within JEDEC MS-012. FIGURE 1. Case outlines. – continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 10 Case Y FIGURE 1. Case outlines – Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 11 Case Y Dimensions Symbol Inches Millimeters Min Max Min Max A --- 0.069 --- 1.75 A1 0.004 0.010 0.10 0.25 b 0.012 0.020 0.31 0.51 c 0.007 0.010 0.17 0.25 D 0.189 0.197 4.80 5.00 E 0.150 0.157 3.80 4.00 E1 0.228 0.244 5.80 6.20 e L n 0.050 TYP 0.016 1.27 TYP 0.050 0.40 8 1.27 8 NOTES: 1. Controlling dimensions are inch, millimeter dimensions are given for reference only. 2. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inch (0.15 mm). 3. Falls with JEDEC MS-012-AA. FIGURE 1. Case outlines – Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 12 Device types Case outlines Terminal number All X Y Terminal symbol 1 COMP COMP 2 NC VFB 3 VFB ISENSE 4 NC RT / CT 5 ISENSE GND 6 NC OUTPUT 7 RT / CT VCC 8 PWR GND VREF 9 GND --- 10 OUTPUT --- 11 VC --- 12 VCC --- 13 NC --- 14 VREF --- NC = No connection FIGURE 2. Terminal connections. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 13 NOTE: Toggle flip flop used only in devices 03 and 04. FIGURE 3. Block diagram. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 14 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number Top-side marking V62/03625-01XE 2/ UC1842AMDREP 1842AME V62/03625-02XE 2/ UC1843AMDREP 1843AME V62/03625-03XE 2/ UC1844AMDREP 1844AME V62/03625-04XE 2/ UC1845AMDREP 1845AME V62/03625-01YE 01295 UC1842AMDREP 1842AME V62/03625-02YE 01295 UC1843AMDREP 1843AME V62/03625-03YE 01295 UC1844AMDREP 1844AME V62/03625-04YE 01295 UC1845AMDREP 1845AME 1/ 2/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. No longer available from approved source of supply. CAGE code 01295 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Source of supply Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 SIZE CODE IDENT NO. DWG NO. A 16236 V62/03625 REV B PAGE 15