Document No.001-88106 Rev. *A ECN # 4432506 Cypress Semiconductor Product Qualification Report QTP# 091501 VERSION *A July 2014 Powerline Communications Solution S4AD-5, Fab4 CY8CLED16P01 CY8CPLC10 CY8CPLC20 Integrated PLC Solution FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 13 Document No.001-88106 Rev. *A ECN # 4432506 PRODUCT QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp 052004 PSoC 8C21001A Neutron Product Family on SONOS S4AD-5 Technology, Fab4 Aug 05 091501 Qualify PLC Product Family May 09 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 13 Document No.001-88106 Rev. *A ECN # 4432506 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify PLC Product Family Transfer on S4AD-5 process at Fab4 Marketing Part #: CY8CPLC20 Device Description: 5V Industrial Powerline Communication Solution Cypress Division: Cypress Semiconductor Corporation – Data Communications Division TECHNOLOGY/FAB PROCESS DESCRIPTION S4AD-5 Number of Metal Layers: 2 Metal Composition: Metal 1: 500A TiW/6,000A Al 0.5% Cu /300A TiW Metal 2: 500A TiW/8,000A Al 0.5% Cu/300A TiW Passivation Type and Materials: 7,000A TEOS / 6,000A Si3N4 Generic Process Technology/Design Rule (drawn): Gate Oxide Material/Thickness (MOS): Single Poly, Double Metal, 0.35 m Name/Location of Die Fab (prime) Facility: Cypress Semiconductor – Minnesota Die Fab Line ID/Wafer Process ID: Fab 4, S4AD-5, SONOS SiO2 / 110A PACKAGE AVAILABILITY PACKAGE ASSEMBLY SITE FACILITY 28-Lead SSOP PHIL-M, CML-RA 48-Lead QFN KOREA-L 100-Lead TQFP CML-RA, JCET-JT Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 13 Document No.001-88106 Rev. *A ECN # 4432506 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: SP28 28-Lead SSOP Sumitomo EME-G600 V-O per UL94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: Ni-Pd-Au Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: 10-05678 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA °C/W: 90C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-09888 Name/Location of Assembly (prime) facility: Amkor Philippines (M) MSL Level 3 Reflow Profile 260C Test Location ELECTRICAL TEST / FINISH DESCRIPTION ELECTRICAL TEST / FINISH DESCRIPTION CML-R, KYEC Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 13 Document No.001-88106 Rev. *A ECN # 4432506 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Test Condition (Temp/Bias) Stress/Test Result P/F High Temperature Operating Life Early Failure Rate AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, Vcc Max = 5.5V, 125C P High Temperature Operating Life Latent Failure Rate AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, Vcc Max = 5.5V, 125C P High Accelerated Saturation Test (HAST) 130C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 1 P 168 Hrs, 85C/85%RH+3IR-Reflow, 260C+0, -5C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65C to 150C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH+3IR-Reflow, 260C+0, -5C P Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 1 Pressure Cooker P 168 Hrs, 85C/85%RH+3IR-Reflow, 260qC+0, -5C Data Retention 150C 5C No Bias P High Temperature Steady State life 125C, 5.5V, Vcc Max P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JESD22, Method A114-B P JESD22, Method A114-E Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V MIL-STD-883, Method 3015.7 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V ESD22-C101C P Endurance Test MIL-STD-883, Method 883-1033 P Age Bond Strength 200C, 4hrs MIL-STD-883, Method 883-2011 P Current Density Meets the Technology Device Level Reliability Specifications P Low Temperature Operating Life -30C, 5.5V, 8MHZ P SEM Analysis MIL-STD-883, Method 883-2018-2 P Acoustic Microscopy J-STD-020 P Dynamic Latch up 125C, 8.3V P Latch up Sensitivity 125C, 200mA, 300mA P In accordance with JEDEC 17 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 13 Document No.001-88106 Rev. *A ECN # 4432506 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal3 A.F Failure Rate High Temperature Operating Life Early Failure Rate1 2.445 Devices 0 N/A N/A 0 PPM High Temperature Operating Life1, 2 Long Term Failure Rate 780,750 DHRs 0 0 .7 55 21 FIT 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 Where: EA =The Activation Energy of the defect mechanism. k = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # 052004 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL1 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 15 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M COMP 15 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M COMP 15 0 STRESS: AGE BOND STRENGTH CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 10 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M COMP 10 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M COMP 10 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 500 256 0 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 1000 256 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 500 256 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 1000 254 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 500 252 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 1000 252 0 4516647 610521157 TAIWAN-T COMP 45 0 STRESS: ENDURANCE CY8C21534 (8C21534A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 9 0 CY8C21534 (8C21534A) 4516674 610522255 TAIWAN-T COMP 9 0 CY8C21534 (8C21534A) 4517851 610522404 TAIWAN-T COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 9 0 CY8C21534 (8C21534A) 4516674 610522255 TAIWAN-T COMP 9 0 CY8C21534 (8C21534A) 4517851 610522404 TAIWAN-T COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, (2,200V) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 3 0 CY8C21534 (8C21534A) 4516674 610522255 TAIWAN-T COMP 3 0 CY8C21534 (8C21534A) 4517851 610522404 TAIWAN-T COMP 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 052004 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 5.5V, Vcc Max) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 120 1002 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 120 1002 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 120 1002 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 5.5V, Vcc Max) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 750 235 0 CY8C21534 (8C21534A) 4517851 610522404 TAIWAN-T 750 235 0 CY8C21534 (8C21534A) 4516674 610522255 TAIWAN-T 750 235 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (125C, 5.5V) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 168 76 0 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 336 76 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 168 HR 85C/85%RH (MSL1) CY8C21234 (8C21234A) 4516647 610527569 PHIL-M 128 49 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 128 44 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 128 44 0 500 45 0 STRESS: LOW TEMPERATURE OPERATING LIFE (-30C, 5.5V) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 168 HR 85C/85%RH (MSL1) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 168 45 0 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 336 45 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 168 45 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 336 45 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 168 45 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 336 45 0 STRESS: STATIC LATCH-UP TESTING (125C, 11V, r300mA) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T COMP 3 0 CY8C21534 (8C21534A) 4516674 610522255 TAIWAN-T COMP 3 0 CY8C21534 (8C21534A) 4517851 610522404 TAIWAN-T COMP 3 0 610521157 TAIWAN-T COMP 3 0 STRESS: DYNAMIC LATCH-UP (8.3V) CY8C21534 (8C21534A) 4516647 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 052004 Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH (MSL1) CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 300 50 0 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 500 50 0 CY8C21534 (8C21534A) 4516647 610521157 TAIWAN-T 1000 50 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 300 45 0 CY8C21234 (8C21234A) 4516674 610521849 PHIL-M 1000 45 0 CY8C21234 (8C21234A) 4517851 610522407 PHIL-M 300 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 060201 Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CPLC20 4547386 610608768 PHIL-M COMP 15 0 CY8CPLC20 4548960 610608766 PHIL-M COMP 15 0 CY8CPLC20 4549207 610610435 PHIL-M COMP 15 0 PHIL-M COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CPLC20 4547386 610608768 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (2,200V) CY8CPLC20 4547386 610608768 PHIL-M COMP 8 0 STRESS: NVM ENDURANCE / DATA RETENTION TEST CY8CPLC20 4547386 610608768 PHIL-M 1008 79 0 CY8CPLC20 4548960 610608766 PHIL-M 1008 78 0 CY8CPLC20 4549207 610610435 PHIL-M 1008 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Max CY8CPLC20 4547386 610608768 PHIL-M 48 815 0 CY8CPLC20 4548960 610608766 PHIL-M 48 815 0 CY8CPLC20 4549207 610610435 PHIL-M 48 815 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 125C, 5.5V, Vcc Max CY8CPLC20 4547386 610608768 PHIL-M 1000 84 0 CY8CPLC20 4548960 610608766 PHIL-M 1000 84 0 CY8CPLC20 4549207 610610435 PHIL-M 1000 84 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8CPLC20 4547386 610608768 PHIL-M 96 80 0 CY8CPLC20 4547386 610608768 PHIL-M 168 80 0 CY8CPLC20 4548960 610608766 PHIL-M 96 79 0 CY8CPLC20 4548960 610608766 PHIL-M 168 79 0 CY8CPLC20 4549207 610610435 PHIL-M 96 76 0 CY8CPLC20 4549207 610610435 PHIL-M 168 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 060201 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, PRE COND 192 HR 30C/60%RH, MSL3 CY8CPLC20 4547386 610608768 PHIL-M 128 80 0 CY8CPLC20 4548960 610608766 PHIL-M 96 78 0 CY8CPLC20 4548960 610608766 PHIL-M 128 78 0 CY8CPLC20 4549207 610610435 PHIL-M 96 78 0 CY8CPLC20 4549207 610610435 PHIL-M 128 78 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8CPLC20 4547386 610608768 PHIL-M 500 80 0 CY8CPLC20 4547386 610608768 PHIL-M 1000 75 0 CY8CPLC20 4548960 610608766 PHIL-M 500 80 0 CY8CPLC20 4548960 610608766 PHIL-M 1000 79 0 CY8CPLC20 4549207 610610435 PHIL-M 1000 80 0 COMP 3 0 STRESS: STATIC LATCH-UP TESTING (125C, 8.50V, r200mA) CY8CPLC20 4547386 610608768 PHIL-M Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 082009 Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL, 250V CY8CPLC20 4824302 610837905 PHIL-M COMP 3 0 PHIL-M COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8CPLC20 4824302 610837905 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY8CPLC20 4824302 610837905 PHIL-M COMP 3 0 4824302 610837905 PHIL-M 1008 80 0 COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ENDURANCE CY8CPLC20 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 500V CY8CPLC20 4824302 610837905 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1000V CY8CPLC20 4824302 610837905 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1500V CY8CPLC20 4824302 610837905 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 2000V CY8CPLC20 4824302 610837905 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 4000V CY8CPLC20 4824302 610837905 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 6000V CY8CPLC20 4824302 610837905 PHIL-M COMP 3 0 610837905 PHIL-M COMP 30 0 COMP 6 0 COMP 3 0 STRESS: E-TEST DISTRIBUTION CY8CPLC20 4824302 STRESS: STATIC LATCH-UP TESTING, 125C, 7.88V, +/200mA CY8CPLC20 4824302 610837905 PHIL-M STRESS: STATIC LATCH-UP TESTING, 125C, 8.66V, +/240mA CY8CPLC20 4824302 610837905 PHIL-M Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 13 Document No.001-88106 Rev. *A ECN # 4432506 Document History Page Document Title: QTP# 091501: POWERLINE COMMUNICATIONS SOLUTION "CY8CLED16P01/CPLC10/CPLC20" S4AD-5, FAB4 Document Number: 001-88106 Rev. ECN Orig. of No. Change ** 4039416 HSTO *A 4432506 HSTO Description of Change Initial Spec Release Qualification report published on Cypress.com is documented on memo FDW-420 and was transferred to qualification report spec template. Updated package availability based on current qualified test & assembly site. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 13