484-FBGA (23 X 23MM) NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

484-FBGA (23x23mm)
Non Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BB
1254.7600 mg
1312.0509 mg
Body Size (mil/mm)
Package Weight – Site 2
23 x 23 mm
N/A
SUMMARY
The 484L-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are
RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above
allowable levels).
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 011707, 130803 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS
are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is
not considered Pb-Free or RoHS compliant.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
Analysis
Report
(Note 2)
0
0
38.1100
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
30,372
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75822 Rev *C
Page 1 of 5
484-FBGA (23x23mm)
Non Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Single die, silver filled epoxy die attach
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance
per
Homogenous
Material
PPM
% Weight of
Substance
per Package
SiO2
60676-86-0
46.2300
10.4899
36,844
3.6844
Acrylic
29690-82-2
40.5400
9.1988
32,309
3.2309
Epoxy
68541-56-0
Bisphenol
Triazol
Cu
13676-54-5
25722-66-1
7440-50-8
27.0600
66.0200
78.9600
173.3300
6.1401
14.9804
17.9165
39.3297
21,566
52,616
62,928
138,138
2.1566
5.2616
6.2928
13.8138
Ni
7440-02-0
Au
Br
Sn
Pb
Ag
Amine
Epoxy Resin
Si
Au
Ion Impurities
Silica Fused
Epoxy Resin
Phenolic Resin
Mixed Siloxanes
Brominated Resin
Silica
Antimony Trioxide
Carbon Black
Silica Cristobalite
Antimony
Pentoxide
7440-57-5
7726-95-6
7440-31-5
7439-92-1
7440-22-4
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
14808-60-7
1309-64-4
1333-86-4
14464-46-1
6.1300
2.1600
0.2800
64.8900
38.1100
79.1600
3.5100
17.5400
67.0000
16.8383
0.0017
368.9000
73.7800
31.6200
21.0800
9.4860
4.2160
4.2160
4.2160
4.2160
1.3909
0.4901
0.0635
63.0000
37.0000
78.9941
3.5026
17.5032
100.0000
99.9899
0.0101
70.0000
14.0000
6.0000
4.0000
1.8000
0.8000
0.8000
0.8000
0.8000
4,885
1,721
223
51,715
30,372
63,088
2,797
13,979
53,397
13,420
1
294,000
58,800
25,200
16,800
7,560
3,360
3,360
3,360
3,360
0.4885
0.1721
0.0223
5.1715
3.0372
6.3088
0.2797
1.3979
5.3397
1.3420
0.0001
29.4000
5.8800
2.5200
1.6800
0.7560
0.3360
0.3360%
0.3360
0.3360
5.2700
1.0000
4,200
0.4200
1309-64-4
Package Weight (mg):
1254.7600
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75822 Rev *C
Page 2 of 5
484-FBGA (23x23mm)
Non Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Stacked Die using DAF die attach
Material
Substrate
Solder Ball
Die Attach
SiO2
60676-86-0
46.2300
% Weight of
Substance
per
Homogenous
Material
10.4899
Acrylic
29690-82-2
40.5400
9.1988
30,898
3.0898
Epoxy
68541-56-0
27.0600
6.1401
20,624
2.0624
Bisphenol
Triazol
Cu
13676-54-5
25722-66-1
7440-50-8
66.0200
78.9600
173.3300
14.9804
17.9165
39.3297
50,318
60,181
132,106
5.0318
6.0181
13.2106
Ni
7440-02-0
6.1300
1.3909
4,672
0.4672
Au
Br
Sn
Pb
Modified epoxy
resin
Epoxy resin 1
Dapsone
Siloxanes and
silicones di-Me
Silane
Elastomeric
polymer
Epoxy resin
Si
Au
Ion Impurities
Silica Fused
Epoxy Resin
Phenolic Resin
Carbon Black
7440-57-5
7726-95-6
7440-31-5
7439-92-1
2.1600
0.2800
96.6200
56.7500
0.4901
0.0635
63.0000
37.0000
1,646
213
73,640
43,253
0.1646
0.0213
7.3640
4.3253
Trade Secret
24.3700
59.9951
18,574
1.8574
Trade Secret
80-08-0
10.1500
1.2200
24.9877
3.0034
7,736
930
0.7736
0.0930
67762-90-7
1.2200
3.0034
930
0.0930
Trade Secret
1.2200
3.0034
930
0.0930
Trade Secret
1.2200
3.0034
930
0.0930
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
1333-86-4
1.2200
103.2500
9.45
0.0009
496.9000
36.7000
28.2300
2.8200
3.0034
100.0000
99.9899
0.0101
88.0014
6.4996
4.9996
0.4994
930
78,694
7,202
1
378,720
27,971
21,516
2,149
0.0930
7.8694
0.7202
0.0001
37.8720
2.7971
2.1516
0.2149
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
1312.0509
PPM
% Weight of
Substance
per Package
35,235
3.5235
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75822 Rev *C
Page 3 of 5
484-FBGA (23x23mm)
Non Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
< 5.0
< 5.0
< 5.0
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Material
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75822 Rev *C
Page 4 of 5
484-FBGA (23x23mm)
Non Pb-Free Package
Document History Page
Document Title:
484-FBGA (23 X 23MM) NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number:
001-75822
**
Orig. of
Change
3509455 HLR
*A
4064088 YUM
*B
4642231 MLA
*C
5142476
Rev.
ECN No.
HLR
DCON
Description of Change
New document
Added assembly site name in the assembly heading.
Changed Assembly code to Assembly site name.
Added table B2 to support QTP# 130803. Add package
weight and QTP# to first page.
Changed the substances with “------------- “to “Trade Secret
Removed “Distribution: WEB” and “Posting: None” from history
page
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75822 Rev *C
Page 5 of 5
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