Document No.001-88092 Rev. ** ECN # 4039149 Cypress Semiconductor Automotive Product Qualification Report QTP# 070901 June 2013 USB 2.0 HUB (HX2LP) AUTOMOTIVE DEVICES C8QR-3R TECHNOLOGY, FAB 4 CY7C65630 CY7C65620 USB 2.0 High Speed Hub CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Zhaomin Ji Principal Reliability Engineer (408) 432-7021 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 11 Document No.001-88092 Rev. ** ECN # 4039149 PRODUCT QUALIFICATION HISTORY QUAL REPORT 070901 DESCRIPTION OF QUALIFICATION PURPOSE USB Hub (HX2LP) CY7C65630, C8Q-3R, Fab 4 Automotive Qual Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 11 DATE COMP. Aug 07 Document No.001-88092 Rev. ** ECN # 4039149 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify CY7C65630-56LFXA device for automotive application Marketing Part #: CY7C65630, CY7C65620 Device Description: 3.3V, Automotive A-grade, available in 56-Lead QFN package Cypress Division: Cypress Semiconductor Corporation – Consumer and Computation Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 4 Metal Composition: Metal 1: 100A Ti/3, 200A Al 0.5% Cu /300A TiW Metal 2: 150A Ti/4, 230A Al 0.5% Cu / 300A TiW Metal 3: 150A Ti/4, 230A Al 0.5% Cu / 300A TiW Metal 4: 150A Ti/8, 000A Al 0.5% Cu / 300A TiW Passivation Type and Materials: 1000A TEOS / 9,000A Si3N4 Generic Process Technology/Design Rule (µ-drawn): CMOS, 4 Metal, 0.13 µm Gate Oxide Material/Thickness (MOS): SiO2 DGOX 32/55A Name/Location of Die Fab (prime) Facility: Cypress Semiconductor-Bloomington, MN Die Fab Line ID/Wafer Process ID: Fab4, C8Q-3R PACKAGE AVAILABILITY ASSEMBLY FACILITY SITE PACKAGE 56-Lead QFN Amkor Korea (L), TAIWAN-G Note: Package Qualification details available upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 11 Document No.001-88092 Rev. ** ECN # 4039149 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Mold Compound Flammability Rating: LY56 56-pin Quad Flat No Lead (QFN) Sumitomo EME-G700 V-0 UL-94 Oxygen Rating Index: NA Lead Frame Material: Copper Lead Finish, Composition / Thickness: 100% Sn Matte Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Die Attach Supplier: Dexter/Ablestik Die Attach Material: 6290 Die Attach Method: Epoxy Dispensing Bond Diagram Designation: 10-06451 Wire Bond Method: Thermosonic Wire Material/Size: Au 1.0mil Thermal Resistance Theta JA °C/W : 30°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-10994 Name/Location of Assembly (prime) facility: Amkor Korea MSL Level: 3 Reflow Profile: 260C Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: 100% Saw ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KYEC,TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 11 Document No.001-88092 Rev. ** ECN # 4039149 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy Cypress Spec. 25-00104 P Ball Shear AEC-Q100-010 P Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC Q100-009 P High Temperature Operating Life Early Failure Rate AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, Vcc Max = 3.8V, 125°C P High Temperature Operating Life Latent Failure Rate JESD22-A108 Dynamic Operating Condition, Vcc Max = 3.8V, 125°C P AEC–Q100–002 P AEC–Q100–011 P External Visual JESD22-B100 P High Accelerated Saturation Test (HAST) JESD22-A110, 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C P High Temp Storage JESD22-A103, 150C P Pressure Cooker Test JESD22-A102, 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C P Physical Dimension JESD22B100 AND B108 P Post Temp Cycle Bond Pull Mil-Std 883, Method 2011 P Static Latch-up AEC-Q100-004 P Solderability JESD22-B102 P Temperature Cycle JESD22-A104, Condition C, -65°C to 150°C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C P Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 11 Document No.001-88092 Rev. ** ECN # 4039149 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life1,2 Long Term Failure Rate * Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 10,467 Devices 0 N/A N/A 0 PPM 251,000 DHR’s 0 0.7 55.4 66 FITs* Based on Automotive qual samples size not Commercial qual sample size. 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate.. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 k = Boltzmann's constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 11 Document No.001-88092 Rev. ** ECN # 4039149 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 070901 Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC MICROSCOPY (MSL3, 260C) CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 22 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 22 0 CY7C65630 (7C65630CC) 4638322 610617719 L-KOREA COMP 22 0 4642838 610709630 L-KOREA COMP 5 0 4642838 610709630 L-KOREA COMP 5 0 STRESS: BALL SHEAR CY7C65630 (7C65630CC) STRESS: BOND PULL CY7C65630 (7C65630CC) STRESS: ELECTRICAL DISTRIBUTION CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 30 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 30 0 CY7C65630 (7C65630CC) 4638322 610617719 L-KOREA COMP 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – EARLY FAILURE RATE, 125C, 3.8V, Vcc Max CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 48 85 0 CY7C65630 (7C65630CC) 4642838 610711410P2 L-KOREA 48 290 0 CY7C65630 (7C65630CC) 4642838 610711416P2 L-KOREA 48 867 0 CY7C65630 (7C65630CC) 4642838 610711410P1 L-KOREA 48 839 0 CY7C65630 (7C65630CC) 4642838 610709630P3 L-KOREA 48 875 0 CY7C65630 (7C65630CC) 4642838 610711410P3 L-KOREA 48 30 0 CY7C65630 (7C65630CC) 4642838 610711416P1 L-KOREA 48 278 0 CY7C65630 (7C65630CC) 4642838 610709630P5 L-KOREA 48 190 0 CY7C65630 (7C65630CC) 4642838 610711416P3 L-KOREA 48 40 0 CY7C65630 (7C65630CC) 4639823 610712725P2 L-KOREA 48 127 0 CY7C65630 (7C65630CC) 4639823 610712728P1 L-KOREA 48 955 0 CY7C65630 (7C65630CC) 4639823 610712728P3 L-KOREA 48 194 0 CY7C65630 (7C65630CC) 4639823 610712725P1 L-KOREA 48 153 0 CY7C65630 (7C65630CC) 4639823 610712729P1 L-KOREA 48 280 0 CY7C65630 (7C65630CC) 4639823 610712729P2 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639823 610712725P3 L-KOREA 48 869 0 CY7C65630 (7C65630CC) 4639822 610717719P2 L-KOREA 48 862 0 CY7C65630 (7C65630CC) 4639822 610717719P1 L-KOREA 48 84 0 CY7C65630 (7C65630CC) 4639822 610717719P3 L-KOREA 48 37 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 11 Document No.001-88092 Rev. ** ECN # 4039149 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 070901 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – EARLY FAILURE RATE, 125C, 3.8V, Vcc Max CY7C65630 (7C65630CC) 4639822 610716238P2 L-KOREA 48 375 0 CY7C65630 (7C65630CC) 4639822 610716238P1 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639822 610717719P4 L-KOREA 48 161 0 CY7C65630 (7C65630CC) 4639822 610716671P1 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639822 610716671P2 L-KOREA 48 105 0 CY7C65630 (7C65630CC) 4639822 610716671P3 L-KOREA 48 161 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 STRESS: ESD - CHARGE DEVICE MODEL, 250V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - CHARGE DEVICE MODEL, 500V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - CHARGE DEVICE MODEL, 750V, Corner Pins Only CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - HUMAN BODY CIRCUIT, 500V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - HUMAN BODY CIRCUIT, 1000V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - HUMAN BODY CIRCUIT, 1500V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - HUMAN BODY CIRCUIT, 2000V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD - HUMAN BODY CIRCUIT, 4000V CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 3 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 458 0 CY7C65630 (7C65630CC) 4642838 610711410P2 L-KOREA COMP 290 0 CY7C65630 (7C65630CC) 4642838 610711416P2 L-KOREA COMP 867 0 CY7C65630 (7C65630CC) 4642838 610711410P1 L-KOREA COMP 839 0 CY7C65630 (7C65630CC) 4642838 610709630P3 L-KOREA COMP 875 0 CY7C65630 (7C65630CC) 4642838 610711410P3 L-KOREA COMP 30 0 CY7C65630 (7C65630CC) 4642838 610711416P1 L-KOREA COMP 278 0 CY7C65630 (7C65630CC) 4642838 610709630P5 L-KOREA COMP 190 0 CY7C65630 (7C65630CC) 4642838 610711416P3 L-KOREA COMP 40 0 STRESS: EXTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 11 Document No.001-88092 Rev. ** ECN # 4039149 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 070901 Assy Loc Duration Samp Rej Failure Mechanism STRESS: EXTERNAL VISUAL CY7C65630 (7C65630CC) 4639823 610712725P2 L-KOREA COMP 127 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 283 0 CY7C65630 (7C65630CC) 4639823 610712728P1 L-KOREA COMP 955 0 CY7C65630 (7C65630CC) 4639823 610712728P3 L-KOREA COMP 194 0 CY7C65630 (7C65630CC) 4639823 610712725P1 L-KOREA COMP 153 0 CY7C65630 (7C65630CC) 4639823 610712729P1 L-KOREA COMP 280 0 CY7C65630 (7C65630CC) 4639823 610712729P2 L-KOREA COMP 870 0 CY7C65630 (7C65630CC) 4639823 610712725P3 L-KOREA COMP 869 0 CY7C65630 (7C65630CC) 4639822 610717719P2 L-KOREA COMP 862 0 CY7C65630 (7C65630CC) 4639822 610717719P1 L-KOREA COMP 84 0 CY7C65630 (7C65630CC) 4639822 610717719P3 L-KOREA COMP 37 0 CY7C65630 (7C65630CC) 4639822 610716238P2 L-KOREA COMP 375 0 CY7C65630 (7C65630CC) 4639822 610716238P1 L-KOREA COMP 870 0 CY7C65630 (7C65630CC) 4639822 610717719P4 L-KOREA COMP 161 0 CY7C65630 (7C65630CC) 4639822 610716671P1 L-KOREA COMP 870 0 CY7C65630 (7C65630CC) 4639822 610716671P2 L-KOREA COMP 105 0 CY7C65630 (7C65630CC) 4639822 610716671P3 L-KOREA COMP 161 0 CY7C65630 (7C65630CC) 4639822 610717719 L-KOREA COMP 292 0 STRESS: HI – ACCEL STRESS TEST, 130C, 85%RH, 5.5V, PRE COND 192 HRS 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 96 77 0 CY7C65630 (7C65630CC) 4639823 610712728 L-KOREA 96 80 0 CY7C65630 (7C65630CC) 4638322 610617719 L-KOREA 96 79 0 L-KOREA 1000 77 0 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY7C65630 (7C65630CC) 4642838 610709630 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – LATENT FAILURE RATE, 125C, 3.8V, Vcc Max CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 1000 84 0 CY7C65630 (7C65630CC) 4639823 610712728P1 L-KOREA 1000 84 0 CY7C65630 (7C65630CC) 4638322 610717719P1 L-KOREA 1000 83 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15psig, , PRE COND 192 HRS 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 96 85 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 96 84 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 96 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 11 Document No.001-88092 Rev. ** ECN # 4039149 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 070901 Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 10 0 CY7C65630 (7C65630CC) 4639823 610712728 L-KOREA COMP 10 0 CY7C65630 (7C65630CC) 4638322 610716238 L-KOREA COMP 10 0 STRESS: POST TEMP CYCLE BOND PULL CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 5 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 5 0 CY7C65630 (7C65630CC) 4638322 610716238 L-KOREA COMP 5 0 STRESS: STATIC LATCH – UP TESTING, 125C, 5.2V, +100mA CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 6 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 15 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 15 0 CY7C65630 (7C65630CC) 4638322 610716238 L-KOREA COMP 15 0 STRESS: SOLDERABILITY STRESS: TEMPERATURE CYCLE TEST, 121C, 100%RH, 15psig, , PRE COND 192 HRS 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 500 90 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 500 85 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 500 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 11 Document No.001-88092 Rev. ** ECN # 4039149 Document History Page Document Title: QTP # 070901 : USB 2.0 HUB (HX2LP) AUTOMOTIVE DEVICES (CY7C65630, CY7C65620) C8QR-3R TECHNOLOGY, FAB 4 Document Number: 001-88092 Rev. ECN Orig. of No. Change ** 4039149 ILZ Description of Change Initial Spec Release Qualification report published on Cypress.com is documented on memo HGA-837 and not in spec format. Initiated spec for QTP 070901 and all data from memo# HGA-837 was transferred to qualification report spec template. Deleted package qualification details on package qualification history table. Deleted Cypress reference Spec and replaced with Industry Standards Updated package availability based on current qualified test & assembly site. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 11