031803:24/32/40/48/56-LEAD QFN PACKAGES, PURE SN, MSL3, 260C REFLOW AMKOR-KOREA (L) QUALIFICATION REPORT

Document No.001-68110 Rev. *A
ECN # 4321321
Cypress Semiconductor
Package Qualification Report
QTP 031803 VERSION *A
March 2014
24/32/40/48/56-Lead QFN Packages
Pure Sn, MSL3, 260°°C Reflow
Amkor- Korea (L)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
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Page 1 of 6
Document No.001-68110 Rev. *A
ECN # 4321321
PACKAGE QUALIFICATION HISTORY
QTP Number
031803
Description of the Qualification Purpose
24/32/40/48/56-Lead QFN package, Pb-Free , MSL3 @260°C Reflow using EME
G700 Ablebond 8290 and Pure Tin Plate assembled at Amkor-Korea (L)
Company Confidential
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Page 2 of 6
Date Comp
Jul 03
Document No.001-68110 Rev. *A
ECN # 4321321
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LF56
Package Outline, Type, or Name:
56-lead Quad Flat no Lead (QFN)
Mold Compound Name/Manufacturer:
EME G700
Mold Compound Flammability Rating:
V-O per UL94
Oxygen Rating Index:
>28%
Lead Frame Material:
C194H Dual Gage
Lead Finish, Composition / Thickness:
Pure Tin
Die Backside Preparation Method/Metallization:
Grinding
Die Separation Method:
Sawing
Die Attach Supplier:
Ablestik
Die Attach Material:
Ablebond 8290
Die Attach Method:
Dispensing
Wire Bond Method:
Thermosonic
Wire Material/Size:
Gold, 1.0mil
Thermal Resistance Theta JA °C/W:
23.27 °C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
49-10999M
Name/Location of Assembly (prime) facility:
Amkor-Korea (L)
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
ASE-Taiwan
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 3 of 6
Document No.001-68110 Rev. *A
ECN # 4321321
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Temperature Cycle
Precondition: JESD22 Moisture Sensitivity MSL3
P
(192 Hrs., 30C, 60% RH)
121°C, 100%RH, 15 Psig
Pressure Cooker Test
Precondition: JESD22 Moisture Sensitivity MSL3
P
(192 Hrs., 30C, 60% RH)
130 C, 85%RH, 3.63V
High Accelerated Saturation Test
(HAST)
Precondition: JESD22 Moisture Sensitivity Level
P
(192 Hrs., 30C, 60% RH)
Acoustic Microscopy
J-STD-020
P
External Visual
MIL-PRF-38535, MILSTD-883, METHOD 2009,
P
J-STD-002, JESD22-B102
Solderability , Steam Aged
P
95% solder coverage minimum
Adhesion of Lead Finish
MIL-STD-883, Method 2025 – Adhesion of Lead Finish
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Page 4 of 6
P
Document No.001-68110 Rev. *A
ECN # 4321321
Reliability Test Data
QTP #:
Device
031803
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
COMP
15
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
COMP
15
0
CY7C65640-LFC (7C65640C)
9108704
610308318M1
KOREA-L
COMP
15
0
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
COMP
15
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
COMP
15
0
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
COMP
3
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
COMP
3
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: EXTERNAL VISUAL
STRESS: SOLDERABILITY
STRESS: ADHESION OF LEAD FINISH
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
COMP
3
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
COMP
3
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
128
50
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
128
48
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
168
50
0
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3
CY7C65640-LFC (7C65640C)
9108704
610308318
KOREA-L
300
50
0
CY7C65640-LFC (7C65640C)
9108704
610308318M
KOREA-L
300
50
0
CY7C65640-LFC (7C65640C)
9108704
610308318M1
KOREA-L
300
50
0
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Page 5 of 6
Document No.001-68110 Rev. *A
ECN # 4321321
Document History Page
Document Title:
Qualification Report
Document Number:
031803: 24/32/40/48/56-Lead QFN Packages, Pure Sn, MSL3, 260C Reflow Amkor-Korea (L)
001-68110
Rev. ECN
Orig. of
No.
Change
**
3193503 NRG
*A
4321321 HSTO
Description of Change
Initial spec release
Changed 20L QFN to 24L QFN (Ref: LGQ-167 memo) on the Title
Page and Package Qualification History page.
Added Pure Sn on the Title Page
Updated the reliability test summary table using the new template.
Align qualification report based on the new template in the front page
Deleted Cypress reference specs 25-00104, 12-00292, 12-00103 and
25-00018 retained/replaced with industry standard
Distribution: WEB
Posting:
None
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Page 6 of 6
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