Document No.001-68110 Rev. *A ECN # 4321321 Cypress Semiconductor Package Qualification Report QTP 031803 VERSION *A March 2014 24/32/40/48/56-Lead QFN Packages Pure Sn, MSL3, 260°°C Reflow Amkor- Korea (L) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-68110 Rev. *A ECN # 4321321 PACKAGE QUALIFICATION HISTORY QTP Number 031803 Description of the Qualification Purpose 24/32/40/48/56-Lead QFN package, Pb-Free , MSL3 @260°C Reflow using EME G700 Ablebond 8290 and Pure Tin Plate assembled at Amkor-Korea (L) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 Date Comp Jul 03 Document No.001-68110 Rev. *A ECN # 4321321 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LF56 Package Outline, Type, or Name: 56-lead Quad Flat no Lead (QFN) Mold Compound Name/Manufacturer: EME G700 Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: C194H Dual Gage Lead Finish, Composition / Thickness: Pure Tin Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Sawing Die Attach Supplier: Ablestik Die Attach Material: Ablebond 8290 Die Attach Method: Dispensing Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.0mil Thermal Resistance Theta JA °C/W: 23.27 °C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-10999M Name/Location of Assembly (prime) facility: Amkor-Korea (L) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ASE-Taiwan Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-68110 Rev. *A ECN # 4321321 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 P (192 Hrs., 30C, 60% RH) 121°C, 100%RH, 15 Psig Pressure Cooker Test Precondition: JESD22 Moisture Sensitivity MSL3 P (192 Hrs., 30C, 60% RH) 130 C, 85%RH, 3.63V High Accelerated Saturation Test (HAST) Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30C, 60% RH) Acoustic Microscopy J-STD-020 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009, P J-STD-002, JESD22-B102 Solderability , Steam Aged P 95% solder coverage minimum Adhesion of Lead Finish MIL-STD-883, Method 2025 – Adhesion of Lead Finish Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 P Document No.001-68110 Rev. *A ECN # 4321321 Reliability Test Data QTP #: Device 031803 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L COMP 15 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L COMP 15 0 CY7C65640-LFC (7C65640C) 9108704 610308318M1 KOREA-L COMP 15 0 CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L COMP 15 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L COMP 15 0 CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L COMP 3 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L COMP 3 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: EXTERNAL VISUAL STRESS: SOLDERABILITY STRESS: ADHESION OF LEAD FINISH CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L COMP 3 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L COMP 3 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L 128 50 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L 128 48 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L 168 50 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C65640-LFC (7C65640C) 9108704 610308318 KOREA-L 300 50 0 CY7C65640-LFC (7C65640C) 9108704 610308318M KOREA-L 300 50 0 CY7C65640-LFC (7C65640C) 9108704 610308318M1 KOREA-L 300 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-68110 Rev. *A ECN # 4321321 Document History Page Document Title: Qualification Report Document Number: 031803: 24/32/40/48/56-Lead QFN Packages, Pure Sn, MSL3, 260C Reflow Amkor-Korea (L) 001-68110 Rev. ECN Orig. of No. Change ** 3193503 NRG *A 4321321 HSTO Description of Change Initial spec release Changed 20L QFN to 24L QFN (Ref: LGQ-167 memo) on the Title Page and Package Qualification History page. Added Pure Sn on the Title Page Updated the reliability test summary table using the new template. Align qualification report based on the new template in the front page Deleted Cypress reference specs 25-00104, 12-00292, 12-00103 and 25-00018 retained/replaced with industry standard Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6