Cypress Semiconductor Package Qualification Report QTP# 090603 VERSION 1.0 March 2009 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260°C Reflow Amkor-Phil (Phil-MB) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Cypress Semiconductor 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow Assembly: Amkor-Phil (Phil-MB) 090603 V.1.0 Page 2 of 6 March 2009 PACKAGE QUALIFICATION HISTORY QUAL REPORT 090603 DESCRIPTION OF QUALIFICATION PURPOSE To qualify 48QFN (7X7X1.0) Saw Type Pb-Free (NiPdAu-Ag) using AMK-06 epoxy, and Nitto 7470-LA Mold compound, MSL3 and 260C Reflow at Amkor Phil (P3) DATE COMP. Mar 09 Cypress Semiconductor 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow Assembly: Amkor-Phil (Phil-MB) 090603 V.1.0 Page 3 of 6 March 2009 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Mold Compound Alpha Emission Rate : LT48A 48- Quad Flat No Lead (QFN) 7470-LA Nitto UL-94 NA Oxygen Rating Index: NA Lead Frame Material: Copper Alloy Frame (C7025) Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation 001-48083 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 25°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: Amkor-Phil (Phil-M) Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Cypress Semiconductor 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow Assembly: Amkor-Phil (Phil-MB) 090603 V.1.0 Page 4 of 6 March 2009 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 3 Result P/F P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C High Accelerated Saturation Test 130°C, 3.63V, 3.8V Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Pressure Cooker Test 121°C, 100%, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Acoustics Microscopy MSL 3 Cypress Spec 12-00292 P Ball Shear Cypress Spec 12-00292 P Bond Pull Cypress Spec 12-00292 P Constructional Analysis Cypress Spec 25-20035 P Die Shear Cypress Spec 12-00292 P Dye Penetration test Cypress Spec 25-00046 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V Cypress Spec. 25-00020 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JESD22, Method A114-B P Final Visual Cypress Spec. 12-00292/25-00103 P Internal Visual Cypress Spec 12-00292/25-00017 P Physical Dimension Cypress Spec. 25-00031 P Solderability Cypress Spec 25-00018 P 125C, -55C Thermal Shock P Cypress Spec. 25-00014 X-Ray Cypress Spec 12-00292 P Cypress Semiconductor 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow Assembly: Amkor-Phil (Phil-MB) 090603 V.1.0 Page 5 of 6 March 2009 Reliability Test Data QTP #: Device 090603 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 15 0 4823626 610841281 PHIL-M COMP 10 0 4823626 610841281 PHIL-M COMP 10 0 4803351 610839924 PHIL-M COMP 5 0 4823626 610841281 PHIL-M COMP 10 0 STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY7C65640A (7C65642EC) STRESS: BOND PULL CY7C65640A (7C65642EC) STRESS: CONSTRUCTIONAL ANALYSIS CYWUSB6934 (7B6934BC) STRESS: DIE SHEAR CY7C65640A (7C65642EC) STRESS: DYE PENETRANT TEST CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 15 0 PHIL-M COMP 7 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CYWUSB6934 (7B6934BC) 4803351 610839923 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V CYWUSB6934 (7B6934BC) 4803351 610839923 PHIL-M COMP 8 0 4823626 610841281 PHIL-M COMP 996 0 STRESS: FINAL VISUAL CY7C65640A (7C65642EC) STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.8V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 128 77 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 128 77 0 4823626 610841281 PHIL-M COMP 5 0 STRESS: INTERNAL VISUAL CY7C65640A (7C65642EC) STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 168 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 168 77 0 Failure Mechanism Cypress Semiconductor 48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow Assembly: Amkor-Phil (Phil-MB) 090603 V.1.0 Page 6 of 6 March 2009 Reliability Test Data QTP #: Device Fab Lot # 090603 Assy Lot # Assy Loc Duration Samp Rej STRESS: PHYSICAL DIMENSION CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 30 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 5 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 5 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 5 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 500 77 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M 500 77 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M 1000 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 500 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 1000 77 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 200 77 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 1000 77 0 4823626 610841281 PHIL-M COMP 1 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 10 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 10 0 STRESS: WAFER THICKNESS CY7C65640A (7C65642EC) STRESS: X-RAY Failure Mechanism