090603 Rev1.0.pdf

Cypress Semiconductor
Package Qualification Report
QTP# 090603 VERSION 1.0
March 2009
48-QFN (7X7X1.0)
NiPdAu-Ag, MSL3, 260°C Reflow
Amkor-Phil (Phil-MB)
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Rene Rodgers
Reliability Engineer, MTS
(408) 943-2732
Mira Ben-Tzur
Quality Engineering Director
(408) 943-2675
Cypress Semiconductor
48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow
Assembly: Amkor-Phil (Phil-MB)
090603 V.1.0
Page 2 of 6
March 2009
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
090603
DESCRIPTION OF QUALIFICATION PURPOSE
To qualify 48QFN (7X7X1.0) Saw Type Pb-Free (NiPdAu-Ag) using AMK-06 epoxy,
and Nitto 7470-LA Mold compound, MSL3 and 260C Reflow at Amkor Phil (P3)
DATE
COMP.
Mar 09
Cypress Semiconductor
48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow
Assembly: Amkor-Phil (Phil-MB)
090603 V.1.0
Page 3 of 6
March 2009
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Mold Compound Alpha Emission Rate :
LT48A
48- Quad Flat No Lead (QFN)
7470-LA Nitto
UL-94
NA
Oxygen Rating Index:
NA
Lead Frame Material:
Copper Alloy Frame (C7025)
Lead Finish, Composition / Thickness:
NiPdAu-Ag
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Saw
Die Attach Supplier:
Henkel
Die Attach Material:
AMK-06
Die Attach Method:
Epoxy
Bond Diagram Designation
001-48083
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 0.8mil
Thermal Resistance Theta JA °C/W:
25°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-20659
Name/Location of Assembly (prime) facility:
Amkor-Phil (Phil-M)
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Cypress Semiconductor
48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow
Assembly: Amkor-Phil (Phil-MB)
090603 V.1.0
Page 4 of 6
March 2009
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Temperature Cycle
Test Condition
(Temp/Bias)
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity MSL 3
Result
P/F
P
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
High Accelerated Saturation Test
130°C, 3.63V, 3.8V
Precondition: JESD22 Moisture Sensitivity MSL 3
P
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
Pressure Cooker Test
121°C, 100%, 15 Psig
Precondition: JESD22 Moisture Sensitivity MSL 3
P
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
Acoustics Microscopy MSL 3
Cypress Spec 12-00292
P
Ball Shear
Cypress Spec 12-00292
P
Bond Pull
Cypress Spec 12-00292
P
Constructional Analysis
Cypress Spec 25-20035
P
Die Shear
Cypress Spec 12-00292
P
Dye Penetration test
Cypress Spec 25-00046
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
Cypress Spec. 25-00020
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JESD22, Method A114-B
P
Final Visual
Cypress Spec. 12-00292/25-00103
P
Internal Visual
Cypress Spec 12-00292/25-00017
P
Physical Dimension
Cypress Spec. 25-00031
P
Solderability
Cypress Spec 25-00018
P
125C, -55C
Thermal Shock
P
Cypress Spec. 25-00014
X-Ray
Cypress Spec 12-00292
P
Cypress Semiconductor
48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow
Assembly: Amkor-Phil (Phil-MB)
090603 V.1.0
Page 5 of 6
March 2009
Reliability Test Data
QTP #:
Device
090603
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
COMP
15
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
COMP
15
0
4823626
610841281
PHIL-M
COMP
10
0
4823626
610841281
PHIL-M
COMP
10
0
4803351
610839924
PHIL-M
COMP
5
0
4823626
610841281
PHIL-M
COMP
10
0
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
CY7C65640A (7C65642EC)
STRESS: BOND PULL
CY7C65640A (7C65642EC)
STRESS: CONSTRUCTIONAL ANALYSIS
CYWUSB6934 (7B6934BC)
STRESS: DIE SHEAR
CY7C65640A (7C65642EC)
STRESS: DYE PENETRANT TEST
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
COMP
15
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
COMP
15
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
COMP
15
0
PHIL-M
COMP
7
0
STRESS: ESD-CHARGE DEVICE MODEL, 500V
CYWUSB6934 (7B6934BC)
4803351
610839923
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V
CYWUSB6934 (7B6934BC)
4803351
610839923
PHIL-M
COMP
8
0
4823626
610841281
PHIL-M
COMP
996
0
STRESS: FINAL VISUAL
CY7C65640A (7C65642EC)
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.8V, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
128
77
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
128
77
0
4823626
610841281
PHIL-M
COMP
5
0
STRESS: INTERNAL VISUAL
CY7C65640A (7C65642EC)
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
168
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
168
77
0
Failure Mechanism
Cypress Semiconductor
48-QFN (7X7X1.0) NiPdAu-Ag, MSL3, 260C Reflow
Assembly: Amkor-Phil (Phil-MB)
090603 V.1.0
Page 6 of 6
March 2009
Reliability Test Data
QTP #:
Device
Fab Lot #
090603
Assy Lot #
Assy Loc
Duration Samp
Rej
STRESS: PHYSICAL DIMENSION
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
COMP
30
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
COMP
30
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
COMP
30
0
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
COMP
5
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
COMP
5
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
COMP
5
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
500
77
0
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
1000
77
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
500
77
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
1000
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
500
77
0
CYWUSB6934 (7B6934BC)
4803351
610839924
PHIL-M
1000
77
0
STRESS: THERMAL SHOCK COND. B – 55C TO 125C
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
200
77
0
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
1000
77
0
4823626
610841281
PHIL-M
COMP
1
0
CY7C65640A (7C65642EC)
4823626
610841281
PHIL-M
COMP
10
0
CY7C65640A (7C65642EC)
4823626
610841285
PHIL-M
COMP
10
0
STRESS: WAFER THICKNESS
CY7C65640A (7C65642EC)
STRESS: X-RAY
Failure Mechanism
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