Document No. 001-94957 Rev. *A ECN #: 4804542 Cypress Semiconductor Customer Specific Qualification Report QTP# 143801 VERSION*A June, 2015 130nm F-RAM Device Family 130nm Technology, TI Fab FM28V100-TG(TR) FM25V10-G(TR) FM25VN10-G(TR) FM25V05-G(TR) FM25V05-PGC FM24V10-G(TR) FM24VN10-G(TR) FM24V05-G(TR) CG8061AST CG8061AS CG8056AS CG8055AS CG8054AS CG8039AS CG8038AS CG8037AS CG8019AAT CG8019AA 1-Mbit (128 K × 8) Parallel F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 512-Kbit (64 K × 8) Serial (SPI) F-RAM Memory 512-Kbit (64 K × 8) Serial (SPI) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 512-Kbit (64 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Parallel F-RAM Memory 1-Mbit (128 K × 8) Parallel F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 512-Kbit (64 K × 8) Serial (SPI) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Serial (I2C) F-RAM Memory 512-Kbit (64 K × 8) Serial (I2C) F-RAM Memory 1-Mbit (128 K × 8) Parallel F-RAM Memory 1-Mbit (128 K × 8) Parallel F-RAM Memory FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number 143801 Description of Qualification Purpose Qualification of Additional Passivation Layers on F-RAM Products Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 13 Date Nov 2014 Document No. 001-94957 Rev. *A ECN #: 4804542 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualification of Additional Passivation Layers on F-RAM Products Device Description: FM28V100-TG(TR), FM25V10-G(TR), FM25VN10-G(TR), FM25V05-G(TR), FM25V05-PGC, FM24V10-G(TR), FM24VN10-G(TR), FM24V05-G(TR), CG8061AST, CG8061AS, CG8056AS, CG8055AS, CG8054AS, CG8039AS, CG8038AS, CG8037AS, CG8019AAT, CG8019AA F-RAM Cypress Division: Cypress Semiconductor Corporation – Memory Product Division (MPD) Marketing Part #: TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: Proprietary* Metal Composition: Proprietary* Proprietary* Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): CMOS / 130nm Gate Oxide Material/Thickness (MOS): Proprietary* Name/Location of Die Fab (prime) Facility: Texas Instruments / Dallas Die Fab Line ID/Wafer Process ID: DMOS 5 / E035.1 *Texas Instruments’ proprietary information is available with signed NDA. ALTERNATIVE PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE 8-Pin, 150mil SOIC UTAC, Thailand 8-Pin, 300mil PDIP UTAC, Thailand 32-Pin, TSOPI ASE, Taiwan Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ820 Mold Compound Flammability Rating: SOIC 8L (208mils) G600 / Sumitomo UL 94 V=0 pass Mold Compound Alpha Emission Rate: <0.1 Oxygen Rating Index: >28% 53% Lead Frame Designation: FMP Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: Matte Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Henkel Die Attach Material: 8200T Bond Diagram Designation 001-86136 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8 mil Thermal Resistance Theta JA C/W: 118 C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-85398 Name/Location of Assembly (prime) facility: UTAC, Thailand (UT) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: UTAC, Thailand / KYEC, Taiwan Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Aged Bond Strength 200°C, 4HRS MIL-STD-883, Method 883-2011 P Criteria: Meet external and internal characteristics of Constructional Analysis Cypress package P 125°C, 1000 Hours Data Retention JESD22-A117 and JESD22-A103 High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 85%RH, 3.6V, Precondition: JESD22 Moisture Sensitivity Level 3 P P 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C High Temperature Operating Life Dynamic Operating Condition, 125°C, 3.6V, 96 Hours Early Failure Rate (EFR) JESD22-A-108 High Temperature Operating Life Dynamic Operating Condition, 125°C, 3.6V, 168,1000 Hours Latent Failure Rate (LFR) JESD22-A-108 Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 3 P P P 96 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65 °C to 150°C, 500 cycles Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 13 P Document No. 001-94957 Rev. *A ECN #: 4804542 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 3600 Devices 0 N/A N/A 0 PPM High Temperature Operating Life Long Term Failure Rate 1,009,000 DHRs 0 0.7 170 16 FIT * 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T 2 is the junction temperature of the device at use conditions. *Data leveraged from QTP# 133203: Qualification of Additional Passivation (4000A SiOxNy & 4000A Si3N4) Layers on F-RAM Products Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: ACOUSTIC, MSL3 CY15B102Q-SXE 4351641 611410018 UTAC COMP 22 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 15 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 15 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 15 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 15 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 15 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 15 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP 30 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP 30 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 UTAC COMP 5 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: AGED BOND PULL (200C, 4 Hours) CY15B102Q-SXE 4351641 611410018 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: CLASS YIELD CY15B102Q-SXE 4351641 611410018 UTAC COMP EQUIVALENT FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP EQUIVALENT FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP EQUIVALENT STRESS: CONSTRUCTIONAL ANALYSIS FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611340083 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 STRESS: DATA RETENTION, 125C CY15B102Q-SXE 4351641 611410018 UTAC 500 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 75 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 500 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.6V), PRE COND 128 HR 30C/60%RH (MSL3) CY15B102Q-SXE 4351641 611410018 UTAC 96 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 128 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 256 73 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 256 73 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 256 72 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 128 63 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 128 63 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 128 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 128 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 128 66 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 128 66 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.6V, Vcc Max) CY15B102Q-SXE 4351641 611410018 UTAC 96 500 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 1200 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 1800 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 100 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 96 800 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 96 792 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 96 799 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 96 799 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 96 800 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 96 799 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.6V, Vcc Max)- Continued FM25V02-G (FM25V02A) 2327007 611339585 UTAC 96 800 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 96 798 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 96 798 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.6V, Vcc Max) FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 168 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 168 57 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 168 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.6V, Vcc Max)- Continued FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY15B102Q-SXE 4351641 611410018 UTAC 96 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 288 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 288 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 288 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 168 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 288 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 168 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 288 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 168 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 288 77 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP EQUIVALENT FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP EQUIVALENT FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP EQUIVALENT STRESS: SORT YIELD Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY15B102Q-SXE 4351641 611410018 UTAC 500 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 1,000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 500 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 13 Document No. 001-94957 Rev. *A ECN #: 4804542 Document History Page Document Title: Document Number: QTP#143801: 130NM F-RAM DEVICE FAMILY, 130NM TECHNOLOGY, TI FAB 001-94957 Rev. ECN No. ** *A Orig. of Change BECK BECK 4557925 4804542 Description of Change Initial release Indicated “Proprietary” Items on the “TECHNOLOGY/FAB PROCESS DESCRIPTION” Table, Page 3, and removed proprietary items from Page 2 (Qualification History) and Page 3 (Product Description). Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 13