PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV321IDBVR SOT-23 DBV 5 3000 178.0 9.0 LMV321IDBVT SOT-23 DBV 5 250 178.0 LMV321IDBVT SOT-23 DBV 5 250 180.0 LMV321IDCKR SC70 DCK 5 3000 LMV321IDCKR SC70 DCK 5 LMV321IDCKT SC70 DCK LMV321IDCKT SC70 DCK LMV324IDR SOIC W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 LMV324IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV324IDRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV324IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV324IPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV324QDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV324QPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV358IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 LMV358IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IDR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2014 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LMV358QDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 LMV358QDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV358QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV321IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 LMV321IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 LMV321IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 LMV321IDCKR SC70 DCK 5 3000 205.0 200.0 33.0 LMV321IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 LMV321IDCKT SC70 DCK 5 250 205.0 200.0 33.0 LMV321IDCKT SC70 DCK 5 250 180.0 180.0 18.0 LMV324IDR SOIC D 14 2500 364.0 364.0 27.0 LMV324IDR SOIC D 14 2500 333.2 345.9 28.6 LMV324IDRG4 SOIC D 14 2500 333.2 345.9 28.6 LMV324IPWR TSSOP PW 14 2000 364.0 364.0 27.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2014 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV324IPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LMV324QDR SOIC D 14 2500 367.0 367.0 38.0 LMV324QPWR TSSOP PW 14 2000 367.0 367.0 35.0 LMV358IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LMV358IDR SOIC D 8 2500 340.5 338.1 20.6 LMV358IDR SOIC D 8 2500 364.0 364.0 27.0 LMV358IDR SOIC D 8 2500 367.0 367.0 35.0 LMV358IDRG4 SOIC D 8 2500 340.5 338.1 20.6 LMV358IPWR TSSOP PW 8 2000 364.0 364.0 27.0 LMV358QDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358QDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LMV358QDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 3