IRF IRAMX16UP60B

PD-96-957 RevD
Integrated Power Hybrid IC for
Appliance Motor Drive Applications.
Description
IRAMX16UP60B
Series
16A, 600V
with Internal Shunt Resistor
International Rectifier's IRAMX16UP60B is a 16A, 600V Integrated Power Hybrid IC with Internal Shunt
Resistor for Appliance Motor Drives applications such as air conditioning systems and compressor drivers as
well as for light industrial application. IR's technology offers an extremely compact, high performance AC
motor-driver in a single isolated package to simplify design.
This advanced HIC is a combination of IR's low VCE(on) Punch-Through IGBT technology and the industry
benchmark 3 phase high voltage, high speed driver in a fully isolated thermally enhanced package.
A built-in temperature monitor and over-current protection, along with the short-circuit rated IGBTs and
integrated under-voltage lockout function, deliver high level of protection and fail-safe operation. Using a
Single in line package (SiP2) with full transfer mold structure minimizes PCB space and resolve isolation
problems to heatsink.
Features
•
•
•
•
•
•
•
•
•
Internal Shunt Resistor
Integrated Gate Drivers and Bootstrap Diodes
Temperature Monitor
Low VCE(on) Non Punch Through IGBT Technology
Undervoltage lockout for all channels
Matched propagation delay for all channels
Schmitt-triggered input logic
Cross-conduction prevention logic
Lower di/dt gate driver for better noise immunity
• Motor Power range 0.75~2.2kW / 85~253 Vac
• Isolation 2000VRMS min
• UL certification pending (UL number: E78996)
Absolute Maximum Ratings
Parameter
Description
VCES / VRRM
IGBT/Diode Blocking Voltage
Value
600
V+
Positive Bus Input Voltage
450
IO @ TC=25°C
RMS Phase Current (Note 1)
16
IO @ TC=100°C
RMS Phase Current (Note 1)
8
IO
Pulsed RMS Phase Current (Note 2)
30
FPWM
PWM Carrier Frequency
20
PD
Power dissipation per IGBT @ TC =25°C
31
W
VISO
Isolation Voltage (1min)
2000
VRMS
TJ (IGBT & Diodes)
Operating Junction temperature Range
-40 to +150
TJ (Driver IC)
Operating Junction temperature Range
-40 to +150
T
Mounting torque Range (M3 screw)
0.5 to 1.0
Units
V
A
kHz
°C
Nm
Note 1: Sinusoidal Modulation at V+=400V, TJ=150°C, FPWM=16kHz, Modulation Depth=0.8, PF=0.6, See Figure 3.
Note 2: tP<100ms; TC=25°C; FPWM=16kHz. Limited by IBUS-ITRIP, see Table "Inverter Section Electrical Characteristics"
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1
IRAMX16UP60B
Internal Electrical Schematic - IRAMX16UP60B
V+ (10)
V- (12)
VB1 (7)
U, VS1 (8)
VB2 (4)
V, VS2 (5)
VB3 (1)
W, VS3 (2)
23 VS1
22 21 20 19 18 17
VB2 HO2 VS2 VB3 HO3 VS3
LO1 16
24 HO1
25 VB1
1 VCC
HIN1 (15)
HIN2 (16)
HIN3 (17)
2 HIN1
LIN1 (18)
5 LIN1
3 HIN2
Driver IC
LO2 15
LO3 14
4 HIN3
LIN2 LIN3 F ITRIP EN RCIN VSS COM
6
7 8
9 10 11
12 13
LIN2 (19)
LIN3 (20)
FLT-EN(21)
ITRIP (22)
VTH (13)
THERMISTOR
VCC (14)
VSS (23)
2
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IRAMX16UP60B
Absolute Maximum Ratings (Continued)
All voltages are absolute referenced to COM/ITRIP.
Symbol
Parameter
IBDF
Units Conditions
Min
Max
Bootstrap Diode Peak Forward
Current
---
4.5
A
tP= 10ms,
TJ = 150°C, TC=100°C
PBR Peak
Bootstrap Resistor Peak Power
(Single Pulse)
---
25.0
W
tP=100µs, TC =100°C
ESR / ERJ series
VS1,2,3
High side floating supply offset
voltage
VB1,2,3 - 25
VB1,2,3 +0.3
V
VB1,2,3
High side floating supply voltage
-0.3
600
V
VCC
Low Side and logic fixed supply
voltage
-0.3
20
V
VIN, VEN, VITRIP
Input voltage LIN, HIN, EN, ITrip
-0.3
Lower of
(VSS+15V) or
VCC+0.3V
V
Inverter Section Electrical Characteristics @TJ= 25°C
Units Conditions
Symbol
Parameter
Min
Typ
Max
V(BR)CES
Collector-to-Emitter Breakdown
Voltage
600
---
---
V
VIN=5V, IC=250µA
∆V(BR)CES / ∆T
Temperature Coeff. Of
Breakdown Voltage
---
0.3
---
V/°C
VIN=5V, IC=1.0mA
(25°C - 150°C)
VCE(ON)
Collector-to-Emitter Saturation
Voltage
---
1.55
1.85
---
1.80
2.10
ICES
Zero Gate Voltage Collector
Current
---
5
80
---
165
---
VFM
Diode Forward Voltage Drop
---
2.0
2.4
---
1.4
1.9
VBDFM
Bootstrap Diode Forward Voltage
Drop
--
--
1.25
---
---
1.10
V
µA
V
V
IC=8A, VCC=15V
IC=8A, VCC=15V, TJ=150°C
VIN=5V, V+=600V
VIN=5V, V+=600V, TJ=150°C
IC=8A
IC=8A, TJ=150°C
IF=1A
IF=1A, TJ=125°C
RBR
Bootstrap Resistor Value
---
22
---
Ω
TJ=25°C
∆RBR/RBR
Bootstrap Resistor Tolerance
---
---
±5
%
TJ=25°C
IBUS_TRIP
Current Protection Threshold
(positive going)
21
---
28
A
TJ=-40°C to 125°C
See Fig. 2
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3
IRAMX16UP60B
Inverter Section Switching Characteristics @ TJ= 25°C
Symbol
Parameter
Min
Typ
Max
EON
Turn-On Switching Loss
---
315
435
EOFF
Turn-Off Switching Loss
---
150
180
ETOT
Total Switching Loss
---
465
615
EREC
Diode Reverse Recovery energy
---
30
60
tRR
Diode Reverse Recovery time
---
70
90
EON
Turn-on Switching Loss
---
500
700
EOFF
Turn-off Switching Loss
---
270
335
ETOT
Total Switching Loss
---
770
1035
EREC
Diode Reverse Recovery energy
---
60
100
tRR
Diode Reverse Recovery time
---
120
150
QG
Turn-On IGBT Gate Charge
RBSOA
Reverse Bias Safe Operating Area
---
56
84
Units Conditions
µJ
IC=8A, V+=400V
VCC=15V, L=2mH
Energy losses include "tail" and
diode reverse recovery
See CT1
ns
µJ
IC=8A, V+=400V
VCC=15V, L=2mH, TJ=150°C
Energy losses include "tail" and
diode reverse recovery
See CT1
ns
nC
+
IC=15A, V =400V, VGE=15V
TJ=150°C, IC=8A, VP=600V
V+= 450V
VCC=+15V to 0V
FULL SQUARE
See CT3
TJ=150°C, VP=600V,
SCSOA
Short Circuit Safe Operating Area
10
---
---
µs
V+= 360V,
VCC=+15V to 0V
See CT2
TJ=150°C, VP=600V, tSC<10µs
ICSC
Short Circuit Collector Current
---
140
---
A
V+= 360V, VGE=15V
VCC=+15V to 0V
See CT2
Recommended Operating Conditions Driver Function
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommende conditions. All voltages are absolute referenced to COM/ITRIP. The VS offset is tested with all supplies biased
at 15V differential (Note 3)
Symbol
Definition
Min
Max
VB1,2,3
High side floating supply voltage
VS+12
VS+20
VS1,2,3
High side floating supply offset voltage
Note 4
450
VCC
Low side and logic fixed supply voltage
12
20
VITRIP
ITRIP input voltage
VSS
VSS+5
VIN
Logic input voltage LIN, HIN
VSS
VSS+4
V
Logic input voltage EN
VSS
VSS+5
V
VEN
Units
V
V
Note 3: For more details, see IR21363 data sheet
Note 4: Logic operational for Vs from COM-5V to COM+600V. Logic state held for Vs from COM-5V to COM-VBS.
(please refer to DT97-3 for more details)
4
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IRAMX16UP60B
Static Electrical Characteristics Driver Function
VBIAS (VCC, VBS1,2,3)=15V, unless otherwise specified. The VIN and IIN parameters are referenced to COM/ITRIP and are
applicable to all six channels. (Note 3)
Symbol
Definition
Min
Typ
Max
Units
VINH , VENH
Logic "0" input voltage
3.0
---
---
V
VINL , VENL
Logic "1" input voltage
---
---
0.8
V
VCCUV+, VBSUV+
VCC and VBS supply undervoltage Positive going threshold
10.6
11.1
11.6
V
VCCUV-, VBSUV-
VCC and VBS supply undervoltage Negative going threshold
10.4
10.9
11.4
V
VCCUVH, VBSUVH
VCC and VBS supply undervoltage lock-out hysteresis
---
0.2
---
V
VIN,Clamp
Input Clamp Voltage (HIN, LIN, ITRIP) IIN=10µA
4.9
5.2
5.5
V
IQBS
Quiescent VBS supply current VIN=0V
---
---
165
µA
---
3.35
mA
IQCC
Quiescent VCC supply current VIN=0V
---
ILK
Offset Supply Leakage Current
---
---
60
µA
IIN+, IEN+
Input bias current VIN=5V
---
200
300
µA
IIN-, IEN-
Input bias current VIN=0V
---
100
220
µA
ITRIP+
ITRIP bias current VITRIP=5V
---
30
100
µA
ITRIP-
ITRIP bias current VITRIP=0V
---
0
1
µA
440
490
540
mV
V(ITRIP)
ITRIP threshold Voltage
V(ITRIP, HYS)
ITRIP Input Hysteresis
---
70
---
mV
RON,FLT
Fault Output ON Resistance
---
50
100
ohm
Dynamic Electrical Characteristics
Driver only timing unless otherwise specified.
Symbol
Parameter
TON
Input to Output propagation turnon delay time (see fig.11)
Min
Typ
Max
---
590
---
Units Conditions
ns
TOFF
Input to Output propagation turnoff delay time (see fig. 11)
---
660
---
ns
TFLIN
Input Filter time (HIN, LIN)
100
200
---
ns
TBLT-Trip
ITRIP Blancking Time
100
150
DT
Dead Time (VBS=VDD=15V)
220
290
MT
Matching Propagation Delay Time
(On & Off)
---
TITrip
ITrip to six switch to turn-off
propagation delay (see fig. 2)
TFLT-CLR
Post ITrip to six switch to turn-off
clear time (see fig. 2)
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VCC=VBS= 15V, IC=8A,
V+=400V
VIN=0 & VIN=5V
ns
VIN=0 & VIN=5V
360
ns
VBS=VCC=15V
40
75
ns
---
---
1.75
µs
---
7.7
---
---
6.7
---
ms
VCC= VBS= 15V, external dead
time> 400ns
VCC=VBS= 15V, IC=8A,
V+=400V
TC = 25°C
TC = 100°C
5
IRAMX16UP60B
Thermal and Mechanical Characteristics
Symbol
Parameter
Min
Typ
Max
Rth(J-C)
Thermal resistance, per IGBT
---
3.5
4.0
Rth(J-C)
Thermal resistance, per Diode
---
5.0
5.5
Rth(C-S)
Thermal resistance, C-S
---
0.1
---
CD
Creepage Distance
3.2
---
---
Units Conditions
Flat, greased surface. Heatsink
°C/W compound thermal conductivity
1W/mK
See outline Drawings
mm
Internal Current Sensing Resistor - Shunt Characteristics
Symbol
Parameter
Min
Typ
Max
RShunt
Resistance
17.9
18.1
18.3
Units Conditions
mΩ
TCoeff
Temperature Coefficient
0
---
200
ppm/°C
PShunt
Power Dissipation
---
---
3.0
W
TRange
Temperature Range
-40
---
125
°C
TC = 25°C
-40°C< TC <100°C
Internal NTC - Thermistor Characteristics
Parameter
Definition
Min
Typ
Max
R25
Resistance
97
100
103
kΩ
TC = 25°C
R125
Resistance
2.25
2.52
2.80
kΩ
TC = 125°C
B
B-constant (25-50°C)
4165
4250
4335
k
125
°C
Temperature Range
-40
Typ. Dissipation constant
Units Conditions
R2 = R1e [B(1/T2 - 1/T1)]
mW/°C TC = 25°C
1
Input-Output Logic Level Table
V+
Ho
Hin1,2,3
(15,16,17)
U,V,W
IC
Driver
(8,5,2)
Lin1,2,3
(18,19,20)
6
Lo
FLT- EN
ITRIP
1
1
1
1
0
0
0
0
1
X
HIN1,2,3 LIN1,2,3
0
1
1
X
X
1
0
1
X
X
U,V,W
V+
0
Off
Off
Off
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IRAMX16UP60B
HIN1,2,3
LIN1,2,3
1
IBUS
2
3
4
5
6
IBUS_trip
6µs
1µs
50%
U,V,W
tfltclr
Sequence of events:
1-2) Current begins to rise
2) Current reaches IBUS_Trip level
2-3) Current is higher than IBUS_Trip for at least 6µs. This value is the worst-case condition with very low
over-current. In case of high current (short circuit), the actual delay will be smaller.
3-4) Delay between driver identification of over-current condition and disabling of all outputs
4) Current starts decreasing, eventually reaching 0
5) Current goes below IBUS_trip, the driver starts its auto-reset sequence
6) Driver is automatically reset and normal operation can resume (over-current condition must be removed
by the time the drivers automatically resets itself)
Figure 2. ITrip Timing Waveform
Note 5: The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge output
voltage would be determined by the direction of current flow in the load.
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7
IRAMX16UP60B
Module Pin-Out Description
Pin
Name
1
VB3
2
W,VS3
Description
High Side Floating Supply Voltage 3
Output 3 - High Side Floating Supply Offset Voltage
3
NA
none
4
VB2
High Side Floating Supply voltage 2
5
V,VS2
6
NA
none
7
VB1
High Side Floating Supply voltage 1
8
U, VS1
9
NA
Output 2 - High Side Floating Supply Offset Voltage
Output 1 - High Side Floating Supply Offset Voltage
none
+
10
V
11
NA
Positive Bus Input Voltage
none
-
Negative Bus Input Voltage
12
V
13
VTH
Temperature Feedback
14
VCC
+15V Main Supply
15
HIN1
Logic Input High Side Gate Driver - Phase 1
16
HIN2
Logic Input High Side Gate Driver - Phase 2
17
HIN3
Logic Input High Side Gate Driver - Phase 3
18
LIN1
Logic Input Low Side Gate Driver - Phase 1
19
LIN2
Logic Input Low Side Gate Driver - Phase 2
20
LIN3
Logic Input Low Side Gate Driver - Phase 3
21
FAULT
22
ITRIP
Current Sense and Itrip Pin
23
VSS
Negative Main Supply
Fault Indicator
1
23
8
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IRAMX16UP60B
Typical Application Connection IRAMX16UP60B
VB3
2.2µF
VS3
W
VB2
VS2
V
VB1
VS1
U
V
DC BUS
CAPACITORS
+
V-
+5V
Vcc (15 V)
+15V
+5V
HIN1
0.1mF
10mF
12kohm
HIN2
HIN3
LIN1
Temp
Monitor
LIN2
LIN3
CONTROLLER
035-Z2L03
VTH
IRAMX16UP60B
3-Phase AC
MOTOR
1
BOOT-STRAP
CAPACITORS
Fault/Enable
ITRIP
VSS
+5V
23
Enable
1K
1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to reduce ringing and
EMI problems. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance.
2. In order to provide good decoupling between VCC-VSS and VB1,2,3-VS1,2,3 terminals, the capacitors shown connected between these terminals should be located very close to the module pins. Additional high frequency capacitors, typically
0.1µF, are strongly recommended.
3. Value of the boot-strap capacitors depends upon the switching frequency. Their selection should be made based on
IR design tip DN 98-2a, application note AN-1044 or Figure 9. Bootstrap capacitor value must be selected to limit the
power dissipation of the internal resistor in series with the VCC. (see maximum ratings Table on page 3).
4. Current sense signal can be obtained from pin 20 and pin 23. Care should be taken to avoid having inverter current
flowing through pin 22 to mantain required current measurement accuracy
5. After approx. 8ms the FAULT is reset. (see Dynamic Characteristics Table on page 5).
6. PWM generator must be disabled within Fault duration to garantee shutdown of the system, overcurrent condition
must be cleared before resuming operation.
7. Fault/Enable pin must be pulled-up to +5V.
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9
Maximum Output Phase RMS Current - A
IRAMX16UP60B
14
12
10
8
6
TC = 100°C
4
TC = 110°C
TC = 120°C
2
TJ = 150°C
Sinusoidal Modulation
0
0
2
4
6
8
10
12
14
16
18
20
PWM Frequency - kHz
Figure 3. Maximum Sinusoidal Phase Current vs. PWM Switching Frequency
Maximum Output Phase RMS Current - A
V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6
10
TJ = 150°C
Sinusoidal Modulation
8
6
FPWM = 20kHz
4
FPWM = 16kHz
FPWM = 12kHz
2
0
1
10
100
Modulation Frequency - Hz
Figure 4. Maximum Sinusoidal Phase Current vs. Modulation Frequency
V+=400V, TJ=150°C, TC=100°C, Modulation Depth=0.8, PF=0.6
10
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IRAMX16UP60B
Total Power Losses - W
150
TJ = 150°C
125
Sinusoidal Modulation
100
75
FPWM = 12 kHz
50
FPWM = 16 kHz
FPWM = 20 kHz
25
0
0
1
2
3
4
5
6
7
8
9
10
11
12
Output Phase Current - ARMS
Figure 5. Total Power Losses vs. PWM Switching Frequency, Sinusoidal modulation
V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6
Total Power Losses - W
150
TJ = 150°C
125
Sinusoidal Modulation
100
75
FPWM = 12 kHz
50
FPWM = 16 kHz
FPWM = 20 kHz
25
0
0
1
2
3
4
5
6
7
8
9
10
11
12
Output Phase Current - ARMS
Figure 6. Total Power Losses vs. Output Phase Current, Sinusoidal modulation
VBUS=400V , TJ=150°C,
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Modulation Depth=0.8, PF=0.6
11
Maximum Allowable Case Temperature -°C
IRAMX16UP60B
160
140
120
100
80
FPWM = 12 kHz
60
FPWM = 16 kHz
40
Sinusoidal Modulation
20
0
FPWM = 20 kHz
TJ = 150°C
0
2
4
6
8
10
12
14
Output Phase Current - ARMS
Figure 7. Maximum Allowable Case temperature vs. Output RMS Current per Phase
IGBT Junction Temperature - °C
160
TJ avg. = 1.2447 x TTherm+ 30.77
150
140
130
120
110
100
65
70
75
80
85
90
95
100
Internal Thermistor Temperature Equivalent Read Out - °C
Figure 8. Estimated Maximum IGBT Junction Temperature vs. Thermistor Temperature
12
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IRAMX16UP60B
Thermistor Pin Read-Out Voltage - V
5.0
+5V
4.5
4.0
TTHERM RTHERM TTHERM
°C
Ω
°C
-40
4397119
25
3.5
RTHERM
Ω
100000
TTHERM
°C
90
RTHERM
Ω
7481
-35
3088599
30
79222
95
6337
-30
2197225
35
63167
100
5384
-25
1581881
40
50677
105
4594
-20
1151037
45
40904
110
3934
-15
846579
50
33195
115
3380
2.0
-10
628988
55
27091
120
2916
-5
471632
60
22224
125
2522
1.5
0
357012
65
18322
130
2190
3.0
2.5
1.0
5
272500
70
15184
135
1907
10
209710
75
12635
140
1665
15
162651
80
10566
145
1459
20
127080
85
8873
150
1282
0.5
-40 -30 -20
-10
0
10
20
30
REXT
VTherm
R Therm
Min
Avg.
Max
40
50
60
70
80
90
100 110 120 130
Thermistor Temperature - °C
Recommended Bootstrap Capacitor - µF
Figure 9. Thermistor Readout vs. Temperature (12kohm pull-up resistor, 5V) and
Nominal Thermistor Resistance values vs. Temperature Table.
16.0
15µF
15.0
14.0
V+
RBS
13.0
DBS
CBS
vB
12.0
+15V
11.0
10µF
10.0
VCC
HIN
HIN
LIN
LIN
VSS COM
9.0
RG1
HO
U,V,W
VS
RG2
LO
VSS
8.0
GND
6.8µF
7.0
6.0
4.7µF
5.0
4.0
3.3µF
3.0
2.0
0
5
10
15
20
PWM Frequency - kHz
Figure 10. Recommended Bootstrap Capacitor Value vs. Switching Frequency
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13
IRAMX16UP60B
Figure 11. Switching Parameter Definitions
VCE
IC
IC
VCE
90% IC
50%
HIN /LIN
90% IC
50%
VCE
HIN /LIN
50%
HIN /LIN
HIN /LIN
50%
VCE
10% IC
10% IC
tr
tf
TON
TOFF
Figure 11a. Input to Output Propagation
turn-on Delay Time
Figure 11b. Input to Output Propagation
turn-off Delay Time
IF
VCE
HIN/LIN
Irr
trr
Figure 11c. Diode Reverse Recovery
14
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IRAMX16UP60B
V+
5V
Ho
IN
Hin1,2,3
IC
Driver
U,V,W
IO
Lo
Lin1,2,3
Figure CT1. Switching Loss Circuit
V+
Ho
Hin1,2,3
1k
VCC
IN
10k
Lin1,2,3
IC
Driver
5VZD
U,V,W
IO
Lo
IN
Io
Figure CT2. S.C.SOA Circuit
V+
Ho
Hin1,2,3
1k
IN
10k
VCC
IC
Driver
5VZD
Lin1,2,3
IN
U,V,W
IO
Lo
Io
Figure CT3. R.B.SOA Circuit
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15
IRAMX16UP60B
Package Outline IRAMX16UP60B
note 2
62
3
A
56
note 3
Ø3.4 TYP.
B
25.8
1
11.4
23
0.80
0.55
TYP.
0.70
22 PITCHES = 44
TYP.
4.7
2.5
0.45
11.4 REF
A B
5.5
46.2
C
9.0 REF.
Ø0.20 M
INT.
2 TYP.
9
note 1
INT.
25.3
035-Z2L03
IRAMX16UP60B
R0.6 TYP.
50
2 TYP.
5.0
3.2
MIN.
CONVEX ONLY
0.10
C
Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
4- Convex only 0.15mm typical
5- Tollerances ±0.5mm, unless otherwise stated
For mounting instruction see AN-1049
16
www.irf.com
IRAMX16UP60B
Package Outline IRAMX16UP60B-2
note 2
62
3
A
56
B
25.8
23
2 TYP.
Ø0.20 M
A B
0.80
0.55
TYP.
4.7
2.5
11.4 REF
22 PITCHES = 44
TYP.
13.9
1
5
note 1
11.4
IRAMX16UP60B
0.70
0.45
25.3
035-Z2L03
11.4 REF.
Ø3.4 TYP.
note 3
5 REF.
5.5
46.2
C
R0.6 TYP.
10°
R
2 TYP.
50
EF.
3.2
MIN.
CONVEX ONLY
0.10 C
Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
4- Convex only 0.15mm typical
5- Tollerances ±0.5mm, unless otherwise stated
For mounting instruction see AN-1049
Data and Specifications are subject to change without notice
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information
07/05
www.irf.com
17