APTDF100H170G Diode Full Bridge Power Module VRRM = 1700V IC = 100A @ Tc = 55°C Application + AC1 AC2 Uninterruptible Power Supply (UPS) Induction heating Welding equipment High speed rectifiers Features - Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance - Symmetrical design - Lead frames for power connections High level of integration Benefits Outstanding performance at high frequency operation Low losses Low noise switching Solderable terminals for easy PCB mounting Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant All ratings @ Tj = 25°C unless otherwise specified Symbol VR VRRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current IF(RMS) IFSM RMS Forward Current Non-Repetitive Forward Surge Current Duty cycle = 50% Max ratings Unit 1700 V Tc = 25°C 120 Tc = 55°C 100 125 300 Tj = 25°C A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-4 APTDF100H170G – Rev2 October , 2012 Absolute maximum ratings APTDF100H170G Electrical Characteristics Symbol Characteristic Test Conditions VF Diode Forward Voltage IF = 100A IRM Maximum Reverse Leakage Current VR = 1700V Min Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Typ 2.2 2.1 Max 2.5 Unit V 250 500 µA Max Unit Dynamic Characteristics Symbol Characteristic trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current Test Conditions IF = 100A VR = 900V di/dt = 1000A/µs Min Typ Tj = 25°C 572 Tj = 125°C 704 Tj = 25°C Tj = 125°C Tj = 25°C 20 35 70 Tj = 125°C 100 ns µC A Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 4000 -40 -40 -40 2.5 Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To Heatsink M5 Typ Max 0.35 150 125 100 4.7 160 Unit °C/W V °C N.m g Typical Performance Curve www.microsemi.com 2-4 APTDF100H170G – Rev2 October , 2012 SP4 Package outline (dimensions in mm) APTDF100H170G Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.35 0.9 0.3 0.7 0.25 0.2 0.5 0.15 0.3 0.1 0.1 0.05 0.05 0 0.00001 Single Pulse 0.0001 0.001 0.01 0.1 Rectangular Pulse Duration (Seconds) Forward Current vs Forward Voltage 800 TJ=25°C 200 150 TJ=125°C 100 50 TJ=25°C 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 trr, Reverse Recovery Time (ns) IF, Forward Current (A) 10 Trr vs. Current Rate of Charge 250 TJ=125°C VR=900V 700 600 500 200 A 400 100 A 300 50 A 200 0 1000 2000 3000 4000 5000 6000 VF, Anode to Cathode Voltage (V) -diF/dt (A/µs) IRRM vs. Current Rate of Charge TJ=125°C VR=900V 70 200 A 100 A 60 50 50 A 40 30 20 0 1000 2000 3000 4000 5000 6000 IRRM, Reverse Recovery Current (A) QRR vs. Current Rate Charge 80 400 TJ=125°C VR=900V 350 100 A 200 A 300 50 A 250 200 150 100 50 0 1000 2000 3000 4000 5000 6000 -diF/dt (A/µs) -diF/dt (A/µs) Max. Average Forward Current vs. Case Temp. 150 Duty Cycle = 0.5 TJ=150°C 125 IF(AV) (A) QRR, Reverse Recovery Charge (µC) 1 100 75 50 25 0 0 25 50 75 100 125 150 Case Temperature (ºC) www.microsemi.com 3-4 APTDF100H170G – Rev2 October , 2012 Thermal Impedance (°C/W) 0.4 APTDF100H170G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 4-4 APTDF100H170G – Rev2 October , 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.