Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MPC5200VR400 PBGA 272 27*27*1.25P1.27 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-11-19 5047K11015D013A1.36 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MPC5200VR400 PBGA 272 27*27*1.25P1.27 ALL 2.545200 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 1.1504 SubPart% ARTICLEPPM ARTICLE% Die Encapsulant Metals Aluminum, metal 7429-90-5 0.03554276 g Die Encapsulant Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000115 g 30896 3.0896 13964 1.3964 1 0.0001 0 Die Encapsulant Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000115 0 g 1 0.0001 0 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0 0.03554276 g 30896 3.0896 13964 Die Encapsulant Solvents, additives, and other materials Carbon Black 1.3964 1333-86-4 0.00355474 g 3090 0.309 1396 Die Encapsulant Lead/Lead Compounds 0.1396 Lead 7439-92-1 0.00000115 g 1 0.0001 0 Die Encapsulant 0 Solvents, additives, and other materials Other organic phosphorous compounds - 0.00355474 g 3090 0.309 1396 0.1396 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.06516096 g 56642 5.6642 25601 2.5601 Die Encapsulant Glass Silica, vitreous 60676-86-0 1.00704059 g 875383 87.5383 395680 39.568 Epoxy Die Attach Exemption SubstanceWeight UoM SubPart PPM g 0.027 g Epoxy Die Attach Solvents, additives, and other materials 1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1yl)ethyl] 38668-46-1 0.00022818 g 8451 0.8451 89 0.0089 Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00349863 g 129579 12.9579 1374 0.1374 Epoxy Die Attach Plastics/polymers 4,4'-Dihydroxydiphenyl 92-88-6 0.00022818 g 8451 0.8451 89 0.0089 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.02304501 g 853519 85.3519 9054 0.9054 Solder Balls - Lead Free 0.4612 g Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000323 g 7 0.0007 1 0.0001 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000323 g 7 0.0007 1 0.0001 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000231 g 5 0.0005 0 0 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.0032284 g 7000 0.7 1268 0.1268 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.0000083 g 18 0.0018 3 0.0003 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00002583 g 56 0.0056 10 0.001 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.01734112 g 37600 3.76 6813 0.6813 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.44058758 g 955307 95.5307 173105 17.3105 Silicon Semiconductor Die 0.09 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.0018 g 20000 2 707 0.0707 Silicon Semiconductor Die Glass Silicon, doped - 0.0882 g 980000 98 34653 3.4653 Organic Substrate 0.7999 g Organic Substrate Metals Barium sulfate 7727-43-7 0.01708986 g 21365 2.1365 6714 0.6714 Organic Substrate Metals Copper, metal 7440-50-8 0.52767486 g 659676 65.9676 207321 20.7321 Organic Substrate Plastics/polymers 2,2'-[(1-methylethylidene)bis(4,1phenyleneoxymethylene)]bisoxirane 1675-54-3 0.00372913 g 4662 0.4662 1465 0.1465 Organic Substrate Plastics/polymers Poly[(o-cresyl glycidyl ether)-co-formaldehyde] 29690-82-2 0.05341892 g 66782 6.6782 20988 2.0988 Organic Substrate Metals Gold, metal 7440-57-5 0.00092148 g 1152 0.1152 362 0.0362 Organic Substrate Solvents, additives, and other materials 1-cyanoguanidine 461-58-5 0.00023197 g 290 0.029 91 0.0091 Organic Substrate Solvents, additives, and other materials 1,1'-(methylenedi-p-phenylene)bismaleimide 13676-54-5 0.016026 g 20035 2.0035 6296 0.6296 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.0063696 g 7963 0.7963 2502 0.2502 Organic Substrate Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.05341892 g 66782 6.6782 20988 2.0988 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.08547011 g 106851 10.6851 33580 3.358 Organic Substrate Solvents, additives, and other materials Proprietary Material-Other miscellaneous substances. - 0.00861412 g 10769 1.0769 3384 0.3384 Organic Substrate Metals Copper phthalocyanine 147-14-8 0.00013918 g 174 0.0174 54 0.0054 Organic Substrate Plastics/polymers Other Non-halogenated Epoxy resins - 0.02679585 g 33499 3.3499 10527 1.0527 Bonding Wire, PdCu 0.0167 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.0163827 g 981000 98.1 6436 0.6436 Bonding Wire, PdCu Metals Gold, metal 7440-57-5 0.0000167 g 1000 0.1 6 0.0006 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.0003006 g 18000 1.8 118 0.0118 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MPC5200VR400_IPC1752_v11.xml http://www.freescale.com/mcds/MPC5200VR400_IPC1752A.xml