INTEGRATED CIRCUITS 74LV368 Hex buffer/line driver; inverting (3-State) Product specification Supersedes data of 1997 Apr 07 IC24 Data Handbook 1998 May 29 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) FEATURES 74LV368 DESCRIPTION • Optimized for Low Voltage applications: 1.0 to 3.6V • Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V • Typical VOLP (output ground bounce) 0.8V @ VCC = 3.3V, The 74LV368 a low–voltage Si–gate CMOS device and is pin and function compatible with 74HC/HCT368. The 74LV368 is a hex inverting buffer/line driver with 3–state outputs. The 3–state outputs (nY) are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF–state. Tamb = 25°C • Typical VOHV (output VOH undershoot) 2V @ VCC = 3.3V, Tamb = 25°C • Inverting outputs • Output capability: bus driver • ICC category: SSI QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr =tf 2.5 ns PARAMETER SYMBOL tPHL/tPLH Propagation delay nA to nY CI Input capacitance CPD Power dissipation capacitance per buffer CONDITIONS CL = 15pF VCC = 3.3V Notes 1, 2 TYPICAL UNIT 9.0 ns 3.5 pF 30 pF NOTES: 1 CPD is used to determine the dynamic power dissipation (PD in µW) PD = CPD VCC2 x fi (CL VCC2 fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; (CL VCC2 fo) = sum of the outputs. 2 The condition is VI = GND to VCC ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. # 16-Pin Plastic DIL –40°C to +125°C 74LV368 N 74LV368 N SOT38-4 16-Pin Plastic SO –40°C to +125°C 74LV368 D 74LV368 D SOT109-1 16-Pin Plastic SSOP Type II –40°C to +125°C 74LV368 DB 74LV368 DB SOT338-1 16-Pin Plastic TSSOP Type I –40°C to +125°C 74LV368 PW 74LV368PW DH SOT403-1 1998 May 29 2 853–1966 19466 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) PIN CONFIGURATION 74LV368 LOGIC SYMBOL (IEEE/IEC) 1 1OE 1 16 VCC 1A 2 15 2OE 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y EN 2 3 4 5 6 7 10 9 15 12 11 14 13 SV00374 SV00373 LOGIC SYMBOL PIN DESCRIPTION PIN NUMBER 1, 15 EN SYMBOL FUNCTION 1OE to 2OE Output enable inputs (active LOW) 2, 4, 6, 10, 12, 14 1A to 6A Data inputs 3, 5, 7, 9, 11, 13 1Y to 6Y Bus outputs 8 GND Ground (0V) 16 VCC Positive supply voltage 2 1A 1Y 3 4 2A 2Y 5 6 3A 3Y 7 10 4A 4Y 9 12 5A 5Y 11 14 6A 6Y 13 1 1OE 15 2OE SV00375 1998 May 29 3 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) FUNCTIONAL DIAGRAM 74LV368 FUNCTION TABLE INPUTS 2 1A 1Y nA nY L L H L H L H X Z 3 4 2A 2Y 5 6 3A 3Y 7 10 4A 4Y 9 1 1OE 12 5A 5Y 11 14 6A 6Y 13 15 2OE OUTPUT nOE NOTES: H = HIGH voltage level L = LOW voltage level X = Don’t care Z = High impedance OFF-state SV00376 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER CONDITIONS MIN TYP. MAX UNIT See Note1 1.0 3.3 3.6 V 0 – VCC V 0 – VCC V +85 +125 °C 500 200 100 ns/V DC supply voltage VI Input voltage VO Output voltage Tamb Operating ambient temperature range in free air tr, tf Input rise and fall times See DC and AC characteristics VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V –40 –40 – – – – – – NOTES: 1 The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V. ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134); Voltages are referenced to GND (ground = 0V) SYMBOL PARAMETER VCC DC supply voltage ±IIK DC input diode current ±IOK ±IO ±IGND, ±ICC Tstg PTOT CONDITIONS RATING UNIT –0.5 to +4.6 V VI < –0.5 or VI > VCC + 0.5V 20 mA DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA DC output source or sink current – bus driver outputs –0.5V < VO < VCC + 0.5V 35 mA 70 mA –65 to +150 °C DC VCC or GND current for types with –bus driver outputs Storage temperature range Power dissipation per package –plastic DIL –plastic mini-pack (SO) –plastic shrink mini-pack (SSOP and TSSOP) for temperature range: –40 to +125°C above +70°C derate linearly with 12mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K 750 500 400 mW NOTES: 1 Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 May 29 4 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 DC CHARACTERISTICS FOR THE LV FAMILY Over recommended operating conditions voltages are referenced to GND (ground = 0V) LIMITS SYMBOL PARAMETER -40°C to +85°C TEST CONDITIONS MIN HIGH level Input voltage VIH LOW level Input voltage VIL MAX MIN 0.9 0.9 VCC = 2.0V 1.4 1.4 VCC = 2.7 to 3.6V 2.0 2.0 V 0.3 0.3 VCC = 2.0V 0.6 0.6 VCC = 2.7 to 3.6V 0.8 0.8 VCC = 1.2V; VI = VIH or VIL; –IO = 100µA VCC = 2.0V; VI = VIH or VIL; –IO = 100µA 1.8 2.0 1.8 VCC = 2.7V; VI = VIH or VIL; –IO = 100µA 2.5 2.7 2.5 VCC = 3.0V; VI = VIH or VIL; –IO = 100µA 2.8 3.0 2.8 VCC = 3.0V;VI = VIH or VIL; –IO = 8mA 2.40 2.82 2.20 VOH HIGH level output voltage; BUS driver outputs VOL LOW level output voltage; all outputs VOL LOW level output voltage; BUS driver outputs VCC = 3.0V;VI = VIH or VIL; IO = 8mA Input leakage current VCC = 3.6V; VI = VCC or GND IOZ 3-State output OFF-state current VCC = 3.6V; VI = VIH or VIL; VO = VCC or GND ICC Quiescent supply current; MSI ∆ICC Additional quiescent supply current per input UNIT MAX VCC = 1.2V HIGH level output voltage; all outputs V 1.2 V V VCC = 1.2V; VI = VIH or VIL; IO = 100µA 0 VCC = 2.0V; VI = VIH or VIL; IO = 100µA 0 0.2 0.2 VCC = 2.7V; VI = VIH or VIL; IO = 100µA 0 0.2 0.2 VCC = 3.0V;VI = VIH or VIL; IO = 100µA 0 0.2 0.2 0.20 0.40 0.50 V 1.0 1.0 µA 5 10 µA VCC = 3.6V; VI = VCC or GND; IO = 0 20.0 160 µA VCC = 2.7V to 3.6V; VI = VCC –0.6V 500 850 µA NOTE: 1 All typical values are measured at Tamb = 25°C. 1998 May 29 -40°C to +125°C VCC = 1.2V VOH II TYP1 5 V Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 AC CHARACTERISTICS GND = 0V; tr = tf = 2.5ns; CL = 50pF; RL = 1KΩ SYMBOL PARAMETER Propagation g delay y nA, to nY tPZL/tPLH tPZH/tPZL MIN TYP1 1.2 – 2.0 – 2.7 LIMITS –40 to +125 °C MAX MIN 55 – – – 19 36 – 44 – 14 26 – 33 3.0 to 3.6 – 102 21 – 26 1.2 – 75 – – – 2.0 – 26 49 – 60 2.7 – 19 36 – 44 3.0 to 3.6 – 142 29 – 35 1.2 – 90 – – – 2.0 – 32 59 – 70 2.7 – 24 44 – 52 3.0 to 3.6 – 192 36 – 42 Figures 2 Figures, 2, 3 3-State output disable time nOE to nY tPHZ/tPLZ VCC(V) Figures 1 Figures, 1, 3 3-State output enable time nOE to nY LIMITS –40 to +85 °C CONDITION WAVEFORM Figures 2 Figures, 2, 3 UNIT MAX ns ns ns NOTE: 1 Unless otherwise stated, all typical values are at Tamb = 25°C. 2 Typical value measured at VCC = 3.3V. AC WAVEFORMS VM = 1.5V at VCC 2.7V VM = 0.5V * VCC at VCC 2.7V VOL and VOH are the typical output voltage drop that occur with the output load. VX = VOL + 0.3V at VCC 2.7V VX = VOL + 0.1 * VCC at VCC < 2.7V VY = VOH – 0.3V at VCC 2.7V VY = VOH – 0.1VCC at VCC < 2.7V VI OE INPUT tPLZ VM VX VOL VM tPZH tPHZ VOH OUTPUT HIGH-to-OFF OFF-to-HIGH GND tPHL tPLH VOH nY OUTPUT tPZL VCC OUTPUT LOW-to-OFF OFF-to-LOW VI nA, nB INPUT VM GND VY VM GND outputs enabled VM outputs disabled outputs enabled SV00344 VOL Figure 2. 3-State enable and disable times SV00377 Figure 1.Input (nA) to output (nY) propagation delay 1998 May 29 6 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) TEST CIRCUIT S1 VCC RL = 1k VO VI PULSE GENERATOR 2 * VCC Open GND D.U.T. 50pF RT CL RL = 1k Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SWITCH POSITION TEST tPLH/tPHL S1 Open tPLZ/tPZL 2 VCC tPHZ/tPZH GND VCC VI < 2.7V VCC 2.7–3.6V 2.7V SV00895 Figure 3. Load circuitry for switching times 1998 May 29 7 74LV368 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) DIP16: plastic dual in-line package; 16 leads (300 mil) 1997 Apr 02 8 74LV368 SOT38-4 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) SO16: plastic small outline package; 16 leads; body width 3.9 mm 1997 Apr 02 9 74LV368 SOT109-1 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm 1997 Apr 02 10 74LV368 SOT338-1 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm 1997 Apr 02 11 74LV368 SOT403-1 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3–State) 74LV368 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: 1997 Apr 07 12 Date of release: 05-96 9397-750-04446