Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name USB2SERA11CFK QFN 24 EP 5*5*1.0P0.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-10-15 00KHA1.4 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e4 USB2SERA11CFK QFN 24 EP 5*5*1.0P0.65 ALL 0.058500 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Epoxy Die Attach 0.0003 Epoxy Die Attach Solvents, additives, and other materials Proprietary Material-Other acrylates - 0.00002648 g Epoxy Die Attach Solvents, additives, and other materials 1,1'-(methylenedi-p-phenylene)bismaleimide 13676-54-5 0.00000993 g Epoxy Die Attach Metals Palladium, metal 7440-05-3 0.0000005 Epoxy Die Attach Plastics/polymers Proprietary Material-Other polymers - Epoxy Die Attach Metals Silver, metal Epoxy Die Attach Plastics/polymers Proprietary Material-Other Methacrylate compounds Silicon Semiconductor Die Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 88252 8.8252 452 0.0452 33094 3.3094 169 0.0169 g 1655 0.1655 8 0.0008 0.00000496 g 16547 1.6547 84 0.0084 7440-22-4 0.0002482 g 827358 82.7358 4242 0.4242 - 0.00000993 g 33094 3.3094 169 0.0169 g 0.0026 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000052 g 20000 2 888 0.0888 Silicon Semiconductor Die Glass Silicon, doped - 0.002548 g 980000 98 43555 4.3555 Bonding Wire, Copper 0.0002 g Bonding Wire, Copper Metals Copper, metal 7440-50-8 0.000194 g 970000 97 3316 0.3316 Bonding Wire, Copper Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000006 g 30000 3 102 0.0102 Die Encapsulant, Halogen-free 0.0482 g Die Encapsulant, Halogen-free Plastics/polymers 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl digycidyl ether 85954-11-6 0.00074517 g 15460 1.546 12737 1.2737 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.00008768 g 1819 0.1819 1498 0.1498 Die Encapsulant, Halogen-free Metals Magnesium dihydroxide 1309-42-8 0.00172893 g 35870 3.587 29554 2.9554 Die Encapsulant, Halogen-free Solvents, additives, and other materials Proprietary Material-Other organic phosphorous compounds - 0.00003822 g 793 0.0793 653 0.0653 Die Encapsulant, Halogen-free Plastics/polymers 1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol 25917-04-8 0.00015236 g 3161 0.3161 2604 0.2604 Die Encapsulant, Halogen-free Plastics/polymers Phenol p-xylylene dimethyl ether copolymer 26834-02-6 0.00175193 g 36347 3.6347 29947 2.9947 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.04115345 g 853806 85.3806 703492 70.3492 Die Encapsulant, Halogen-free Metals Zinc Hydroxide 20427-58-1 0.00080359 g 16672 1.6672 13736 1.3736 Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.00173867 g 36072 3.6072 29720 2.972 Copper Lead Frame 0.0072 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.00648529 g 900735 90.0735 110859 11.0859 Copper Lead Frame Metals Gold, metal 7440-57-5 0.00001038 g 1441 0.1441 177 0.0177 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00002074 g 2881 0.2881 354 0.0354 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00016493 g 22907 2.2907 2819 0.2819 Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.00037344 g 51866 5.1866 6383 0.6383 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.00004149 g 5763 0.5763 709 0.0709 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00010373 g 14407 1.4407 1773 0.1773 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/USB2SERA11CFK_IPC1752_v11.xml http://www.freescale.com/mcds/USB2SERA11CFK_IPC1752A.xml