INTEGRATED CIRCUITS DATA SHEET TDA4651 Multistandard colour decoder with negative colour difference output signals Preliminary specification File under Integrated Circuits, IC02 August 1993 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 FEATURES GENERAL DESCRIPTION Identifies and demodulates PAL, SECAM, NTSC 3.58 and NTSC 4.43 chrominance signals with: The TDA4651 is a monolithic integrated multistandard colour decoder for PAL, SECAM and NTSC (3.58 and 4.43 MHz) with negative colour difference output signals. The colour difference output signals are fed to the TDA4661, switched capacitor delay line. • Gain controlled chrominance amplifier • ACC demodulation controlled by system scanning • Internal colour difference signal output filters to remove the residual subcarrier QUICK REFERENCE DATA SYMBOL PARAMETER VP MIN. TYP. positive supply voltage (pin 13) 10.8 12 13.2 V IP supply current (pin 13) − 60 − mA Vi(p-p) chrominance input voltage (pin 15) (peak-to-peak value) 20 200 400 mV • PAL / NTSC demodulation – H (burst) and V blanking – PAL switch (disabled for NTSC) – NTSC phase shift (disabled for PAL) – PLL-controlled reference oscillator – two reference oscillator crystals on separate pins with automatic switching V1(p-p) V3(p-p) – limiter amplifier – quadrature demodulator with a single external reference tuned circuit – alternate line blanking, H and V blanking – de-emphasis see note 1 MAX. UNIT Colour difference output signals (see note 2) – quadrature demodulator with subcarrier reference • SECAM demodulation CONDITIONS −(R−Y) output (peak-to-peak value) PAL 442 525 624 mV NTSC 370 440 523 mV SECAM 883 1050 1248 mV −(B−Y) output (peak-to-peak value) PAL 559 665 791 mV NTSC 468 557 662 mV SECAM 1119 1330 1581 mV Notes to quick reference data 1. Within 3 dB output voltage deviation. 2. Burst key width for PAL 4.3 µs, for NTSC 3.6 µs Burst width for PAL and NTSC 2.25 µs, ratio burst-chrominance-amplitude 1/2.2. • Identification – automatic standard identification by sequential inquiry ORDERING INFORMATION PACKAGE – secure SECAM identification at 50 Hz only, with PAL priority EXTENDED TYPE NUMBER PINS MATERIAL CODE – four switched outputs for chrominance filter selection and display control PIN POSITION TDA4651 28 DIL plastic SOT117(1) TDA4651WP 28 PLCC plastic SOT261CG(2) – external service switch for oscillator adjustment Note 1. SOT117-1; 1996 November 25. 2. SOT261-2; 1996 November 25. August 1993 2 Philips Semiconductors Preliminary specification TDA4651 Fig.1 Block diagram. Multistandard colour decoder with negative colour difference output signals August 1993 3 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 PINNING SYMBOL PIN DESCRIPTION CHR1 15 chrominance input −(R−Y)o 1 −(R−Y) output CACC 16 automatic colour control −(R−Y)DE 2 (R−Y) de-emphasis HUE 17 hue control −(B−Y)o 3 −(B−Y) output PLL 18 PLL time constant −(B−Y)DE 4 (B−Y) de-emphasis OSC1 19 input for 7.15 MHz oscillator −(B−Y)CL 5 (B−Y) clamping CPLL 20 PLL DC reference −(R−Y)CL 6 (R−Y) clamping OSC2 21 input for 8.86 MHz oscillator SECAM reference tuned circuit NIDENT 22 NTSC identification 8 PIDENT 23 PAL/SECAM identification 9 SSC 24 super sandcastle pulse input 10 N01 25 NTSC (4.43 MHz) identification SECREF 7 GND 11 ground N02 26 NTSC (3.58 MHz) identification CHR2 12 DC for ACC SEC0 27 SECAM identification PAL0 28 PAL identification VP 13 supply voltage CDC 14 DC feedback Fig.3 Pin configuration for PLCC package. Fig.2 Pin configuration for DIL package. August 1993 4 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 FUNCTIONAL DESCRIPTION Reference oscillator Clamp The IC (see block diagram Fig.1) contains all functions required for the identification and demodulation of PAL, SECAM, NTSC 4.43 MHz and NTSC 3.58 MHz signals. When an unknown signal is fed into the input, the circuit has to identify the standard of the signal; to achieve this it has to switch on successively the appropriate input filter, crystal (8.8 or 7.2 MHz) and demodulator and finally, after having identified the signal, it has to switch on the colour and, in the event of NTSC reception, the hue control. The two colour difference signals −(R−Y) and −(B−Y) are available at the outputs. The identification circuit is able to discriminate between NTSC signals with colour carrier frequencies of 3.58 MHz or 4.43 MHz. The reference oscillator for PAL and NTSC operates at twice the colour carrier frequency. It is followed by a divider stage, providing the (R−Y) and (B−Y) reference signal with the correct phase relation to the PAL/NTSC demodulator and the identification part. Behind the demodulators the signals are being filtered and the black level is clamped to a constant DC-level during the burst gate pulse. For the SECAM signals this happens every second line, when the appropriate artificial black level is present. Chrominance amplifier The chrominance amplifier has an asymmetrical input. The input signal has to be AC coupled (pin 15). The differential amplifier stage at the input is followed by the gain control stage and a differential amplifier with lateral PNP transistors having the function of a level shifter. The gain control stage consists of two ACC-rectifier circuits. One rectifier circuit is switched on during SECAM reception respectively during the SECAM part of the system-control-scanning (it is switched on during part of the burst gate pulse and it is disabled during the prolonged frame flyback); the other rectifier is switched on during the burst, when PAL or NTSC signals are received respectively during the PAL and NTSC parts of the system control scanning. The DC-potential of the symmetrical signal connections to the demodulators is kept at the same level by means of a working point control stage. August 1993 De-emphasis and output-buffer Demodulators The demodulation of the colour signal requires three demodulators. Two are common for PAL and NTSC and one for the SECAM signals. In the event of NTSC reception, the symmetrical signal is fed into two differential amplifier stages with the correct gain and from there the signal is fed into two demodulators each consisting of four transistors. During NTSC reception the PAL switch between the differential amplifier of the (R-Y) channel and the corresponding demodulator is disabled. These transistors are switched on and off by the appropriate reference signals. In the event of PAL reception, the symmetrical signal is fed into the same differential amplifiers and the PAL switch is active. The SECAM demodulator is a combined demodulator for −(B−Y) and −(R−Y) with artificial black level being inserted alternately every second line and during line and field flyback. The load resistors of the demodulator are connected to two differential amplifiers, one for −(B−Y) and one for −(R−Y). The unwanted signals occurring every second line ((R−Y) in the −(B−Y) channel and (B−Y) in the −(R−Y) channel) are blanked. 5 Behind the clamping stages is the de-emphasis for the SECAM signals and just in front of the output stages are the colour killer and blanking stages. The blanking level is the same as the clamping level and the black level. Identification The identification part contains three demodulators. The first is demodulating during PAL and NTSC identification or reception. It is active during the burst clamping only. The reference signal has the (R-Y)-phase. The second demodulator is demodulating during the SECAM identification or reception and is active during part of the burst clamping time. It uses the same signals as the SECAM demodulator that is not active during field flyback. These two demodulators are followed by a H/2 switch ‘rectifying’ the demodulated signal. The result is an identification signal (PIDENT) that is positive for a PAL signal during the PAL part of the scanning, for a SECAM signal during the SECAM part of the scanning and for a PAL signal during the NTSC 4.43 part of the scanning. If the PIDENT is positive during the SECAM part of the scanning, the scanner switches back to the PAL part of the scanning in order to prevent that a PAL signal is erroneously identified as a SECAM signal (PAL priority). If then the PIDENT is not positive, the scanner returns to SECAM part and remains there until the PIDENT is Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals positive again. In the event of a field frequency of 60 Hz the signal cannot be identified as a SECAM signal, even if the PIDENT is positive. If the H/2 signal is of the wrong polarity, the identification signal is negative and the H/2 flip-flop is set to the correct phase. The third demodulator is demodulating during NTSC identification or reception only. It is active during the burst clamping time. The resulting identification signal (NIDENT) is positive for PAL and NTSC 4.43 MHz signal during the NTSC 4.43 part of the scanning and for NTSC 3.58 MHz signal during the TDA4651 NTSC 3.58 part of the scanning. The reference signal has the (B-Y) phase. The two identification signals allow an unequivocal identification of the received signal. If a signal has been identified, the scanning is stopped and after a delay time the colour is switched on. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltage (pin 13) − 13.2 V VI input voltage range at pins 1, 3, 17 and 24 to 28 0 VP V IO output current (pins 1 and 3) − −5 mA II/O input/output current (pin 25 to 28) − −5 µA Tamb operating ambient temperature range 0 +70 °C Tstg storage temperature range −25 +150 °C Ptot total power dissipation SOT117 − 1.4 W SOT261CG − 1.1 W THERMAL RESISTANCE SYMBOL Rth j-a August 1993 PARAMETER THERMAL RESISTANCE from junction to ambient in free air SOT117 37 K/W SOT261CG 70 K/W 6 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 CHARACTERISTICS All voltages are measured to GND (pin 11); VP = 12 V; chrominance input signal V15(p−p) = 200 mV (with 75% colour bar signal); Tamb = +25 °C; measured in test circuit of Fig.1; unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP positive supply voltage 10.8 12 13.2 V IP supply current 50 60 80 mA 20 200 400 mV Chrominance part Vi(p−p) input signal range (pin 15) (peak-to-peak value) RI input resistance (pin 15) 8.5 10 11.5 kΩ CI input capacitance (pin 15) − 4 5 pF see note 1 Demodulator part (PAL/NTSC) V1(p−p) V3(p−p) colour difference −(R−Y) output signal (peak-to-peak value) colour difference −(B−Y) output signal (peak-to-peak value) see note 2 PAL 442 525 624 mV NTSC 370 440 523 mV see note 2 PAL 559 665 791 mV NTSC 468 557 662 mV V1/V3 spread of ratio of colour difference signals (R-Y)/(B-Y) at nominal phase of hue control − − ±5 % V1/V1 spread of signal ratio PAL/NTSC at nominal phase of hue control − − ±1 dB m signal linearity V1(p−p) = 0.8 V −(R−Y) 0.8 − − V3(p−p) = 1.0 V −(B−Y) 0.8 − − DC output level proportional to VP 6.3 6.8 7.3 V H/2 ripple at CD outputs without colour bars − − 10 mV V1, 3(p−p) residual carrier at CD outputs (peak-to-peak value) 4.43 MHz − − 10 mV 8.87 MHz − − 30 mV Z1,3 output impedance − − 200 Ω V1,3 Demodulator part (SECAM) (see note 3) V1(p−p) colour difference −(R−Y) output signal (peak-to-peak value) every second line blanked 0.88 1.05 1.25 V V3(p−p) colour difference −(B−Y) output signal (peak-to-peak value) every second line blanked 1.12 1.33 1.58 V V1, 3 DC output level proportional to VP 6.3 6.8 7.3 V H/2 ripple at CD outputs without colour bars; every second line blanked − − 10 mV residual carrier at CD outputs (peak-to-peak value) 4.43 MHz − − 30 mV 8.87 MHz − − 30 mV V1,3(p-p) ∆V1,3/∆VP ∆V1/∆T shift of demodulated fo levels relative to blanking level with supply voltage − − 3 mV/V with temperature − 0.16 − mV/K − −0.25 − mV/K ∆V3/∆T August 1993 7 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals SYMBOL PARAMETER CONDITIONS TDA4651 MIN. TYP. MAX. UNIT Hue control part φ V17 R17 phase shift of reference carrier relative to phase at V17 = 3 V V17 = 2 V −30 −40 − deg phase shift of reference carrier V17 = 3 V − 0 ±5 deg phase shift of reference carrier relative to phase at V17 = 3 V V17 = 4 V 30 40 − deg internal bias voltage see note 4 − 3 − V switching voltage for oscillator adjustment burst OFF; colour ON 0 − 0.5 V switching voltage for forced colour ON hue OFF; colour ON 5.5 − VP V 4.25 5.0 5.75 kΩ − 350 − Ω input resistance Reference oscillator (PLL) (see note 5) R19,21 input resistance C19,21 input capacitance fc catching range − − 10 pF at 4.43 MHz ±400 − − Hz at 3.57 MHz ±330 − − Hz control voltage OFF state − 0.05 0.5 V control voltage ON state; during scanning 2.35 2.45 2.55 V control voltage ON state; internal forced 5.6 5.8 6.0 V control voltage ON state; external forced 9.0 − VP V Identification part (see note 6) V25 to 28 switching voltages I25 to 28 output currents − − −3 mA td delay time for system hold 2 − 3 cycles delay time for colour ON 2 − 3 cycles delay time for colour OFF 0 − 1 cycles − 4 − cycles 7.7 − VP V ts scanning time for each standard see note 7 Super sandcastle pulse detector (see note 8) V24 input pulse amplitude input voltage pulse levels to separate V and H blanking pulses pulse ON 1.3 1.6 1.9 V pulse OFF 1.1 1.4 1.7 V 2.0 2.5 3.0 V voltage pulse amplitude input voltage pulse levels to separate H blanking pulse pulse ON 3.3 3.6 3.9 V pulse OFF 3.1 3.4 3.7 V 4.1 4.5 4.9 V 6.6 7.0 V voltage pulse amplitude I24 August 1993 input voltage pulse levels to separate burst gating pulse pulse ON 6.2 pulse OFF 6.0 6.4 6.8 V input voltage during line scan − − 1.0 V input current during line scan − − −100 µA 8 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 Notes to the characteristics 1. With 20 mV, 3 dB decrease of the output signal is allowed. The level shift at demodulated f0 relative to blanking level is less than 5 mV. 2. Burst key width for PAL 4.3 µs, for NTSC 3.6 µs Burst width for PAL and NTSC 2.25 µs, ratio burst chrominance amplitude 1/2.2. 3. For the SEC+AM standard, amplitude and H/2 ripple content of the CD signals (R−Y) and (B−Y) depend on the characteristics of the external tuned circuit at pins 7 to 10. The resonant frequency of the external tuned circuit must be adjusted such that the demodulated fo voltage level is zero in the −(B−Y) output channel at pin 3. Now it is possible to adjust the quality of the external circuit such that the demodulated fo voltage level is zero in the −(R−Y) output channel at pin 1. If necessary, the fo voltage level in the −(B−Y) output channel must be readjusted to zero by the coil of the tuned circuit. The external capacitors at pins 2 and 4 (each 220 pF) are matched to the internal resistances of the de-emphasis network such that every alternate scanned line is blanked. 4. Pin 17 open-circuit; proportional to supply voltage. 5. The fo frequencies of the 8.8 MHz crystal at pin 21, and the 7.2 MHz crystal at pin 19, can be adjusted when the voltage at pin 17 is less than 0.5 V (burst OFF), thus providing double subcarrier frequencies of the chrominance signal. 6. Switching voltages for chrominance filters and crystals: at pin 28 for PAL at pin 27 for SECAM at pin 26 for NTSC (3.58 MHz) at pin 25 for NTSC (4.43 MHz). 7. The inquiry sequence for the standard is: PAL - SECAM - NTSC (3.58 MHz) - NTSC (4.43 MHz). PAL has priority with respect to SECAM, etc. 8. The super sandcastle pulse is compared with three internal threshold levels which are proportional to VP. Table 1 Specification of quartz crystals in HC-49/U13 holder; standard application. SYMBOL PARAMETER VALUE UNIT 43221430405 43221430418 fn nominal frequency CL load capacitance 8.867238 ∆fn adjustment tolerance of fn at +25 °C 10−12 10−3 7.159090 MHz 20 pF ±40 ppm Rdld max in the drive level range between W and 1.0 × W, the resonance resistance may not exceed (at +25 °C) the value of Rdld max Rn resonance resistance of unwanted response C1 motional capacitance (±20%) 22 C0 parallel capacitance (±20%) 5.5 T operating temperature range ∆fn frequency tolerance over temperature range ±25 ppm Rr maximum resonance resistance over temperature range 60 Ω August 1993 100 50 2Rr (+25 °C) Ω 19.5 fF 4.4 −10 to +60 9 Ω pF °C Philips Semiconductors Preliminary specification TDA4651 Fig.4 Internal circuits. Multistandard colour decoder with negative colour difference output signals August 1993 10 Philips Semiconductors Preliminary specification TDA4651 Fig.5 Application diagram with the switched capacitor delay line TDA4661. Multistandard colour decoder with negative colour difference output signals August 1993 11 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 PACKAGE OUTLINES seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH August 1993 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 12 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 PLCC28: plastic leaded chip carrier; 28 leads SOT261-2 eE eE y X A 19 25 18 26 bp b1 ZE w M 28 1 E HE pin 1 index e A A4 A1 12 4 β k1 (A 3) k 5 11 Lp v M A ZD e detail X D B HD v M B 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) k1 max. Lp v w y 0.51 1.44 1.02 0.18 0.18 0.10 Z D(1) Z E (1) max. max. UNIT A A1 min. A3 A4 max. bp b1 mm 4.57 4.19 0.51 0.25 3.05 0.53 0.33 0.81 0.66 0.180 0.020 0.01 0.165 0.12 0.430 0.430 0.495 0.495 0.048 0.057 0.021 0.032 0.456 0.456 0.020 0.05 0.007 0.007 0.004 0.085 0.085 0.390 0.390 0.485 0.485 0.042 0.040 0.013 0.026 0.450 0.450 inches D (1) E (1) e eD eE HD HE k 11.58 11.58 10.92 10.92 12.57 12.57 1.22 1.27 11.43 11.43 9.91 9.91 12.32 12.32 1.07 2.16 β 2.16 45 o Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-25 SOT261-2 August 1993 EUROPEAN PROJECTION 13 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). WAVE SOLDERING DIP Wave soldering techniques can be used for all PLCC packages if the following conditions are observed: SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. • The package footprint must incorporate solder thieves at the downstream corners. • The longitudinal axis of the package footprint must be parallel to the solder flow. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. REPAIRING SOLDERED JOINTS Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. PLCC REPAIRING SOLDERED JOINTS REFLOW SOLDERING Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Reflow soldering techniques are suitable for all PLCC packages. The choice of heating method may be influenced by larger PLCC packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our “Quality Reference Handbook” (order code 9397 750 00192). August 1993 14 Philips Semiconductors Preliminary specification Multistandard colour decoder with negative colour difference output signals TDA4651 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1993 15