NXP Semiconductors User’s guide Document Number: KTFRDMHB2000EVMUG Rev. 1.0, 3/2016 FRDM-HB2000-EVM evaluation board Figure 1. FRDM-HB2000-EVM © 2016 NXP B.V. Contents 1 2 3 4 5 6 7 8 9 10 11 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Getting to know the hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 FRDM-KL25Z Freedom SPI dongle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Installing the software and setting up the hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Board layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Board bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Accessory item bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 FRDM-HB2000-EVM evaluation board, Rev. 1.0 2 NXP Semiconductors Important notice 1 Important notice NXP provides the enclosed product(s) under the following conditions: This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The goods provided may not be complete in terms of required design, marketing and or manufacturing related protective considerations, including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services. Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and will be replaced by a new kit. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typical”, must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur. Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part. NXP™ and the NXP logo are trademarks of NXP Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2016 NXP B.V. FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 3 Getting started 2 Getting started 2.1 Kit contents/packing list The FRDM-HB2000-EVM contents includes: • Assembled and tested evaluation board/module in anti-static bag • FRDM-KL25Z • Warranty card 2.2 Jump start NXP’s analog product development boards help to easily evaluate NXP products. These tools support analog mixed signal and power solutions including monolithic ICs using proven high-volume SMARTMOS mixed signal technology, and system-in-package devices utilizing power, SMARTMOS and MCU dies. NXP products enable longer battery life, smaller form factor, component count reduction, ease of design, lower system cost and improved performance in powering state of the art systems. • Go to www.nxp.com/FRDM-HB2000-EVM • Review the tool summary page • Look for Jump Start Your Design • Download documents, software and other information Once the files are downloaded, review the user guide in the bundle. The user guide includes setup instructions, BOM and schematics. Jump start bundles are available on each tool summary page with the most relevant and current information. The information includes everything needed for design. 2.3 Required equipment and software To use this kit, you need: • 3/16” blade screwdriver for connecting the cables • DC Power supply: 5.0 V to 40 V with up to 20 A current handling capability, depending on motor requirements • USB Standard A (male) to mini-B (male) cable • Typical loads (brushed DC motor, power resistors or inductive load with up to 5.0 A and 28 V operation) • Function generator (optional) • FRDM-KL25Z Freedom Development Platform for SPI communication (included in KIT) • SPIGen software from www.nxp.com (For using FRDM-KL25Z based SPI Dongle) 2.4 System requirements The kit requires the following to function properly with the software: • USB enabled computer with Windows XP or newer FRDM-HB2000-EVM evaluation board, Rev. 1.0 4 NXP Semiconductors Getting to know the hardware 3 Getting to know the hardware 3.1 Board overview The FRDM-HB2000-EVM evaluation kit exercises all the functions of the MC33HB2000 H-Bridge device. The parallel input can be easily controlled by lab equipment or any MCU with GPIOs. The board can be used in conjunction with a FRDM-KL25Z board connected to a PC’s USB port. Configure, control, and monitor the status of MC33HB2000 by using the board’s SPI communication capabilities. 3.2 Board features The FRDM-HB2000-EVM board evaluates the NXP part MC33HB2000, including all functions. The board features the following: • Built-in reverse battery protection • Test points allows probing its signals • Built-in voltage regulator to supply logic level circuitry • LEDs to indicate the supply status and the direction of the motor • Low equivalent series resistance (ESR) capacitor to reduce ripple in the power supply • Transient voltage suppressor to handle system level transients 3.3 Block diagram The hardware block diagram is shown in Figure 2. 5V Voltage Reverse Power Supply Regulator Battery and Transient Protection VPWR Optional 5.0 V Supply to FRDM LED VDD LED Charge Pump Capacitor Optional 3.3 V Supply from FRDM VPWR FS_B LED VDDQ CCP To MCU GPIO FS_B From MCU GPIO IN1 IN2 ENBL DIS OUT1 FWD LED OUT2 MOSI MCU SPI Load MC33HB2000 MISO SCLK REV LED To MCU ADC input CFB CSB Shunt Resistor All Grounds Figure 2. Block diagram FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 5 Getting to know the hardware 3.3.1 Device features This evaluation board features the following NXP product: Table 1. Features Device Description Features • Advanced diagnostic reporting via a serial peripheral interface (SPI): charge pump undervoltage on VPWR, short to ground and short to VPWR for each output, open load, temperature warning and overtemperature shutdown • Thermal management: Excellent thermal resistance of <1.0 °C/W between junction and case (exposed pad) • Eight selectable slew rates via the SPI: 0.25 V/s to more than 16 V/s for EMI and thermal performance optimization • Four selectable current limits via the SPI: 5.4/7.0/8.8/10.7 A, covering a wide range of applications MC33HB2000 The 33HB2000 is a monolithic H-Bridge Power IC, enhanced with SPI configurability and diagnostic capabilities. • Can be operated without the SPI with a default slew rate of 2.0 V/s and a 7.0 A current limit threshold • Highly accurate real-time current feedback through a current mirror output signal with less than 5.0% error • Drives inductive loads in a full H-Bridge or Half-bridge configuration • Overvoltage protection places the load in high-side recirculation (braking) mode with notification in H-Bridge mode • Wide operating range: 5.0 V to 28 V operation • Low RDS(on) integrated MOSFETs: Maximum of 235 m(TJ = 150 °C) for each MOSFET • Internal protection for overtemperature, undervoltage and short-circuit by signaling the error condition and disabling the outputs • I/0 Pins can withstand up to 36 V 3.3.2 Modes of operation Figure 3. Modes of operation FRDM-HB2000-EVM evaluation board, Rev. 1.0 6 NXP Semiconductors Getting to know the hardware 3.3.3 Architecture Figure 4. Architecture 3.3.4 Thermal management Figure 5. Architecture FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 7 Getting to know the hardware 3.4 Board description Figure 6 describes the main elements on the FRDM-HB2000-EVM. 5.0 V Regulator Jumpers Test Points Reverse Battery Protection Power and Ground Inputs Output Terminal MC33HB2000 Figure 6. Board description Table 2. Board Description Name MC33HB2000 Description Monolithic H-Bridge power IC in a robust thermally enhanced 32 lead SOIC-EP package 5.0 V Regulator 5.0 V regulator for VDD and supply Jumpers Jumpers for configuring the board for different modes of operation Reverse Battery Protection MOSFET for protecting MC33HB2000 in reverse battery condition Power and Ground inputs Power supply terminal to connect the battery/power supply with the board Test Points Test points to probe different signals Output terminal Output connector to connect a load to the MC33HB2000 output FRDM-HB2000-EVM evaluation board, Rev. 1.0 8 NXP Semiconductors Getting to know the hardware 3.5 LED display The following LEDs serve as visual output devices for the evaluation board: FWD REV VDD VBAT FS_B Figure 7. LED locations Table 3. LED display LED ID Description VBAT GREEN LED, indicates when main/battery supply is connected VDD GREEN LED, indicates when +5.0 V supply is connected FS_B RED LED, illuminates when the H-Bridge detects a fault FWD GREEN LED, indicates current flowing in forward direction REV RED LED, indicates current flowing in reverse direction FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 9 Getting to know the hardware 3.6 Jumper definitions The Figure 8 illustrates the evaluation board jumper locations. Table 4 explains the function of each position. Blue fonts in the Jumper Position column indicate the default settings for use with the FRDM-KL25Z. ENBL CFB IN2 IN1 EX_IN DIS VDD CFB_R MOSI SCLK MISO VDD_REG CS_B FS_B VDDQ Figure 8. Jumper locations Table 4. Jumper definitions Name J1 J2 J3 Signal IN1 DIS IN2 J4 CS_B J5 ENBL J6 SCLK J7 MOSI J8 MISO J11 CFB J14 VDDQ Jumper position Connection 1–2 IN1 control through MCU parallel output on J10 Pin 1 (DATA0) 2–3 IN1 control through external input on J15 Pin 1 1–2 DIS control through MCU parallel output on J10 Pin 13 (CTRL1) 2–3 DIS connected to GND to keep the outputs enabled 1–2 IN2 control through MCU parallel output on J10 Pin 3 (DATA1) 2–3 IN2 control through external input on J15 Pin 2 1–2 CS_B control through MCU SPI output J10 Pin 6 (SPI_CS_B) 2–3 CS_B pulled up to VDD for operation without SPI 1–2 ENBL control through MCU parallel output J10 Pin 11 (CTRL0) 2–3 ENBL pulled up to VDD to keep the outputs enabled 1–2 SPI clock SCLK from MCU J10 Pin 12 (SPI_SCLK 2–3 SCLK connected to GND for operation without SPI 1–2 MOSI control through MCU SPI output J10 Pin 8 (SPI_MOSI) 2–3 MOSI connected to GND for operation without SPI 1–2 MISO control through MCU SPI output J10 Pin 10 (SPI_MISO) 2–3 MISO not connected for operation without SPI 1-2 CFB connected to 200 resistor 1–2 VDD connected to VDDQ 2–3 VDDQ not connected FRDM-HB2000-EVM evaluation board, Rev. 1.0 10 NXP Semiconductors Getting to know the hardware Table 4. Jumper definitions (continued) Name Signal J17 VDD J18 Jumper position Connection 1–2 VDD supply from regulator U2 2–3 VDD supply from FRDM board CFB_R 1–2 CFB connected to MCU ADC input J10 Pin 17 (CFB_READ) J19 FS_B 1–2 FS_B connected to the pull-up resistor J26 VDD_REG 1–2 VDD to FRDM board J15 EX_IN Open IN1 and IN2 External Inputs The FRDM-HB2000-EVM, in conjunction with a FRDM-KL25Z board (shipped with the kit), can evaluate the design by means of a GUI, any MCU with GPIO or with simple lab equipment. A FRDM-KL25Z-compatible GUI and MCU program are available online at the following link: www.nxp.com/FRDM-HB2000-EVM. The FRDM-HB2000-EVM is compatible with any Arduino™ platform board. However, if a board other than the FRDM-KL25Z is used, MCU code must be written to work with the board. 3.7 Input signal definitions The following input signals control the outputs or functions inside the circuit. Table 5. Input signal definitions Input Name Description DIS Disable signal to tri-state the outputs ENBL 3.8 Disable signal to tri-state the output and put the part in Sleep mode IN1 Logic input to control OUT1 IN2 Logic input to control OUT2 MOSI Master out slave input for the SPI CS_B Chip select bar input for the SPI SCLK Clock for the SPI Output signal definitions The FRDM-HB2000-EVM uses the following output signals to drive a load such as a brushed DC motor. The board provides an analog output for real time load current monitoring. This signal allows closed loop control of the load. Table 6. Output signal definitions Output Name 3.9 Description OUT1 Output 1 of H-Bridge OUT2 Output 2 of H-Bridge FS_B Open drain Active Low status flag output to indicate fault CFB Current mirror output for real time load current monitoring MISO Master input slave output for SPI Test point definitions The following test points provide access to various signals to and from the board. FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 11 Getting to know the hardware ENBL1 FS_B1 DIS1 IN_1 MOSI1 IN_2 GND2 GND1 CFB_V VDD1 SCLK1 CCP CS_B1 GND GND3 VPWR MISO1 VDDQ1 Figure 9. Test point locations Table 7. Test point definitions Test point name Signal name CFB_V CFB_READ Description CFB pin voltage going to ADC CCP CCP Charge pump voltage ENBL1 ENBL Enable/disable signal to activate/tri-state the outputs and put the device to sleep mode DIS1 DIS Enable/disable signal to activate/tri-state the outputs IN_1 IN1 Direction control in H-Bridge mode and OUT1 control in half-bridge mode IN_2 IN2 PWM control in H-Bridge mode and OUT2 control in half-bridge mode VPWR VPWR System voltage VDDQ1 VDDQ VDDQ digital output supply voltage FSB1 FSB Fault status monitoring pin VDD1 VDD VDD supply for the part CS_B1 CS_B Chip select bar SCLK1 SCLK Clock for SPI MOSI1 MOSI Master output slave input signal MISO1 MISO Master input slave output signal GND GND Ground signal GND1 GND Ground signal GND2 GND Ground signal GND3 GND Ground signal FRDM-HB2000-EVM evaluation board, Rev. 1.0 12 NXP Semiconductors Getting to know the hardware 3.10 Screw terminal connections The board has the following screw terminal connections to connect the power supply and the load. J20 J21 Figure 10. Screw terminal locations Table 8. Screw terminal connections Screw Terminal Name Description J20 Power supply connector for the MC33HB2000 J21 Output connector to connect load FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 13 FRDM-KL25Z Freedom SPI dongle 4 FRDM-KL25Z Freedom SPI dongle The NXP Freedom development platform is a set of software and hardware tools supporting evaluation and development. It is ideal for rapid prototyping of microcontroller-based applications. The NXP Freedom KL25Z hardware, FRDM-KL25Z, is a simple, yet sophisticated design featuring a Kinetis L series microcontroller, the industry's first microcontroller built on the ARM® Cortex™-M0+ core. RGB LED J10 I/O Header J1 I/O Header J9 I/O Header J2 I/O Header KL25Z USB Reset OpenSDA USB Figure 11. FRDM-KL25Z 4.1 Connecting the FRDM-KL25Z to the board The FRDM-KL25Z evaluation board was chosen specifically to work with the FRDM-HB2000-EVM kit because of its low cost and features. The FRDM-KL25Z board makes use of the USB, built in LEDs and I/O ports available with NXP’s Kinetis KL2x family of microcontrollers. The FRDM-KL25Z connects to a PC through a USB port, which permits the user to control a DC brushed motor and to drive the evaluation board inputs in order to operate the motor via the GPIOs and SPI pins. The FRDM-KL25Z also monitors the SPI registers, thereby facilitating the use of safety and advanced diagnostic functions. The FRDM-HB2000-EVM connects to the FRDM-KL25Z using the four dual row Arduino™ R3 connectors on the bottom of the board (see Table 9, Figure 12, and Figure 13). FRDM-HB2000-EVM evaluation board, Rev. 1.0 14 NXP Semiconductors FRDM-KL25Z Freedom SPI dongle Figure 12. Connecting the FRDM-HB2000-EVM to the FRDM-KL25Z Figure 13. FRDM-KL25Z to FRDM-HB2000-EVM connections FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 15 FRDM-KL25Z Freedom SPI dongle Table 9. FRDM-HB2000-EVM to FRDM-KL25Z Connections FRDM-HB2000-EVM FRDM-KL25Z Pin hardware name Description Header Pin Header Pin FRDM-HB2000-EVM FRDM-KL25Z J24 1 J1 1 N/C PTC7 No connection J24 2 J1 2 N/C PTA1 No connection J24 3 J1 3 N/C PTC0 No connection J24 4 J1 4 N/C PTA2 No connection J24 5 J1 5 N/C PTC3 No connection J24 6 J1 6 N/C PTD4 No connection J24 7 J1 7 N/C PTC4 No connection J24 8 J1 8 N/C PTA12 No connection J24 9 J1 9 N/C PTC5 No connection J24 10 J1 10 N/C PTA4 No connection J24 11 J1 11 N/C PTC6 No connection J24 12 J1 12 N/C PTA5 No connection J24 13 J1 13 N/C PTC10 Not connection J24 14 J1 14 N/C PTC8 No connection J24 15 J1 15 N/C PTC11 Not connection J24 16 J1 16 N/C PTC9 No connection J10 1 J2 1 DATA0/IN1 PTC12 IN1 signal for the H-Bridge J10 2 J2 2 N/C PTA13 No connection J10 3 J2 3 DATA1/IN2 PTC13 IN2 signal for the H-Bridge J10 4 J2 4 N/C PTD5 No connection J10 5 J2 5 FS_B PTC16 Fault status pin to report fault J10 6 J2 6 CS_B PTD0 Chip select bar pin J10 7 J2 7 N/C PTC17 No connection J10 8 J2 8 MOSI PTD2 Master output serial input J10 9 J2 9 N/C PTA16 No connection J10 10 J2 10 MISO PTD3 Master input serial output J10 11 J2 11 N/C PTA17 No connection J10 12 J2 12 SCLK PTD1 Clock for SPI J10 13 J2 13 N/C PTE31 No connection J10 14 J2 14 GND GND No connection J10 15 J2 15 N/C N/C No connection J10 16 J2 16 N/C VREFH No connection J10 17 J2 17 CFB_READ PTD6 ADC input for monitoring the CFB pin J10 18 J2 18 N/C PTE0 Disable signal to tri-state the output and put the part in sleep mode (Active Low) FRDM-HB2000-EVM evaluation board, Rev. 1.0 16 NXP Semiconductors FRDM-KL25Z Freedom SPI dongle Table 9. FRDM-HB2000-EVM to FRDM-KL25Z Connections (continued) FRDM-HB2000-EVM FRDM-KL25Z Pin hardware name Description Header Pin Header Pin FRDM-HB2000-EVM FRDM-KL25Z J10 19 J2 19 N/C PTD7 No connection J10 20 J2 20 FRDM_VDD PTE1 No connection J23 1 J10 1 N/C PTE20 No connection J23 2 J10 2 N/C PTB0 No connection J23 3 J10 3 N/C PTE21 No connection J23 4 J10 4 N/C PTB1 No connection J23 5 J10 5 N/C PTE22 No connection J23 6 J10 6 N/C PTB2 No connection J23 7 J10 7 N/C PTE23 No connection J23 8 J10 8 N/C PTB3 No connection J23 9 J10 9 N/C PTE29 No connection J23 10 J10 10 N/C PTC2 No connection J23 11 J10 11 N/C PTE30 No connection J23 12 J10 12 N/C PTC1 No connection J25 1 J9 1 N/C PTB8 No connection J25 2 J9 2 N/C SDA_PTD5 No connection J25 3 J9 3 N/C PTB9 No connection J25 4 J9 4 N/C P3V3 No connection J25 5 J9 5 N/C PTB10 No connection J25 6 J9 6 N/C RESET/PTA20 No connection J25 7 J9 7 N/C PTB11 No connection J25 8 J9 8 N/C P3V3 No connection J25 9 J9 9 N/C PTE2 No connection J25 10 J9 10 N/C P5V_USB No connection J25 11 J9 11 N/C PTE3 No connection J25 12 J9 12 GND GND Ground J25 13 J9 13 N/C PTE4 No connection J25 14 J9 14 GND GND No connection J25 15 J9 15 N/C PTE5 No connection J25 16 J9 16 VDD_REG P5-9V_VIN 5.0 V logic input to FRDM-KL25Z board from FRDM-HB2000-EVM FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 17 Installing the software and setting up the hardware 5 Installing the software and setting up the hardware 5.1 Configuring the hardware The FRDM-HB2000-EVM consists of an H-Bridge, a parallel and SPI interface, power conditioning circuitry and an FRDM-KL25Z board. The board can be configured for use in conjunction with a FRDM-KL25Z board or a function generator. Caution: When using the FRDM-HB2000-EVM, make sure that the maximum motor supply voltage (VPWR) stays within the 5.0 V to 40 V range. Operating outside this range may cause damage to the board. 5.1.1 Step-by-step instructions for setting up the hardware for use with a FRDM-KL25Z To configure the FRDM-HB2000-EVM for use with the FRDM-KL25Z do the following: 1. Connect the FRDM-HB2000-EVM to the FRDM-KL25Z using the Arduino™ connectors on each board. 2. Connect the USB cable (not supplied with the kit) between the PC and the KL25Z USB port on the FRDM-KL25Z board. 3. With the power switched off, attach the DC power supply to the VBAT and GND screw connector terminal (J20) on the evaluation board. 4. Connect the load to the screw terminal (J21). Figure 14 illustrates the hardware configuration using a FRDM-KL25Z. 5 - 40 V Power Supply, 20 A Brushed DC Motor Standard A to Mini-B USB Cable FRDM-HB2000-EVM USB Workstation FRDM-KL25Z Board Figure 14. FRDM-HB2000-EVM configured for use with an FRDM-KL25Z board FRDM-HB2000-EVM evaluation board, Rev. 1.0 18 NXP Semiconductors Installing the software and setting up the hardware 5.1.2 Step-by-step instructions for setting up the hardware for use with a function generator This section describes how to configure the FRDM-HB2000-EVM for use with a function generator. The same connections apply if the board is connected to a microcontroller instead of a function generator. See the board description (Section 3.4, Board description, page 8), the schematic (Section 6, Schematic, page 25) and the MC33HB2000 datasheet, to configure the board for use in a specific environment. 1. Connect the function generator to the EX_IN jumper, with one channel attached to each pin. 2. Change the board jumper connections, as shown in Figure 15. 3. With the power switched off, attach the DC power supply to the VBAT and GND screw connector terminal (J20) on the evaluation board. 4. Connect the load to the screw terminal (J21). Figure 15 illustrates the hardware configuration. Function Generator (or MCU) 5 - 40 V Power Supply, 20 A Jumpers moved from 1 - 2 (default) to 2 - 3 position Brushed DC Motor VDD jumper remains in 1 - 2 (default) position Jumpers moved from 1 - 2 (default) to 2 - 3 position Figure 15. FRDM-HB2000-EVM configured for use with a function generator FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 19 Installing the software and setting up the hardware 5.2 Installing and using SPIGen on the computer The latest version of SPIGen supports the MC33HB2000 and is designed to run on any Windows 8, Windows 7, Vista, or XP-based operating system. To install the software, do the following: 1. Go to the following website and click on the Download button: www.nxp.com/SPIGen. 2. When the SPIGEN: SPI Generator (SPIGen) Software page appears, go to the Device Drivers section and click on the Download button associated with the description of the select environment. A wizard guides the user through the process. 3. If instructed for the SPIGen wizard to create a short-cut, a SPIGen icon appears on the desktop. If elected not to create a short-cut, the SPIGen executable is installed by default at C:Program Files\SPIGen. Note: Installing the device drivers overwrites any previous SPIGen installation and replaces it with a current version containing the MC33HB2000 drivers. However, configuration files (.spi) from the previous version remain intact. 4. Launch SPIGen. The HB2000/HB2001 device should appear in the device view panel at the left (see Figure 14). Figure 16. SPIGen home page 5. To access the HB2000/HB2001 tab in the SPIGen window, expand the HB2000/HB2001 folder in the device view. Then click on the Registers icon (see Figure 17). If the pre-programmed code on FRDM-KL25Z is accidentally erased, download "UsbSpiDongleKL25Z_SPIDrive_v512.srec" from the following link: www.nxp.com/Usb-Spi-Dongle-firmware-KL25Z-HB2000-1. FRDM-HB2000-EVM evaluation board, Rev. 1.0 20 NXP Semiconductors Installing the software and setting up the hardware Figure 17. MC33HB2000 SPI window 6. Reading all the SPI registers displays the following default status. Figure 18. SPI control FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 21 Installing the software and setting up the hardware 5.2.0.1 SPI control Figure 19. SPI control description Table 10. SPI control description Name Description Read Click the read button on top of each register to read the content of each register. Write Click individual bits of any register and then press the corresponding write button to write into the register. SPI control This section is designed for ease of use. Each dropdown menu sets or resets appropriate bits in the registers for a selected configuration. However, after configuration selection, press the write button of the corresponding register to be able to configure the part. FRDM-HB2000-EVM evaluation board, Rev. 1.0 22 NXP Semiconductors Installing the software and setting up the hardware 5.2.0.2 Parallel control Figure 20. Parallel control description Direction: • Forward: Current flowing through OUT1 to OUT2 • Reverse: Current flowing through OUT2 to OUT1 Recirculation: • High-side: Freewheel-High (both high-side FETs turned on) during PWMing • Low-side: Freewheel-Low (both low-side FETs turned on) during PWMing (only valid for Half-Bridge mode) ENBL: • Yes: ENBL is logic HIGH, the H-Bridge is operational • No: ENBL is logic LOW, the H-Bridge outputs are tri-stated and placed in sleep mode DIS: • DIS is logic HIGH, both OUT1 and OUT2 are tri-stated • DIS is logic LOW, both OUT1 and OUT2 are enabled PWM Freq: • Enter PWM frequency up to 20000 Hz Duty Cycle: • Select PWM duty cycle from 10-90% Start: • After selection of parallel control configuration, press “Start” to activate the outputs Stop: • Press “Stop” to deactivate the outputs Current Feedback: • Shows current through the high-side FET using the current recopy feature Status Fault: • Shows any fault condition in sleep mode FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 23 Installing the software and setting up the hardware Table 11. Logic behind direction control with high-side versus low-side recirculation Half-Bridge Mode Forward - High-side recirculation 1 2 3 IN1 = 1, IN2 = PWM signal with selected duty cycle and frequency Reverse - High-side recirculation IN1 = PWM signal with selected duty cycle and frequency, IN2 = 1 Forward - Low-side recirculation IN1 = PWM signal with selected duty cycle and frequency, IN2 = 0 Reverse - Low-side recirculation 4 IN1 = 0, IN2 = PWM signal with selected duty cycle and frequency H-Bridge Mode Forward - High-side recirculation 1 IN1 = 1, IN2 = PWM signal with selected duty cycle and frequency Reverse - High-side recirculation 2 IN1 = 0, IN2 = PWM signal with selected duty cycle and frequency FRDM-HB2000-EVM evaluation board, Rev. 1.0 24 NXP Semiconductors OUT2 OUT1 VPWR IN U2 C7 0.33UF 1 GREEN VBAT A A C C 3 1 VDD_ HDR_1X3 R2 47K VDD_REG 4 3 Outputs REV RED 5 2 3 R204 1K R203 1K CCP GREEN VDD R207 4.70K VDD FRDM_VDD Do not populate D59 SMBJ40 VPWR C4 0.033UF C5 0.033UF 1 2 CON 1X2 TB TH OUT Jumper setting 1-2 for VDD through regulator and 2-3 for VDD supply through FRDM board. 1M R1 4 C A Q1 IPD30N06S2-15 1 C8 0.1uF 3 BAS70TW-7-F 6 1 D57 GREEN FWD Power Supply MC7805ABD2TG OUT 1N4148WS D58 1 2 1 J20 CON 1X2 TB TH GND 4 Q3 SMMBTA06LT1G 2 3 2 CS_B1 SCLK1 MOSI1 MISO1 VDD1 27 30 31 29 CS_B SCLK MOSI MISO CS SCLK MOSI MISO ENBL DIS IN2 IN1 U1 GND GND1 GND2 GND3 FS_B1 2 3 4 5 ENBL DIS IN2 IN1 VDDQ 28 VDDQ R10 10K A C C A A C AGND1 AGND2 1 19 GND 8 9 24 25 VPWR1 VPWR2 VPWR3 VPWR4 PGND1 PGND2 PGND3 PGND4 21 20 14 13 12 26 10 11 22 23 6 7 MC33HB200EKAF NC_21 NC_20 NC_14 NC_13 NC_12 CCP OUT1_10 OUT1_11 OUT2_22 OUT2_23 CFB FS VPWR CCP DIS1 ENBL1 CCP CFB_READ CCP ENBL DIS IN2 IN1 VPWR VDDQ GND GND GND GND FS_B VDD SPI Signal Test Points CS_B SCLK MOSI MISO + FS_B_ HDR_1X2 C1 0.1 UF Main Signal Test Points IN_2 CFB_V CCP CFB C3 0.1 UF Main Circuit IN_1 VPWR VDDQ1 15 16 17 18 DGND 32 EP 33 NXP Semiconductors 1 2 C2 100UF RED FS_B R206 4.70K VDD OUT2 OUT1 FS_B 2 4 6 8 10 12 14 16 3 EX_IN1 3 2 1 HDR_1X3 DIS 3 2 HDR_1X3 MOSI 2 VDDQ HDR_1X2 1 2 VDD_REG VDD_REG HDR_1X3 VDDQ Supply from the regulator 3 1 VDD VDDQ MOSI (Option for input with and without SPI) MOSI 1 DIS (Option for input with and without SPI) SPI_MOSI DIS CTRL1 1 3 5 7 9 11 13 15 3 2 1 HDR_1X3 CS_B 3 2 1 HDR_1X3 MISO 1 2 J10 CFB HDR_1X3 ENBL HDR_1X3 SCLK CFB HDR_1X2 1 2 Current Feedback R202 200 IN1 and IN2 External Inputs HDR_1X2 EX_IN 1 2 SCLK (Option for input with and without SPI) 3 2 1 ENBL (Option for input with and without SPI) 3 2 1 0 0 0 0 0 J24 CFB_READ CTRL0 CTRL1 DATA0 DATA1 FS_B HDR_2X8 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 All settings jumper position 1-2 for operation with MCU and 2-3 for manual operation. C9 0.047UF R193 SPI Connector 1 3 5 7 9 11 13 15 17 19 12 10 8 6 4 2 HDR_2X6 J23 HDR_10X2 2 4 6 8 10 12 14 16 18 20 11 9 7 5 3 1 SCLK SPI_SCLK VDD R209 4.70K ENBL CTRL0 EX_IN1 EX_IN2 R187 R188 R210 CFB_READ Jumpers HDR_1X2 CFB_R MISO (Option for input with and without SPI) FRDM_VDD provides 3.3V instead of 5V FRDM_VDD SPI_CS_B SPI_MOSI SPI_MISO SPI_SCLK HDR_2X8 J25 MISO SPI_MISO VDD R208 4.70K HDR_1X3 IN2 CS_B (Option for input with and without SPI) SPI_CS_B CS_B 3 2 1 IN2 (Option for input with and without SPI) EX_IN2 IN2 IN1 (Option for input with and without SPI) DATA1 2 IN1 HDR_1X3 IN1 1 DATA0 6 A C VBATT Schematic Schematic Figure 21. Evaluation board schematic FRDM-HB2000-EVM evaluation board, Rev. 1.0 25 Board layout 7 Board layout 7.1 Silkscreen FRDM-HB2000-EVM evaluation board, Rev. 1.0 26 NXP Semiconductors Board bill of materials 8 Board bill of materials Table 12. Bill of materials (1) Item Qty Schematic Label Value Value/Description Part Number Assy Opt Active Components 1 1 U1 IC DRV H-BRIDGE MOTOR 3.0 A 5.0 to 28 V SOIC32—NXP MC33HB2000EK (2) 2 1 U2 IC VREG 5.0 V 1.0 A 5.0 to 18 V D2PAK—ON Semiconductor MC7805ABD2TG (2) Diodes 3 1 D2 24 V DIODE TVS UNIDIR 600 W 24 V AEC-Q101 SMB SMBJ24AHE3/52 4 1 D57 70 V DIODE SCH TRIPLE 70 mA 70 V / 200 MW SOT363 BAS70TW-7-F 5 1 D58 75 V DIODE SW 150 mA 75 V SOD-323 1N4148WS-7-F 6 2 D59, D64 150 mA LED RED SGL 25 mA 0805 598-8110-107F 7 3 D60, D61, D63 25 mA LED GRN SGL 25 mA 0805 598-8170-107F C1, C3 0.1 F CAP CER 0.1 F 50 V 10% X7R 0805 C0805C104K5RAC MAL214699104E3 Capacitors 8 2 9 1 C2 100 F CAP ALEL 100 F 50 V 20% AEC-Q200 RADIAL SMT 10 2 C4, C5 0.033 F CAP CER 0.033 F 50 V 10% X7R 0805 08055C333KAT2A 11 1 C7 0.33 CAP CER 0.33 F 50 V 10% X7R 0603 C1608X7R1H334K080AC 12 1 C8 0.1 F CAP CER 0.1 F 16 V 10% X7R AEC-Q200 0603 GCM188R71C104KA37D 13 1 C9 0.047 F CAP CER 0.047 F 25 V 10% X7R 0603 C0603X7R250-473KNE Resistors 14 1 R1 1.0 M RES 1 M 1/4 W 1% AEC-Q200 0603 CRCW06031M00FKEAHP 15 1 R2 47 k RES MF 47 k 1/10 W 1.0% AEC-Q200 0603 CRCW060347K0FKEA 16 1 R10 10 k RES MF 10 k 1/10 W 5% AEC-Q200 0603 ERJ-3GEYJ103V 17 4 R18, R188, R192, R193 0 RES MF 0 1/10 W -- 0603 CRCW06030000Z0EA 18 1 R202 200 RES MF 200 1/10 W 1% 0603 RK73H1JTTD2000F 19 2 R203, R204 1.0 K RES MF 1.0 K 1/10 W 1% 0603 AR03FTNX1001 20 4 R206, R207, R208, R209 4.70 K RES MF 4.70 K 1/10 W 1% 0603 RK73H1JTTD4701F FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 27 Accessory item bill of materials Table 12. Bill of materials (1) (continued) Item Qty Schematic Label Value Value/Description Part Number Assy Opt Switches, Connectors, Jumpers and Test Points 21 16 IN1, GND1,IN2, GND2, GND3, VPWR, VDDQ, VDD,SCLK, MOSI, MISO, GND,FS_B, ENBL, DIS, CS_B 22 11 J1, J2, J3, J4, J5, J6, J7, J8, J14, J17 HDR 1X3 TH 100 MIL SP 374H AU 826629-3 23 1 J10 HDR 2X10 TH 100 MIL CTR 330H AU 100L TSW-110-07-S-D 24 4 J11, J15, J18, J19, J26 HDR 1X2 TH 100 MIL SP 378H AU 130L 826629-2 25 2 J20, J21 CON 1X2 TB TH 5.08 MM 543H SN 138L 20020316-H021B01LF 26 1 J23 HDR 2X6 TH 100 MIL CTR 330H AU TSW-106-07-S-D 27 2 J24, J25 HDR 2X8 TH 100 MIL CTR 330H AU TSW-108-07-G-D IPD30N06S2-15 SMMBTA06LT1G TEST POINT BLACK 40 MIL DRILL 180 MIL TH 109L 5001 28 1 Q1 TRAN NMOS PWR 30 A 55 V AEC-Q101 TO252 29 1 Q3 TRAN NPN DRIVER 500 mA 80 V AEC-Q101 SOT23 Notes 1. NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. 2. Critical components. For critical components, it is vital to use the manufacturer listed. 9 Accessory item bill of materials Table 13. Bill of materials (3) Item Qty 1 1 Part Number FRDM-KL25Z Description NXP Freedom Development Platform for Kinetis KL14/15/24/25 MCUs Notes 3. NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. FRDM-HB2000-EVM evaluation board, Rev. 1.0 28 NXP Semiconductors References 10 References Following are URLs where you can obtain information on related NXP products and application solutions: NXP.com support pages Description URL FRDM-HB2000-EVM Tool Summary Page www.nxp.com/FRDM-HB2000-EVM MC33HB2000 Product Summary Page www.nxp.com/MC33HB2000 FRDM-KL25Z Tool Summary Page www.nxp.com/webapp/sps/site/prod_summary.jsp?code=FRDM-KL25Z SPIGen Software www.nxp.com/SPIGEN 10.1 Support Visit www.nxp.com/support for a list of phone numbers within your region. 10.2 Warranty Visit www.nxp.com/warranty to submit a request for tool warranty. FRDM-HB2000-EVM evaluation board, Rev. 1.0 NXP Semiconductors 29 Revision history 11 Revision history Revision Date 1.0 3/2016 Description of Changes • Initial release FRDM-HB2000-EVM evaluation board, Rev. 1.0 30 NXP Semiconductors How to Reach Us: Information in this document is provided solely to enable system and software implementers to use NXP products. Home Page: NXP.com There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits Web Support: http://www.nxp.com/support products herein. based on the information in this document. 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NXP, the NXP logo, Freescale, the Freescale logo, SafeAssure, the SafeAssure logo and SMARTMOS are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2016 NXP B.V. Document Number: KTFRDMHB2000EVMUG Rev. 1.0 3/2016