Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCIMX27LMOP4B MAPBGA 473 19*19*.8P.8 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-07-31 5365K11153D007A1.7 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MCIMX27LMOP4B MAPBGA 473 19*19*.8P.8 ALL 0.919400 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.0038 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000285 g Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.00076 g Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.000285 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 Bonding Wire SubstanceWeight SubPart% ARTICLEPPM ARTICLE% UoM SubPart PPM 75000 7.5 309 0.0309 200000 20 826 0.0826 g 75000 7.5 309 0.0309 0.00076 g 200000 20 826 0.0826 0.00171 g 450000 45 1859 0.1859 1000000 100 9353 0.9353 g 0.0086 Bonding Wire Solder Balls - Lead Free Exemption g Metals Gold, metal 7440-57-5 0.0086 0.122 g g Solder Balls - Lead Free Metals Aluminum, metal 7429-90-5 0.00000061 g 5 0.0005 0 0 Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000988 g 81 0.0081 10 0.001 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000464 g 38 0.0038 5 0.0005 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000476 g 39 0.0039 5 0.0005 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.00061952 g 5078 0.5078 673 0.0673 Solder Balls - Lead Free Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00000488 g 40 0.004 5 0.0005 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.00000415 g 34 0.0034 4 0.0004 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00002733 g 224 0.0224 29 0.0029 Solder Balls - Lead Free Nickel (external applications only) Nickel 7440-02-0 0.00000476 g 39 0.0039 5 0.0005 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00110154 g 9029 0.9029 1198 0.1198 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.12020903 g 985320 98.532 130747 13.0747 Solder Balls - Lead Free Metals Zinc, metal 7440-66-6 0.00000073 g 6 0.0006 0 0 Solder Balls - Lead Free Metals Germanium 7440-56-4 0.00000817 g 67 0.0067 8 0.0008 Die Encapsulant 0.5163 g Die Encapsulant Plastics/polymers Other Epoxy resins - 0.030978 g 60000 6 33693 3.3693 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.005163 g 10000 1 5615 0.5615 Die Encapsulant Solvents, additives, and other materials Other inorganic compounds. - 0.010326 g 20000 2 11231 1.1231 Die Encapsulant Plastics/polymers Other phenolic resins - 0.025815 g 50000 5 28078 2.8078 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.444018 g 860000 86 482961 48.2961 Silicon Semiconductor Die 0.0239 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000478 g 20000 2 519 0.0519 Silicon Semiconductor Die Glass Silicon, doped - 0.023422 g 980000 98 25475 2.5475 Organic Substrate, Halogen-fre 0.2448 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00509453 g 20811 2.0811 5541 0.5541 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.10857126 g 443510 44.351 118089 11.8089 Organic Substrate, Halogen-fre Plastics/polymers Epikote 862 28064-14-4 0.01861459 g 76040 7.604 20246 2.0246 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.00078581 g 3210 0.321 854 0.0854 Organic Substrate, Halogen-fre Nickel (external applications only) Nickel 7440-02-0 0.0045736 g 18683 1.8683 4974 0.4974 Organic Substrate, Halogen-fre Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.01006201 g 41103 4.1103 10944 1.0944 Organic Substrate, Halogen-fre Glass Fibrous-glass-wool 65997-17-3 0.06162962 g 251755 25.1755 67032 6.7032 Organic Substrate, Halogen-fre Glass Silicon dioxide 7631-86-9 0.00528254 g 21579 2.1579 5745 0.5745 Organic Substrate, Halogen-fre Metals Aluminum Hydroxide 21645-51-2 0.03018604 g 123309 12.3309 32832 3.2832 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCIMX27LMOP4B_IPC1752_v11.xml http://www.freescale.com/mcds/MCIMX27LMOP4B_IPC1752A.xml