Freescale Semiconductor Users Guide Documentation Number: KT34716UG Rev. 3.0, 1/2009 Using the 1.0 MHz Dual Switch-Mode DDR Power Supply (KIT34716EPEVBE) 1 Introduction This User’s Guide will help the designer get better acquainted with the 34716 IC and Evaluation board. It contains a procedure to configure each block of the 34716 in a practical way, which is based on a working Evaluation Board designed by Freescale (KIT34716EPEVBE). 2 34716 Specification The 34716 is a highly integrated, space-efficient, low cost, dual synchronous buck switching regulator with integrated N-channel power MOSFETs. It is a high performance point-of-load (PoL) power supply with its second output having the ability to track an external reference voltage. it provides a full power supply solution for Double-Data-Rate (DDR) Memories. Channel one provides a source only 5.0 A drive capability, while channel two can sink and source up to 3.0 A. Both channels are highly efficient with tight output regulation. With its high current drive capability, channel one can be used to supply the VDDQ to the memory chipset. The second channel’s © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. Contents 1 2 3 4 5 6 7 8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 34716 Specification. . . . . . . . . . . . . . . . . . . . . 1 Application Diagram . . . . . . . . . . . . . . . . . . . . 2 Board’s Specifications . . . . . . . . . . . . . . . . . . 2 Component Selection for 34716 Eval Board. 3 Layout Design . . . . . . . . . . . . . . . . . . . . . . . . 12 Conclusion. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 References. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Application Diagram ability to track a reference voltage makes it ideal to provide the termination voltage (VTT) for modern data buses. The 34716 also provides a buffered output reference voltage (VREFOUT) to the memory chipset. 3 Application Diagram 34716 3.0V to 6.0V VIN CBOOT1 VDDQ L1 R11 CO1 PVIN2 VIN CIN RS1 PVIN1 BOOT1 SW1 VOUT1 R21 RIH VTT L2 RS2 CX2 COMP1 PGND1 RFQH FREQ RFQH RIL CBOOT2 INV2 INV1 VDDI CVDDI VDDQ R12 ILIM1 GND COMP2 VREFOUT PGND2 Termination Resistors CO2 CS2 CS1 RF1 CX1 CF1 VREFIN BOOT2 SW2 VOUT2 VDDQ RF2 DDR Memory Chipset CF2 CREF Memory Bus DDR Memory Controller VREF VIN 1.0k PG Microcontroller STBY SD Figure 1. Application diagram for 34716 4 Board’s Specifications The Board was designed to have an operating range defined by: Channel #1 Channel #2 VIN_MAX 6.0 V VIN_MAX 6.0 V VIN_MIN 3.0 V VIN_MIN 3.0 V VOUT_MAX 3.6 V VOUT_MAX 1.35 V VOUT_MIN 0.7 V VOUT_MIN 0.7 V IOUT_MAX 5.0 A IOUT_MAX 3.0 A IOUT_MIN 0.0 A IOUT_MIN -3.0 A Using the 34716, Rev. 3.0 2 Freescale Semiconductor Component Selection for 34716 Eval Board 5 5.1 Component Selection for 34716 Eval Board I/O Parameters: VIN = PVIN1 = 3.3V FSW = 1 MHz VOUT1 = VDDQ= 1.8 V (DDR2 Standard) IOUT1 = 5 A PVIN2 = VREFIN =VOUT1=1.8V VOUT2 =VTT = 0.90 V IOUT2 = 3A 5.2 Configuring the Output Voltage: Channel 1 of the 34716 is a general purpose DC-DC converter, the resistor divider to the -INV1 node is the responsible for setting the output voltage. The equation is: ⎛ R1 ⎞ VOUT = V REF ⎜ + 1⎟ ⎝ R2 ⎠ Where VREF is the internal VBG=0.7V. Then, for a regulated output at 1.8 V, we choose R1 = 20KΩ and R2 is calculated as follows: R2 = VREF R1 = 12.72 KΩ VOUT − VREF Channel 2 is a DDR specific voltage power supply, and the output voltage is given by the equation: VTT = V REFIN 2 Where VREFIN is the VDDQ voltage supplied by VOUT1. 5.3 Switching Frequency Configuration The switching frequency will have a value of 1.0 MHz by connecting the FREQ terminal to the GND terminal. If the smallest frequency value of 200 KHz is desired, then connect the FREQ terminal to VDDI. To program the switching frequency to another value, an external resistor divider will be connected to the FREQ terminal to achieve the voltages given by the Frequency Selection Table Using the 34716, Rev. 3.0 Freescale Semiconductor 3 Component Selection for 34716 Eval Board Frequency Khz Voltage applied to pin FREQ [V] 200 2.341 – 2.500 253 2.185 - 2.340 307 2.029 - 2.184 360 1.873 - 2.028 413 1.717 – 1.872 466 1.561 – 1.716 520 1.405 - 1.560 573 1.249 - 1.404 627 1.093 - 1.248 680 0.936 - 1.092 733 0.781 - 0.936 787 0.625 - 0.780 840 0.469 - 0.624 893 0.313 - 0.468 947 0.157 - 0.312 1000 0.000 - 0.156 Table 1. Frequency Selection Table The EVB frequency is set to 1 MHz, connecting the FREQ terminal directly to GND. Using the 34716, Rev. 3.0 4 Freescale Semiconductor Component Selection for 34716 Eval Board 5.4 Selecting Inductor Inductor calculation is as follows: L = D'MAX ∗T ∗ D 'MAX = 1 − (VOUT + I OUT * ( Rds (on) _ ls + r _ w)) ∆I OUT VOUT Vin _ max Maximum Off time percentage T = 1µs Switching period Rds (on) _ ls = 45mΩ Drain – to – source resistance of FET r _ w = 10mΩ Winding resistance of Inductor ∆I OUT = 0.4 * I OUT Output current ripple L1 = 0.72uH L 2 = 0.75uH However, since channel 1 will be serving as power supply for channel 2, we have to locate the LC poles at different frequencies in order to ensure that the input impedance of the second converter is always higher than the output impedance of the first converter, and thus, ensure system stability. To move the LC poles, we can select different values of “L” for each channel, for instance, L1 = 1.0µH and L2 = 1.5µH, to allow some operating margin for each channel. 5.5 Input Capacitors for PVIN1 and PVIN2 Input capacitor selection process is the same for both channels, and should be based on the current ripple allowed on the input line, since output of channel 1 is the input of channel 2, the input capacitor on channel 2 should be calculated for the maximum allowed output ripple on channel 1. The input capacitor should provide the ripple current generated during the inductor charge time. This ripple is dependent on the output current sourced by 34716 so that: I RMS = I OUT D(1 − D) Where: IRMS is the RMS value of the input capacitor current. IOUT is the output current, D= VOUT/Vin is the duty cycle. For a buck converter, IRMS has its maximum at PVIN = 2VOUT Using the 34716, Rev. 3.0 Freescale Semiconductor 5 Component Selection for 34716 Eval Board Since I RMS_MAX = PMAX ESR Where PMAX is the maximum power dissipation of the capacitor and is a constant based on physical size (generally given in the datasheets under the heading AC power dissipation.). We derive that the lower the ESR, the higher would be the ripple current capability. In other words, a low ESR capacitor (i.e., with high ripple current capability) can withstand high ripple current levels without overheating. Therefore, for greater efficiency and because the overall voltage ripple on the input line also depends on the input capacitor ESR, we recommend using low ESR capacitors. CinMIN = 0.5 * L * ( I RMS ) 2 ∆VOUT *Vin For a ∆VOUT = 0.5*Vin, Then CinMIN = 30.4µF To ensure better performance on regulation, an array of low ESR ceramic capacitors were used to get a total of 300 µF in both input terminals. 5.6 Selecting the Output Filter Capacitor The following considerations are most important for the output capacitor and not the actual Farad value: the physical size, the ESR of the capacitor, and the voltage rating. Calculate the minimum output capacitor using the following formula: C0 = ∆Iout 8 ∗ FSW ∗ ∆Vout A more significative calculation must include the transient response in order to calculate the real minimum capacitor value and assure a good performance. Using the 34716, Rev. 3.0 6 Freescale Semiconductor Component Selection for 34716 Eval Board . Transient Response percentage Maximum Transient Voltage TR_% TR_V_dip = VOUT*TR_% Maximum current step ∆Iout _ step = (Vin _ min − Vout ) * D _ max Fsw * L Inductor Current rise time dt _ I _ rise = T * Iout ∆Iout _ step Iout * dt _ I _ rise TR _ V _ dip To find the Maximum allowed ESR, the following formula was used: ∆Vout * Fsw * L ESRmax = Vout (1 − D min) Co = As a DDR specification, the ESR should be around 2 mΩ. To achieve this, an array of capacitors in parallel were used, with 3 Low ESR Ceramic capacitors of 100 µF on each channel. 5.7 Bootstrap Capacitor Freescale recommends a 0.1 µF capacitor for CBOOT1 and CBOOT2. 5.8 Compensation Network Compensation network is calculated exactly in the same way for both channels. Since we are using different values for L, the LC poles will be located at different frequencies to ensure stability of the system when converter 1 is supplying the power voltage of converter 2. 1. Choose a value for R1 (May be equal for both channels) 2. Using a Crossover frequency of 100 kHz, set the Zero pole frequency to Fcross/10 FP 0 = 1 1 Fcross = 10 2π * R1C F CF = 1 2π * R1 FPO 3. Knowing the LC frequency, the Frequency of Zero 1 and Zero 2 in the compensation network are equal to FLC FLC = 1 = FZ 1 = FZ 2 2π LX Co X RF = 1 2π * C F FZ 1 FZ 1 = 1 2π * RF C F CS = FZ 2 = 1 2π * R1CS 1 2π * R1 FZ 2 Using the 34716, Rev. 3.0 Freescale Semiconductor 7 Component Selection for 34716 Eval Board 4. Calculate RS by placing the first pole at the ESR zero frequency. FESR = 1 = FP1 2π * Co X * ESR FP1 = 1 2π * RS C S RS = 1 2π * FP1C S 5. Set the second pole at Crossover Frequency to achieve a faster response and a proper phase margin. FP 2 = 1 CX = C F Cx 2π * RF CF + Cx CF 2π * RF C F FP 2 − 1 For Channel 1 For Channel 2 FLC = 9.19 KHz FESR = 265.26 KHz (For ESR = 2.0mΩ) FCROSS = 100 KHz FPO = 10 KHz FLC = 7.5 KHz FESR = 265.26 KHz (For ESR = 2.0mΩ) FCROSS = 100 KHz FPO = 10 KHz R1 = 20 KΩ CF = 0.75 nF RF = 22 KΩ CS = 0.91 nF RS = 0.560 KΩ CX = 0.015 nF R1 = 20 KΩ CF = 1.8 nF RF = 15 KΩ CS = 1 nF RS = 300 KΩ CX = 0.020 nF Figure 2. Compensation Network Note: R2 only applies to Channel 1 Using the 34716, Rev. 3.0 8 Freescale Semiconductor Component Selection for 34716 Eval Board 5.9 Soft Start Table 2 shows the voltage that should be applied to the ILIM1 terminal to get the desired configuration of the soft start timing. Channel 2 of the 34716 has a soft start of 1.6ms. Soft Start [ms] Voltage applied to ILIM 3.2 1.25 - 1.49V 1.6 1.50 - 1.81V 0.8 1.82 - 2.13V 0.4 2.14 - 2.50V Table 2. Soft Start Configurations The ILIM1 terminal is directly connected to VDDI to achieve a soft start of 0.4ms. 5.10 Tracking Configurations The 34716 allows a default Ratiometric tracking on channel 2 by connecting VDDQ on the VREFIN terminal. It has an internal resistor divider that allows an output of VDDQ/2. Using the 34716, Rev. 3.0 Freescale Semiconductor 9 Component Selection for 34716 Eval Board 5.11 EVB Schematic Design. VDDI GND FREQ ILIM2 VIN BOOT1 N/C 19 BOOT2 ILIM1 20 22 21 VIN VIN 24 BOOT2 FREQ 1 GND VDDI 26 STBY C28 SW1 23 U2 BOOT1 25 BOOT1 ILIM1 ILIM1 STBY FREQ VDDI VIN ILIM2 C14 0.1uF STBY C15 BOOT2 18 SW2 0.1uF 0.1uF PVIN1 2 PVIN1 PVIN2 17 2 PVIN1 PVIN2 17 PVIN2 SW2 16 SW2 PVIN2 PVIN1 SW1 SW1 3 SW1 SW2 MC34716 3 SW2 16 PGND1 PGND2 15 4 PGND1 PGND2 15 5 VOUT1 VOUT2 14 SW1 VO2 INV2 0.1uF GND C11 COMP2 COMP1 INV1 VO1 VREFIN C27 /SHTD 4 /PGOOD GND VREFOUT GND 0.1uF INV1 PG COMP1 12 13 COMP2 INV2 11 10 9 VREFOUT SD 8 VREFIN PG 7 INV1 6 VOUT2 COMP1 VOUT1 COMP2 INV2 SD VREFIN VREFOUT C13 0.1uF C12 0.1uF COMPENSATION NETWORK SW1 COMPENSATION NETWORK SW2 VO1 VO2 C20 0.910nF C23 1nF R1 20k INV1 C18 COMP1 R14 560 15pF R15 COMP2 R18 300 20pF C19 R4 20k INV2 C21 R19 R2 C22 R17 12.7k 22k 17.4k_nopop 15k 0.75nF BUCK CONVERTER 1 Vo1_1 1.8nF BUCK CONVERTER 2 Vo1_2 Vo2_1 L1 SW1 1 SW2 1 1uH D3 R20 4.7_nopop PMEG2010EA_nopop VO2_2 L2 VO1 2 VO2 2 1.5uH C10 100uF C24 100uF C25 100uF D2 R3 4.7_nopop C6 100uF C7 100uF C8 100uF PMEG2010EA_nopop C26 1nF_nopop C9 1nF_nopop Figure 3. KIT34716EPEVBE Schematic Part 1 Using the 34716, Rev. 3.0 10 Freescale Semiconductor Component Selection for 34716 Eval Board I/O SIGNALS VIN CAPACITORS VIN PVIN13 2 1 C17 10uF C16 0.1uF R7 1k J3 PVIN2 VO2 GND R8 10k VMASTER D1 LED 3 2 1 R9 10k J4 VM VM LED 3 2 1 JUMPERS ILIM1,ILIM2,FREQ VO1 VMASTER LED STBY 1 2 1 2 1 3 5 7 9 2 4 6 8 10 VDDI J1 VREFIN R16 10k PG VDDI VIN GND VDDI VO1 VMASTER VIN J2 GND PGOOD LED R10 10k_nopop STBY R12 10k_nopop SD ILIM1 R22 10k_nopop CON10A SD ILIM2 R13 10k_nopop FREQ R11 10k PVIN1 CAPACITORS PVIN2 CAPACITORS PVIN1 PVIN2 C1 0.1uF C2 1uF C3 100uF C4 100uF C5 100uF C30 0.1uF C31 1uF C32 100uF C33 100uF C29 100uF TRIMPOTS nopop VDDI ILIM1 ILIM2 R21 R5 POT_50K_nopop POT_50K_nopop FREQ R6 POT_50K_nopop Figure 4. KIT34716EPEVBE Schematic Part 2 Using the 34716, Rev. 3.0 Freescale Semiconductor 11 Layout Design 6 Layout Design Figure 5. PCB Top View Layout Design Figure 6. PCB Bottom View Layout Design Using the 34716, Rev. 3.0 12 Freescale Semiconductor Layout Design Figure 7. PCB Inner View Layout Design 6.1 • • • • • • • • • • • PCB Layout Recommendations Place decoupling capacitors as close as possible to their corresponding pad(s) Try to place all components on just one Layer. Do not place a Ground Plane on component and routing side. Create a Ground plane layer and tie it to ground signals with vias. To effectively transfer heat from the center thermal pad on the top layer to the ground plane, vias need to be used in the center pad. Use 5 to 9 vias spaced evenly with a finished diameter of 0.3mm. Place Test vias as close as possible to the IC to ensure a good measurement value. PVIN, VIN, VOUT signals have to be tracked with a widely and straight copper area Never trace the Feedback signal in parallel to the SW signal. Ensure the SW Inductor is placed as close as possible to its pads. SW track has to be as thin and short as possible. Make sure the I/O connectors are capable to manage the Load current. Note: Freescale does not recommend connecting the PGND pins to the thermal pad. The thermal pad is connected to the signal ground and should not be used to make the connection from the PGND pins to the ground plane. Doing so can cause ground bounce on the signal ground from the high di/dt switch current and parasitic trace inductance. Using the 34716, Rev. 3.0 Freescale Semiconductor 13 Layout Design 6.2 Bill of Materials Table 3. BILL OF MATERIALS KIT34716 EVB Number: KIT34716EPEVBE Item Qty Reference Value Description Footprint 1 23 VOUT1,SW1,PVIN1,INV1,ILIM1,COMP1, BOOT1,VOUT2,SW2,PVIN2,INV2,ILIM2, COMP2,BOOT2,VREFOUT,VREFIN,VIN, VDDI,STBY,SD,PG,GND,FREQ not populated PC Test point miniature SMT TP 2 2 C2,C31 1.0µF Cap Cer 1.0 µF 6.3V 10% X5R 0603 SM/C_0603 3 12 C3,C4,C5,C6,C7,C8,C10,C24,C25,C29, C32,C33 100µF Cap Cer 100 µF 6.3V 10% X5R 1210 SM/C_1210 4 2 C9,C26 not populated 5 10 C1,C11,C12,C13,C14,C15,C16,C27,C28, C30 0.1µF Cap Cer 0.1 µF 50V 10% X7R 0603 SM/C_0603 6 1 C17 10µF Cap Cer 10 µF 6.3V 20% X5R 0603 SM/C_0603 7 1 C18 15pF Cap Cer 15pF 50V 1% C0G 0603 SM/C_0603 8 1 C19 750pF Cap Cer 750pF 50V 5% C0G 0603 SM/C_0603 9 1 C20 910pF Cap Cer 910pF 50V 5% C0G 0603 SM/C_0603 10 1 C21 20pF Cap Cer 20pF 50V 5% C0G 0603 SM/C_0603 11 1 C22 1.8nF Cap Cer 1800pF 50V 5% C0G 0603 SM/C_0603 12 1 C23 1.0nF Cap Cer 1000pF 25V 5% C0G 0603 SM/C_0603 13 1 D1 LED LED Green 0603 SMD SM/C_0603 14 2 D2,D3 not populated 15 1 J1 Pin Header (2 x 5) HDR 2X5 TH 100mil CTR 330H AU 0.1" (2.54mm) 16 3 100mils jumpers Jumpers 17 3 J2,J3,J4 not populated 100mils Using the 34716, Rev. 3.0 14 Freescale Semiconductor Layout Design 18 1 J5 not populated 19 1 L1 1.0µH Inductor Power 1.0µH 7.5A SMD B82464G 20 1 L2 1.5µH Inductor Power 1.5µH 7.0A SMD B82464G 21 2 R1,R4 20kΩ Res MF 20kΩ 1/10W 1% 0603 SMD SM/C_0603 22 1 R2 12.7kΩ Res MF 12.7kΩ 1/10W 1% 0603 SMD SM/C_0603 23 2 R3,R20 not populated 24 3 R5,R6,R21 not populated 25 1 R7 1kΩ Res MF 1.0kΩ 1/10W 1% 0603 SM/C_0603 26 1 R10 10kΩ Res MF 10kΩ 1/10W 1% 0603 SM/C_0603 27 3 R12,R13,R22 not populated 28 4 R8,R9,R11,R16 10kΩ Res MF 10kΩ 1/10W 1% 0603 SM/C_0603 29 1 R14 560Ω Res MF 560Ω 1/10W 1% 0603 SM/C_0603 30 1 R15 22kΩ Res MF 22kΩ 1/10W 5% 0603 SM/C_0603 31 1 R17 17.4kΩ Res MF 17.4kΩ 1/10W 1% 0603 SM/C_0603 32 1 R18 300Ω Res MF 300Ω 1/10W 5% 0603 SM/C_0603 33 1 R19 15kΩ Res MF 15kΩ 1/10W 1% 0603 SM/C_0603 34 1 SD Push_Button Switch Tact Mini 200GF SLV Gwing 35 1 STBY not populated Switch Tact Mini 200GF SLV Gwing 36 1 U2 MC34716 QFN_26 Notes: Freescale does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or tables. While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. Using the 34716, Rev. 3.0 Freescale Semiconductor 15 Conclusion 7 Conclusion With this User Guide, the user will be capable of configuring the 34716 as power supply for DDR memory chips, as well as other devices that can make use of some of the capabilities that the 34716 offers. The board is fully configured to work at any desirable input voltage within 3.0 and 6.0 V. However, it is highly recommended to calculate all components for the specific application situation in order to assure a better efficiency and stability of the IC. 8 References • • • 34716 Datasheet, 3A and 5A 1MHz Fully Integrated Double Switch-mode Power Supply, Freescale Semiconductor, Inc. Application Note “AN1989 MC34701 and MC34702 Component Selection Guide”, Freescale Semiconductor, Inc. Sanjaya Maniktala, “Switching Power Supplies A to Z”, Newnes, 2006. Using the 34716, Rev. 3.0 16 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. Web Support: http://www.freescale.com/support For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp. USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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