+;
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BGS8324
WLAN LNA + Switch
Rev. 2 — 21 June 2016
Product data sheet
1. General description
The BGS8324 is a fully integrated Low-Noise Amplifier (LNA) and SP3T switch for
Bluetooth path and transmit path for WLAN applications in the 2.4 GHz to 2.5 GHz ISM
band. The BGS8324 is manufactured using NXPs high performance QUBiC eighth
generation SiGe:C technology. The BGS8324 couples best-in-class noise figure, linearity
and low insertion loss CMOS switches with the process stability and ruggedness that are
the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm 2.0 mm footprint
HX2QFN12 package and a thickness of 300 m.
2. Features and benefits
Intended for IEEE 802.11b/g/n WLAN application
Covers full ISM low band 2400 MHz to 2500 MHz
Noise figure = 2 dB
Gain 16 dB
High input 1 dB compression point Pi(1dB) of 6 dBm
High in band IP3i of 7 dBm
Supply voltage 2.7 V to 5.25 V
Stand-by mode current consumption at 8 A for 3.3 V supply voltage
Optimized performance at a low supply current of 8.3 mA
Integrated concurrent 5 GHz notch filter
5 modes of operation (standby, high gain receive, bypass receive, transmit and
Bluetooth modes)
Integrated matching for input and output
Requires only one supply decoupling capacitor
ElectroStatic Discharge (ESD) protection on all pins (HBM > 2 kV)
Small 12-pin leadless package 2 mm 2 mm 0.3 mm; 0.5 mm pitch
3. Applications
IEEE 802.11b/g/n WiFi, WLAN
Smartphones, tablets, netbooks and other portable computing devices
Access points, routers, gateways
Wireless video
General-purpose Industrial, Scientific and Medical (ISM) applications
BGS8324
NXP Semiconductors
WLAN LNA + Switch
4. Quick reference data
Table 1.
Quick reference data
VCC = 3.3 V; Tamb = 25 C; 50 load, unless otherwise specified.
Symbol
Parameter
Conditions
RF performance at ANT-RX path in high-gain receive mode
Min
Typ
-
8.3
Max
Unit
[1]
high-gain receive mode
[1]
ICC
supply current
12.0
mA
Gtr
transducer power gain
13.7 16
18
dB
NF
noise figure
-
2
-
dB
Pi(1dB)
input power at 1 dB gain compression
-
6
-
dBm
RLin
input return loss
-
12
-
dB
RLout
output return loss
-
12
-
dB
-
8
15
A
9
6
4
dB
-
0.8
-
dB
-
0.95 -
dB
in-band
RF performance at ANT-RX path in bypass receive mode [1]
ICC
supply current
Gtr
transducer power gain
bypass receive mode
[1]
RF performance at ANT-TX path in transmit mode [1]
ins
insertion loss
RF performance at ANT-BT path in Bluetooth mode
ins
[1]
[1]
insertion loss
See Table 10 for the appropriate control signal settings.
5. Ordering information
Table 2.
Ordering information
Type number
BGS8324
Package
Name
Description
Version
HX2QFN12
plastic, thermal enhanced super thin quad flat package; no leads; 12
terminals; body 2.0 x 2.0 x 0.3 mm
SOT1261-1
6. Marking
Table 3.
Marking codes
Type number
Marking code
BGS8324
24
BGS8324
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
7. Functional diagram
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Functional diagram
8. Pinning information
8.1 Pinning
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Pin configuration
8.2 Pin description
Table 4.
BGS8324
Product data sheet
Pin description
Symbol
Pin
Description
VTX
1
transmit mode control
TX
2
transmit input
GND
3, 4, 9, exposed die pad
ground
RX
5
receive output
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
Table 4.
Pin description …continued
Symbol
Pin
Description
LNA_EN
6
LNA enable
VCC
7
supply voltage
BT
8
Bluetooth input / output
VBT
10
Bluetooth mode control
VRX
11
receive mode control
ANT
12
antenna input / output
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
ICC
supply current
VI(VBT)
Min
Max
Unit
0.3
6
V
worst case up to P1dB
-
16
mA
input voltage on pin VBT
see Figure 1
0.3
4
V
VI(VRX)
input voltage on pin VRX
see Figure 1
0.3
4
V
VI(VTX)
input voltage on pin VTX
see Figure 1
0.3
4
V
VI(LNA_EN)
input voltage on pin LNA_EN
0.3
4
V
Pi(ANT)
input power-on pin ANT
high-gain receive mode
-
7
dBm
bypass receive mode
-
19
dBm
Pi(TX)
input power-on pin TX
CW; transmit mode
-
33
dBm
Pi(BT)
input power-on pin BT
CW; Bluetooth mode
-
22
dBm
Tamb
ambient temperature
40
85
C
Tj
junction temperature
40
150
C
Tstg
storage temperature
40
140
C
human body model
[1]
-
2000
V
charged device model
[2]
-
500
V
VESD
Conditions
electrostatic discharge voltage
[1]
According to ANSI/ESDA/JEDEC standard JS-001.
[2]
According to JEDEC standard JESD22-C101.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol
Parameter
f
frequency
VCC
supply voltage
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
[1]
Conditions
[1]
Min
Typ
Max
Unit
2400
-
2500
MHz
2.7
3.3
5.25
V
1.8
-
3.6
V
0
-
+0.4
V
VIH is the result of an input voltage on that specific pin between 1.8 V and VCC 0.2 V and 3.6 V maximum.
BGS8324
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
11. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
Typ
Unit
250
K/W
12. Characteristics
Table 8.
DC Characteristics
VCC = 3.3 V; Tamb = 25 C; 50 load, unless otherwise specified.
Symbol
Parameter
Conditions
supply current
ICC
Ictrl(LNA_EN)
ton
toff
Min
Typ
high-gain receive mode
[1]
Max
Unit
-
bypass receive mode
[1]
-
8.3
12
mA
8
15
transmit mode
[1]
A
Bluetooth mode
[1]
-
200
300
A
standby mode
[1]
-
8
15
A
-
8
15
A
-
20
30
A
turn-on time
[2]
-
-
500
ns
turn-off time
[2]
-
-
500
ns
control current on pin LNA_EN
[1]
See Table 10 for the appropriate control signal settings.
[2]
From any of three operating modes to another and from 10 % or 90 % of control signal edge to 90 % output level.
Table 9.
RF Characteristics
VCC = 3.3 V; Tamb = 25 °C; 50 load, unless otherwise specified. All measurements done on application board (decoupling
capacitor 100 nF placed near to VCC pin 7) with SMA connectors as reference plane.
Symbol Parameter
Conditions
RF performance at ANT-RX path in high-gain receive mode
Gtr
transducer power gain
Gp(flat)
power gain flatness
NF
noise figure
Min
Typ
Max
Unit
13.7
16
18
dB
-
-
0.5
dB
-
2.0
-
dB
[1]
peak-to-peak over any 40 MHz band
Pi(1dB)
input power at 1 dB gain compression
in-band
-
6
-
dBm
IP3i
input third-order intercept point
20 MHz tone spacing; Pi = 20 dBm
-
7
-
dBm
RLin
input return loss
-
12
-
dB
RLout
output return loss
-
12
-
dB
9
6
4
dB
RF performance at ANT-RX path in bypass receive mode
[1]
Gtr
transducer power gain
Gp(flat)
power gain flatness
peak-to-peak over any 40 MHz band
-
-
0.5
dB
Pi(1dB)
input power at 1 dB gain compression
in-band
-
11.5
-
dBm
20 MHz tone spacing; Pi = 3 dBm
-
22.5
-
dBm
IP3i
input third-order intercept point
RLin
input return loss
9
dB
RLout
output return loss
14
dB
BGS8324
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
Table 9.
RF Characteristics …continued
VCC = 3.3 V; Tamb = 25 °C; 50 load, unless otherwise specified. All measurements done on application board (decoupling
capacitor 100 nF placed near to VCC pin 7) with SMA connectors as reference plane.
Symbol Parameter
Conditions
RF performance at ANT-TX path in transmit mode
Min
Typ
Max
Unit
[1]
ins
insertion loss
-
0.8
-
dB
Gp(flat)
power gain flatness
peak-to-peak over any 40 MHz band
-
-
0.2
dB
ISL
isolation
measured between pin RX and pin TX
30
-
-
dB
Pi(1dB)
input power at 1 dB gain compression
in-band
-
32
-
dBm
RLin
input return loss
15
dB
RLout
output return loss
15
dB
RF performance at ANT-BT path in Bluetooth mode
ins
insertion loss
[1]
-
0.95
-
dB
Gp(flat)
power gain flatness
peak-to-peak over any 40 MHz band
-
-
0.2
dB
Pi(1dB)
input power at 1 dB gain compression
in-band
-
20
-
dBm
RLin
input return loss
RLout
output return loss
RF performance at ANT-BT path + ANT-RX path in concurrent mode
16
dB
15
dB
[1]
ins
insertion loss
ANT-BT path
-
5
-
dB
Gtr
transducer power gain
ANT-RX path
-
12.5
-
dB
[1]
See Table 10 for the appropriate control signal settings.
Table 10. Control signal truth table
Other modes than the ones given in this table are not allowed.
Control signal setting
Mode of operation
Mode name
VBT
VRX
VTX
LNA_EN
SP3T switch
pin 10
pin 11
pin 1
pin 6
ANT-RX
ANT-TX
ANT-BT
HIGH
HIGH
LOW
HIGH
ON
OFF
ON
ON
concurrent mode
LOW
HIGH
LOW
HIGH
ON
OFF
OFF
ON
high-gain receive mode
LOW
HIGH
LOW
LOW
ON
OFF
OFF
OFF
bypass receive mode
LOW
LOW
HIGH
LOW
OFF
ON
OFF
OFF
transmit mode
HIGH
LOW
LOW
LOW
OFF
OFF
ON
OFF
Bluetooth mode
LOW
LOW
LOW
LOW
OFF
OFF
OFF
OFF
standby mode
BGS8324
Product data sheet
LNA
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
13. Application information
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BGS8324
Product data sheet
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All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
14. Package outline
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BGS8324
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
15. Handling information
15.1 Moisture sensitivity
Table 11.
Moisture sensitivity level
Test methodology
Class
JESD-22-A113
1
15.2 ElectroStatic Discharge (ESD)
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
16. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CMOS
Complementary Metal–Oxide Semiconductor
CW
Continuous Wave
ESD
ElectroStatic Discharge
HBM
Human Body Model
ISM
Industrial, Scientific and Medical
LAN
Local Area Network
LNA
Low-Noise Amplifier
MMIC
Monolithic Microwave Integrated Circuit
SiGe:C
Silicon Germanium Carbon
SMA
SubMiniature version A
SP3T
Single Pole 3 Throw
WLAN
Wireless Local Area Network
17. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
BGS8324 v.2
20160621
Product data sheet
Modifications:
BGS8324 v.1
BGS8324
Product data sheet
•
Change notice
Supersedes
BGS8324 v.1
Data sheet status changed from Preliminary data sheet to Product data sheet
20151221
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
-
-
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGS8324
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGS8324
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 June 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 12
BGS8324
NXP Semiconductors
WLAN LNA + Switch
20. Contents
1
2
3
4
5
6
7
8
8.1
8.2
9
10
11
12
13
14
15
15.1
15.2
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Handling information. . . . . . . . . . . . . . . . . . . . . 9
Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 9
ElectroStatic Discharge (ESD) . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 June 2016
Document identifier: BGS8324