74LVC2G240 Dual inverting buffer/line driver; 3-state Rev. 8 — 8 April 2013 Product data sheet 1. General description The 74LVC2G240 is a dual inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH level at pins nOE causes the outputs to assume a high-impedance OFF-state. Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the 74LVC2G240 as a translator in a mixed 3.3 V and 5 V environment. It is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V 24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from 40 C to +85 C and 40 C to +125 C 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC2G240DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC2G240DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 74LVC2G240GT 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 1.95 0.5 mm 74LVC2G240GF 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1 0.5 mm 74LVC2G240GD 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; body 3 2 0.5 mm 74LVC2G240GM 40 C to +125 C XQFN8 plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 1.6 0.5 mm SOT902-2 74LVC2G240GN 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.2 1.0 0.35 mm SOT1116 74LVC2G240GS 40 C to +125 C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1.0 0.35 mm SOT1203 SOT1089 4. Marking Table 2. Marking codes Type number Marking code[1] 74LVC2G240DP V240 74LVC2G240DC V40 74LVC2G240GT V40 74LVC2G240GF V2 74LVC2G240GD V40 74LVC2G240GM V40 74LVC2G240GN V2 74LVC2G240GS V2 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 2 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 5. Functional diagram EN 1OE 1Y 1A EN 2OE 2A 2Y 001aah783 001aah782 Fig 1. Logic symbol Fig 2. IEC logic symbol 6. Pinning information 6.1 Pinning 74LVC2G240 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 74LVC2G240 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 001aaf076 Transparent top view 001aaf075 Fig 3. Pin configuration SOT505-2 and SOT765-1 74LVC2G240 Product data sheet Fig 4. Pin configuration SOT833-1, SOT1089, SOT1116 and SOT1203 All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 3 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 74LVC2G240 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 1Y 2A 8 1 7 1OE 2 6 1A 3 5 2Y GND 1OE 2OE 4 74LVC2G240 VCC terminal 1 index area 001aam590 Transparent top view Transparent top view Fig 5. 001aaf077 Pin configuration SOT996-2 Fig 6. Pin configuration SOT902-2 6.2 Pin description Table 3. Pin description Symbol Pin 1OE Description SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 SOT902-2 1 7 output enable input 1OE (active LOW) 1A 2 6 data input 2Y 3 5 data output GND 4 4 ground (0 V) 2A 5 3 data input 1Y 6 2 data output 2OE 7 1 output enable input 2OE (active LOW) VCC 8 8 supply voltage 7. Functional description Table 4. Function table[1] Input Output nOE nA L L H L H L H X Z [1] nY H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 4 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current output voltage VO Conditions VI < 0 V [1] Min Max Unit 0.5 +6.5 V 50 - mA 0.5 +6.5 V - 50 mA Enable mode [1] 0.5 VCC + 0.5 V Disable mode [1] 0.5 +6.5 V [1][2] 0.5 +6.5 V - 50 mA 100 mA VO > VCC or VO < 0 V Power-down mode IO output current ICC supply current - IGND ground current 100 - mA Tstg storage temperature 65 +150 C - 300 mW total power dissipation Ptot VO = 0 V to VCC Tamb = 40 C to +125 C [3] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] For TSSOP8 packages: above 55 C the value of Ptot derates linearly at 2.5 mW/K. For VSSOP8 packages: above 110 C the value of Ptot derates linearly at 8.0 mW/K. For XSON8 and XQFN8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC supply voltage VI input voltage VO output voltage Conditions Tamb ambient temperature t/V input transition rise and fall rate 74LVC2G240 Product data sheet Min Max Unit 1.65 5.5 V 0 5.5 V VCC = 1.65 V to 5.5 V; Enable mode 0 VCC V VCC = 1.65 V to 5.5 V; Disable mode 0 5.5 V VCC = 0 V; Power-down mode 0 5.5 V 40 +125 C VCC = 1.65 V to 2.7 V - 20 ns/V VCC = 2.7 V to 5.5 V - 10 ns/V All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 5 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit VCC = 1.65 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.45 V IO = 8 mA; VCC = 2.3 V - - 0.3 V Tamb = 40 C to +85 C VIH VIL VOL VOH HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL IO = 12 mA; VCC = 2.7 V - - 0.4 V IO = 24 mA; VCC = 3.0 V - - 0.55 V IO = 32 mA; VCC = 4.5 V - - 0.55 V HIGH-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 1.2 - - V IO = 8 mA; VCC = 2.3 V 1.9 - - V IO = 12 mA; VCC = 2.7 V 2.2 - - V IO = 24 mA; VCC = 3.0 V 2.3 - - V IO = 32 mA; VCC = 4.5 V 3.8 - - V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - 0.1 5 A IOZ OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V - 0.1 10 A IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - 0.1 10 A ICC supply current VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V - 0.1 10 A ICC additional supply current per pin; VI = VCC 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V - 5 500 A CI input capacitance - 2 - pF 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 6 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit VCC = 1.65 V to 1.95 V 0.65 VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7 VCC - - V VCC = 1.65 V to 1.95 V - - 0.35 VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.6 V - - 0.8 V VCC = 4.5 V to 5.5 V - - 0.3 VCC V Tamb = 40 C to +125 C HIGH-level input voltage VIH LOW-level input voltage VIL LOW-level output voltage VOL VOH VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.70 V IO = 8 mA; VCC = 2.3 V - - 0.45 V IO = 12 mA; VCC = 2.7 V - - 0.60 V IO = 24 mA; VCC = 3.0 V - - 0.80 V IO = 32 mA; VCC = 4.5 V - - 0.80 V IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 0.95 - - V IO = 8 mA; VCC = 2.3 V 1.7 - - V IO = 12 mA; VCC = 2.7 V 1.9 - - V IO = 24 mA; VCC = 3.0 V 2.0 - - V IO = 32 mA; VCC = 4.5 V HIGH-level output voltage VI = VIH or VIL 3.4 - - V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 20 A IOZ OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V - - 20 A IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - - 20 A ICC supply current VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V - - 40 A ICC additional supply current per pin; VI = VCC 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V - - 5 mA [1] Typical values are measured at VCC = 3.3 V and Tamb = 25 C. 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 7 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9. Symbol Parameter 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 4.1 9.5 1.0 11.9 ns VCC = 2.3 V to 2.7 V 0.5 2.6 5.2 0.5 6.5 ns VCC = 2.7 V 1.0 3.0 5.5 1.0 6.9 ns VCC = 3.0 V to 3.6 V 0.5 2.5 4.6 0.5 5.8 ns VCC = 4.5 V to 5.5 V 0.5 2.0 4.0 0.5 5.0 ns VCC = 1.65 V to 1.95 V 1.5 4.5 10.3 1.5 12.9 ns VCC = 2.3 V to 2.7 V 1.0 2.9 5.6 1.0 7.0 ns VCC = 2.7 V 1.5 3.4 5.6 1.5 7.0 ns VCC = 3.0 V to 3.6 V 0.5 2.5 4.7 0.5 5.9 ns 0.5 2.0 3.8 0.5 4.8 ns VCC = 1.65 V to 1.95 V 1.0 3.5 11.6 1.0 14.1 ns VCC = 2.3 V to 2.7 V 0.5 1.9 5.8 0.5 7.6 ns VCC = 2.7 V 1.0 2.8 4.5 1.0 5.8 ns VCC = 3.0 V to 3.6 V 1.0 2.7 4.4 1.0 5.7 ns VCC = 4.5 V to 5.5 V 0.5 1.9 3.4 0.5 4.6 ns output enabled - 18 - - - pF output disabled - 5 - - - pF propagation delay nA to nY; see Figure 7 tpd enable time ten nOE to nY; see Figure 8 [2] [3] VCC = 4.5 V to 5.5 V disable time tdis power dissipation capacitance CPD nOE to nY; see Figure 8 per buffer; VI = GND to VCC [1] Typical values are measured at nominal VCC and at Tamb = 25 C. [2] tpd is the same as tPLH and tPHL [3] ten is the same as tPZH and tPZL [4] tdis is the same as tPLZ and tPHZ [5] 40 C to +125 C Unit Typ[1] [4] [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 8 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 12. Waveforms VI VM nA input VM GND t PHL t PLH VOH VM VM nY output VOL mna960 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. The data input (nA) to output (nY) propagation delays VI nOE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna961 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Table 9. 3-state enable and disable times Measurement points Supply voltage Input Output VCC VM VM VX VY 1.65 V to 1.95 V 0.5 VCC 0.5 VCC VOL + 0.15 V VOH 0.15 V 2.3 V to 2.7 V 0.5 VCC 0.5 VCC VOL + 0.15 V VOH 0.15 V 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V 3.0 V to 3.6 V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V 4.5 V to 5.5 V 0.5 VCC 0.5 VCC VOL + 0.3 V VOH 0.3 V 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 9 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 9. Table 10. Test circuit for measuring switching times Test data Supply voltage Input Load VEXT VI CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 1.65 V to 1.95 V VCC 30 pF 1 k open GND 2 VCC 2.3 V to 2.7 V VCC 30 pF 500 open GND 2 VCC 2.7 V 2.7 V 50 pF 500 open GND 6V 3.0 V to 3.6 V 2.7 V 50 pF 500 open GND 6V 4.5 V to 5.5 V VCC 50 pF 500 open GND 2 VCC 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 10 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 10. Package outline SOT505-2 (TSSOP8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 11 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 11. Package outline SOT765-1 (VSSOP8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 12 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 12. Package outline SOT833-1 (XSON8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 13 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm SOT1089 E terminal 1 index area D A A1 detail X (4×)(2) e L (8×)(2) b 4 5 e1 1 terminal 1 index area 8 L1 X 0 0.5 scale Dimensions Unit mm max nom min 1 mm A(1) 0.5 A1 b D E e e1 L L1 0.35 0.40 0.04 0.20 1.40 1.05 0.15 1.35 1.00 0.55 0.35 0.30 0.35 0.27 0.32 0.12 1.30 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1089 sot1089_po References IEC JEDEC JEITA European projection Issue date 10-04-09 10-04-12 MO-252 Fig 13. Package outline SOT1089 (XSON8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 14 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit(1) mm max nom min A A1 b 0.05 0.35 D E 2.1 3.1 0.5 0.00 0.15 1.9 e e1 0.5 1.5 2.9 L L1 L2 0.5 0.15 0.6 0.3 0.05 0.4 v 0.1 w y 0.05 0.05 y1 0.1 sot996-2_po Outline version References IEC JEDEC JEITA European projection Issue date 07-12-21 12-11-20 SOT996-2 Fig 14. Package outline SOT996-2 (XSON8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 15 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-2 X A B D terminal 1 index area E A A1 detail X e v w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L metal area not for soldering L1 0 1 Dimensions Unit(1) mm max nom min 2 mm scale A 0.5 A1 b D E e e1 0.05 0.25 1.65 1.65 0.20 1.60 1.60 0.55 0.00 0.15 1.55 1.55 0.5 L L1 v 0.35 0.15 0.30 0.10 0.25 0.05 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT902-2 --- MO-255 --- sot902-2_po European projection Issue date 10-11-02 11-03-31 Fig 15. Package outline SOT902-2 (XQFN8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 16 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm 1 2 SOT1116 b 4 3 (4×)(2) L L1 e 8 7 e1 6 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 1.25 1.05 nom 0.15 1.20 1.00 0.55 min 0.12 1.15 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1116_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-07 SOT1116 Fig 16. Package outline SOT1116 (XSON8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 17 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm SOT1203 b 2 1 3 (4×)(2) 4 L L1 e 8 7 6 e1 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.40 1.05 0.35 0.40 nom 0.15 1.35 1.00 0.55 0.35 0.30 0.35 min 0.12 1.30 0.95 0.27 0.32 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version sot1203_po References IEC JEDEC JEITA European projection Issue date 10-04-02 10-04-06 SOT1203 Fig 17. Package outline SOT1203 (XSON8) 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 18 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC2G240 v.8 20130408 Product data sheet - 74LVC2G240 v.7 Modifications: 74LVC2G240 v.7 Modifications: 74LVC2G240 v.6 Modifications: • For type number 74LVC2G240GD XSON8U has changed to XSON8. 20120622 • - 74LVC2G240 v.6 For type number 74LVC2G240GM the SOT code has changed to SOT902-2. 20111128 • Product data sheet Product data sheet - 74LVC2G240 v.5 Legal pages updated. 74LVC2G240 v.5 20100915 Product data sheet - 74LVC2G240 v.4 74LVC2G240 v.4 20080229 Product data sheet - 74LVC2G240 v.3 74LVC2G240 v.3 20071005 Product data sheet - 74LVC2G240 v.2 74LVC2G240 v.2 20060728 Product data sheet - 74LVC2G240 v.1 74LVC2G240 v.1 20030311 Product specification - - 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 19 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVC2G240 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 20 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC2G240 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 8 April 2013 © NXP B.V. 2013. All rights reserved. 21 of 22 74LVC2G240 NXP Semiconductors Dual inverting buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 April 2013 Document identifier: 74LVC2G240