74VHC245; 74VHCT245 Octal bus transceiver; 3-state Rev. 01 — 25 August 2009 Product data sheet 1. General description The 74VHC245; 74VHCT245 are high-speed Si-gate CMOS devices. The 74VHC245; 74VHCT245 are octal transceivers featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74VHC245; 74VHCT245 feature an output enable input (OE), for easy cascading, and a send and receive direction control input (DIR). OE controls the outputs so that the buses are effectively isolated. 2. Features n n n n Balanced propagation delays All inputs have Schmitt-trigger action Inputs accept voltages higher than VCC Input levels: u The 74VHC245 operates with CMOS input level u The 74VHCT245 operates with TTL input level n ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Multiple package options n Specified from −40 °C to +85 °C and from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number 74VHC245D Package Temperature range Name Description Version −40 °C to +125 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 −40 °C to +125 °C DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm 74VHCT245D 74VHC245PW 74VHCT245PW 74VHC245BQ 74VHCT245BQ 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 4. Functional diagram 1 DIR OE 2 B0 3 19 3EN1 3EN2 1 14 18 3 17 4 16 13 5 15 6 14 7 13 8 12 A6 12 A7 B7 11 9 Logic symbol Fig 2. IEC logic symbol 74VHC_VHCT245_1 Product data sheet 11 mna175 mna174 Fig 1. 2 A5 B6 9 G3 2 B5 8 15 A4 B4 7 1 16 A3 B3 6 17 A2 B2 5 18 A1 B1 4 19 A0 © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 2 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 5. Pinning information 5.1 Pinning 1 terminal 1 index area 74VHC245 74VHCT245 20 VCC DIR 74VHC245 74VHCT245 A0 2 19 OE A1 3 18 B0 A2 4 17 B1 DIR 1 20 VCC A0 2 19 OE A1 3 18 B0 A3 5 16 B2 A2 4 17 B1 A4 6 15 B3 A3 5 16 B2 A5 7 14 B4 A4 6 15 B3 A6 8 A5 7 14 B4 A6 8 13 B5 A7 9 A7 9 12 B6 GND 10 11 B7 GND(1) 13 B5 B7 11 GND 10 12 B6 001aak060 Transparent top view 001aak059 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 3. Pin configuration SO20, TSSOP20 Fig 4. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description DIR 1 direction control input A0 2 data input/output A1 3 data input/output A2 4 data input/output A3 5 data input/output A4 6 data input/output A5 7 data input/output A6 8 data input/output A7 9 data input/output GND 10 ground (0 V) B7 11 data input/output B6 12 data input/output B5 13 data input/output B4 14 data input/output B3 15 data input/output B2 16 data input/output 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 3 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 2. Pin description …continued Symbol Pin Description B1 17 data input/output B0 18 data input/output OE 19 output enable input (active LOW) VCC 20 supply voltage 6. Functional description Table 3. Function table[1] Control Input/output OE DIR An Bn L L A=B inputs L H inputs B=A H X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI input voltage Conditions Min Max Unit −0.5 +7.0 V −0.5 +7.0 V −20 - mA −20 +20 mA −25 +25 mA mA IIK input clamping current VI < −0.5 V [1] IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] IO output current VO = −0.5 V to (VCC + 0.5 V) ICC supply current - +75 IGND ground current −75 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation - 500 mW Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO20 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP20 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN20 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 4 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V 74VHC245 VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74VHCT245 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate - - 20 ns/V VCC = 4.5 V to 5.5 V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74VHC245 VIH VIL VOH VOL HIGH-level input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V LOW-level input voltage VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 5 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 µA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 µA CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF VI = VCC or GND 74VHCT245 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 µA IO = −8.0 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.80 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA OFF-state VI = VIH or VIL; output current VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 µA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 µA ∆ICC additional per input pin; supply current VI = VCC − 2.1 V; other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF II input leakage current IOZ VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VCC or GND 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 6 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter 25 °C Conditions Min Typ[1] CL = 15 pF - CL = 50 pF - −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max 5.0 8.4 1.0 10.0 1.0 10.5 ns 6.5 11.9 1.0 13.5 1.0 15.0 ns 3.5 5.5 1.0 6.5 1.0 7.0 ns 5.0 7.5 1.0 8.5 1.0 9.5 ns 74VHC245 tpd propagation delay An to Bn; Bn to An; see Figure 5 [2] VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF ten enable time OE to An; OE to Bn; signal name DIR; see Figure 6 [3] VCC = 3.0 V to 3.6 V CL = 15 pF - 6.5 13.2 1.0 15.5 1.0 16.5 ns CL = 50 pF - 9.0 16.7 1.0 19.0 1.0 21.0 ns CL = 15 pF - 4.0 8.5 1.0 10.0 1.0 11.0 ns CL = 50 pF - 5.0 10.6 1.0 12.0 1.0 13.5 ns CL = 15 pF - 7.5 12.5 1.0 15.5 1.0 16.0 ns CL = 50 pF - 10.0 15.8 1.0 18.0 1.0 20.0 ns - 4.5 7.8 1.0 9.2 1.0 10.0 ns - 6.0 9.7 1.0 11.0 1.0 12.5 ns - 12 - - - - - pF - 3.5 7.7 1.0 8.5 1.0 10.0 ns - 4.5 8.7 1.0 9.5 1.0 11.0 ns CL = 15 pF - 5.0 13.8 1.0 15.0 1.0 17.5 ns CL = 50 pF - 6.0 14.8 1.0 16.0 1.0 18.5 ns VCC = 4.5 V to 5.5 V tdis disable time OE to An; OE to Bn; signal name DIR; see Figure 6 [4] VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power fi = 1 MHz; dissipation VI = GND to VCC capacitance [5] 74VHCT245; VCC = 4.5 V to 5.5 V tpd propagation delay An to Bn; Bn to An; see Figure 5 [2] CL = 15 pF CL = 50 pF ten enable time OE to An; OE to Bn; signal name DIR; see Figure 6 [3] 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 7 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter tdis disable time 25 °C Conditions Min Max Min Max Min Max - 5.0 14.4 1.0 15.5 1.0 18.0 ns - 6.0 15.4 1.0 16.5 1.0 19.5 ns - 15 - - - - - pF [4] OE to An; OE to Bn; signal name DIR; see Figure 6 CL = 15 pF CL = 50 pF [5] power fi = 1 MHz; dissipation VI = GND to VCC capacitance CPD −40 °C to +85 °C −40 °C to +125 °C Unit Typ[1] [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZL and tPZH. [4] tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 10.1 Waveforms VI An, Bn input VM VM GND tPLH tPHL VOH Bn, An output VM VM VOL mna176 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Input to output propagation delays 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 8 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state VI OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PHZ VOH t PZH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna367 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Enable and disable times Table 8. Measurement points Type Input Output VM VM VX VY 74VHC245 0.5VCC 0.5VCC VOL + 0.3 V VOH − 0.3 V 74VHCT245 1.5 V 0.5VCC VOL + 0.3 V VOH − 0.3 V 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 9 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 7. Load circuitry for measuring switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74VHC245 VCC ≤ 3.0 ns 15 pF, 50 pF 1 kΩ open GND VCC 74VHCT245 3.0 V ≤ 3.0 ns 15 pF, 50 pF 1 kΩ open GND VCC 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 10 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 11. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 8. Package outline SOT163-1 (SO20) 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 11 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 9. Package outline SOT360-1 (TSSOP20) 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 12 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b 1 0.05 0.00 0.30 0.18 mm c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 10. Package outline SOT764-1 (DHVQFN20) 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 13 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 12. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 13. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74VHC_VHCT245_1 20090825 Product data sheet - - 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 14 of 16 74VHC245; 74VHCT245 NXP Semiconductors Octal bus transceiver; 3-state 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74VHC_VHCT245_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 25 August 2009 15 of 16 NXP Semiconductors 74VHC245; 74VHCT245 Octal bus transceiver; 3-state 16. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 10.1 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 August 2009 Document identifier: 74VHC_VHCT245_1