MPC745/755 Microprocessor MOS-13 HiP4DP Rev. 2.8 Qualification Report Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA Report Rev.: A Revision date: 06/15/04 Page 1 of 7 MPC745/755 Product Information: Product / Technology / Fab / Package Description MPC745: 255 PBGA (PX), 21 x 21 mm MPC755: 360 PBGA (PX), 25 x 25 mm, 360 CBGA (RX), 25 x 25 mm MPC745/755 K76D 6.79 x 7.92 mm CBGA – Ceramic / PBGA – Organic SMD Electroplate .18 ± .05 micron HiP4DP MOS-13 / Austin TX 4.0 mils 1P / 5M Freescale, Kuala Lumpur, Malaysia Aluminum CBGA – MSL 1 / PBGA – MSL 3 Package Device Mask Set Die Size Substrate Bump Technology Die Technology Process Technology Name/Location of Die Fab Facility Bump Diameter Poly / Metal layers Assembly Location Final Metal Technology Moisture Sensitivity Level MPC745/755 Product Reliability Data Summary: HTOL / 2.5V, 90ºC Lot / Mask Set 0K76D 5K76D 38105 / 8K76D 168 Hours 0 / 232 0 / 93 0 / 77 38396 / 8K76D 39044 / 8K76D 41394 / 9K76D 42901 / 9K76D 40862 / 9K76D Totals 1 / 77 0 / 77 0 / 77 0 / 77 0 / 77 1 / 787 Failure Comments 504 Hours 0 / 136 0 / 93 0 / 77 (1) (1) 1008 Hours 0 / 136 0 / 93 0 / 77 (2) (2) 1- ABIST fail 0 / 76 0 / 77 0 / 73 0 / 77 0 / 459 0 / 456 3 - ESD fails Confirmed ESD / Latch-up Lot / Mask Set 0K76D 5K76D 39044 / 8K76D 38105 / 8K76D 38396 / 8K76D Totals HBM @ 2KV MM @ 200V CDM (socketed) @ 1KV 0/3 0/3 0/3 0/3 0/3 0 / 15 0/3 0/3 0/3 0/3 0/3 0 / 15 0/3 CDM (field induced) @ 1KV 0/3 0/3 0/3 Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA Report Rev.: A Revision date: 06/15/04 Page 2 of 7 Latch-up @ 200mA 0/3 0/3 0/3 0/3 0/3 0 / 15 360 CBGA Package Reliability Data (by similarity): Assembly Die Pull Lot / Mask Set D55283B/ L64M D55285C/ L64M D55213A1 & D55285C1/ L64M Totals Failure Comments Results 0 / 84 0 / 80 0 / 84 0 / 248 Strength Avg = 24.64 Stdev = 3.07 Avg = 30.95 Stdev = 2.44 Avg = 25.22 Stdev =4.02 Moisture Sensitivity Level Characterization Lot / Mask Set D55283B/ L64M D56764F/ L64M / D55213A1 & D55285C1/ L64M / Totals Failure Comments MSL1 @ 245degC 0 / 77 0 / 77 0 / 77 0 / 231 Temperature Cycle / -55ºC +125ºC Air-to-Air, with MSL1 Preconditioning Lot / Mask Set D55283B/ L64M D55285C/ L64M D55213A1 & D55285C1/ L64M Totals Failure Comments 100 Cycles 400 Cycles 800 Cycles 0 / 77 0 / 77 0 / 77 0 / 231 0 / 77 0 / 77 0 / 77 0 / 231 0 / 77 0 / 77 0 / 77 0 / 231 1000 Cycles FYI 0 / 77 0 / 77 0 / 77 0 / 231 Thermal Shock / -55ºC +125ºC Liquid-to-Liquid, with MSL1 Preconditioning Lot WED417468800 WED442189600 WED403628500 Totals Failure Comments 400 Cycles 0 / 77 0 / 77 0/ 77 0 / 231 800 Cycles 0 / 77 0 / 77 0 / 77 0 / 231 1000 Cycles - FYI 0 / 77 0 / 77 0 / 77 0 / 231 Autoclave / 121ºC, 100% RH, 2 atm, with MSL1 Preconditioning Lot / Mask Set D55283B/ L64M D56764F / L64M D55213A1 & D55285C1/ L64M Totals Failure Comments 48 hrs 0 / 77 0 / 77 0 / 77 0 / 231 96 hrs 0 / 77 0 / 77 0 / 77 0 / 231 Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA 144 hrs 0 / 77 0 / 77 0 / 77 0 / 231 Report Rev.: A Revision date: 06/15/04 Page 3 of 7 High Temperature Bake / 150ºC - FYI Lot / Mask Set D55283B & D55285C/ L64M D56764F/ L64M D55213A1 & D55285C1/ L64M Totals Failure Comments 504 hrs 0 / 77 0 / 77 0 / 77 0 / 231 1008 hrs 0/76 --0/77 0/153 360 pin 25x25mm PBGA Package Reliability Data: Moisture Sensitivity Level 3 Preconditioning / 85C, 85% RH, 168 Hours + IR Reflow (245C, 3 Passes) Lot D36045021 D36045022 D36045023 Totals Failure Comments MSL3 0/77 0/77 0/77 0/231 Electrical Test Room/Hot 0/77 0/77 0/77 0/231 CSAM 0/77 0/77 0/77 0/231 Temperature Cycle / -40ºC +125ºC Air-to-Air, with MSL3 245ºC Preconditioning Lot D36045021 D36045022 D36045023 Totals Failure Comments 500 Cycles 0/77 0/77 0/77 0/231 1000 Cycles 0/77 0/77 0/77 0/231 Temperature Cycle / -0ºC +125ºC Air-to-Air, with MSL3 245ºC Preconditioning Lot D36045021 D36045022 D36045023 Totals Failure Comments 1000 Cycles 0/77 0/75 0/80 0/232 2000 Cycles 0/77 0/75 0/80 0/232 Temperature Humidity & Bias 85°C/85%RH/Nominal Bias (w/MSL3 245C PC) Lot D36045021 D36045022 D36045023 Totals Failure Comments 504 Hours 0/76 0/77 0/77 0/230 761 Hours 0/76 0/77 0/77 0/230 Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA 1008 Hours 0/76 0/77 0/77 0/230 Report Rev.: A Revision date: 06/15/04 Page 4 of 7 Die Pull Non-wets 0/77 0/77 0/77 0/231 MPC745/755 Product FIT Rate and MTBF Derated Curves: Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA Report Rev.: A Revision date: 06/15/04 Page 5 of 7 Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA Report Rev.: A Revision date: 06/15/04 Page 6 of 7 Revision History: Revision History Revision Original A Date* 11/26/02 06/15/04 Comment Added CBGA and PBGA Electroplate Results Device No./Rev.: MPC745/755 Rev 2.8 Description: MPC745/755 Technology:MOS13 HiP4DP Package: 255PBGA / 360PBGA / 360CBGA Report Rev.: A Revision date: 06/15/04 Page 7 of 7 Author Leo Loc John Alvarado