MPC8240 Reliability and Qualfication Data

M
XPC8240RX RELIABILITY DATA SUMMARY
XPC8240
Fab:
Mask:
Process:
Package:
Assy:
- Kahlua - Information
MOS13, Austin, TX
J60F
HiP3
352 pin TBGA
ASAT, HongKong
XC8240 - Kahlua - TECHNOLOGY:
MOS13 on the 0.29µm HiP3 process
DYNAMIC LIFETEST (3.1V, 125°C)
504 HRS
1008 HRS
0 / 231
0 / 231
168 HRS
0 / 231
2016 HRS
/
ESD (HBM)
1KV
/
2KV
0 / 12
ESD (MM)
100V
/
200V
0 / 12
ESD (CDM)
500V
/
1KV
0 / 12
LATCHUP
150 mA
0 / 3
200 mA
0 / 12
SUPPORTING TECHNOLOGY:
HiP3 Summary for 3Q98-1Q01
24 HRS
0 / 3155
DYNAMIC LIFETEST (3.1V, 125°C)
168 HRS
504 HRS
0 / 3155
0 / 2134
1008 HRS
0 / 885
Last Updated KM 09 March 2001
M
XPC8240RX RELIABILITY DATA SUMMARY
TECHNOLOGY FAILURE RATES - HiP3
100000
FITs (Failures/1E9 Device-Hours)
90% Confidence FITs
10000
2.50 V
2.63 V
2.70 V
1000
100
10
40 °C
50 °C
60 °C
70 °C
80 °C
90 °C
100 °C
110 °C
120 °C
Junction Temperature
1.E+06
90% Confidence MTBF
2.50 V
2.63 V
2.70 V
MTBF (years)
1.E+05
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
40 °C
50 °C
60 °C
70 °C
80 °C
90 °C
100 °C
110 °C
120 °C
Junction Temperature
Last Updated KM 09 March 2001
M
XPC8240RX RELIABILITY DATA SUMMARY
PACKAGE: 352 Pin 35 x 35mm TBGA - ASAT
Data Summary 2Q99 - 1Q01
MOISTURE CZ
PRECOND MSL3
PRECOND MSL4
0 / 90
PRECOND MSL4
0 / 924
PRECOND MSL4
0 / 231
TEMPERATURE CYCLING (-65°C/+150°C)
100 CYC
500 CYC
0 / 924
0 / 924
THERMAL SHOCK (-55°C/+125°C)
100 CYC
500 CYC
0 / 231
0 / 231
1000 CYC
231
1000 CYC
AUTOCLAVE (+121°C, 100% RH, 2 atm)
PRECOND MSL4
48 HRS
144 HRS
0 / 693
4 / 693
0 / 0
Failure 48hr: 1 Short Fail
Failure 48hr: 3 Copper Fragment in DeBussing Hole - Corrective action implemented
PRECOND MSL4
0 / 462
THB (+85°C/85% RH/1.8V)
168 HRS
504 HRS
0 / 462
0 / 462
1008 HRS
BAKE (175°C)
168 HRS
504 HRS
0 / 231
0 / 231
Last Updated KM 09 March 2001