PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV821M5 SOT-23 DBV 5 1000 178.0 8.4 LMV821M5/NOPB SOT-23 DBV 5 1000 178.0 LMV821M5X SOT-23 DBV 5 3000 178.0 LMV821M5X/NOPB SOT-23 DBV 5 3000 LMV821M7 SC70 DCK 5 LMV821M7/NOPB SC70 DCK LMV821M7X SC70 DCK LMV821M7X/NOPB SC70 W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV822MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV822MM/NOPB VSSOP DGK 8 1000 178.0 13.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV822MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV822MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV822MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV822Q1MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV822Q1MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV824MTX TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 LMV824MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 LMV824MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2016 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMV824MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LMV824NDGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 LMV824Q1MAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LMV824Q1MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV821M5 SOT-23 DBV 5 1000 210.0 185.0 35.0 LMV821M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMV821M5X SOT-23 DBV 5 3000 210.0 185.0 35.0 LMV821M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMV821M7 SC70 DCK 5 1000 210.0 185.0 35.0 LMV821M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LMV821M7X SC70 DCK 5 3000 210.0 185.0 35.0 LMV821M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LMV822MM VSSOP DGK 8 1000 210.0 185.0 35.0 LMV822MM/NOPB VSSOP DGK 8 1000 202.0 201.0 28.0 LMV822MMX/NOPB VSSOP DGK 8 3500 364.0 364.0 27.0 LMV822MX SOIC D 8 2500 367.0 367.0 35.0 LMV822MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2016 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV822Q1MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMV822Q1MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LMV824MTX TSSOP PW 14 2500 367.0 367.0 35.0 LMV824MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 LMV824MX SOIC D 14 2500 367.0 367.0 35.0 LMV824MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LMV824NDGVR TVSOP DGV 14 2000 367.0 367.0 35.0 LMV824Q1MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LMV824Q1MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 Pack Materials-Page 3