DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz Check for Samples: DS90CF383B FEATURES DESCRIPTION • The DS90CF383B transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 227 Mbytes/sec. The DS90CF383B is fixed as a Falling edge strobe transmitter and will interoperate with a Falling edge strobe Receiver (DS90CF386) without any translation logic. 1 23 • • • • • • • • • • • • • • • • No Special Start-up Sequence Required Between Clock/Data and /PD Pins. Input Signal (Clock and Data) Can be Applied Either Before or After the Device is Powered. Support Spread Spectrum Clocking Up to 100KHz Frequency Modulation & Deviations of ±2.5% Center Spread or −5% Down Spread. "Input Clock Detection" Feature Will Pull All LVDS Pairs to Logic Low when Input Clock is Missing and When /PD Pin is Logic High. 18 to 68 MHz Shift Clock Support Best–in–Class Set & Hold Times on TxINPUTs Tx Power Consumption < 130 mW (typ) @65MHz Grayscale 40% Less Power Dissipation Than BiCMOS Alternatives Tx Power-down Mode < 60μW (typ) Supports VGA, SVGA, XGA and Dual Pixel SXGA. Narrow Cus Reduces Cable Size and Cost Up to 1.8 Gbps Throughput Up to 227 Megabytes/sec Bandwidth 345 mV (typ) Swing LVDS Devices for Low EMI PLL Requires No External Components Compatible with TIA/EIA-644 LVDS Standard Low Profile 56-Lead TSSOP Package Improved Replacement for: – SN75LVDS83, DS90CF383A This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TRI-STATE is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2013, Texas Instruments Incorporated DS90CF383B SNLS178E – JULY 2004 – REVISED APRIL 2013 www.ti.com Block Diagram DS90CF383B See Package Number DGG0056A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (1) Value Unit −0.3V to +4 V CMOS/TTL Input Voltage −0.3V to (VCC + 0.3) V LVDS Driver Output Voltage −0.3V to (VCC + 0.3) V Supply Voltage (VCC) LVDS Output Short Circuit Duration Continuous Junction Temperature +150 °C Storage Temperature −65°C to +150 °C +260 °C 1.63 W Lead Temperature (Soldering, 4 sec) Maximum Package Power Dissipation Capacity @ 25°C DGG0056A (TSSOP) Package: DS90CF383B Package Derating: DS90CF383B 12.5 mW/°C above +25°C ESD Rating (HBM, 1.5 kΩ, 100 pF) ESD Rating (EIAJ, 0Ω, 200 pF) (1) (2) 7 kV 500 V If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The “Electrical Characteristics” specify conditions for device operation. Recommended Operating Conditions Supply Voltage (VCC) Operating Free Air Temperature (TA) Min Nom Max Units 3.0 3.3 3.6 V −10 +25 +70 °C 200 mVPP 68 MHz Supply Noise Voltage (VCC) TxCLKIN frequency 18 Electrical Characteristics (1) Over recommended operating supply and temperature ranges unless otherwise specified. (1) 2 Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except VOD and ΔVOD). Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 Electrical Characteristics(1) (continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Typ (2) Min Max Units CMOS/TTL DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VCC V VIL Low Level Input Voltage GND 0.8 V VCL Input Clamp Voltage ICL = −18 mA −0.79 −1.5 V IIN Input Current V IN = 0.4V, 2.5V or VCC +1.8 +10 μA V IN = GND −10 0 μA RL = 100Ω 250 345 LVDS DC SPECIFICATIONS VOD Differential Output Voltage ΔVOD Change in VOD between complimentary output states VOS Offset Voltage ΔVOS Change in VOS between complimentary output states IOS Output Short Circuit Current mV 35 mV 1.38 V 35 mV −3.5 −5 mA Power Down = 0V, VOUT = 0V or V CC ±1 ±10 μA RL = 100Ω, f = 25 MHz CL = 5 pF, f = 40 MHz Worst Case Pattern (Figure 1 Figure 4 ) " Typ f = 65 MHz " values are given for V CC = 3.6V and TA = +25°C, " Max " values are given for V CC = 3.6V and TA = −10°C 31 45 mA 37 50 mA 48 60 mA RL = 100Ω, f = 25 MHz CL = 5 pF, f = 40 MHz 16 Grayscale Pattern (Figure 2 Figure 4 ) " Typ f = 65 MHz " values are given for V CC = 3.6V and TA = +25°C, " Max " values are given for VCC = 3.6V and TA = −10°C 29 40 mA 33 45 mA 39 50 mA Power Down = Low Driver Outputs in TRI-STATE® under Power Down Mode 17 150 μA (3) 1.13 1.25 VOUT = 0V, RL = 100Ω ® IOZ 450 Output TRI-STATE Current TRANSMITTER SUPPLY CURRENT ICCTW ICCTG ICCTZ (2) (3) Transmitter Supply Current Worst Case Transmitter Supply Current 16 Grayscale Transmitter Supply Current Power Down Typical values are given for VCC = 3.3V and T A = +25°C unless specified otherwise. VOS previously referred as VCM. Recommended Transmitter Input Characteristics Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter TCIT TxCLK IN Transition Time (Figure 5 ) TCIP TxCLK IN Period (Figure 6 ) TCIH TCIL TXIT TxIN, and Power Down pin Transition Time TXPD Minimum pulse width for Power Down pin signal Min Typ Max Units 5 ns 14.7 T 50 ns TxCLK IN High Time (Figure 6 ) 0.35T 0.5T 0.65T ns TxCLK IN Low Time (Figure 6) 0.35T 0.5T 0.65T ns 6 ns 1.5 1 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B us 3 DS90CF383B SNLS178E – JULY 2004 – REVISED APRIL 2013 www.ti.com Transmitter Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter Min Typ Max Units LLHT LVDS Low-to-High Transition Time (Figure 4 ) 0.75 1.4 ns LHLT LVDS High-to-Low Transition Time (Figure 4 ) 0.75 1.4 ns TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (1) −0.20 0 +0.20 ns TPPos1 Transmitter Output Pulse Position for Bit 1 2.00 2.20 2.40 ns TPPos2 Transmitter Output Pulse Position for Bit 2 4.20 4.40 4.60 ns TPPos3 Transmitter Output Pulse Position for Bit 3 6.39 6.59 6.79 ns TPPos4 Transmitter Output Pulse Position for Bit 4 8.59 8.79 8.99 ns TPPos5 Transmitter Output Pulse Position for Bit 5 10.70 10.99 11.19 ns TPPos6 Transmitter Output Pulse Position for Bit 6 12.99 13.19 13.39 ns TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (1) −0.25 0 +0.25 ns TPPos1 Transmitter Output Pulse Position for Bit 1 3.32 3.57 3.82 ns TPPos2 Transmitter Output Pulse Position for Bit 2 6.89 7.14 7.39 ns TPPos3 Transmitter Output Pulse Position for Bit 3 10.46 10.71 10.96 ns TPPos4 Transmitter Output Pulse Position for Bit 4 14.04 14.29 14.54 ns TPPos5 Transmitter Output Pulse Position for Bit 5 17.61 17.86 18.11 ns TPPos6 Transmitter Output Pulse Position for Bit 6 21.18 21.43 21.68 ns TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (1) −0.45 0 +0.45 ns TPPos1 Transmitter Output Pulse Position for Bit 1 5.26 5.71 6.16 ns TPPos2 Transmitter Output Pulse Position for Bit 2 10.98 11.43 11.88 ns TPPos3 Transmitter Output Pulse Position for Bit 3 16.69 17.14 17.59 ns TPPos4 Transmitter Output Pulse Position for Bit 4 22.41 22.86 23.31 ns TPPos5 Transmitter Output Pulse Position for Bit 5 28.12 28.57 29.02 ns TPPos6 Transmitter Output Pulse Position for Bit 6 33.84 34.29 34.74 ns TSTC TxIN Setup to TxCLK IN (Figure 6 ) THTC TxIN Hold to TxCLK IN (Figure 6 ) TCCD TxCLK IN to TxCLK OUT Delay (Figure 7 ) 50% duty cycle input clock is assumed, TA = −10°C, and 65MHz for " Min ", TA = 70°C, and 25MHz for " Max ", VCC = 3.6V SSCG Spread Spectrum Clock support; Modulation frequency with a linear profile (2) f = 65 MHz f = 40 MHz f = 25 MHz 2.5 ns 0.5 ns 3.011 f = 25 MHz 100KHz ± 2.5%/−5% f = 40 MHz 100KHz ± 2.5%/−5% f = 65 MHz 100KHz ± 2.5%/−5% 6.062 ns TPLLS Transmitter Phase Lock Loop Set (Figure 8 ) 10 ms TPDD Transmitter Power Down Delay (Figure 10 ) 100 ns (1) (2) 4 The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature ranges. This parameter is functionality tested only on Automatic Test Equipment (ATE). Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the performance of tracking Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK− pins. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 AC Timing Diagrams Figure 1. “Worst Case” Test Pattern The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O. The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical stripes across the display. Figure 1 and Figure 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT). Recommended pin to signal mapping. Customer may choose to define differently. Figure 2. “16 Grayscale” Test Pattern Figure 3. DS90CF383B (Transmitter) LVDS Output Load Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B 5 DS90CF383B SNLS178E – JULY 2004 – REVISED APRIL 2013 www.ti.com Figure 4. DS90CF383B (Transmitter) LVDS Transition Times Figure 5. DS90CF383B (Transmitter) Input Clock Transition Time Figure 6. DS90CF383B (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe) Figure 7. DS90CF383B (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe) Figure 8. DS90CF383B (Transmitter) Phase Lock Loop Set Time 6 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 Figure 9. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs Figure 10. Transmitter Power Down Delay Figure 11. Transmitter LVDS Output Pulse Position Measurement Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B 7 DS90CF383B SNLS178E – JULY 2004 – REVISED APRIL 2013 www.ti.com DS90CF383B PIN DESCRIPTIONS — FPD LINK TRANSMITTER Pin Name I/O No. TxIN I 28 TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable). TxOUT+ O 4 Positive LVDS differential data output. TxOUT− O 4 Negative LVDS differential data output. FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN. TxCLK OUT+ O 1 Positive LVDS differential clock output. TxCLK OUT− O 1 Negative LVDS differential clock output. PWR DOWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down. See Applications Information. VCC I 4 Power supply pins for TTL inputs. GND I 5 Ground pins for TTL inputs. PLL VCC I 1 Power supply pin for PLL. PLL GND I 2 Ground pins for PLL. LVDS VCC I 1 Power supply pin for LVDS outputs. LVDS GND I 3 Ground pins for LVDS outputs. 8 Description Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 APPLICATIONS INFORMATION The DS90CF383B are backward compatible with the DS90C383/DS90CF383, DS90C383A/DS90CF383A and are a pin-for-pin replacement. This device may also be used as a replacement for the DS90CF583 (5V, 65MHz) and DS90CF581 (5V, 40MHz) FPD-Link Transmitters with certain considerations/modifications: 1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of the transmitter. TRANSMITTER INPUT PINS The DS90CF383B transmitter input and control inputs accept 3.3V LVTTL/LVCMOS levels. They are not 5V tolerant. TRANSMITTER CLOCK CLOCK/DATA SEQUENCING The DS90CF383B does not require any special requirement for sequencing of the input clock/data and PD (PowerDown) signal. The DS90CF383B offers a more robust input sequencing feature where the input clock/data can be inserted after the release of the PD signal. In the case where the clock/data is stopped and reapplied, such as changing video mode within Graphics Controller, it is not necessary to cycle the PD signal. However, there are in certain cases where the PD may need to be asserted during these mode changes. In cases where the source (Graphics Source) may be supplying an unstable clock or spurious noisy clock output to the LVDS transmitter, the LVDS Transmitter may attempt to lock onto this unstable clock signal but is unable to do so due the instability or quality of the clock source. The PD signal in these cases should then be asserted once a stable clock is applied to the LVDS transmitter. Asserting the PWR DOWN pin will effectively place the device in reset and disable the PLL, enabling the LVDS Transmitter into a power saving standby mode. However, it is still generally a good practice to assert the PWR DOWN pin or reset the LVDS transmitter whenever the clock/data is stopped and reapplied but it is not mandatory for the DS90CF383B. SPREAD SPECTRUM CLOCK SUPPORT The DS90CF383B can support Spread Spectrum Clocking signal type inputs. The DS90CF383B outputs will accurately track Spread Spectrum Clock/Data inputs with modulation frequencies of up to 100KHz (max.)with either center spread of ±2.5% or down spread -5% deviations. POWER SOURCES SEQUENCE In typical applications, it is recommended to have VCC, LVDS VCC and PLL VCC from the same power source with three separate de-coupling bypass capacitor groups. There is no requirement on which VCC entering the device first. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B 9 DS90CF383B SNLS178E – JULY 2004 – REVISED APRIL 2013 www.ti.com Pin Diagram Figure 12. DS90CF383B See Package Number DGG0056A Block Diagram Typical Application 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B DS90CF383B www.ti.com SNLS178E – JULY 2004 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision D (April 2013) to Revision E • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: DS90CF383B 11 PACKAGE OPTION ADDENDUM www.ti.com 17-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) DS90CF383BMTX/NOPB ACTIVE Package Type Package Pins Package Drawing Qty TSSOP DGG 56 1000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU SN Level-2-260C-1 YEAR (4) -10 to 70 DS90CF383BMT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing DS90CF383BMTX/NOPB TSSOP DGG 56 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 14.5 1.8 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90CF383BMTX/NOPB TSSOP DGG 56 1000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. 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