PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) UCC27321D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27321 UCC27321DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27321 UCC27321DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27321 UCC27321DGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27321 UCC27321DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27321 UCC27321DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27321 UCC27321DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27321 UCC27321P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 UCC27321P UCC27321PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 UCC27321P UCC27322D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27322 UCC27322DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27322 UCC27322DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27322 UCC27322DGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27322 UCC27322DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27322 UCC27322DGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 105 27322 UCC27322DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27322 UCC27322DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 27322 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) UCC27322P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 UCC27322P UCC27322PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 UCC27322P UCC37321D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37321 UCC37321DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37321 UCC37321DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37321 UCC37321DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37321 UCC37321DGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37321 UCC37321DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37321 UCC37321P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 UCC37321P UCC37321PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 UCC37321P UCC37322D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37322 UCC37322DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37322 UCC37322DGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37322 UCC37322DGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37322 UCC37322DGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37322 UCC37322DGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 37322 UCC37322DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37322 UCC37322DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 37322 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) UCC37322P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 UCC37322P UCC37322PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 UCC37322P (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 OTHER QUALIFIED VERSIONS OF UCC27321, UCC27322 : • Automotive: UCC27321-Q1, UCC27322-Q1 • Enhanced Product: UCC27322-EP NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4