LX8610-xx_old2.pdf

L I N D O C # : 8610
LX8610-xx
1 A B I C M O S V E RY L O W D R O P O U T R E G U L AT O R S
T
H E
I
N F I N I T E
P
O W E R
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O F
P
N N O VA T I O N
R E L I M I N A R Y
DESCRIPTION
The LX8610 family are positive very
low dropout regulators. They are
designed to provide a power supply for
very low headroom applications, such as
3.3V - 2.5V.
BiCMOS technology allows an
effective series pass element resistance,
RDS(ON) of 250mΩ resulting in a typical
dropout voltage of 250mV at 1A.
Low Quiescent Current and LogicControlled Shutdown help conserve
battery life and increase system efficiency.
Typical quiescent current is under 400µA
irrespective of load current, while the
D
A T A
S
H E E T
K E Y F E AT U R E S
■ Dropout Voltage Typically 250mV At 1A
And 50mV At 10mA
■ Low Quiescent Current, Under 400µA,
Irrespective Of Load
■ Shutdown Current 10µA
■ Adjustable Output Version In 8-Pin SOIC
Package
■ Fixed Outputs Of 2.5V, 3.3V Available In
3-Pin SOT-223 Package
■ Low Reverse Leakage Current
■ Short-Circuit And Thermal Shutdown
Protection
shutdown current is only 10µA. The
device will enter shutdown mode when
the ENABLE pin is pulled low.
Thermal and Short-Circuit Current
Limiting: the LX8610 limits the current
when the output is shorted, so protecting
sensitive load circuits. The device will
also turn off if the junction temperature
exceeds 165°C.
Available in small outline SOT-223
and 8-pin SOIC: adjustable versions use
the 8-pin SOIC, and fixed output voltage
devices are supplied in the 3-lead SOT223.
A P P L I C AT I O N S
■ 3.3V & 2.5V Supplies For Memory,
Microprocessors, Clock Circuits, Etc.
■ Portable Equipment
NOTE: For current data & package dimensions, visit our web site: http://www.linfinity.com.
PRODUCT HIGHLIGHT
LX8610- X X B L O C K D I A G R A M
V
V
IN
C u rre n t
L im it
R e fe re n c e
C u rre n t
R
O U T
A
A D J *
C h a rg e
P u m p
R
B
1 .2 5 V
G N D
E N A B L E
R
1 .5 V
R e v e rs e
V o lta g e
S e n s e
T h e rm a l
S h u td o w n
A
R
B
L X 8 6 1 0 -0 0
-
-
L X 8 6 1 0 -2 5
2 5 k
2 5 k
L X 8 6 1 0 -3 3
4 1 k
2 5 k
* L X 8 6 1 0 -0 0 V e r s io n O n ly .
PA C K A G E O R D E R I N F O R M AT I O N
Output
SOT-223 DM Plastic SOIC
TA (°C)
ST Plastic
Voltage
3-pin
8-pin
0 to 70
3.3
LX8610-33CST
LX8610-33CDM
2.5
LX8610-25CST
LX8610-25CDM
ADJ (00)
—
LX8610-00CDM
Note: All surface-mount packages are available in Tape & Reel, append the letter "T"
to part number. (i.e. LX8610-xxCDMT)
Copyright © 2000
Rev. 0.5 1/00
LINFINITY MICROELECTRONICS INC.
11861 WESTERN AVENUE, GARDEN GROVE, CA. 92841, 714-898-8121, FAX: 714-893-2570
1
PRODUCT DATABOOK 1996/1997
LX8610-xx
1 A B I C M O S V E RY L OW D R O P O U T R E G U L AT O R S
P
R E L I M I N A R Y
A B S O L U T E M A X I M U M R AT I N G S
D
A T A
S
H E E T
(Note 1)
Input Voltage (VIN) ...................................................................................................... 6.5V
Enable Pin .............................................................................................. -0.3V to VIN+0.3V
Operating Junction Temperature
Plastic (ST & DM Packages) ................................................................................. 125°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
PA C K A G E P I N O U T S
TAB IS GND
3. VOUT
2. GND
1. VIN
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
ST PACKAGE
(Top View)
T H E R M A L D ATA
ST PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
15°C/W
*150°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
165°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
VOUT
GND/HEATSINK
GND/HEATSINK
ADJ
1
8
2
7
3
6
4
5
ENABLE
GND/HEATSINK
GND/HEATSINK
VIN
DM PACKAGE
(Top View)
* θJAcan be improved with package soldered to 0.5IN2 copper area over backside ground
plane or internal power plane. θJAcan vary from 20ºC/W to > 40ºC/W depending on
mounting technique.
FUNCTIONAL PIN DESCRIPTION
Pin
Designator
2
Description
VIN
Positive supply input for the regulator. Bypass to GND with at least 2.2µF of low ESR, ESL capacitance if supply source
is further than 1 inch from the device.
VOUT
Output for the regulator. It is recommended to bypass to GND with at least 10µF although this is not required for
regulation, rather its needed for transient response. Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to these load steps.
GND
Reference ground. The input and output decoupling capacitors should be connected to this pin. In addition the tab on
the SOT-223 package and pins 2, 3, 6 and 7 on the SOIC package are also used for heatsinking the device.
ADJ
Feedback pin for the regulator. For the LX8610-00, the output voltage can be set by two external resistors with the
following relationship: VOUT = 1.25V * (1+R2/R1) where R1 is the resistor connected between VOUT and ADJ, and R2 is
the resistor connected between ADJ and GND pin.
ENABLE
Enable input. This pin has a threshold of about 1.5V, it should be actively pulled high to enable the regulator. This can
be accomplished with a resistive pull-up or controlled by a logic gate. When low, it turns off the regulator and puts the
device in a low current shutdown state.
Copyright © 2000
Rev. 0.5 1/00
PRODUCT DATABOOK 1996/1997
LX8610-xx
1 A B I C M O S V E RY L OW D R O P O U T R E G U L AT O R S
P
R E L I M I N A R Y
D
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H E E T
R E C O M M E N D E D O P E R AT I N G C O N D I T I O N S
Parameter
Symbol
Input Voltage
Load Current (with adequate heatsinking)
Input Capacitor (VIN to GND)
Output Capacitor (VOUT to GND)
VIN
Recommended Operating Conditions
Min.
Typ.
Max.
2.5
10
2.2
10
5.5
1000
Units
V
mA
µF
µF
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for the LX8610-xxC with 0°C ≤ TA ≤ 70°C; VIN = VOUT +
1.5V; IOUT = 10mA; CIN = 10µF; COUT = 22µF; TJ = TA. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures
equal to the ambient temperature.)
LX8610-33 Fixed 3.3V, 1A
Parameter
Symbol
Output Voltage
VOUT
Line Regulation
Load Regulation
Dropout Voltage (VDO = VIN - VOUT)
VREG
IREG
VDO
Current Limit
Short Circuit Current
Quiescent Current
Reverse Leakage Current
ICL
ISC
IQ
Test Conditions
TJ = 25°C
Over Temperature
VIN = 3.45V to 5.5V
IOUT = 10mA to 1A
IOUT = 1A, VOUT = ∆VOUT - 1%
IOUT = 0.5A, VOUT = ∆VOUT - 1%
IOUT = 10mA, VOUT = ∆VOUT - 1%
VOUT = VOUT - 1%
VOUT = 0V
IOUT = 10mA to 1A
0V < VIN < VOUT, VOUT < 3.4V (at VOUT)
0V < VIN < VOUT, VOUT < 3.4V (at VIN)
Enable Threshold *
Shutdown Current *
Min.
3.25
3.22
1.1
1
-50
0.8
LX8610-33
Typ.
Max.
3.3
4
5
0.25
0.15
0.05
1.3
1.25
400
400
0
1.5
10
3.35
3.38
8
10
0.4
0.25
0.15
1.8
1.7
600
650
25
Units
V
V
mV
mV
V
V
V
A
A
µA
µA
mA
V
µA
LX8610-25 Fixed 2.5V, 1A
Parameter
Symbol
Output Voltage
VOUT
Line Regulation
Load Regulation
Dropout Voltage (VDO = VIN - VOUT)
VREG
IREG
VDO
Current Limit
Short Circuit Current
Quiescent Current
Reverse Leakage Current
ICL
ISC
IQ
Test Conditions
TJ = 25°C
Over Temperature
VIN = 3.1V to 5.5V, IOUT = -10mA
IOUT = 10mA to 1A
IOUT = 1A, VOUT = ∆VOUT - 1%
IOUT = 0.5A, VOUT = ∆VOUT - 1%
IOUT = 10mA, VOUT = ∆VOUT - 1%
VOUT = VOUT - 1%
VOUT = 0V
IOUT = 10mA to 1A
0V < VIN < VOUT, VOUT < 2.6V (at VOUT)
0V < VIN < VOUT, VOUT < 2.6V (at VIN)
Enable Threshold *
Shutdown Current *
Min.
2.46
2.44
1.1
1
-50
0.8
LX8610-25
Typ.
Max.
2.5
2.5
3
5
0.25
0.15
0.05
1.3
1.25
300
400
0
1.5
10
2.54
2.56
6
10
0.4
0.25
0.1
1.8
1.7
600
650
25
Units
V
V
mV
mV
V
V
V
A
A
µA
µA
mA
V
µA
* Enable Threshold and Shutdown Current apply only to 8-pin SOIC package outline versions.
Copyright © 2000
Rev. 0.5 1/00
3
PRODUCT DATABOOK 1996/1997
LX8610-xx
1 A B I C M O S V E RY L OW D R O P O U T R E G U L AT O R S
P
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H E E T
E L E C T R I C A L C H A R A C T E R I S T I C S (Continued)
LX8610-00 Adjustable Output, 1A
Parameter
Symbol
Reference Voltage
VREF
Line Regulation
Load Regulation
Dropout Voltage (VDO = VOUT - VIN)
VREG
IREG
VDO
Current Limit
Short Circuit Current
Quiescent Current
Reverse Leakage Current
ICL
ISC
IQ
Bias Current at ADJ Pin
Enable Threshold
Shutdown Current
Test Conditions
Min.
1.238
1.225
TJ = 25°C
Over Temperature
VIN = VOUT+150mV to 5.5V, IOUT = 10mA
IOUT = 10mA to 1A
IOUT = 1A, VIN > 4V
IOUT = 0.5A, VIN > 3V
IOUT = 10mA, VIN > 3V
VOUT = VOUT - 1%
VOUT = 0V
IOUT = 10mA to 1A, VIN = 5.5V
0V < VIN < VOUT, VOUT < 5.5V (at VOUT)
0V < VIN < VOUT, VOUT < 5.5V (at VIN)
1.1
1
-50
0.8
Enable < 0.8V
LX8610-00
Typ.
Max.
1.25
1.25
2
7
0.25
0.15
0.05
1.3
1.25
400
400
0
100
1.5
10
1.262
1.270
4
15
0.4
0.25
0.15
1.8
1.7
600
650
250
25
Units
V
V
mV
mV
V
V
V
A
A
µA
µA
mA
nA
V
µA
T Y P I C A L A P P L I C AT I O N
VIN
LX8610-xx
CIN
VOUT
5
1
GND ADJ
2
ENABLE
R1
4
3
COUT
R2
VREF
VOUT = VREF 1 +
R2
R1
FIGURE 1 — Typical Application
4
Copyright © 2000
Rev. 0.5 1/00
PRODUCT DATABOOK 1996/1997
LX8610-xx
1 A B I C M O S V E RY L OW D R O P O U T R E G U L AT O R S
P
R E L I M I N A R Y
D
A T A
S
H E E T
CHARACTERISTIC CURVES
300
DROPOUT (mV)
250
200
0
25 C
150
75 C
100
50
0
0.01
0.25
0.5
0.75
1
IOUT (A)
FIGURE 2 — Dropout Voltage vs. Output Current (Typical - LX8610-25CST)
PRELIMINARY DATA - Information contained in this document is pre-production data, and is proprietary to LinFinity. It may
not modified in any way without the express written consent of LinFinity. Product referred to herein is offered in sample form
only, and Linfinity reserves the right to change or discontinue this proposed product at any time.
Copyright © 2000
Rev. 0.5 1/00
5