REVISIONS LTR DESCRIPTION A Add device type 11. Update boilerplate. Editorial change throughout. – phn B Update boilerplate paragraphs to current requirements. - phn DATE 06-02-22 APPROVED Thomas M. Hess 12-02-14 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES PMIC N/A REV B PAGE 1 PREPARED BY Original date of drawing YY-MM-DD 03-06-18 B 2 B 3 B 4 AMSC N/A . B 8 B 9 B 10 B 11 B 12 MICROCIRCUIT, LINEAR, FAST-TRANSIENTRESPONSE 2-A LOW DROPOUT VOLTAGE REGULATORS, MONOLITHIC SILICON Thomas M. Hess REV B 7 TITLE Phu H. Nguyen APPROVED BY A B 6 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Phu H. Nguyen CHECKED BY SIZE B 5 CODE IDENT. NO. DWG NO. V62/03635 16236 B PAGE 1 OF 12 5962-V028-12 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a fast-transient-response 2-A low dropout voltage regulators, with an operating temperature range of -40°C to +125°C and of -55°C to +125°C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/03635 01 X E Drawing number Device type (See 1.2.1) Case outline (See 1.2.2) Lead finish (See 1.2.3) 1.2.1 Device type(s). 1/ Device Type Generic Output voltage Circuit function 01 TPS75201-EP +1.5 V to +5.0 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . 02 TPS75215-EP +1.5 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . 03 TPS75218-EP +1.8 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . 04 TPS75225-EP +2.5 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . 05 06 07 08 09 10 TPS75233-EP TPS75301-EP TPS75315-EP TPS75318-EP TPS75325-EP TPS75333-EP +3.3 V +1.5 V to +5.0 V +1.5 V +1.8 V +2.5 V +3.3 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . Fast-transient-response 2-A low-dropout voltage regulator with power good. Fast-transient-response 2-A low-dropout voltage regulator with power good. Fast-transient-response 2-A low-dropout voltage regulator with power good. Fast-transient-response 2-A low-dropout voltage regulator with power good. Fast-transient-response 2-A low-dropout voltage regulator with power good. 11 TPS75201M-EP +1.5 V to +5.0 V Fast-transient-response 2-A low-dropout voltage regulator with RESET . 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins X 20 JEDEC PUB 95 Package style JEDEC MO-153 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator A B C D E Z DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Material Hot solder dip Tin-lead plate Gold plate Palladium Gold flash palladium Other SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/03635 PAGE 2 1.3 Absolute maximum ratings. 2/ Input voltage range (VI) ......................................................................................... -0.3 V to +5.5 V 3/ Voltage range at EN ............................................................................................. -0.3 V to +16.5 V Maximum RESET voltage (device type 01-05) ................................................... Maximum PG voltage (device type 06-10) ........................................................... Peak output current .............................................................................................. Output voltage (VO) (OUT, FB) .............................................................................. Continuous total power dissipation........................................................................ Operating virtual junction temperature range (TJ): Device type 01 to 10 ..................................................................................... Device type 11 .............................................................................................. Storage temperature range (TSTG)......................................................................... ESD rating, (HBM) ................................................................................................ +16.5 V +16.5 V Internally limited +5.5 V See dissipation rating tables -40°C to +125°C -55°C to +125°C -65°C to +150°C 2 kV Dissipation Rating Table – Ambient Temperatures Case Air Flow TA < 25°C Derating Factor TA = 70°C TA = 85°C outline (CFM) Power rating Above TA = 25°C Power Rating Power Rating 0 2.9 W 23.5 mW/°C 1.9 W 1.5 W 300 4.3 W 34.6 mW/°C 2.8 W 2.2 W 0 3.0 W 23.8 mW/°C 1.9 W 1.5 W 300 7.2 W 57.9 mW/°C 4.6 W 3.8 W X 4/ X 5/ 1.4 Recommended operating conditions. Input voltage range (VI) ......................................................................................... Output voltage (VO) ............................................................................................... Output current (IO) ................................................................................................. Operating virtual junction temperature range (TJ): Device type 01 to 10 ..................................................................................... Device type 11 .............................................................................................. +2.7 V to +5.0 V +1.5 V to +5.0 V 0 to 2.0 A 6/ -40°C to +125°C -55°C to +125°C 1/ 2/ Users are cautioned to review the manufacturers data manual for additional user information relating to these devices. Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3/ All voltage values are with respect to network terminal ground. 4/ This parameter is measured with the recommended copper heat sink pattern on a 1-layer PCB, 5 in x 5 in PCB, 1 oz. copper, 2 in x 2 in coverage. 5/ This parameter is measured with the recommended copper heat sink pattern on a 8-layer PCB, 1.5 in x 2 in PCB, 1 oz. 2 2 copper with layer 1, 2, 4, 5, 7, and 8 at 5% coverage (0.9 in ) and layers 3 and 6 at 100% coverage (6 in ). For more information, refer to the manufacturer technical brief SLMA002. 6/ To calculate the minimum input voltage for your maximum output current, use the following equation: VI(min) = VO(max) + VDO(max load) DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 3 2. APPLICABLE DOCUMENTS JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC – Solid State Technology Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. B. C. Manufacturer’s name, CAGE code, or logo Pin 1 identifier ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline(s). The case outline(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.5.3 Block diagrams. The block diagrams shall be as specified on figure 3. 3.5.4 Timing diagram. The timing diagram shall be as specified on figure 4. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 4 TABLE I. Electrical performance characteristics. 1/ Test Test conditions VI = VO(Typ) + 1 V Device type 01, 06, 11 1.5 V ≤ VO ≤ 5.0 V 2.7 V < VIN < 5.0 V, TJ = 25°C 04, 09 TJ = 25°C 05, 10 3.5 V ≤ VIN ≤ 5.0 V 4.3 V ≤ VIN ≤ 5.0 V TJ = 25°C, 3/ All Output voltage line regulation (∆VO/VO) 4/ 5/ VO + 1 V < VI ≤ 5.0 V, 3/ 2.550 3.366 125 All TJ = 25°C 0.01 TYP VO + 1 V < VI ≤ 5.0 V VO = 1.5 V, CO = 100 µF, TJ = 25°C VO = 0 V FB input current EN = VI FB = 1.5 V All 1 TYP mV 04, 09, 11 60 TYP µVrms All Thermal shutdown junction temperature EN = VI , TJ = 25°C, 4.5 150 TYP °C All 1 TYP µA 10 -1.0 2.0 V 0.7 f = 100 Hz, CO = 100 µF, TJ = 25°C, IO = 2.0 A IO(RESET) = 300 µA, Trip threshold voltage VO decreasing Hysteresis voltage Measured at VO Output low voltage VI = 2.7 V, Leakage current V(RESET) = 5 V V 60 TYP dB 4/ V(RESET) ≤ 0.8V 01-05, 11 RESET Reset µA 1.0 Low level enable input voltage Minimum input voltage for valid A All 01, 06, 11 All High level enable input voltage Power supply ripple rejection 5/ %/V 0.1 BW = 300 Hz to 50 kHz, Standby current µA 75 TYP All 6/ Output current limit 1.836 3.3 TYP 3.234 Quiescent current (GND current) 4/ 1.530 2.5 TYP 2.450 4.3 V < VIN < 5.0 V, 1.02 VO 1.8 TYP 1.764 TJ = 25°C V 1.5 TYP 03, 08 TJ = 25°C 3.5 V < VIN < 5.0 V, Output noise voltage 0.98 VO 1.470 2.8 V ≤ VIN ≤ 5.0 V Load regulation Max VO TYP 02, 07 2.7 V ≤ VIN ≤ 5.0 V 2.8 V < VIN < 5.0 V, Unit Min IO = 1 mA, EN = 0 V CO = 47 µF -40°C ≤ TJ ≤ 125°C 2/ -55°C ≤ TJ ≤ 125°C 3 unless otherwise specified 1.5 V ≤ VO ≤ 5.0 V, TJ = 25°C Output voltage 4/ 6/ Limits 1.3 V 98 %VO 92 0.5 TYP IO(RESET) = 1 mA RESET time out delay %VO 0.4 V 1.0 µA 100 TYP ms See notes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 5 TABLE I. Electrical performance characteristics - Continued. 1/ Test Test conditions VI = VO(Typ) + 1 V Device type Min IO = 1 mA, EN = 0 V CO = 47 µF -40°C ≤ TJ ≤ 125°C 2/ -55°C ≤ TJ ≤ 125°C 3 unless otherwise specified PG Minimum input voltage for valid PG IO(PG) = 300 µA , Trip threshold voltage VO decreasing Hysteresis voltage Measured at VO Output low voltage IO(PG) = 1 mA Leakage current V(PG) = 5 V Input current ( EN ) Limits V(PG) ≤ 0.8 V 06 - 10 80 All EN = VI High level EN input voltage All Low level EN input voltage All 7/ All IO = 2.0 A, VI = 3.2 V, TJ = 25°C IO = 2.0 A, VI = 3.2 V 1/ 2/ 3/ 4/ 5/ 6/ 7/ Max 1.3 V 86 %VO 0.5 TYP EN = 0 V Dropout voltage (3.3 V Output) Unit %VO 0.4 V 1 µA -1 1 µA -1 1 µA 2.0 V 0.7 210 TYP V mV 400 Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. For device type 01 to 10 For device type 11. Minimum IN operating voltage is 2.7 V or VO(Typ) + 1V, whichever is greater. Maximum IN voltage 5.0 V. If VO ≤ 1.8 V then Vimin = 2.7 V, VImax = 5.0 V: V (V − 2 .7 V ) Line Reg. (mV) = (%/V) x O Im ax x 1000 100 If VO ≥ 2.5 V then VImin = VO + 1 V, Vimax = 5.0 V. V (V − (VO + 1V )) x 1000 Line Reg. (mV) = (%/V) x O Im ax 100 IO = 1 mA to 2.0 A. IN voltage equals VO(Typ) – 100 mV; Device type 02, 03, 04, 06, 07 and 08 dropout voltage limited by input voltage range limitations ( i.e., device type 05 and 10 input voltage needs to drop to 3.2 V for purpose of this test). DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 6 Case X Notes: 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusions. 4. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. 5. Falls within JEDEC MO-153. FIGURE 1. Case outline. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 7 Case X Millimeters Symbol Min Max A 1.20 A1 0.05 0.15 b 0.19 0.30 c 0.15 NOM D 6.40 6.60 E 4.30 4.500 E1 6.20 6.60 e 0.65 TYP L 0.50 0.75 FIGURE 1. Case outline - Continued. 1/ Terminal number Terminal symbol Terminal number Terminal symbol 1 GND/HEATSINK 11 GND/HEATSINK 2 NC 12 NC 3 IN 13 NC 4 IN 14 NC 5 EN 15 NC 6 RESET or PG 1/ 16 NC 7 FB/SENSE 17 GND 8 OUTPUT 18 NC 9 OUTPUT 19 NC 10 GND/HEASINK 20 GND/HEATSINK PG is on the device types: 06-10 and RESET is on the device type 01-05. NC: No internal connection FIGURE 2. Terminal connections. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 8 Functional block diagram – adjustable version Functional block diagram – fixed voltage version FIGURE 3. Block diagrams. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 9 RESET timing diagram NOTES: 1. 2. Vres is the minimum input voltage for a valid RESET . The symbol Vres is not currently listed within EIA or JEDEC standards for semiconductor symbology. VIT - Trip voltage is typically 5% lower than the output voltage (95% VO) VIT- to VIT+ is the hysteresis voltage. FIGURE 4. Timing diagram. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 10 PG timing diagram Notes: 1. VPG is the minimum input voltage for a valid PG. The symbol VPG is not currently listed within EIA or JEDEC standards for semiconductor symbology. 2. VIT- Trip voltage is typically 17 % lower than the output voltage (83% VO) VIT– to VIT+ is the hysteresis voltage. FIGURE 4. Timing diagram - Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 11 4 VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ V62/03635-01XE V62/03635-02XE V62/03635-03XE V62/03635-04XE V62/03635-05XE V62/03635-06XE V62/03635-07XE V62/03635-08XE V62/03635-09XE V62/03635-10XE V62/03635-11XE 1/ 2/ 3/ 4/ Device manufacturer CAGE code 01295 01295 01295 01295 01295 01295 01295 01295 01295 01295 01295 Vendor part number 2/ TPS75201QPWPEP 3/ TPS75215QPWPEP TPS75218QPWPEP TPS75225QPWPEP TPS75233QPWPEP TPS75301QPWPEP TPS75315QPWPEP TPS75318QPWPEP TPS75325QPWPEP TPS75333QPWPEP TPS75201MPWPREP The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. The PWP package is available taped and reeled. Add an R suffix to the device type (e.g., TPS75201QPWPREP) to indicate tape and reel. This device is programmable using an external resistor divider (see manufacturer application information). This device is not available from an approved source of supplied. CAGE code 01295 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Source of supply Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 SIZE A CODE IDENT NO. 16236 REV B DWG NO. V62/03635 PAGE 12